KR101767536B1 - Manufacturing method of multi layer ceramic capacitor - Google Patents
Manufacturing method of multi layer ceramic capacitor Download PDFInfo
- Publication number
- KR101767536B1 KR101767536B1 KR1020150174243A KR20150174243A KR101767536B1 KR 101767536 B1 KR101767536 B1 KR 101767536B1 KR 1020150174243 A KR1020150174243 A KR 1020150174243A KR 20150174243 A KR20150174243 A KR 20150174243A KR 101767536 B1 KR101767536 B1 KR 101767536B1
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- South Korea
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- ceramic
- internal electrode
- pattern
- green sheet
- ceramic green
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000003985 ceramic capacitor Substances 0.000 title abstract description 68
- 239000000919 ceramic Substances 0.000 claims abstract description 146
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 238000007747 plating Methods 0.000 claims abstract description 41
- 238000001291 vacuum drying Methods 0.000 claims abstract description 19
- 239000002003 electrode paste Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 29
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 239000000243 solution Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229910052739 hydrogen Inorganic materials 0.000 description 11
- 239000001257 hydrogen Substances 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 10
- 238000005406 washing Methods 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The present invention relates to a method of manufacturing a ceramic capacitor in which a resin layer is applied to the surface of a ceramic sintered body by plating on an external electrode and vacuum drying is performed so that a high voltage or a high surge voltage is applied or an insulation resistance breakage due to expansion of the internal electrode The present invention relates to a method of manufacturing a multilayer ceramic capacitor capable of preventing the loss of electrostatic capacitance and preventing the loss of electrostatic capacity. The multilayer ceramic capacitor includes a plurality of dielectric layers and a plurality of dielectric layers each having a plurality of internal electrode layers Forming a sintered body; Forming external electrodes such that one end and the other end of the ceramic fired body are respectively surrounded and connected to a plurality of internal electrode layers formed so that one end or the other end is exposed; Applying a resin layer to a surface exposed to the outside of a front surface of the ceramic sintered body; Forming a plating layer on the surface of the external electrode by wet barrel plating; And vacuum-drying the ceramic sintered body subjected to wet barrel plating.
Description
The present invention relates to a method of manufacturing a multilayer ceramic capacitor, and more particularly, to a method of manufacturing a multilayer ceramic capacitor, in which a resin layer is coated on the surface of a ceramic sintered body during plating and vacuum dried, The present invention relates to a method of manufacturing a multilayer ceramic capacitor which can prevent degradation of insulation resistance due to expansion, moisture, and hydrogen, thereby reducing the service life.
A manufacturing method of a multilayer ceramic capacitor (MLCC) will be described with reference to Korean Patent No. 811388 (Patent Document 1).
Korean Patent No. 811388 relates to a method of manufacturing a multilayer ceramic capacitor, wherein a plurality of green sheets are first formed to produce a multilayer ceramic capacitor. When a plurality of green sheets are formed, a plurality of internal electrode patterns are formed in each of the green sheets. When a plurality of internal electrode patterns are formed, a plurality of green sheets are laminated to form a green sheet laminate. When the green sheet laminate is formed, the green sheet laminate is cut to form a green chip. When the green chip is formed, the green chip is preliminarily fired, fired, and polished to form an external electrode, thereby manufacturing a multilayer ceramic capacitor.
Korean Patent No. 811388 discloses a method of manufacturing a conventional multilayer ceramic capacitor in which hydrogen is generated during a plating process by forming an external electrode using a plating method. When hydrogen is generated during the plating process for forming the external electrode, the generated hydrogen permeates the inside of the ceramic capacitor and can be diffused into the internal electrode formed of nickel (Ni) material. When the hydrogen is diffused to the internal electrode, the internal electrode expands and the distance between two different internal electrodes disposed between the dielectrics is narrowed. As a result, high voltage, high surge voltage, or insulation resistance breakage There is a problem that the electrostatic loss is increased or the insulation resistance is lowered due to electrical connection to each other, and the chemical erosion occurs in the multilayer ceramic capacitor due to the acid or alkali plating solution, so that the mechanical strength of the ceramic itself is weakened and the reliability of the electrical characteristics of the multilayer ceramic capacitor There is a problem that can be reduced.
The object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a ceramic capacitor which comprises applying a resin layer on a surface of a ceramic fired body during plating, And a method for manufacturing a multilayer ceramic capacitor which can prevent degradation of insulation resistance and deterioration of service life due to expansion, moisture, and hydrogen.
It is another object of the present invention to provide a method of manufacturing a ceramic electronic device, which comprises applying a resin layer on a surface of a ceramic sintered body when plating external electrodes, and vacuum drying the ceramic sintered body to prevent chemical erosion of the ceramic sintered body by acid or alkali plating solution during the plating process, And a method of manufacturing a multilayer ceramic capacitor capable of preventing the mechanical strength from being weakened.
Another object of the present invention is to prevent the loss of electrostatic capacity and to prevent the occurrence of chemical erosion of the ceramic sintered body by the plating liquid to prevent the mechanical strength of the ceramic itself from becoming weak so that the reliability of the electrical characteristics of the multilayer ceramic capacitor The present invention provides a method of manufacturing a multilayer ceramic capacitor.
A method of manufacturing a multilayer ceramic capacitor of the present invention includes: forming a ceramic sintered body having a plurality of dielectric layers and a plurality of internal electrode layers formed on the plurality of dielectric layers such that one or both ends of the dielectric layer are exposed; Forming external electrodes such that one end and the other end of the ceramic fired body are respectively surrounded and connected to a plurality of internal electrode layers formed so as to expose one end or the other end; Applying a resin layer to a surface exposed to the outside of the front surface of the ceramic sintered body; Forming a plating layer on the surface of the external electrode by a wet barrel plating method; And a step of vacuum-drying the ceramic barrel finished with the wet barrel plating.
A method of manufacturing a multilayer ceramic capacitor according to the present invention is a method of manufacturing a multilayer ceramic capacitor in which a resin layer is coated on a surface of a ceramic sintered body when plating an external electrode and vacuum dried to apply a high voltage or a high surge voltage, It is advantageous in that the insulation resistance is lowered due to the influence of hydrogen and the lifetime is prevented from being lowered. When the external electrode is plated with a resin layer on the surface of the ceramic fired body and vacuum drying is performed, It is possible to prevent the chemical mechanical erosion of the ceramic sintered body from being caused by the ceramic body and to prevent the mechanical strength of the ceramic itself from being weakened. It is possible to prevent the loss of the electrostatic capacity and to prevent the ceramic sintered body from being chemically eroded by the plating liquid To prevent the mechanical strength of the ceramic itself from becoming weak As there is an advantage capable of improving the reliability of the electrical characteristics of the monolithic ceramic capacitor.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a process flow diagram showing a method for producing a multilayer ceramic capacitor of the present invention,
FIG. 2 is a process flow chart showing the plating layer forming method shown in FIG. 1 in detail,
3 is a plan view of the ceramic green sheet coated with the internal electrode paste pattern manufactured by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1,
FIG. 4 is a plan view of the ceramic squeeze produced by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1,
5 is a cross-sectional view of the ceramic squeezer shown in Fig. 4,
FIG. 6 is a cross-sectional view of a ceramic pressure-sensitive adhesive having a corner portion removed by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1;
FIG. 7 is a cross-sectional view of a ceramic sintered body in which external electrodes are formed by the method for manufacturing a multilayer ceramic capacitor of the present invention shown in FIG. 1,
FIG. 8 is a cross-sectional view of a ceramic sintered body to which a resin layer is applied by the method for manufacturing a multilayer ceramic capacitor of the present invention shown in FIG. 1,
FIG. 9 is a sectional view of a multilayer ceramic capacitor completed by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1; FIG.
Hereinafter, embodiments of a method for manufacturing a multilayer ceramic capacitor of the present invention will be described with reference to the accompanying drawings.
As shown in FIGS. 1 and 9, a method of manufacturing a multilayer ceramic capacitor according to the present invention includes firstly forming a plurality of
The method for manufacturing the multilayer ceramic capacitor of the present invention will be described in detail as follows.
In step S10 of forming the ceramic fired
4 and 5, a plurality of ceramic
When the ceramic pressure-sensitive adhesive 10a is formed, the ceramic pressure-sensitive adhesive 10a is debinded at 200 to 500 ° C (S16). Here, well-known techniques are applied to binder removal processing. The
The first margin length ML1 shown in FIG. 4 indicates a length from the other end to the other end of the ceramic
Step S20 of forming the
The step of applying the resin layer 30 (S30) may be performed by forming the
In the step S40 of forming the
After the second water washing is completed and the pretreatment of the ceramic fired
The step of vacuum drying (S50) is a step of drying the moisture attached to the ceramic sintered body (10) through the second water washing step (S45) as shown in Figs. 1 and 9 when the second water washing step (S45) Drying is performed by vacuum drying the ceramic fired
In order to test the electrical characteristics of the multilayer ceramic capacitor manufactured by the method of manufacturing the multilayer ceramic capacitor of the present invention, a multilayer ceramic capacitor was prepared as in Example 1.
In order to manufacture the multilayer ceramic capacitor according to the first embodiment of the method for manufacturing a multilayer ceramic capacitor of the present invention, an internal
After the
In the accelerated life test, a DC voltage of 18.9 V was applied at 125 ° C, and the product whose insulation resistance dropped below 1 Mohm (mega ohm) within 2 hours was defective. The number of samples was 50, The PCBT test was carried out at 125 ° C, 85% relative humidity, and 2% relative humidity. The PCBT test was carried out at 125 ° C, relative humidity 85%, relative humidity 85%, DC voltage of 6.3V, Atm, 12.6V DC voltage was applied, and the product whose insulation resistance dropped below 1 Mohm within 12 hours was treated as defective and the number of samples was 50.
Untreated
Untreated
Table 1 shows the results of the accelerated lifetime test, the high-temperature moisture-absorption load test and the PCBT test. As shown in Table 1, the vacuum drying was untreated, that is, 5 of the 50 laminated ceramic capacitors, 10 of the accelerated life test, 10 of the high temperature resistant moisture load test, and 10 of the PCBT test. On the other hand, in the case of the laminated ceramic capacitor in which the resin layer (30) was applied three times in addition to the copper hot air drying at 150 ° C. for 200 minutes, one in the accelerated life test, one in the high temperature resistant moisture load test and one in the PCBT test The dog was badly treated.
In the case of performing vacuum drying, the multilayer ceramic capacitors which were vacuum-dried at 100 ° C. and 15 torr for 30 minutes and not coated with the resin layer (30) were found to have 3 in the accelerated lifetime test and 3 in the accelerated life test One defect was treated in the dog and PCBT test. On the other hand, when the
The decrease in the insulation resistance characteristic of the multilayer ceramic capacitor, which may occur during the plating process, can be prevented according to the number of application times of the
As described above, in the method of manufacturing a multilayer ceramic capacitor of the present invention, a resin layer is coated on the surface of a ceramic sintered body when plating an external electrode, and vacuum drying is performed to apply a high voltage or a high surge voltage, It is possible to prevent deterioration of the insulation resistance due to expansion of water or hydrogen and deterioration of the service life. When the external electrode is plated with a resin layer on the surface of the ceramic fired body and vacuum dried, It is possible to prevent the chemical erosion of the ceramic fired body from being caused by the alkali plating solution to prevent the mechanical strength of the ceramic itself from becoming weak and to prevent the loss of the electrostatic capacity and to prevent the ceramic fired body from being chemically eroded by the plating liquid And that the mechanical strength of the ceramic itself is weakened By thereby improving the reliability of the electrical characteristics of the monolithic ceramic capacitor.
The present invention can be applied to the manufacturing industry of multilayer ceramic capacitors in the method of manufacturing multilayer ceramic capacitors of the present invention.
10: Ceramic baked body 11: Dielectric layer
12: internal electrode layer 20: external electrode
30: resin layer 40: plated layer
41: nickel layer 42: tin layer
Claims (8)
Forming external electrodes such that one end and the other end of the ceramic fired body are respectively surrounded and connected to a plurality of internal electrode layers formed so as to expose one end or the other end;
Applying a resin layer to a surface exposed to the outside of the front surface of the ceramic sintered body;
Forming a plating layer on the surface of the external electrode by a wet barrel plating method; And
Vacuum-drying the ceramic barrel after the wet barrel plating is completed,
Wherein the step of vacuum drying the ceramic fired body comprises vacuum drying the ceramic fired body in an atmosphere at a temperature of 100 to 250 DEG C and a pressure of 15 to 150 torr for 30 to 360 minutes .
The step of forming the ceramic fired body includes: preparing a green sheet slurry;
Forming a plurality of ceramic green sheets using the green sheet slurry;
Applying a plurality of internal electrode paste patterns to the plurality of ceramic green sheets such that the plurality of internal electrode paste patterns are spaced apart from each other;
Stacking a plurality of ceramic green sheets coated with the plurality of internal electrode paste patterns, and pressing the ceramic green sheets to manufacture a ceramic sheet pressed body;
Forming a plurality of ceramic green sheets as a ceramic green sheet pattern and cutting the ceramic sheet pressed body so that the inner electrode paste pattern applied to each of the plurality of ceramic green sheets is exposed at one end or the other end;
Treating the ceramic pressure-sensitive adhesive at 200 to 500 ° C;
Forming a ceramic sintered body by firing the binder-treated ceramic sintered material at 1000 to 1300 캜 for 1 to 3 hours so that the ceramic green sheet pattern and the internal electrode paste pattern become the internal electrode layers and the ceramic dielectric layers, respectively; And
And barrel polishing to remove a corner portion of the ceramic sintered body.
In the step of forming the ceramic pressure bonding agent by cutting the ceramic sheet press body
Wherein the thickness of the ceramic green sheet pattern is 0.5 to 3 占 퐉, the thickness of the internal electrode paste pattern is 0.2 to 1.2 占 퐉, the number of the ceramic green sheet patterns is 100 to 1500, Wherein the thickness of the ceramic green sheet pattern is the same as that of the ceramic green sheet pattern.
In the step of forming the ceramic pressure bonding agent by cutting the ceramic sheet pressed body, one of the ends of the internal electrode paste pattern is aligned with the ceramic green sheet pattern, and the first margin length is 2 to 50 Mu m, and the second margin length is Respectively,
When the end of one end of the inner electrode paste pattern is exposed, the length of the first margin is longer than the length from the other end to the other end of the ceramic green sheet pattern. When the other end of the inner electrode paste pattern is exposed, And the second margin length is a length from one end of the internal electrode paste pattern orthogonal to the first margin length to one end of the ceramic green sheet pattern or a length from one end of the internal electrode paste pattern to the other end of the ceramic green sheet pattern, Is a length from the other end of the ceramic green sheet pattern to the other end of the ceramic green sheet pattern.
Wherein the resin layer is applied to a surface exposed to the outside of the front surface of the ceramic fired body by using a resin-containing solution having a thermal decomposition temperature of 200 ° C or higher and a dipping method in the step of applying the resin layer .
Wherein the resin contained in the resin-containing solution is one selected from the group consisting of an epoxy resin, a polyimide resin, a polyamide resin, a silicone resin, a PEEK (polyetheretherketone) resin, A method of manufacturing a capacitor.
Wherein the resin layer is applied repeatedly 1 to 3 times by using a dipping method in the step of applying the resin layer.
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KR1020150174243A KR101767536B1 (en) | 2015-12-08 | 2015-12-08 | Manufacturing method of multi layer ceramic capacitor |
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KR1020150174243A KR101767536B1 (en) | 2015-12-08 | 2015-12-08 | Manufacturing method of multi layer ceramic capacitor |
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KR20170067504A KR20170067504A (en) | 2017-06-16 |
KR101767536B1 true KR101767536B1 (en) | 2017-08-11 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102478423B1 (en) | 2021-09-08 | 2022-12-19 | 삼화콘덴서공업 주식회사 | Multi-layer ceramic capacitor manufacturing method |
KR20220170399A (en) | 2021-06-22 | 2022-12-30 | 삼화콘덴서공업주식회사 | Conductive paste composition for termination electrode of multilayer ceramic capacitor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015198239A (en) * | 2014-04-03 | 2015-11-09 | 株式会社村田製作所 | Method of manufacturing electronic component |
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JP2015198239A (en) * | 2014-04-03 | 2015-11-09 | 株式会社村田製作所 | Method of manufacturing electronic component |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220170399A (en) | 2021-06-22 | 2022-12-30 | 삼화콘덴서공업주식회사 | Conductive paste composition for termination electrode of multilayer ceramic capacitor |
US11682522B2 (en) | 2021-06-22 | 2023-06-20 | Samhwa Capacitor Co., Ltd. | Conductive paste composition for external electrode of multilayer ceramic capacitor |
KR102478423B1 (en) | 2021-09-08 | 2022-12-19 | 삼화콘덴서공업 주식회사 | Multi-layer ceramic capacitor manufacturing method |
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