KR101773148B1 - System for forming conductive pattern irradiated with light on substrate coating conductivity fine metal ink - Google Patents

System for forming conductive pattern irradiated with light on substrate coating conductivity fine metal ink Download PDF

Info

Publication number
KR101773148B1
KR101773148B1 KR1020150157656A KR20150157656A KR101773148B1 KR 101773148 B1 KR101773148 B1 KR 101773148B1 KR 1020150157656 A KR1020150157656 A KR 1020150157656A KR 20150157656 A KR20150157656 A KR 20150157656A KR 101773148 B1 KR101773148 B1 KR 101773148B1
Authority
KR
South Korea
Prior art keywords
substrate
metal
light
conductive material
conductive
Prior art date
Application number
KR1020150157656A
Other languages
Korean (ko)
Other versions
KR20170054912A (en
Inventor
우규희
이택민
권신
김인영
최영만
강동우
김광영
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Priority to KR1020150157656A priority Critical patent/KR101773148B1/en
Priority to CN201680062921.8A priority patent/CN108353503B/en
Priority to PCT/KR2016/011940 priority patent/WO2017073967A1/en
Publication of KR20170054912A publication Critical patent/KR20170054912A/en
Application granted granted Critical
Publication of KR101773148B1 publication Critical patent/KR101773148B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • B08B7/026—Using sound waves
    • B08B7/028—Using ultrasounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink includes a coating device for applying a metal conductive material to the flexible plastic substrate, a coating device positioned at a rear end of the coating device so as to be horizontal with the substrate, And a light generating device for generating light toward the substrate so that the metal conductive material is irradiated with light through the mask and the pattern, wherein the metal conductive material is formed in a pattern formed on the mask in a short time through the light generated in the light generating device There is an effect that sintering can be performed on the substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink,

The present invention relates to a system for forming a conductive pattern on a substrate by irradiating and sintering light onto a substrate coated with a conductive metal ink, and more particularly, to a system for forming a conductive pattern on a substrate through a pattern formed through the mask, To a system for forming a conductive pattern by being irradiated onto a substrate coated with a metal ink and sintered according to the pattern of the mask.

Currently, metal conductive inks used in printing electronics are inks mixed with gold, silver and copper microparticles. A high-temperature thermal sintering process is generally used as a method of sintering conductive ink.

However, such a thermal sintering process is disadvantageous in that it is long in the process time and is difficult to apply to a plastic substrate because it is a method of heating at a high temperature of 200 ° C to 350 ° C and cooling the sintered metal nano-particles.

In addition, when copper metal which is easily oxidized in the atmosphere is applied to such a heat sintering process, it must be carried out in an inert gas or a high vacuum atmosphere, which causes a disadvantage that the process cost is increased.

Recently, an apparatus for sintering ink mixed with metal fine particles, which are easily oxidized in the atmosphere, through irradiation of plasma, infrared rays, laser, intense pulsed light (IPL) and the like has been developed.

The light sintering apparatus has an advantage in that it can sinter the fine particles at a low temperature and in a very short process time as compared with the conventional thermal sintering apparatus.

On the other hand, when fabricating a metal pattern using a conductive ink, generally, a conductive ink is coated on the entire surface of the substrate and a metal pattern is formed using a process such as wet etching, dry etching, or photolithography, or a direct representation method such as inkjet printing A metal pattern is formed by using a printing method of the above.

However, the above methods are difficult to apply to the production of a large area metal pattern rather than a local part, and there is a limit to increase the production speed.

Therefore, even if the process is carried out in the air, a new patterning technique based on the photo-sintering process is employed to ensure oxidation stability of metals such as copper, which are easily oxidized in the atmosphere, There is a need for research on methods and apparatuses for fabricating metal conductive patterns at high speed.

Korean Patent Publication No. 10-2012-0132424 (2012.12.05.) Korean Registered Patent No. 10-1400605 (May 21, 2014)

SUMMARY OF THE INVENTION It is an object of the present invention, which has been made in view of the above circumstances, to provide a method of forming a pattern on a substrate, in which light is applied to ink through a pattern formed in the mask, so that the metal fine particles coated on the substrate are self-nanoembedding Irradiating light onto a substrate coated with a conductive metal ink capable of forming a large-sized conductive pattern at a high speed by removing the metal fine particles in the region not blocked by the mask, To provide a system for forming a pattern.

In order to accomplish the above object, a system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink according to an embodiment of the present invention includes a coating device for applying a solution containing metal nano-powder to a flexible plastic substrate, And a light generating device positioned at the rear end of the application device so as to be horizontal with the substrate and generating light toward the substrate so that light is irradiated onto the metal coating layer on the substrate through the through pattern formed in the mask.

The apparatus may further include a supply roll wound around the substrate and a recovery roll spaced a predetermined distance from the supply roll and rewinding the substrate extended from the supply roll.

It is also possible to use a measuring device for measuring the distance between the mask and the light generating device and the substrate, a height moving device for moving the mask or light generating device in a direction perpendicular to the substrate, a marker formed on the mask, A sensing device, and a horizontal moving device for moving the mask or light generating device in a direction parallel to the substrate.

In addition, the metal nano powder may include a powder having one or more of various shapes such as wire, rod, or sphere, which is made of any one of metal materials of gold, silver, aluminum, copper, nickel and platinum.

The metal nanopowder is mixed with a solvent capable of dispersing the metal powder so as to be coated on the substrate in a solution form.

Further, in addition to the metal nano-powder, gallium-phosphorus (GaP), oxidation zirconate kotyum (ZrO 2), silicon (Si), cadmium sulfide (CdS), titanium dioxide (TiO 2), zinc oxide (ZnO), iron oxide (Fe 2 O 3 ), tungsten oxide (WO 2 ), and tin oxide (SnO 2 ). In particular, the semiconductor powder may have a band gap band gap is 3.5 eV or less.

Further, the light generating device may be an INTEL PULSED LIGHT (IPL) capable of emitting a complex light having a wide wavelength band.

In addition, it may further comprise an adhesive roll in contact with the substrate so as to collect the coated metal powder in the region not irradiated with light.

Further, the adhesive roll is positioned between the light generating device and the recovery roll, and the outer peripheral surface of the adhesive roll is shielded by the mask and is not irradiated with light, so that the metal powder having low adhesive force with the substrate can be attached.

Further, a cleaning device may be provided at the rear end of the adhesive roll for wiping off the metal nano powder having a low adhesive force with the substrate by being shielded by the mask and not being irradiated with light.

The cleaning device may include a fabric for wiping the metal nanoparticles, a mechanism for supplying a cleaning solvent to the fabric, and a mechanism for removing the coating layer remaining on the substrate by immersing in a cleaning solvent and ultrasonic cleaning may be included .

Further, the mask may be made of any one of metal, paper, and fabric that does not transmit light.

According to the system for forming the conductive pattern by irradiating light onto the substrate coated with the conductive metal ink of the present invention as described above, the metal nano powder can be photo-sintered for a very short time, so that even if copper is applied, It is expected.

In addition, it has an effect that it can be easily applied to a flexible and transparent plastic substrate which is poor in temperature.

Particularly, since the light generated in the light generating device is irradiated on the metal nano powder layer applied to the substrate in the form of a pattern penetrating the mask, the powder in the region irradiated with light is photo-sintered in a short time, (self-embedding), the adhesion to the substrate is excellent.

On the other hand, since the powder in the non-irradiated area is not sintered and has poor adhesion with the substrate, the area is removed by adhesive tape or rubbed with a cloth to remove the metal conductive pattern to a large area , Enabling high-speed production.

1 is a schematic diagram of a system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink according to a first embodiment of the present invention;
2 is a schematic diagram of a system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, it should be noted that the same components or parts among the drawings denote the same reference numerals whenever possible.

1, a system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink according to an embodiment of the present invention includes an applicator (not shown) for applying a metal conductive material 120 to a flexible plastic substrate 110 The mask 200 is disposed at a rear end of the coating device 100 so as to be parallel to the substrate 110. The mask 200 has a pattern 210 formed thereon and the metal conductive material 120 is irradiated with light And a light generating device 300 for generating light toward the substrate 110, as needed.

The metal conductive material 120 includes a group of nanowires of any one of gold, silver, aluminum, copper, nickel, and platinum or a group of nano powders of gold, silver, aluminum, copper, nickel, do.

The metal conductive material 120 absorbs heat through the irradiated light in addition to a cluster of the nanowires or a cluster of the nano powder described above and has a characteristic that the adhesion property with respect to the substrate 110 is excellent, The substrate 110 may include a patternable material.

The metal conductive material 120 further includes a solvent that is mixed with the nanowire clusters or the nanoflower clusters.

Solvent, gallium-phosphorus (GaP), oxidation zirconate kotyum (ZrO 2), silicon (Si), cadmium sulfide (CdS), titanium dioxide (TiO 2), zinc (ZnO), iron oxide (Fe 2 O 3) oxide, And at least one semiconductor powder selected from the group consisting of tungsten oxide (WO 2 ) and tin oxide (SnO 2 ). The semiconductor powder preferably has a band gap of 3.5 eV or less.

The application device 100 applies the metal conductive material 120 to the substrate 110 through any one of spin coating, slot die coating, gravure coating, bar coating, dip coating, and spray coating. In one embodiment of the present invention, the application device 100 includes an injector capable of spraying a solvent containing the metal conductive material 120 toward the substrate 110. [

In one embodiment of the present invention, the optical generation apparatus 300 is an INTEL PULSED LIGHT (IPL) capable of emitting a complex light of a wide wavelength band. The IPL (e.g., NOVACENTRIX PURGE 1300) can induce light sintering of the metal conductive material 120 for a very short process time in milliseconds, and thus can be applied to a so-called roll-to-roll printing system.

In addition, the metal conductive material 120 can be sintered at a very low process temperature, and the process temperature is particularly low, so that deformation of the substrate 110 is prevented even if the plastic substrate 110 is used.

One embodiment of the present invention includes a feed roll 400 with a flexible substrate 110 wrapped thereon and a plurality of rolls 400 spaced a predetermined distance from the feed roll 400 and rewinding the substrate 110 unwound from the feed roll 400 By further including the recovery roll 500, a roll-to-roll printing system as described above is constructed.

One embodiment of the present invention further includes an adhesive roll 600 in contact with the substrate 110 to recover the metal conductive material 120 applied to the substrate 110. The adhesive roll 600 is positioned between the light generating device 300 and the recovery roll 500 and is adhered to the outer circumferential surface of the adhesive roll 600. The light generated in the light generating device 300 is blocked by the mask 200 by the adhesive force of the adhesive material so that the metal conductive material 120 not irradiated with light, that is, the metal conductive material 120 Is recovered from the substrate 110.

The mask 200 is fabricated to have low light transmittance and is made of metal, paper, or cloth.

An embodiment of the present invention also includes a measuring device for measuring a distance between the mask 200 and the light generating device 300 and the substrate 110 and a measuring device for measuring the distance between the mask 200 and the light generating device 300 A sensing device for sensing a marker formed on the mask 200 and a marker formed on the substrate 110 and a mask 200 or a light generating device 300 for moving the substrate 200 110 in a horizontal direction.

When the distance between the light generating device 300 and the mask 200 and the substrate 110 is equal to or greater than the threshold value, light exceeding an appropriate amount of the generated light generated through the light generating device 300 can not reach the substrate 110. Because the generated light diffuses to the periphery through the gap existing between the light generating device 300, the mask 200, and the substrate 110. That is, the occurrence of photo-sintering of the metal conductive material 120 may be insufficient, or a pattern shape error may occur.

Taking this into consideration, the measuring apparatus and the height moving apparatus are operated so that the distance between the light generating device 300 and the mask 200 and the substrate 110 is below the threshold value.

In addition, after confirming that the markers formed on the substrate 110 and the markers formed on the mask 200 coincide with each other, light is generated by the light generating device 300 so that the positions of the substrate 110 and the mask 200 are shifted The shape error of the conductive pattern that can be generated can be minimized.

The operation procedure of the system for forming the conductive pattern by irradiating light onto the substrate coated with the conductive metal ink of the present invention will be described in more detail as follows. The substrate 110 is moved from the supply roll 400 to the recovery roll 500 and stops moving when positioned under the mask 200 and moves the markers and masks The markers formed on the substrate 200 are aligned. When the markers formed on the substrate 110 and the markers formed on the mask 200 are aligned, light is generated in the light generating device 300.

Alternatively, by repeatedly turning on / off the light generating device 300 by moving the substrate 110 continuously from the supply roll 400 to the recovery roll 500, the conductive pattern can be continuously As shown in Fig.

The light generated in the light generating device 300 is irradiated to the metal conductive material 120 applied to the substrate 110 through the pattern 210 penetrating the mask 200.

The exposed portions of the metal conductive material 120 applied to the substrate 110 are photo-sintered to the substrate 110.

The substrate 110 is then moved from the supply roll 400 toward the recovery roll 500 and is not optically sintered to the metal conductive material 120 so that the substrate 110 is not self- A conductive pattern is left on the substrate 110 in the same shape as the shape of the pattern 210 by moving to the adhesive roll 600 by an adhesive force as a portion having a low adhesive force with the adhesive roll 600 contacts the adhesive roll 600.

A cleaning device 700 is provided at the rear end of the light generating device 300 so that the metal conductive material 120 applied to the substrate 110 can be wiped off at the rear end of the contact roll 600 as shown in FIG. .

As described above, the metal conductive material 120 includes a cluster of nanowires or a cluster of nanoflowers and a solvent. The cleaning apparatus 700 includes a cleaning towel (not shown) in which a solvent capable of cleaning the metal conductive material 120 in an area not irradiated with light is buried and a mechanism (not shown) for supplying a solvent with the cleaning towel And the cleaning towel is brought into contact with the substrate 110 to wipe off the non-sintered metal conductive material 120.

In some cases, the cleaning apparatus 700 may include an ultrasonic cleaner (not shown) containing a solvent. The ultrasonic cleaner separates the unsintered metal conductive material 120 from the substrate 110 by applying vibration or ultrasonic waves to the solvent containing the substrate 110. The ultrasonic cleaner includes a mechanism (not shown) for generating vibration or ultrasonic waves.

The cleaning device 700 may be installed on the front side of the contact roll 600, may be used alone, and may include a drying device (not shown) capable of drying the solvent at the rear end of the cleaning device 700 .

As described above, the system for photo-sintering fine metal according to the present invention to form a conductive pattern on a substrate has been described with reference to the drawings. However, the present invention is not limited to the embodiments and drawings disclosed herein It is to be understood that various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.

100: Coating device 110:
120: metal conductive material 200: mask
210: pattern 300: light generating device
400: feed roll 500: recovery roll
600: Adhesive roll 700: Cleaning device

Claims (14)

A coating device for applying a metal conductive material to the flexible plastic substrate;
A mask positioned at a rear end of the applicator so as to be parallel to the substrate and having a pattern penetrated therethrough;
And an IPL (Intense Pulsed Light) capable of emitting a complex light having a wide wavelength band, wherein light is generated toward the substrate by irradiating the metal conductive material with light through the pattern, A photogenerator for forming a pattern by causing a conductive material to self-embed with the flexible plastic substrate;
A measuring device for measuring a distance between the mask, the light generating device, and the substrate;
Wherein the mask or the light generating device is moved in a direction perpendicular to the substrate so that the metal conductive material can be self-coupled with the flexible plastic substrate by irradiation of light of the light generating device, A height moving device for adjusting the distance between the device and the mask and the substrate to be less than or equal to a predetermined value;
A sensing device for sensing a marker formed on the mask and a marker formed on the substrate; And
A horizontal moving device for moving the mask or the light generating device in a direction parallel to the substrate;
A supply roll on which the substrate is wound;
An adhesive roll in contact with the substrate to recover the metal conductive material applied to the substrate; And
A return roll that is spaced a predetermined distance from the supply roll and that unwinds the substrate extending from the supply roll,
Wherein the conductive pattern is formed by irradiating light onto a substrate coated with a conductive metal ink.
delete delete The method according to claim 1,
The metal conductive material may include,
A cluster of nanowires of any one of gold, silver, aluminum, copper, nickel, and platinum,
A system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink comprising a population of nano-powders of any one of gold, silver, aluminum, copper, nickel, and platinum.
5. The method of claim 4,
The metal conductive material may include,
Further comprising a solvent mixed with the nanowire assembly or the nanoflower assembly to form a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink.
5. The method of claim 4,
The metal conductive material may include,
(GaP), zirconium oxide (ZrO 2 ), silicon (Si), cadmium sulfide (CdS), titanium dioxide (TiO 2 ), and zinc oxide having a band gap of 3.5 eV or less and a high light absorptivity Wherein the substrate further comprises at least one semiconductor powder selected from the group consisting of zinc oxide (ZnO), iron oxide (Fe 2 O 3 ), tungsten oxide (WO 2 ) and tin oxide (SnO 2 ) To form a conductive pattern.
delete delete The method according to claim 1,
The adhesive rolls
And a return roll located between the light generating device and the recovery roll,
Wherein a conductive pattern is formed by irradiating light onto a substrate coated with a conductive metal ink to which an adhesive material is adhered to an outer circumferential surface of the adhesive roll.
The method according to claim 1,
And a cleaning device for wiping the metal conductive material applied to the substrate at a front end or a rear end of the adhesive roll to form a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink.
11. The method of claim 10,
The metal conductive material may include,
A population of nanowires or a population of nanopowders and a solvent,
The cleaning device includes:
A cleaning towel to which the solvent is buried and which is in contact with the substrate;
And a mechanism for supplying the solvent to the cleaning towel,
The cleaning towel may include:
Wherein the conductive pattern is formed by irradiating light onto a substrate coated with a conductive metal ink that contacts the substrate and wipes off a metal conductive material having low adhesion to the substrate due to not being irradiated with light.
12. The method of claim 11,
The cleaning device includes:
And an ultrasonic cleaner for immersing the substrate in the solvent and applying ultrasonic waves or vibration to the solvent to separate the metal conductive material having low adhesion to the substrate due to the vibration of the solvent,
The ultrasonic cleaner includes:
And a mechanism for applying ultrasonic waves or vibration to the solvent, wherein the substrate is coated with a conductive metal ink to form a conductive pattern.
The method according to claim 1,
Further comprising a cleaning device provided at a rear end of the light generating device for wiping the metal conductive material applied to the substrate to form a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink.
The method according to claim 1,
Wherein,
A system for forming a conductive pattern by irradiating light onto a substrate coated with a conductive metal ink, which is made of metal, paper or cloth.
KR1020150157656A 2015-10-26 2015-11-10 System for forming conductive pattern irradiated with light on substrate coating conductivity fine metal ink KR101773148B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020150157656A KR101773148B1 (en) 2015-11-10 2015-11-10 System for forming conductive pattern irradiated with light on substrate coating conductivity fine metal ink
CN201680062921.8A CN108353503B (en) 2015-10-26 2016-10-21 Pattern forming apparatus and method using intense pulsed light sintering
PCT/KR2016/011940 WO2017073967A1 (en) 2015-10-26 2016-10-21 Pattern forming device using photo sintering and pattern forming method using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150157656A KR101773148B1 (en) 2015-11-10 2015-11-10 System for forming conductive pattern irradiated with light on substrate coating conductivity fine metal ink

Publications (2)

Publication Number Publication Date
KR20170054912A KR20170054912A (en) 2017-05-18
KR101773148B1 true KR101773148B1 (en) 2017-08-30

Family

ID=59049110

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150157656A KR101773148B1 (en) 2015-10-26 2015-11-10 System for forming conductive pattern irradiated with light on substrate coating conductivity fine metal ink

Country Status (1)

Country Link
KR (1) KR101773148B1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505358A (en) * 2005-08-12 2009-02-05 カンブリオス テクノロジーズ コーポレイション Transparent conductors based on nanowires
US20140333916A1 (en) * 2013-05-13 2014-11-13 Nokia Corporation Method and apparatus for the formation of conductive films on a substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505358A (en) * 2005-08-12 2009-02-05 カンブリオス テクノロジーズ コーポレイション Transparent conductors based on nanowires
US20140333916A1 (en) * 2013-05-13 2014-11-13 Nokia Corporation Method and apparatus for the formation of conductive films on a substrate

Also Published As

Publication number Publication date
KR20170054912A (en) 2017-05-18

Similar Documents

Publication Publication Date Title
US8398227B2 (en) Pattern drawing method and pattern drawing apparatus
TWI612106B (en) Method of forming a conductor from a metallic ink
KR20150109372A (en) Method and apparatus for forming patterns in coatings on opposite sides of a transparent substrate
JP5760060B2 (en) Metal film forming method, metal film forming product manufacturing method and manufacturing apparatus
CN101801674A (en) metallic ink
WO2015115503A1 (en) Electroconductive pattern, substrate with electroconductive pattern, method for manufacturing substrate with electroconductive pattern, structure having on-surface electroconductive pattern, and method for manufacturing said structure
JP2009277466A (en) Transparent conductive film and its manufacturing method
TWI719032B (en) A method for aligning metal layers in fabricating a multilayer printable electronic device
KR102603669B1 (en) Material transfer method
JP2008503052A (en) Printing organometallic compounds to form conductive traces
TW200911061A (en) Method and apparatus for printing conductive inks
KR101773148B1 (en) System for forming conductive pattern irradiated with light on substrate coating conductivity fine metal ink
KR102068144B1 (en) Sintering unit for manufacturing an electrode pattern, a manufacturing system for the electrode pattern using the same, and a method for manufacturing the electrode pattern using the manufacturing system
KR101821766B1 (en) Roll to roll patterning system
KR20140090641A (en) Base material for forming electroconductive pattern, circuit board, and method for producing each
KR101357179B1 (en) Manufacturing method of nanowire, pattern forming method, and nanowire using the same
KR101164061B1 (en) Pattern fabricating method and pattern transferring apparatus, flexible display panel, flexible solar cell, electronic book, thin film transistor, electromagnetic-shielding sheet, flexible printed circuit board applying thereof
CN108353503B (en) Pattern forming apparatus and method using intense pulsed light sintering
US9046777B2 (en) Method for manufacturing a fine metal electrode
Khan et al. Substrate treatment evaluation and their impact on printing results for wearable electronics
JP2017104765A (en) Formation method for functional film and formation apparatus for functional film
KR101494216B1 (en) sintering method of copper ink using laser
KR20190016278A (en) Method for forming an electrode pattern overcoming pattern size dependence in intense pulse light sintering
KR102659412B1 (en) Micro/Nano Metal printing method and the apparatus using of it
JP2014195794A (en) Method of forming conductive pattern

Legal Events

Date Code Title Description
AMND Amendment
E601 Decision to refuse application
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant