KR101780727B1 - Moisture-proof film composition for electronic equipment, method for manufacturing moisture-proof film using the same composition, and electronic equipment - Google Patents
Moisture-proof film composition for electronic equipment, method for manufacturing moisture-proof film using the same composition, and electronic equipment Download PDFInfo
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- KR101780727B1 KR101780727B1 KR1020150082863A KR20150082863A KR101780727B1 KR 101780727 B1 KR101780727 B1 KR 101780727B1 KR 1020150082863 A KR1020150082863 A KR 1020150082863A KR 20150082863 A KR20150082863 A KR 20150082863A KR 101780727 B1 KR101780727 B1 KR 101780727B1
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Abstract
A moisture permeation preventive film composition for electronic devices, a method of forming a moisture permeation preventive film for electronic devices using the same, and an electronic device, which comprises: 1 to 10% by weight of an aerosol; 10 to 50% by weight of a solvent; 0.1 to 5% by weight of an additive; And a binder for the remainder; and a method for forming a moisture barrier layer for electronic devices and an electronic apparatus using the composition.
Description
A moisture permeation preventive film composition for electronic equipment, a method of forming a moisture permeation preventive film for electronic equipment using the same, and an electronic apparatus.
Generally, a glass material is mainly used when flexibility is not required, and a film or an ink material is used when flexibility is required.
On the other hand, in order to secure a low water permeability, which is a unique function of the moisture permeation prevention film for electronic devices, regardless of the material thereof, it is common to form a moisture permeation prevention film in a multilayer structure.
However, in the case of the moisture permeation preventive film manufactured using a glass material or the moisture permeation prevention film formed of a multilayer structure as described above, flexibility is inadequate, the manufacturing process is complicated, and the manufacturing cost is increased accordingly, This is a low problem.
Means for Solving the Problems The present inventors intend to solve the above-mentioned problems by proposing a moisture permeation preventive film composition for electronic devices including aerogels.
In addition, a method of forming a moisture-permeable film for electronic devices by a simple process using the composition is proposed, and an electronic device including the moisture-permeable film is also presented.
In one embodiment of the invention, 1 to 10% by weight of an aerosol; 10 to 50% by weight of a solvent; 0.1 to 5% by weight of an additive; And a binder for the rest of the composition.
Specifically, the description of the aerogels is as follows.
The aerogels may be hydrophobic.
More specifically, the aerogels may comprise silica.
Instead of the airgel, it may be one comprising hydrophobized fumed silica.
The binder will be described as follows.
The binder may include silicone oil.
Alternatively, the binder may comprise at least one member selected from the group consisting of an intramolecular silanol group, an alkoxysilyl group, and polydimethylsiloxane.
The solvent is selected from the group consisting of toluene, ethyl alcohol, methyl ethyl ketone (MEK), N-heptane, and isopropyl alcohol (IPA) As shown in FIG.
The description of the additive is as follows.
The additive may be a surfactant, an antifoaming agent, or a mixture thereof.
In this regard, the surfactant may be selected from the group consisting of sodium alkyl diphenyloxide disulfonate, polyoxyethylene tridecyl ether sulfate, polyalkylene oxide silane, sodium alkyl < RTI ID = 0.0 > Sodium alkyl diphenyloxide disulfonate, and a fluorine-based surfactant. In the present invention,
The antifoaming agent may be at least one or more selected from the group consisting of silicon, polysiloxane, polymethylsiloxane, modified polysiloxane, and ether-modified polysiloxane .
In another embodiment of the present invention, there is provided a moisture barrier coating composition for electronic equipment comprising 1 to 10% by weight of an airgel, 10 to 50% by weight of a solvent, 0.1 to 5% by weight of an additive, ; Applying the moisture and moisture barrier coating composition for electronic devices on a substrate; And drying the moisture permeation preventive film composition for electronic equipment applied on the substrate. The present invention also provides a method of forming a moisture permeation prevention film for electronic equipment.
Each of the above steps will be described below.
In the step of applying the moisture permeation preventing film composition for electronic equipment to the substrate, the application amount of the moisture permeationproof film composition for electronic equipment (m 2 ) per one side of the substrate may be 135 to 1227 g / m 2 .
In another embodiment of the present invention, a substrate; And a moisture permeable membrane for electronic devices, the electronic device being disposed on the substrate, wherein the moisture permeable membrane includes an airgel of 1 to 10 wt%, an additive of 0.1 to 5 wt%, and a binder of the remainder.
The moisture permeation preventive film for electronic devices is as follows.
The thickness of the moisture permeation preventive film for electronic devices may be 100 to 900 탆.
The moisture permeation preventive film for electronic devices may be a single layer.
The description of the above description is as follows.
The substrate may be a flexible substrate.
The flexible substrate may be formed of at least one material selected from the group consisting of polyethylene terephthalate (PET), polyacrylate (PA), polycarbonate (PC), polyethersulfone (PES), polyimide imide, PI), and combinations thereof.
Independently, the substrate may be a rigid substrate.
The rigid substrate may be made of a material selected from glass.
Meanwhile, the electronic device may be a touch panel, a battery, or a display device.
According to the embodiments of the present invention, a moisture permeation preventive film composition for electronic equipment which can reduce the water permeability by including aerogels, thereby preventing the function of the electronic device from deteriorating and improving the service life, and a method of forming a moisture permeation preventive film , And an electronic apparatus.
Furthermore, by securing excellent flexibility of the moisture permeation prevention film, it can be applied to a flexible or wearable display and is applicable to various electronic devices such as a touch panel sensor, a battery, It is possible.
According to the embodiments of the present invention, a moisture permeation preventive film composition for electronic equipment which can reduce the water permeability by including aerogels, thereby preventing the function of the electronic device from deteriorating and improving the service life, and a method of forming a moisture permeation preventive film , And an electronic apparatus.
Furthermore, by securing excellent flexibility of the moisture permeation prevention film, it can be applied to a flexible or wearable display and is applicable to various electronic devices such as a touch panel sensor, a battery, It is possible.
Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.
In one embodiment of the invention, 1 to 10% by weight of an aerosol; 10 to 50% by weight of a solvent; 0.1 to 5% by weight of an additive; And a binder for the rest of the composition.
This is equivalent to a moisture barrier coating composition for electronic devices that includes an airgel (specifically, hydrophobic airgel) to lower water permeability, thereby preventing deterioration of the function of the electronic device and improving the service life.
because of this. It is possible to secure excellent flexibility of the moisture permeation preventive film and to apply to a flexible or wearable display and to various electronic devices such as a touch panel sensor and a battery There is an advantage.
Hereinafter, the moisture permeation preventive film composition for electronic devices will be specifically described.
As described above, 1 to 10% by weight of an aerosol is added to 100% by weight of the total amount of the moisture permeation preventive film composition for electronic devices; 10 to 50% by weight of a solvent; 0.1 to 5% by weight of an additive; And the remainder of the binder. The reason for limiting the content of each of the materials is as follows.
Airgel: 1 to 10 wt%
When the content of the airgel in the moisture permeation preventive film composition for electronic devices satisfies the range of 1 to 10% by weight, the water permeability of the moisture permeation prevention film may be lowered and flexibility may be ensured as described above.
However, if it exceeds 10% by weight, the viscosity of the composition becomes too high, so that it is difficult to uniformly form the moisture barrier layer, and transparency and transparency of the moisture barrier layer may be lowered. On the other hand, if the content is less than 1% by weight, the content thereof is too low, so that the effectiveness is not expected.
Solvent: 10 to 50 wt%
When the content of the solvent in the moisture permeation preventive film composition for electronic equipment is in the range of 10 to 50% by weight, the viscosity and density of the binder, the airgel, and the additive can be appropriately dispersed.
However, when it is 50% by weight or more, the density of the composition is lowered due to an excessively high content of the solvent, and the water permeability of the moisture permeation preventive film thus formed is increased. On the other hand, if it is less than 10% by weight, the viscosity of the composition becomes excessively high, so that the respective substances are not easily dispersed uniformly, and bubbles which are difficult to be removed may be present inside the moisture permeation preventive film thus formed.
Additive: 0.1 to 5 wt%
Depending on the desired properties, the additive may be included in the moisture permeation preventive film composition for electronic devices in an amount of 0.1 to 5% by weight.
However, if it exceeds 5% by weight, the content of the airgel relatively decreases, and the water permeability of the moisture permeation preventive film thus formed can be reduced. On the other hand, when the content is less than 0.1% by weight, it is difficult to expect effectiveness because of an excessively small content.
Hereinafter, each component of the moisture permeation preventive film composition for electronic devices provided in one embodiment of the present invention will be described in more detail.
First, the description of the aerogels is as follows.
The aerogels may be hydrophobic. In this case, the moisture permeability of the moisture permeation preventive film can be remarkably lowered.
More specifically, the aerogels may comprise silica, and such silica aerogels are used in the embodiments described below. Instead of the airgel, it may be one containing fumed silica which has been subjected to hydrophobic treatment.
The particle size of the airgel is not particularly limited, but it is required to be equal to or less than the thickness of the moisture-proofing prevention film to be formed.
The binder will be described as follows.
The binder may include silicone oil.
Alternatively, the binder may comprise at least one member selected from the group consisting of an intramolecular silanol group, an alkoxysilyl group, and polydimethylsiloxane.
The solvent is not particularly limited as long as it is a substance capable of dissolving and uniformly dispersing the airgel, the binder and the additive, as described above.
For example, the solvent may be selected from the group consisting of toluene, ethyl alcohol, methyl ethyl ketone (MEK), N-heptane, and isopropyl alcohol (IPA) , And the like.
In the case of the following examples, ethyl alcohol was used as the solvent.
The additives are described below.
The additive may be a surfactant, an antifoaming agent, or a mixture thereof for imparting various functions or improving physical properties to the moisture and moisture barrier coating composition for electronic devices. That is, as the additive, the surfactant may be used alone, the defoaming agent may be used alone, or the surfactant and the defoaming agent may be mixed and used.
In this regard, the surfactant may be selected from the group consisting of sodium alkyl diphenyloxide disulfonate, polyoxyethylene tridecyl ether sulfate, polyalkylene oxide silane, sodium alkyl < RTI ID = 0.0 > Sodium alkyl diphenyloxide disulfonate, and a fluorine-based surfactant. In the present invention,
That is, only one of the substances listed above as the surfactant may be selected, or two or more substances may be selected in combination. In the following examples, a fluorine-based surfactant was used as the surfactant.
The antifoaming agent may be at least one or more selected from the group consisting of silicon, polysiloxane, polymethylsiloxane, modified polysiloxane, and ether-modified polysiloxane .
That is, only one of the materials listed above may be selected as the antifoaming agent, or a combination of two or more materials may be selected. In the case of the following examples, a silicone antifoaming agent was used as the surfactant.
In another embodiment of the present invention, there is provided a moisture barrier coating composition for electronic equipment comprising 1 to 10% by weight of an airgel, 10 to 50% by weight of a solvent, 0.1 to 5% by weight of an additive, ; Applying the moisture and moisture barrier coating composition for electronic devices on a substrate; And drying the moisture permeation preventive film composition for electronic equipment applied on the substrate. The present invention also provides a method of forming a moisture permeation prevention film for electronic equipment.
Specifically, the moisture permeation preventive film composition for electronic devices may be the same as described above. In this case, the method for forming the moisture-permeable barrier layer for electronic devices may be a simple process of preparing a composition by mixing the raw materials, applying the composition on the substrate, and then drying the composition. It can be said to have the excellent effect mentioned above.
Hereinafter, the above-described steps will be described while omitting duplicate descriptions.
In the step of applying the moisture permeation preventive film composition for electronic equipment to the substrate, the application amount of the moisture permeationproof film composition for electronic equipment (m 2 ) per one side of the substrate may be 135 to 1227 g / m 2 .
When the application amount of the above range is satisfied, the thickness of the moisture-permeable protective film to be finally formed may be 100 to 900 탆, which is a thickness within a range capable of securing flexibility and exhibiting excellent moisture-proof function.
On the other hand, when the application amount of the moisture permeation prevention film composition for electronic equipment is less than 135 g / m 2 per one side of the substrate, the moisture permeation prevention film may be formed with a thin thickness of less than 100 μm, and the effectiveness of the moisture permeation prevention film may be insignificant. When the application amount of the moisture permeation prevention film composition for electronic equipment is more than 1227 g / m 2 per one side of the substrate, the moisture permeation prevention film is formed with an excessively thick thickness exceeding 900 탆, and flexibility and permeability of the moisture permeation prevention film can be ensured none.
The step of drying the moisture permeation preventive film composition for electronic equipment coated on the substrate may be performed for 1 to 3 hours at a temperature of 80 to 140 ° C. In this process, The solvent in the moisture permeation barrier film composition may be removed and a moisture barrier film composed of the remaining components may be formed.
In another embodiment of the present invention, a substrate; And a moisture permeable membrane for electronic devices, the electronic device being disposed on the substrate, wherein the moisture permeable membrane includes an airgel of 1 to 10 wt%, an additive of 0.1 to 5 wt%, and a binder of the remainder.
Specifically, the moisture-permeable film for electronic devices may be formed using the above-described moisture-permeable film composition for electronic devices and the method of forming the moisture-permeable film for electronic devices described above.
Hereinafter, the components that are the same as those described above will be omitted, and the respective components of the electronic apparatus will be described.
The moisture permeation preventive film for electronic devices is as follows.
The thickness of the moisture permeation preventing film for electronic devices is not particularly limited, but may be 100 to 900 탆. As described above, when the thickness is less than 100 탆, the thickness is too thin to prevent the moisture permeation. If the thickness exceeds 900 탆, the thickness becomes too thick, which may affect the flexibility.
The moisture permeation preventive film for electronic devices may be a single layer. Specifically, the moisture permeation preventing film for electronic devices satisfying the above-mentioned composition can exhibit excellent moisture permeation prevention function even if it is composed of a single layer rather than a multilayer structure. In addition, as mentioned above, the moisture barrier layer made of a multi-layer structure is not flexible, but the moisture barrier layer for an electronic device having the single layer may exhibit excellent flexibility.
The description of the above description is as follows.
The substrate may be a flexible substrate. In this case, it is applicable to a flexible or wearable display.
The flexible substrate is not particularly limited as long as it is a material having no flexibility. However, the flexible substrate may be made of a material such as polyethylene terephthalate (PET), polyacrylate (PA), polycarbonate (PC) A material selected from the group consisting of polyethersulfone (PES), polyimide (PI), and combinations thereof.
Independently, the substrate may be a rigid substrate. This means a substrate which is generally used even now.
The rigid substrate is not particularly limited as long as it is a material having no flexibility, but may be made of a material selected from glass.
The electronic device may be a touch panel, a battery, or a display device. Examples of the display device include a liquid crystal display (LCD) LCDs, light emitting diodes (LEDs), and organic light emitting diodes (OLEDs). As such, it is applicable to various electronic apparatuses.
Hereinafter, preferred embodiments of the present invention and evaluation examples thereof will be described. However, the following examples are only a preferred embodiment of the present invention, and the present invention is not limited to the following examples.
Example 1 to 5
First, each of the raw materials was mixed with the composition shown in Table 1 below to prepare a moisture and moisture barrier coating composition for electronic equipment.
Specifically, silica oil (manufactured by JIOS AEROGEL) is used as the binder of the raw material, silicone oil (Shin-Etsu of the manufacturer), airgel, ethyl alcohol (ethyl alcohol, Silicone antifoaming agent (AIR PRODUCTS) was used as the antifoaming agent, and fluorinated surfactant (Momentive) was used as the surfactant.
Then, the moisture barrier layer composition for electronic devices was coated on the substrate and dried in a dry oven controlled at 110 캜 for 2 hours to form a moisture barrier layer having a thickness of 500 탆.
At this time, depending on the evaluation type, the substrate may be a commercially available PET film, which is a type of flexible substrate, in a width of 5 cm, a length of 5 cm, and a thickness of 100 m, or a commercially available rigid substrate Was cut into a width of 10 cm, a length of 10 cm, and a thickness of 3 mm.
The coating amount per side of the substrate was 520 g / m 2 , and the thickness of the moisture permeation barrier formed at this time was 500 μm. In the case of transparency evaluation described later, a moisture permeation prevention film was formed only on one half of the base material, and the place where the moisture permeation prevention film was formed and the place where the moisture permeation prevention film was not formed were evaluated.
Comparative Example One
As shown in the following Table 1, the same steps as those of Examples 1 to 5 were carried out except that only the binder was used to form a moisture barrier layer on the substrate.
Note: In the above table, the content of each substance is expressed as% by weight based on 100 wt% of the total weight of the composition.
Evaluation example : Breathing Evaluation of physical properties of barrier film
Transparency, flexibility, light transmittance (%), and water permeability (g / m 2 · day) of the respective moisture barrier films formed in Examples 1 to 5 and Comparative Example 1 were evaluated, Respectively.
(Transparency)
(Flexibility)
(g / m 2 · day)
Specifically, the conditions of each evaluation are as follows.
Transparency (Transparency) Rating: If you used for the glass substrates were evaluated on the extent of the background looks good on the back, up and down. Particularly, photographs taken in evaluating transparency for Examples 1, 3, 5 and Comparative Example 1 are shown in Figs. 1 to 4, respectively.
Evaluation of Flexibility : When the PET film was used as the base material, evaluation was made as to whether the moisture permeation preventive film fell off or the surface was damaged when bent at 90 ° or more. Particularly, photographs taken while evaluating the flexibility of Example 5 are shown in Figs. 5 and 6. Fig.
Evaluation of light transmittance (%) : When the PET film was used as the substrate, the light transmittance was measured using a color difference meter.
Evaluation of water permeability : When a PET film was used as a substrate, the water permeability was evaluated with the ASTM F1249 standard and the corresponding equipment.
The results of these evaluations show that in Examples 1 to 5 in which not only the binder but also the composition including the silica airgel and the additives were applied to the moisture permeation preventive film, transparency and transparency were obtained while securing the same degree of flexibility as Comparative Example 1 in which only the binder was applied to the moisture permeation preventive film. It is understood that the light transmittance can be lowered and the water permeability, which is a characteristic required especially for the moisture barrier film, can be significantly lowered.
It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. As will be understood by those skilled in the art. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.
Claims (20)
10 to 50% by weight of a solvent;
0.1 to 5% by weight of an additive; And
A binder of the remainder,
Wherein the binder comprises at least one member selected from the group consisting of silicone oil, a silanol group in the molecule, an alkoxysilyl group, and polydimethylsiloxane,
Moisture barrier composition for electronic devices.
In the airgel,
Lt; / RTI >
Moisture barrier composition for electronic devices.
In the airgel,
Silica. ≪ RTI ID = 0.0 >
Moisture barrier composition for electronic devices.
Instead of the airgel,
Lt; RTI ID = 0.0 > hydrophobicized < / RTI > fumed silica.
Moisture barrier composition for electronic devices.
The solvent,
At least one member selected from the group consisting of toluene, ethyl alcohol, methyl ethyl ketone (MEK), N-heptane, and isopropyl alcohol (IPA) ≪ / RTI >
Moisture barrier composition for electronic devices.
Preferably,
Surfactants, antifoaming agents, or mixtures thereof.
Moisture barrier composition for electronic devices.
The surfactant,
Sodium alkyl diphenyloxide disulfonate, polyoxyethylene tridecyl ether sulfate, polyalkylene oxide silane, sodium alkyldiphenyloxide disulfonate, diphenyl ether disulfonate, and fluorinated surfactants.
Moisture barrier composition for electronic devices.
The anti-
Wherein the substrate comprises at least one or more selected from the group consisting of silicon, polysiloxane, polymethylsiloxane, modified polysiloxane, and ether-modified polysiloxane.
Moisture barrier composition for electronic devices.
Applying the moisture and moisture barrier coating composition for electronic devices on a substrate; And
And drying the moisture permeation preventive film composition for electronic equipment applied on the substrate,
Wherein the binder comprises at least one member selected from the group consisting of silicone oil, a silanol group in the molecule, an alkoxysilyl group, and polydimethylsiloxane,
A method of forming a moisture barrier film for electronic devices.
In the step of applying the moisture barrier coating composition for electronic devices on a substrate,
The application amount of the moisture permeation preventive film composition for electronic equipment (m 2 )
135 to 1227 g / m < 2 >
A method of forming a moisture barrier film for electronic devices.
A moisture permeable membrane for electronic equipment, which is located on the substrate and comprises 7 to 10% by weight of airgel, 0.1 to 5% by weight of an additive, and a binder of the remainder,
Wherein the binder comprises at least one member selected from the group consisting of silicone oil, a silanol group in the molecule, an alkoxysilyl group, and polydimethylsiloxane,
Electronics.
The thickness of the moisture-
100 to 900 < RTI ID = 0.0 >
Electronics.
The moisture-permeable barrier film for electronic devices may further comprise:
Wherein the substrate is a single layer.
Electronics.
The above-
In a flexible substrate,
Electronics.
The flexible substrate may include:
(PET), polyacrylate (PA), polycarbonate (PC), polyethersulfone (PES), polyimide (PI) and combinations thereof , ≪ / RTI > and < RTI ID = 0.0 >
Electronics.
The above-
A rigid substrate,
Electronics.
The rigid substrate may be a rigid substrate,
≪ RTI ID = 0.0 > a < / RTI > glass,
Electronics.
The electronic device includes:
A touch panel, a battery, or a display device,
Electronics.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200241327Y1 (en) * | 2001-04-03 | 2001-10-10 | (주)세라켐 | Wall equipped with means for prevention illegal sticking |
| JP5698199B2 (en) * | 1999-09-28 | 2015-04-08 | キャボット コーポレイションＣａｂｏｔ Ｃｏｒｐｏｒａｔｉｏｎ | Surface coating composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5698199B2 (en) * | 1999-09-28 | 2015-04-08 | キャボット コーポレイションＣａｂｏｔ Ｃｏｒｐｏｒａｔｉｏｎ | Surface coating composition |
| KR200241327Y1 (en) * | 2001-04-03 | 2001-10-10 | (주)세라켐 | Wall equipped with means for prevention illegal sticking |
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