KR101770308B1 - Metal thin film pressure sensor - Google Patents

Metal thin film pressure sensor Download PDF

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Publication number
KR101770308B1
KR101770308B1 KR1020160032830A KR20160032830A KR101770308B1 KR 101770308 B1 KR101770308 B1 KR 101770308B1 KR 1020160032830 A KR1020160032830 A KR 1020160032830A KR 20160032830 A KR20160032830 A KR 20160032830A KR 101770308 B1 KR101770308 B1 KR 101770308B1
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KR
South Korea
Prior art keywords
thin film
metal thin
pressure
lower housing
substrate
Prior art date
Application number
KR1020160032830A
Other languages
Korean (ko)
Inventor
김태완
장지상
서호철
Original Assignee
세종공업 주식회사
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Priority to KR1020160032830A priority Critical patent/KR101770308B1/en
Application granted granted Critical
Publication of KR101770308B1 publication Critical patent/KR101770308B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/30—Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor

Abstract

The present invention relates to a metal thin film pressure sensor, comprising: a lower side housing having an interior space opened in upper and lower directions; a metal thin film coupled so as to cover a lower side of an opening portion of the lower side housing; a pressure device mounted on a central portion of an upper surface of the thin film; a PCB coupled to the inside of the lower side housing; and an upper side housing coupled to cover an upper portion of the lower side housing, and provided with an electrode terminal electrically connected to the PCB.

Description

[0001] The present invention relates to a metal thin film pressure sensor,

The present invention relates to a pressure sensor, and more particularly, to a metal thin film pressure sensor in which a metal thin film on which a sensor chip is mounted is integrally formed in a housing, thereby enabling miniaturization of the product and improved reliability.

BACKGROUND ART A pressure sensor is mainly used in a vehicle, a chemical facility, a semiconductor manufacturing facility, or the like for measuring the pressure of a fluid installed on a flow path or a valve side of a fluid. For example, Hydrogen gas or air pressure, exhaust gas pressure in a silencer, and other general industrial pressure gauges from a low pressure to a high pressure.

Such a pressure sensor is constituted by a pressure element provided with a pressure to which the fluid is introduced, which is close to the inlet and the pressure guiding inlet, and the pressure element can be composed of various elements such as a semiconductor chip or a strain gauge. Further, the temperature sensor includes a temperature element installed on the flow path through which the fluid passes and sensing the temperature of the fluid.

Hereinafter, a conventional pressure sensor will be described in detail with reference to the accompanying drawings.

1 is a sectional view showing an internal structure of a conventional pressure sensor.

The conventional pressure sensor includes a lower housing 20 and an upper housing 30 which are coupled in a laminated structure so as to have an internal space in which a printed circuit board (PCB) 10 can be seated, 50 are injected into the lower housing 20 and are coupled to the lower surface of the lower housing 20. A seating jaw 202 is formed on a sidewall of the inner space of the lower housing 20 so that the edge of the PCB 10 is seated in the lower housing 20. The edge of the bottom surface of the PCB 10 contacts only the lower housing 20 And the remaining portion is kept apart from the bottom surface of the lower housing 20. [

The pressure housing 60 is mounted on a center portion of the pressure housing 40 protruding upward and the pressure element 60 is electrically connected to the PCB 10 by a wire 61. The pressure device 60 is configured to sense the pressure transmitted through the pressure transmitting material 50 and then transmit the sensed pressure signal to the PCB 10 through the wire. A temperature element 12 for measuring the temperature of the lower housing 20 is mounted on the bottom surface of the PCB 10 and a thermal pad 23 is provided between the bottom surface of the temperature element 12 and the bottom surface of the lower housing 20 Respectively. When the thermal pad 23 is provided between the temperature element 12 and the lower housing 20 as described above, the heat of the lower housing 20 is transmitted to the temperature element 12 instantly through the thermal pad 23. [ , The temperature in the flow path can be measured and reflected in real time.

On the other hand, in order to transmit measured values measured by the pressure device 60 and the temperature device 12 to the outside, there is provided at least one electrode terminal 31 for electrically connecting the PCB 10 to the outside of the housing, The electrode terminal 31 is mounted through the upper housing 30 vertically. At this time, the electrode terminal 31 is electrically connected to the PCB 10 through the connector 11.

However, the conventional pressure sensor constructed as above has a limitation in reducing the length of the product because the pressure housing 40 in which the pressure transmitting material 50 is embedded is required, and the PCB 10 for signal transmission is limited There is a disadvantage in that there is a limit in reducing the cross-sectional area of the bar product. Further, the conventional pressure sensor has a disadvantage in that the pressure value can not be measured when the pressure-transmitting material 50 is frozen because the ambient temperature is very low, and the internal structure is complicated.

KR 10-0777105 B1

The present invention has been proposed in order to solve the above problems, and it is an object of the present invention to provide a metal thin film which can measure pressure without a pressure transmitting material, simplify internal structure and miniaturize a product, A pressure sensor is provided.

According to an aspect of the present invention, there is provided a metal thin film pressure sensor comprising: a lower housing opened up and down; A metal thin film coupled to cover the lower opening of the lower housing; A pressure element mounted on a center portion of the upper surface of the metal thin film; A PCB coupled to the inside of the lower housing; And an upper housing coupled to cover the upper portion of the lower housing and having an electrode terminal electrically connected to the PCB.

The metal thin film is integrally formed with the lower housing by an insert injection method.

The lower end of the lower housing is provided with an inner flange having an insertion groove formed in the bottom surface thereof. The PCB has an edge mounted on the upper surface of the inner flange, and an edge of the metal thin film protruded upwardly to be inserted into the insertion groove. .

Wherein the PCB comprises a lower substrate having a through hole formed in a portion corresponding to the pressure element and having an edge seated on an upper surface of the inner flange and a lower substrate mounted on the upper side of the lower substrate so as to be parallel to the lower substrate, And an upper substrate electrically connected to the substrate.

Wherein the connection portion is made of a material having electrical insulation and has a lower end and an upper end attached to the upper surface of the lower substrate and a lower surface of the upper substrate, respectively, and a support block inserted into the support block to electrically connect the lower substrate and the upper substrate And a connecting wire to which the wire is connected.

The upper surface of the metal thin film is provided with a support end protruding upward so as to be in close contact with the outer wall of the pressure device, thereby limiting the lateral movement of the pressure device.

The lower end of the lower housing and the bottom surface of the metal foil are formed to form one plane.

The use of the metal thin film pressure sensor according to the present invention has the advantage that the pressure can be measured without a pressure transmitting material, simplification of the internal structure and miniaturization of the product, prevention of freezing, easy removal of foreign matter, and high measurement reliability.

1 is a sectional view showing an internal structure of a conventional pressure sensor.
2 is a sectional view showing an internal structure of a metal thin-film pressure sensor according to the present invention.
FIG. 3 is a cross-sectional view showing a coupling structure of the lower housing and the metal thin film included in the metal thin film pressure sensor according to the present invention.
4 is a cross-sectional view of a second embodiment of the metal thin film included in the metal thin film pressure sensor according to the present invention.
5 is an exploded perspective view of the PCB included in the metal thin film pressure sensor according to the present invention.

Hereinafter, embodiments of a metal thin film pressure sensor according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a sectional view showing the internal structure of a metal thin film pressure sensor according to the present invention, and FIG. 3 is a sectional view showing a combined structure of a lower housing and a metal thin film included in the metal thin film pressure sensor according to the present invention.

The metal thin film pressure sensor according to the present invention is a device for measuring the pressure of the fluid mounted on a flow path of a fluid having a certain level of pressure such as an exhaust pipe of a vehicle and is equipped with a separate pressure housing And the pressure of the fluid can be measured even if it is not provided.

That is, the metal thin film pressure sensor according to the present invention includes a cylindrical lower housing 100 having an inner space opened up and down, and a metal thin film 200 (not shown) coupled to cover the lower opening 110 of the lower housing 100 A pressure device 300 mounted on a center portion of the upper surface of the metal foil 200 and a pressure sensor 300 connected to the pressure device 300 by a wire 310 coupled to the inside of the lower housing 100, 400 and an upper housing 500 coupled to cover the upper portion of the lower housing 100 and having an electrode terminal 510 electrically connected to the connector 700 on the PCB 400, Respectively.

The metal thin film 200 is installed to seal the lower opening 110 of the lower housing 100 and the upper housing 500 is coupled by the adhesive 620 to seal the upper portion of the lower housing 100. Further, when the pressure of the space where the metal thin film pressure sensor according to the present invention is changed causes the metal thin film 200 to be deformed, the pressure device 300 senses the pressure and calculates the pressure of the surrounding space by numerical values.

As described above, the metal thin film pressure sensor according to the present invention is configured such that the metal thin film 200 directly senses the change in the ambient pressure, rather than receiving the pressure through the separate pressure transmitting material, It is possible to simplify and miniaturize the product. That is, the conventional pressure sensor shown in FIG. 1 has an advantage that the entire length of the product is shortened as the pressure housing 40 is removed.

In addition, the metal thin film pressure sensor according to the present invention is not directly transmitted to the pressure device 300 through the pressure transmitting material, but is directly transmitted through the metal thin film 200, The response can be improved, and the pressure measurement error can be reduced.

In the meantime, the pressure transmitting material included in the conventional pressure sensor is required to maintain the fluid state so that the pressure can be transferred. When the freezing occurs due to the very low ambient temperature, the pressure transmission becomes impossible, There is a decisive problem. However, since the metal thin film pressure sensor according to the present invention does not require a pressure transmitting material, it is possible to measure the pressure normally even at a very low ambient temperature. Further, in the conventional pressure sensor, when the pressure transmitting material is frozen, the volume of the pressure transmitting material is increased, and the pressure housing may be damaged. However, since the metal thin film pressure sensor according to the present invention does not have the pressure transmitting material itself, It is possible to expect that the problem of the damage caused by the breakdown is solved fundamentally.

The metal thin film pressure sensor according to the present invention may include a signal calibration element 412 mounted on the PCB 400 and an O-ring 620 mounted on the outer circumferential surface of the lower housing 100. The calibration element and the O-ring are applied to the conventional pressure sensor in the same manner, and detailed description of the O-ring and the signal correction element will be omitted.

On the other hand, when the external pressure is directly applied to the metal thin film 200, the metal thin film 200 may be deformed to some extent, and the metal thin film 200 may be detached from the lower housing 100. When the lower housing 100 and the metal foil 200 are separately manufactured and then combined with each other, a gap is formed between the lower housing 100 and the metal foil 200, It may not be isolated.

Therefore, the metal thin film 200 is preferably formed integrally with the lower housing 100 by an insert injection method. When the metal thin film 200 is integrally formed with the lower housing 100 by the insert injection method, there is no fear of generating a gap between the metal thin film 200 and the lower housing 100, The metal foil 200 is prevented from being detached from the lower housing 100 because the edges of the metal foil 200 are bonded to the lower housing 100 very firmly.

An inner flange 120 is formed on the lower inner wall of the lower housing 100 and the metal foil 200 is integrally coupled to the lower housing 100 by coupling an edge of the inner flange 120 to the bottom surface of the inner flange 120. At this time, an insertion groove 130 is formed on the bottom surface of the inner flange 120 so that the coupling force between the metal thin film 200 and the lower housing 100 can be further increased. An insertion portion 210 protruding upward to be inserted into the groove 130 is formed.

When the insertion portion 210 formed at the edge of the metal thin film 200 is inserted into the insertion groove 130 as described above, the metal thin film 200 is bent to be convex upward by the pressure applied from the outside, (The point where the pressure device 300 is mounted), the insertion portion 210 can be held in a fixed state by being caught by the step of the insertion groove 130. That is, the metal thin film 200 has an advantage of being able to maintain a state of being integrally coupled with the lower housing 100 as long as an external force large enough to break the insertion portion 210 is not applied, that is, There are advantages.

When the metal thin film 200 is integrally formed with the lower housing 100 by the insert injection method as shown in this embodiment, the bottom surface of the metal thin film 200 is accurately positioned at the lower end of the lower housing 100 The lower end of the lower housing 100 and the lower surface of the metal foil 200 can form a single plane so that the external pressure applied to the metal foil 200 can be applied to the bottom surface of the metal foil 200 It is possible to distribute them evenly. For example, when the metal thin film 200 protrudes more than the lower end of the lower housing 100, an external pressure may be applied to the side edge of the metal thin film 200 in a horizontal direction, so that the metal thin film 200 may deform abnormally So accurate pressure measurement may be difficult. However, when the lower end of the lower housing 100 and the lower surface of the metal foil 200 form a single plane as shown in this embodiment, external pressure is uniformly distributed on the bottom surface of the metal foil 200, There is no phenomenon that the metal thin film 200 is abnormally deformed, so that accurate pressure measurement is possible.

Meanwhile, the PCB 400 mounted in the lower housing 100 is disposed such that the edge thereof is seated on the upper surface of the inner flange 120,

At this time, if the PCB 400 is formed as one flat plate, the lower housing 20 must be made very wide like the conventional pressure sensor shown in FIG. 1, which makes it difficult to miniaturize the product. Of course, if the size of the PCB 10 is reduced, the size of the lower housing 20 can be reduced to enable downsizing of the product. However, the PCB 10 must have an area larger than a reference value so that various patterns can be formed, There is a limit in reducing the size of the battery 10.

The metal thin film pressure sensor according to the present invention is further characterized in that the PCB 400 is constructed in a multi-layer structure so as to solve the above problems. That is, the PCB 400 includes a lower substrate 410 having a through hole 414 formed at a portion corresponding to the pressure device 300 and an edge mounted on the upper surface of the inner flange 120, And an upper substrate 420 mounted on the lower substrate 410 so as to be parallel to the substrate 410 and electrically connected to the lower substrate 410 by a connection part 430.

When the PCB 400 has a multi-layer structure, it is possible to reduce the horizontal cross-sectional area of the lower housing 100 while ensuring a wider overall surface area of the PCB 400, thereby making it possible to miniaturize the product.

4 is a cross-sectional view of a metal thin film 200 included in the metal thin film pressure sensor according to the second embodiment of the present invention.

When the pressure device 300 is mounted on the upper surface of the metal thin film 200, the mounting position of the pressure device 300 is shifted in the lateral direction in a process of bending by a certain amount of external pressure of the metal thin film 200 There is a concern.

The metal thin film pressure sensor according to the present invention is provided with a pressure element 300 on the upper surface of the metal thin film 200 so that the above problem does not occur, that is, the mounting position of the pressure element 300 can be stably fixed. And a supporting end 220 protruding upward so as to be in close contact with an outer wall of the housing.

When the supporting end 220 is provided on the upper surface of the metal thin film 200 as described above, the lateral movement of the pressure element 300 is restricted, thereby reducing the phenomenon that the pressure element 300 is detached from the metal thin film 200 There is an advantage that it can be.

5 is an exploded perspective view of the PCB 400 included in the metal thin film pressure sensor according to the present invention.

The lower substrate 410 and the upper substrate 420 may be electrically connected to the lower substrate 410 and the upper substrate 420 such that the PCB 400 included in the present invention is arranged to be vertically spaced apart as described above, A connection part 430 is required.

At this time, if the connection part 430 is made of a normal wire, the connection part 430 may be separated from the lower substrate 410 or the upper substrate 420 when an impact is applied from the outside. The connection unit 430 is formed to perform the function of integrally connecting the lower substrate 410 and the upper substrate 420 and the function of electrically connecting the lower substrate 410 and the upper substrate 420 .

5, the connection part 430 is made of a material having electric insulation and has a lower end and an upper end attached to the upper surface of the lower substrate 410 and a lower surface of the upper substrate 420, respectively, And a connection wire 434 which is inserted into the support block 432 and electrically connects the lower substrate 410 and the upper substrate 420.

The support block 432 physically couples the lower substrate 410 and the upper substrate 420 to each other so that the lower substrate 410 and the upper substrate 420 are integrally coupled to each other even if a certain level of external force is applied thereto. Can be maintained. When the connection between the lower substrate 410 and the upper substrate 420 is stably maintained as described above, both ends of the connection wires 434 in the longitudinal direction are stably connected to the lower substrate 410 and the upper substrate 420 The lower substrate 410 and the upper substrate 420 can maintain stable signal transmission.

In addition, if the upper substrate 420 can be stably supported by the plurality of connection portions 430, it is not necessary to form a separate mounting step on the inner wall of the lower housing 100 for mounting the upper substrate 420 , The inner structure of the lower housing 100 can be expected to be simplified.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. It will also be appreciated that many modifications and variations will be apparent to those skilled in the art without departing from the scope of the invention.

100: Lower housing 110:
120: inner flange 130: insertion groove
200: metal thin film 210:
220: Supporting stage 300: Pressure element
310: wire 400:
410: lower substrate 414: through hole
420: upper substrate 430: connection portion
432: Support block 434: Connecting wire
500: upper housing 510: electrode terminal
620: Adhesive 700: Connector

Claims (7)

A lower housing having an inner space opened up and down;
A metal thin film coupled to cover the lower opening of the lower housing, the metal thin film being integrally formed with the lower housing by an insert injection method and having a bottom surface forming a plane with the lower housing;
A pressure element mounted on a center portion of the upper surface of the metal thin film;
A PCB coupled to the inside of the lower housing; And
An upper housing coupled to cover an upper portion of the lower housing and having an electrode terminal electrically connected to the PCB;
≪ / RTI >
An inner flange having an insertion groove formed in a bottom surface thereof is provided on a lower side inner wall of the lower housing, an edge of the PCB is seated on an upper surface of the inner flange,
An insertion portion protruding upward to be inserted into the insertion groove is formed at an edge of the metal thin film,
Wherein the upper surface of the metal thin film is provided with a support end protruding upward so as to be in close contact with the outer wall of the pressure device,
Wherein the PCB comprises a lower substrate having a through hole formed in a portion corresponding to the pressure element and having an edge seated on an upper surface of the inner flange and a lower substrate mounted on the upper side of the lower substrate so as to be parallel to the lower substrate, And an upper substrate electrically connected to the metal thin film pressure sensor. delete delete delete The method according to claim 1,
The connecting portion
A supporting block which is made of a material having electric insulation and has a lower end and an upper end respectively attached to the upper surface of the lower substrate and the lower surface of the upper substrate, and a connecting wire inserted into the supporting block to electrically connect the lower substrate and the upper substrate Wherein the metal thin film pressure sensor comprises:
delete delete
KR1020160032830A 2016-03-18 2016-03-18 Metal thin film pressure sensor KR101770308B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160032830A KR101770308B1 (en) 2016-03-18 2016-03-18 Metal thin film pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160032830A KR101770308B1 (en) 2016-03-18 2016-03-18 Metal thin film pressure sensor

Publications (1)

Publication Number Publication Date
KR101770308B1 true KR101770308B1 (en) 2017-08-23

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Application Number Title Priority Date Filing Date
KR1020160032830A KR101770308B1 (en) 2016-03-18 2016-03-18 Metal thin film pressure sensor

Country Status (1)

Country Link
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