KR101775454B1 - Air-flow Control System And Its Control Method for Application Tester - Google Patents

Air-flow Control System And Its Control Method for Application Tester Download PDF

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Publication number
KR101775454B1
KR101775454B1 KR1020150160955A KR20150160955A KR101775454B1 KR 101775454 B1 KR101775454 B1 KR 101775454B1 KR 1020150160955 A KR1020150160955 A KR 1020150160955A KR 20150160955 A KR20150160955 A KR 20150160955A KR 101775454 B1 KR101775454 B1 KR 101775454B1
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KR
South Korea
Prior art keywords
air
outside
supplied
cpus
discharging
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Application number
KR1020150160955A
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Korean (ko)
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KR20170057618A (en
Inventor
이영철
김행곤
현 여
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이영철
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Priority to KR1020150160955A priority Critical patent/KR101775454B1/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/26—Functional testing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/26—Functional testing
    • G06F11/273—Tester hardware, i.e. output processing circuits

Abstract

The present invention relates to an air flow control device for an application tester and an air flow control method for the same, and includes first and second cooling fans (3a, 3c) for supplying outside air to the inside from the left and right sides of the memory substrate, Wow; First and second air knives 5a and 5b for blocking external air supplied from the first and second cooling fans 3a and 3c and switching the direction of air into the memory substrate, 5b); The air supplied from the first and second air knives 5a and 5b may be supplied to the first and second CPUs 2a and 2b inside the first and second CPUs 2a and 2b, First and second air blow gauges (4a, 4b) detachably installed on the memory substrate to concentrate the air flow; And first and second exhaust fans (3b and 3d) for discharging the internal air to the outside in order to circulate air that has passed through the first and second CPUs (2a and 2b) .

Description

[0001] The present invention relates to an air flow control system and an air flow control method for an application tester,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an air flow adjusting device and a method of controlling the air flow, and more particularly, to a method of controlling an air flow adjusting device of a main board device The test program is slowed or stopped due to the heat emission and congestion caused by the operation of the application tester to solve the ineffective problem that the operation temperature becomes high and the module is adversely affected. And a method of controlling the air flow.
The present invention is the result of research carried out by the Institute for Creation Science and Information and Communication Technology Promotion Center (IITP-2016-H8601-16-1007).

The structure and operation of the conventional airflow control system will be described with reference to FIG.

FIG. 1 is a cross-sectional view illustrating an air flow system applied to solve a problem caused by heat discharge and stagnation caused by operation of a main board device according to a conventional method.

Referring to FIG. 1, cooling fans 3a and 3b for blowing heat generated in the memory module 1 and the first and second CPUs 2a and 2b, while operating a main board, And the cooling fans (3c, 3d) for discharging are operated and rotated to generate wind and forced cooling.

The fan cooling fans 3a and 3b sequentially cool the first CPU 2a and the second CPU 2b by introducing outside air into the module and passing through the first and second CPUs 2a and 2b One air is discharged to the outside by the operation of the discharge cooling fans 3c and 3d provided on the discharge port side.

At this time, the air discharged to the outside passes through the surface temperature of the first and second CPUs 2a and 2b of 60 to 70 ° C and the temperature becomes 50 ° C or more, And has an inflow structure.

Accordingly, there is a problem that it is very difficult to satisfy the operating temperature condition of the elements including the CPU because the external air must be low, and the increased temperature is re-circulated in a vicious circle.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to eliminate the heat flow of a high temperature of a main board, which occurs when a memory module is tested in an application tester, And an object of the present invention is to provide an airflow control device and an adjustment method thereof for an application tester that provides an operating temperature condition that an application tester can normally test.

The apparatus for adjusting the airflow of the application tester according to the embodiment of the present invention includes first and second cooling fans (3a, 3c) for supplying external air to the inside and the left side of the memory substrate; First and second air knives 5a and 5b for blocking external air supplied from the first and second cooling fans 3a and 3c and switching the direction of air into the memory substrate, 5b); The air supplied from the first and second air knives 5a and 5b may be supplied to the first and second CPUs 2a and 2b inside the first and second CPUs 2a and 2b, First and second air blow gauges (4a, 4b) detachably installed on the memory substrate to concentrate the air flow; And first and second exhaust fans (3b and 3d) for discharging the internal air to the outside in order to circulate air that has passed through the first and second CPUs (2a and 2b) The first and second air knives (5a, 5b) function to mix compressed air by concentrating the direction by sucking air supplied from the outside. As shown in Fig.

Also, an air flow control method of an air flow control system of an application tester according to an embodiment of the present invention includes: an external air sucking step of introducing air into the outside air using a cooling fan; Cooling the heat of the main board device; An air knife for reducing the inflow temperature of the air sucked in the external air sucking step to mix compressed air; An air concentration concentrator for supplying the compressed air to the heat generating element as much as possible, A discharging step of discharging the heated internal air to the outside of the tester using a discharge fan; An outdoor discharge step of discharging hot air discharged to the outside to the outside using a dust collecting facility so as not to be scattered; As shown in Fig.

According to the embodiment of the present invention, it is possible to provide a structure for eliminating the heat flow generated by the operation of the main board device, thereby improving the characteristics of the devices and reducing the test time and defective rate, Flow control device can be provided.

In addition, according to the embodiment of the present invention, it is possible to concentrate the flow of the air supplied and discharged by the cooling fan, thereby greatly reducing the heat generated in the internal components.

1 is a sectional view for explaining a structure of an air flow system for solving the problem caused by the discharge and stagnation of heat generated by operation of a conventional main board device,
FIG. 2 to FIG. 3 are diagrams sequentially illustrating the method of implementing the air flow system according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

(Example)

The airflow control system of the application tester according to the present invention comprises first and second cooling fans (3a, 3c) for supplying outside air to the inside from the left and right sides of the memory substrate; First and second air knives 5a and 5b for blocking external air supplied from the first and second cooling fans 3a and 3c and switching the direction of air into the memory substrate, 5b); The air supplied from the first and second air knives 5a and 5b may be supplied to the first and second CPUs 2a and 2b inside the first and second CPUs 2a and 2b, First and second air blow gauges (4a, 4b) detachably installed on the memory substrate to concentrate the air flow; And first and second exhaust fans (3b and 3d) for discharging the internal air to the outside in order to circulate air that has passed through the first and second CPUs (2a and 2b) The first and second air knives 5a and 5b function to mix compressed air by concentrating the direction by sucking the air supplied from the outside of the air knife 5a and 5b, And performing the above-described operations.

2 to 3, the reference numerals in the drawings denote constitutions and actions of the present invention.

Reference numeral 1 denotes a memory module.

Reference numeral 2 denotes the first and second CPUs 2a and 2b and is one of the heat generating elements generating high heat according to the operation.

Reference numerals 3a and 3c denote first and second cooling fans. These are cooling fans for supplying outside air into the memory substrate.

And reference numerals 3b and 3d denote first and second exhaust fans. They function to circulate the inside and to discharge the air with higher temperature to the outside.

Reference numerals 4a and 4b denote first and second air supply converters. And controls the direction to concentrate and supply the air sucked into the heating element. Which is detachable and detachable so as to facilitate internal cleaning and replacement.

Reference numerals 5a and 5b denote first and second air knives, which concentrate air supplied from the outside to supply strong air (wind) to the inside of the memory substrate.

Conventionally, cooling fans are provided on one side (for example, left side) of the memory substrate, while discharge fans are provided on the other side. However, the present invention is characterized in that the configuration is changed in order to effectively discharge the internal air.

That is, the first cooling fan 3a and the first cooling fan 3c are provided at one side (left side)

The second cooling fan 3b and the second cooling fan 3d are installed on the other side (right side) to maximize the cooling efficiency.

Next, an air flow control method of an air flow control system of an application tester according to the present invention comprises the steps of introducing outside air by utilizing a suction fan, supplying the introduced air to a main board device A step of cooling the exothermic heat of the tester, a step of discharging the air whose temperature has risen to the outside of the tester, and a step of discharging the hot air discharged to the outside using a dust collecting facility .

More specifically, an air flow control method of an air flow control system of an application tester according to an embodiment of the present invention includes: an external air sucking step of introducing air into the outside air by using a cooling fan; Cooling the heat of the main board device; An air knife for reducing the inflow temperature of the air sucked in the external air sucking step to mix compressed air; An air concentration concentrator for supplying the compressed air to the heat generating element as much as possible, A discharging step of discharging the heated internal air to the outside of the tester using a discharge fan; An outdoor discharge step of discharging hot air discharged to the outside to the outside using a dust collecting facility so as not to be scattered; .

The air flow control system of the application tester and the control method thereof according to the embodiment of the present invention will be described in more detail.

The air flow control system of the application tester according to the embodiment of the present invention introduces the external air by the force of Air Flow 75CFM / Static 10.60mm-H2O by using a fan. The compressed air is supplied together with the introduced external air and the air knife.

At this time, the proper temperature of the compressed air is maintained at about 14 ° C. In order to mix the external air and the compressed air well, an air bar for supplying compressed air is installed in accordance with the flow direction of the fan.

The inflow air is cooled and vortexed through the air blower so that the maximum amount of outside air can flow to the heating element of the main board element, so that the high temperature air passing through the heating element Air flow coupling is performed through a fan for discharging, then the air is flown in the direction of the air flow, and the air is discharged to the outside through an exhaust dust collecting facility.

The configuration, operation, and effect of the airflow control system of the application tester according to the embodiment of the present invention will be described in more detail.

FIGS. 2 to 3 are views sequentially illustrating a method of implementing an air flow system of an application tester according to the present invention.

Referring to FIG. 2, first and second air knives 5a and 5b (first and second cooling fans 5a and 5b) are provided when first and second cooling fans 3a and 3c rotate and external air flows in. The compressed air is tilted and mixed with the outside air.

Next, the air mixed with the outside air is supplied to the first and second air blowers 4a and 4b installed inside the first and second air knives 5a and 5b .

The first and second air blowers 4a and 4b function to concentrate the direction of the air supplied and concentrate the cooling air to the first and second CPUs 2a and 2b, 2b so that the air of high temperature is discharged through the first and second discharge fans 3b, 3d.

3, the discharged high-temperature air is supplied to a plurality of air ducts 6a and 6b (not shown) installed on the outside so as not to be re-introduced through the first and second cooling fans 3a and 3c Through a plurality of air ducts 6a and 6b and an air flow duct 8 through a coupling 7 structure that concentrates the air discharged through the plurality of air ducts 6a and 6b into one place. And is discharged to the outside.

The present invention can be applied to a system having a variety of structures in which a main board is designed and tested in a vertical structure, and a system in which module-type products are applied to an application test system It is applicable.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be possible.

1: Memory Module
2a and 2b: first and second CPUs
3a and 3c: first and second cooling fans,
3b and 3d: first and second exhaust fans,
4a, 4b: First and second air blowers (Air Blow Guard)
5a and 5b: first and second air knives (air knife)
6a and 6b: first and second air ducts,
7: Coupling
8: Air Flow Duct

Claims (5)

delete First and second cooling fans (3a, 3c) for supplying outside air to the inside from the left and right sides of the memory substrate; First and second air knives 5a and 5b for blocking external air supplied from the first and second cooling fans 3a and 3c and switching the direction of air into the memory substrate, 5b); The air supplied from the first and second air knives 5a and 5b may be supplied to the first and second CPUs 2a and 2b inside the first and second CPUs 2a and 2b, First and second air blow gauges (4a, 4b) detachably installed on the memory substrate to concentrate the air flow; And first and second exhaust fans (3b and 3d) for discharging the internal air to the outside in order to circulate air that has passed through the first and second CPUs (2a and 2b) 1. An airflow control system for an application tester comprising:
Wherein the first and second air knives (5a, 5b) function to mix the compressed air by concentrating the direction by sucking the air supplied from the outside. system.
delete delete A method of controlling airflow in an airflow control system of an application tester,
An external air sucking step of introducing air into the outside by utilizing a cooling fan;
Cooling the heat of the main board device;
An air knife for reducing the inflow temperature of the air sucked in the external air sucking step to mix compressed air;
An air concentration concentrator for supplying the compressed air to the heat generating element as much as possible,
A discharging step of discharging the heated internal air to the outside of the tester using a discharge fan;
An outdoor discharging step of discharging the hot air discharged to the outside to the outside using a dust collecting facility so as not to be scattered; To
Wherein the air flow control system is configured to control the air flow of the application tester.
KR1020150160955A 2015-11-17 2015-11-17 Air-flow Control System And Its Control Method for Application Tester KR101775454B1 (en)

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KR101775454B1 true KR101775454B1 (en) 2017-09-06

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10698460B2 (en) 2017-03-13 2020-06-30 Samsung Electronics Co., Ltd. Advanced thermal control for SSD
US10809780B2 (en) 2017-03-13 2020-10-20 Samsung Electronics Co., Ltd. Active disturbance rejection based thermal control

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101034767B1 (en) 2009-02-17 2011-05-17 오성엘에스티(주) Burn-in tester for testing semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101034767B1 (en) 2009-02-17 2011-05-17 오성엘에스티(주) Burn-in tester for testing semiconductor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10698460B2 (en) 2017-03-13 2020-06-30 Samsung Electronics Co., Ltd. Advanced thermal control for SSD
US10809780B2 (en) 2017-03-13 2020-10-20 Samsung Electronics Co., Ltd. Active disturbance rejection based thermal control
US11460898B2 (en) 2017-03-13 2022-10-04 Samsung Electronics Co., Ltd. Advanced thermal control for SSD
US11709528B2 (en) 2017-03-13 2023-07-25 Samsung Electronics Co., Ltd. Active disturbance rejection based thermal control
US11755085B2 (en) 2017-03-13 2023-09-12 Samsung Electronics Co., Ltd. Advanced thermal control for SSD

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