KR101767536B1 - Manufacturing method of multi layer ceramic capacitor - Google Patents

Manufacturing method of multi layer ceramic capacitor Download PDF

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KR101767536B1
KR101767536B1 KR1020150174243A KR20150174243A KR101767536B1 KR 101767536 B1 KR101767536 B1 KR 101767536B1 KR 1020150174243 A KR1020150174243 A KR 1020150174243A KR 20150174243 A KR20150174243 A KR 20150174243A KR 101767536 B1 KR101767536 B1 KR 101767536B1
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ceramic
internal electrode
pattern
green sheet
ceramic green
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KR1020150174243A
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KR20170067504A (en
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오영주
윤중락
신동순
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삼화콘덴서공업주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material

Abstract

The present invention relates to a method of manufacturing a ceramic capacitor in which a resin layer is applied to the surface of a ceramic sintered body by plating on an external electrode and vacuum drying is performed so that a high voltage or a high surge voltage is applied or an insulation resistance breakage due to expansion of the internal electrode The present invention relates to a method of manufacturing a multilayer ceramic capacitor capable of preventing the loss of electrostatic capacitance and preventing the loss of electrostatic capacity. The multilayer ceramic capacitor includes a plurality of dielectric layers and a plurality of dielectric layers each having a plurality of internal electrode layers Forming a sintered body; Forming external electrodes such that one end and the other end of the ceramic fired body are respectively surrounded and connected to a plurality of internal electrode layers formed so that one end or the other end is exposed; Applying a resin layer to a surface exposed to the outside of a front surface of the ceramic sintered body; Forming a plating layer on the surface of the external electrode by wet barrel plating; And vacuum-drying the ceramic sintered body subjected to wet barrel plating.

Description

[0001] The present invention relates to a method of manufacturing a multilayer ceramic capacitor,

The present invention relates to a method of manufacturing a multilayer ceramic capacitor, and more particularly, to a method of manufacturing a multilayer ceramic capacitor, in which a resin layer is coated on the surface of a ceramic sintered body during plating and vacuum dried, The present invention relates to a method of manufacturing a multilayer ceramic capacitor which can prevent degradation of insulation resistance due to expansion, moisture, and hydrogen, thereby reducing the service life.

A manufacturing method of a multilayer ceramic capacitor (MLCC) will be described with reference to Korean Patent No. 811388 (Patent Document 1).

Korean Patent No. 811388 relates to a method of manufacturing a multilayer ceramic capacitor, wherein a plurality of green sheets are first formed to produce a multilayer ceramic capacitor. When a plurality of green sheets are formed, a plurality of internal electrode patterns are formed in each of the green sheets. When a plurality of internal electrode patterns are formed, a plurality of green sheets are laminated to form a green sheet laminate. When the green sheet laminate is formed, the green sheet laminate is cut to form a green chip. When the green chip is formed, the green chip is preliminarily fired, fired, and polished to form an external electrode, thereby manufacturing a multilayer ceramic capacitor.

Korean Patent No. 811388 discloses a method of manufacturing a conventional multilayer ceramic capacitor in which hydrogen is generated during a plating process by forming an external electrode using a plating method. When hydrogen is generated during the plating process for forming the external electrode, the generated hydrogen permeates the inside of the ceramic capacitor and can be diffused into the internal electrode formed of nickel (Ni) material. When the hydrogen is diffused to the internal electrode, the internal electrode expands and the distance between two different internal electrodes disposed between the dielectrics is narrowed. As a result, high voltage, high surge voltage, or insulation resistance breakage There is a problem that the electrostatic loss is increased or the insulation resistance is lowered due to electrical connection to each other, and the chemical erosion occurs in the multilayer ceramic capacitor due to the acid or alkali plating solution, so that the mechanical strength of the ceramic itself is weakened and the reliability of the electrical characteristics of the multilayer ceramic capacitor There is a problem that can be reduced.

Patent Document 1: Korean Patent No. 811388 (Registered Date: Feb. 29, 2008)

The object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a ceramic capacitor which comprises applying a resin layer on a surface of a ceramic fired body during plating, And a method for manufacturing a multilayer ceramic capacitor which can prevent degradation of insulation resistance and deterioration of service life due to expansion, moisture, and hydrogen.

It is another object of the present invention to provide a method of manufacturing a ceramic electronic device, which comprises applying a resin layer on a surface of a ceramic sintered body when plating external electrodes, and vacuum drying the ceramic sintered body to prevent chemical erosion of the ceramic sintered body by acid or alkali plating solution during the plating process, And a method of manufacturing a multilayer ceramic capacitor capable of preventing the mechanical strength from being weakened.

Another object of the present invention is to prevent the loss of electrostatic capacity and to prevent the occurrence of chemical erosion of the ceramic sintered body by the plating liquid to prevent the mechanical strength of the ceramic itself from becoming weak so that the reliability of the electrical characteristics of the multilayer ceramic capacitor The present invention provides a method of manufacturing a multilayer ceramic capacitor.

A method of manufacturing a multilayer ceramic capacitor of the present invention includes: forming a ceramic sintered body having a plurality of dielectric layers and a plurality of internal electrode layers formed on the plurality of dielectric layers such that one or both ends of the dielectric layer are exposed; Forming external electrodes such that one end and the other end of the ceramic fired body are respectively surrounded and connected to a plurality of internal electrode layers formed so as to expose one end or the other end; Applying a resin layer to a surface exposed to the outside of the front surface of the ceramic sintered body; Forming a plating layer on the surface of the external electrode by a wet barrel plating method; And a step of vacuum-drying the ceramic barrel finished with the wet barrel plating.

A method of manufacturing a multilayer ceramic capacitor according to the present invention is a method of manufacturing a multilayer ceramic capacitor in which a resin layer is coated on a surface of a ceramic sintered body when plating an external electrode and vacuum dried to apply a high voltage or a high surge voltage, It is advantageous in that the insulation resistance is lowered due to the influence of hydrogen and the lifetime is prevented from being lowered. When the external electrode is plated with a resin layer on the surface of the ceramic fired body and vacuum drying is performed, It is possible to prevent the chemical mechanical erosion of the ceramic sintered body from being caused by the ceramic body and to prevent the mechanical strength of the ceramic itself from being weakened. It is possible to prevent the loss of the electrostatic capacity and to prevent the ceramic sintered body from being chemically eroded by the plating liquid To prevent the mechanical strength of the ceramic itself from becoming weak As there is an advantage capable of improving the reliability of the electrical characteristics of the monolithic ceramic capacitor.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a process flow diagram showing a method for producing a multilayer ceramic capacitor of the present invention,
FIG. 2 is a process flow chart showing the plating layer forming method shown in FIG. 1 in detail,
3 is a plan view of the ceramic green sheet coated with the internal electrode paste pattern manufactured by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1,
FIG. 4 is a plan view of the ceramic squeeze produced by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1,
5 is a cross-sectional view of the ceramic squeezer shown in Fig. 4,
FIG. 6 is a cross-sectional view of a ceramic pressure-sensitive adhesive having a corner portion removed by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1;
FIG. 7 is a cross-sectional view of a ceramic sintered body in which external electrodes are formed by the method for manufacturing a multilayer ceramic capacitor of the present invention shown in FIG. 1,
FIG. 8 is a cross-sectional view of a ceramic sintered body to which a resin layer is applied by the method for manufacturing a multilayer ceramic capacitor of the present invention shown in FIG. 1,
FIG. 9 is a sectional view of a multilayer ceramic capacitor completed by the method of manufacturing the multilayer ceramic capacitor of the present invention shown in FIG. 1; FIG.

Hereinafter, embodiments of a method for manufacturing a multilayer ceramic capacitor of the present invention will be described with reference to the accompanying drawings.

As shown in FIGS. 1 and 9, a method of manufacturing a multilayer ceramic capacitor according to the present invention includes firstly forming a plurality of dielectric layers 11 and a plurality of dielectric layers 11 by barreling, A ceramic sintered body 10 having a plurality of internal electrode layers 12 is formed (S10). When the ceramic sintered body 10 is formed, the ceramic sintered body 10 is formed so that one end and the other end of the ceramics sintered body 10 are surrounded by the external electrode 12 to be connected to the plurality of internal electrode layers 12, 20 are formed (S20). When the external electrode 20 is formed, the resin layer 30 is coated on the exposed surface of the ceramic sintered body 10 (S30). When the resin layer 30 is applied, a plating layer 40 is formed on the surface of the external electrode 20 using a wet barrel plating method on the surface of the external electrode 20 (S40). When the plating layer 40 is formed, the ceramic sintered body 10 that has been wet barrel-plated is vacuum-dried (S50).

The method for manufacturing the multilayer ceramic capacitor of the present invention will be described in detail as follows.

In step S10 of forming the ceramic fired body 10, as shown in Figs. 1 and 3 to 6, a known green sheet slurry for preparing a ceramic green sheet 11a is first prepared (S11). When the green sheet slurry is prepared, a plurality of ceramic green sheets 11a are formed using a green sheet slurry and a doctor blade method (S12). When the ceramic green sheet 11a is formed, a plurality of internal electrode paste patterns 12a are applied to the plurality of ceramic green sheets 11a so as to be spaced apart from each other as shown in FIG. 3 (S13). Here, nickel (Ni) is used as each material of the plurality of internal electrode paste patterns 12a. When a plurality of internal electrode paste patterns 12a are applied to a single ceramic green sheet 11a so as to be spaced apart from each other, a plurality of ceramic green sheets 11a coated with a plurality of internal electrode paste patterns 12a are stacked Followed by pressing to produce a ceramic sheet compact (not shown) (S14).

4 and 5, a plurality of ceramic green sheets 11a are formed into a ceramic green sheet pattern 11b so that the internal electrode paste patterns 12a applied to the respective ceramic green sheet patterns 11a are formed at one end or the other The ceramics pressed body 10a is formed by cutting the ceramic sheet pressed body so that the end of the ceramic pressed body 10a is exposed (S15). The thickness T1 of the ceramic green sheet pattern 11b is 0.5 to 3 占 퐉 and the thickness T2 of the internal electrode paste pattern 12a is 0.2 to 1.2 占 퐉. The ceramic pressure-sensitive adhesive sheet 10a is also formed so that the number of layers of the ceramic green sheet pattern 11b is 100 to 1500 and the number of layers of the internal electrode paste pattern 12a is the same as that of the ceramic green sheet pattern 11b. As shown in FIG. 4, the ceramic pressure bonding agent 10a is formed such that the transverse length CL1 is 1,6 ± 0,15 cm and the longitudinal length CL2 is 0.85 ± 0,15 cm. That is, although the multilayer ceramic capacitor manufactured by the method of manufacturing the multilayer ceramic capacitor of the present invention has a chip scale of 1608, the chip scale of the multilayer ceramic capacitor is not limited to the 1608 standard.

When the ceramic pressure-sensitive adhesive 10a is formed, the ceramic pressure-sensitive adhesive 10a is debinded at 200 to 500 ° C (S16). Here, well-known techniques are applied to binder removal processing. The ceramic binder 10a subjected to the binder removal treatment so that the ceramic green sheet pattern 11b and the internal electrode paste pattern 12a become the internal electrode layer 12 and the ceramic dielectric layer 11 after the debindering process is completed is placed in a reducing atmosphere Followed by firing at 1000 to 1300 캜 for 1 to 3 hours to form the ceramic fired body 10 (S16). When the ceramic sintered body 10 is formed, barrel polishing is performed to remove the corner portion of the ceramic sintered body 10 as shown in Fig. 6 (S17). The internal electrode paste pattern 12a of the barrel-polished ceramic fired body 10 has one of the ends and the other end thereof aligned with the ceramic green sheet pattern 11b and has a first margin length ( ML1) is 2 to 50 mu m, and the second margin length ML2 is

Figure 112015120174162-pat00001
. That is, in the method of manufacturing the multilayer ceramic capacitor of the present invention, the resin layer 30 is coated on the surface of the ceramic sintered body 10 by plating on the external electrode 20 to be described later, It is possible to prevent breakdown of the insulation resistance due to expansion of the ceramic green sheet pattern 11b along the surface of the ceramic green sheet pattern 11b and electrical connection therebetween, thereby maximizing the surface area of the internal electrode paste pattern 12a in the ceramic green sheet pattern 11b do. Therefore, the multilayer ceramic capacitor manufactured by the method of manufacturing the multilayer ceramic capacitor of the present invention can maximize capacitance with respect to the surface area of the same ceramic green sheet pattern 11b as well as withstanding voltage.

The first margin length ML1 shown in FIG. 4 indicates a length from the other end to the other end of the ceramic green sheet pattern 11b when the one end of the internal electrode paste pattern 12a is exposed, When the other end of the ceramic green sheet pattern 11a is exposed, the length from the one end to the one end of the ceramic green sheet pattern 11b. The second margin length ML2 may be a length from one end of the internal electrode paste pattern 12a perpendicular to the first margin length ML1 to one end of the ceramic green sheet pattern 11b, 12a from the other end to the other end of the ceramic green sheet pattern 11b.

Step S20 of forming the external electrode 20 is performed such that when the ceramic sintered body 10 is formed, one end of the ceramic sintered body 10 and the other end of the ceramic sintered body 10 are wrapped, The outer electrode paste is formed of copper (Cu), and the remaining material for manufacturing copper (Cu) paste is formed by using a known electrode paste Description will be omitted.

The step of applying the resin layer 30 (S30) may be performed by forming the external electrode 20 on the surface exposed to the outside of the ceramic sintered body 10, that is, the surface of the ceramic sintered body 10 Is applied to the surface exposed to the outside of the front surface of the ceramic sintered body (10) by using a resin-containing solution having a pyrolysis temperature of 200 ° C or higher and a dipping method on the surface exposed to the outside without forming the external electrode (20). Here, the resin-containing solution having a pyrolysis temperature of 200 ° C or higher means that the thermal decomposition temperature of the resin contained in the resin-containing solution is 200 ° C or higher, and the resin is an epoxy resin, a polyimide resin, a polyamide resin , A silicone resin, a PEEK (polyetheretherketone) resin, and a bain resin are selected and used. The resin layer 30 is densely formed by applying the resin layer 30 repeatedly 1 to 3 times by using the dipping method and the resin layer 30 is densely packed with the resin layer 30 by the wet barrel plating method The hydrogen generated during the plating process can be prevented from penetrating into the ceramic sintered body 10 and expanding the internal electrode layer 12.

In the step S40 of forming the plating layer 40, as shown in FIGS. 2 and 9, the ceramic fired body 10 on which the external electrode 20 is formed is pre-cleaned (S41). In this pretreatment, the ceramic fired body 10 on which the external electrode 20 is formed is degreased (S1) using an alkaline cleaning solution having a pH of 6 to 10 and a temperature of 45 to 60 ° C. When degreasing of the ceramic fired body 10 is completed, the first water washing is performed to clean the degreased ceramic fired body 10 using pure water at room temperature (S2). After completion of the first water washing, the first fired ceramic fired body 10 is pickled by washing with an acidic cleaning solution having a pH of 3 to 5 and a temperature of 45 to 60 ° C (S3). Here, a known acidic washing solution having a pH of 3 to 4 is used as the acidic washing solution, and acidic washing with acidic solution is used. When the pickling is completed, the second water rinsing is performed to clean the ceramic fired body 10 which has been pickled with pure water at room temperature (S4). Here, pretreatment, that is, degreasing is performed to remove contaminants adhering to the surface of the ceramic fired body 10.

After the second water washing is completed and the pretreatment of the ceramic fired body 10 is completed, the pretreated ceramic fired body 10 is fired for 0.5 to 5 hours using a nickel (Ni) plating solution having a pH of 3 to 8 and a temperature of 45 to 60 ° C Nickel (Ni) is plated to form a nickel layer 41 on the surface of the external electrode 20 (S42). When the nickel layer 41 is formed on the surface of the external electrode 20, the first flushing is performed to clean the ceramic sintered body 10 coated with nickel (Ni) using pure water (S43). When the first water washing is completed, the first fired ceramic fired body 10 is plated with tin (Sn) for 0.5 to 5 hours using a tin (Sn) plating solution having a pH of 3 to 8 and a temperature of 45 to 60 占 폚, A tin layer 42 is formed on the surface of the layer 41 (S44), and plating of the plating layer 40 is completed. When the tin layer 42 is formed, a second flushing is performed to clean the tin-plated ceramic fired body 10 with pure water (S45).

The step of vacuum drying (S50) is a step of drying the moisture attached to the ceramic sintered body (10) through the second water washing step (S45) as shown in Figs. 1 and 9 when the second water washing step (S45) Drying is performed by vacuum drying the ceramic fired body 10 in an atmosphere at a temperature of 100 to 250 DEG C and a pressure of 15 to 150 torr for 30 to 360 minutes. By vacuum drying the ceramic sintered body 10 as described above, it is possible to discharge the hydrogen or the plating liquid that can permeate through the resin layer 30 during the plating process, and by the method of manufacturing the multilayer ceramic capacitor of the present invention by using hydrogen or a plating solution It is possible to prevent the reliability of the manufactured multilayer ceramic capacitor from deteriorating.

In order to test the electrical characteristics of the multilayer ceramic capacitor manufactured by the method of manufacturing the multilayer ceramic capacitor of the present invention, a multilayer ceramic capacitor was prepared as in Example 1.

In order to manufacture the multilayer ceramic capacitor according to the first embodiment of the method for manufacturing a multilayer ceramic capacitor of the present invention, an internal electrode paste pattern 12a is first screen printed (printed) on a ceramic green sheet 11b having a thickness (T1) And an internal electrode paste pattern 12a was formed so as to have a thickness T1 of 1 mu m. A ceramic green sheet 11b coated with an internal electrode paste pattern 12a having a thickness T1 of 1 占 퐉 is laminated in such a manner that the ends of the internal electrode paste pattern 12a are exposed to one side or the other side, A pressure-sensitive adhesive 10a was produced. The ceramic pressure-sensitive adhesive 10a was prepared so that the chip scale was the 1608 standard.

After the ceramic presser 10a was manufactured, the ceramic compact 10 was fired in a reducing atmosphere of 1200 ° C, which was rapidly heated, for 1 hour, and barrel polishing was performed. Then, steps S20 to S50 of the method for manufacturing a multilayer ceramic capacitor of the present invention shown in FIG. 1, the number of times of application of the resin layer 30 shown in Table 1, hot air drying and vacuum drying conditions, Ceramic capacitors were fabricated. That is, for the test of the multilayer ceramic capacitor manufactured by the method of manufacturing the multilayer ceramic capacitor of the present invention, the number of application of the resin layer 30 is divided into 1 to 3, the vacuum drying condition is 100 to 150 ° C, 30 to 90 torr, and the time was divided into 30 to 150 minutes to prepare a multilayer ceramic capacitor. Accelerated life test, high temperature and humidity resistance load test, and PCBT (pressure cooker bias test) tests were conducted using the multilayer ceramic capacitor thus fabricated.

In the accelerated life test, a DC voltage of 18.9 V was applied at 125 ° C, and the product whose insulation resistance dropped below 1 Mohm (mega ohm) within 2 hours was defective. The number of samples was 50, The PCBT test was carried out at 125 ° C, 85% relative humidity, and 2% relative humidity. The PCBT test was carried out at 125 ° C, relative humidity 85%, relative humidity 85%, DC voltage of 6.3V, Atm, 12.6V DC voltage was applied, and the product whose insulation resistance dropped below 1 Mohm within 12 hours was treated as defective and the number of samples was 50.

sample Coating count hot air dry Vacuum drying Accelerated life test High Temperature Humidity Load Test PCBT test Temperature (℃) Time (minutes) Temperature (℃) Pressure (Torr) Time (minutes) One 0 120 180

Untreated


5/50 10/50 10/50 2 0 150 200 5/50 8/50 7/50 3 One 120 100 2/50 5/50 6/50 4 One 150 200 3/50 5/50 6/50 5 3 120 180 5/50 1/50 2/50 6 3 120 200 1/50 1/50 1/50 7 3 150 200 1/50 1/50 0/50 8 0




Untreated






100 15 30 3/50 2/50 1/50 9 0 100 30 30 2/50 3/50 3/50 10 One 120 15 180 0/50 0/50 0/50 11 3 150 90 30 0/50 0/50 0/50 12 0 100 15 90 1/50 0/50 3/50 13 One 100 30 90 0/50 0/50 0/50 14 One 120 60 90 0/50 0/50 0/50 15 One 120 60 120 0/50 0/50 0/50 16 0 150 90 120 1/50 1/50 2/50 17 One 150 60 120 0/50 0/50 0/50 18 3 100 30 100 0/50 0/50 0/50 19 3 120 60 180 0/50 0/50 0/50 20 0 150 60 180 2/50 0/50 1/50 21 3 100 30 120 0/50 0/50 0/50

Table 1 shows the results of the accelerated lifetime test, the high-temperature moisture-absorption load test and the PCBT test. As shown in Table 1, the vacuum drying was untreated, that is, 5 of the 50 laminated ceramic capacitors, 10 of the accelerated life test, 10 of the high temperature resistant moisture load test, and 10 of the PCBT test. On the other hand, in the case of the laminated ceramic capacitor in which the resin layer (30) was applied three times in addition to the copper hot air drying at 150 ° C. for 200 minutes, one in the accelerated life test, one in the high temperature resistant moisture load test and one in the PCBT test The dog was badly treated.

In the case of performing vacuum drying, the multilayer ceramic capacitors which were vacuum-dried at 100 ° C. and 15 torr for 30 minutes and not coated with the resin layer (30) were found to have 3 in the accelerated lifetime test and 3 in the accelerated life test One defect was treated in the dog and PCBT test. On the other hand, when the resin layer 30 was applied three times in vacuum drying at 100 ° C. and 30 torr for 120 minutes, the number of laminated ceramic capacitors was 0 in the accelerated life test among the 50 laminated ceramic capacitors, and 0 in the accelerated life test And 0 in PCBT test.

The decrease in the insulation resistance characteristic of the multilayer ceramic capacitor, which may occur during the plating process, can be prevented according to the number of application times of the resin layer 30. However, by vacuum drying the resin layer 30 with application of the resin layer 30, It is possible to prevent degradation of the electrical characteristics of the multilayer ceramic capacitor manufactured by the multilayer ceramic capacitor manufacturing method of the present invention by preventing deterioration of the insulation resistance characteristic of the multilayer ceramic capacitor that may be generated.

As described above, in the method of manufacturing a multilayer ceramic capacitor of the present invention, a resin layer is coated on the surface of a ceramic sintered body when plating an external electrode, and vacuum drying is performed to apply a high voltage or a high surge voltage, It is possible to prevent deterioration of the insulation resistance due to expansion of water or hydrogen and deterioration of the service life. When the external electrode is plated with a resin layer on the surface of the ceramic fired body and vacuum dried, It is possible to prevent the chemical erosion of the ceramic fired body from being caused by the alkali plating solution to prevent the mechanical strength of the ceramic itself from becoming weak and to prevent the loss of the electrostatic capacity and to prevent the ceramic fired body from being chemically eroded by the plating liquid And that the mechanical strength of the ceramic itself is weakened By thereby improving the reliability of the electrical characteristics of the monolithic ceramic capacitor.

The present invention can be applied to the manufacturing industry of multilayer ceramic capacitors in the method of manufacturing multilayer ceramic capacitors of the present invention.

10: Ceramic baked body 11: Dielectric layer
12: internal electrode layer 20: external electrode
30: resin layer 40: plated layer
41: nickel layer 42: tin layer

Claims (8)

Forming a ceramic sintered body having a plurality of dielectric layers and a plurality of internal electrode layers formed on the plurality of dielectric layers such that one or both ends of the dielectric layer are exposed;
Forming external electrodes such that one end and the other end of the ceramic fired body are respectively surrounded and connected to a plurality of internal electrode layers formed so as to expose one end or the other end;
Applying a resin layer to a surface exposed to the outside of the front surface of the ceramic sintered body;
Forming a plating layer on the surface of the external electrode by a wet barrel plating method; And
Vacuum-drying the ceramic barrel after the wet barrel plating is completed,
Wherein the step of vacuum drying the ceramic fired body comprises vacuum drying the ceramic fired body in an atmosphere at a temperature of 100 to 250 DEG C and a pressure of 15 to 150 torr for 30 to 360 minutes . The method according to claim 1,
The step of forming the ceramic fired body includes: preparing a green sheet slurry;
Forming a plurality of ceramic green sheets using the green sheet slurry;
Applying a plurality of internal electrode paste patterns to the plurality of ceramic green sheets such that the plurality of internal electrode paste patterns are spaced apart from each other;
Stacking a plurality of ceramic green sheets coated with the plurality of internal electrode paste patterns, and pressing the ceramic green sheets to manufacture a ceramic sheet pressed body;
Forming a plurality of ceramic green sheets as a ceramic green sheet pattern and cutting the ceramic sheet pressed body so that the inner electrode paste pattern applied to each of the plurality of ceramic green sheets is exposed at one end or the other end;
Treating the ceramic pressure-sensitive adhesive at 200 to 500 ° C;
Forming a ceramic sintered body by firing the binder-treated ceramic sintered material at 1000 to 1300 캜 for 1 to 3 hours so that the ceramic green sheet pattern and the internal electrode paste pattern become the internal electrode layers and the ceramic dielectric layers, respectively; And
And barrel polishing to remove a corner portion of the ceramic sintered body. 3. The method of claim 2,
In the step of forming the ceramic pressure bonding agent by cutting the ceramic sheet press body
Wherein the thickness of the ceramic green sheet pattern is 0.5 to 3 占 퐉, the thickness of the internal electrode paste pattern is 0.2 to 1.2 占 퐉, the number of the ceramic green sheet patterns is 100 to 1500, Wherein the thickness of the ceramic green sheet pattern is the same as that of the ceramic green sheet pattern. 3. The method of claim 2,
In the step of forming the ceramic pressure bonding agent by cutting the ceramic sheet pressed body, one of the ends of the internal electrode paste pattern is aligned with the ceramic green sheet pattern, and the first margin length is 2 to 50 Mu m, and the second margin length is
Figure 112015120174162-pat00002
Respectively,
When the end of one end of the inner electrode paste pattern is exposed, the length of the first margin is longer than the length from the other end to the other end of the ceramic green sheet pattern. When the other end of the inner electrode paste pattern is exposed, And the second margin length is a length from one end of the internal electrode paste pattern orthogonal to the first margin length to one end of the ceramic green sheet pattern or a length from one end of the internal electrode paste pattern to the other end of the ceramic green sheet pattern, Is a length from the other end of the ceramic green sheet pattern to the other end of the ceramic green sheet pattern. The method according to claim 1,
Wherein the resin layer is applied to a surface exposed to the outside of the front surface of the ceramic fired body by using a resin-containing solution having a thermal decomposition temperature of 200 ° C or higher and a dipping method in the step of applying the resin layer . 6. The method of claim 5,
Wherein the resin contained in the resin-containing solution is one selected from the group consisting of an epoxy resin, a polyimide resin, a polyamide resin, a silicone resin, a PEEK (polyetheretherketone) resin, A method of manufacturing a capacitor. The method according to claim 1,
Wherein the resin layer is applied repeatedly 1 to 3 times by using a dipping method in the step of applying the resin layer. delete
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KR102478423B1 (en) 2021-09-08 2022-12-19 삼화콘덴서공업 주식회사 Multi-layer ceramic capacitor manufacturing method
KR20220170399A (en) 2021-06-22 2022-12-30 삼화콘덴서공업주식회사 Conductive paste composition for termination electrode of multilayer ceramic capacitor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015198239A (en) * 2014-04-03 2015-11-09 株式会社村田製作所 Method of manufacturing electronic component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015198239A (en) * 2014-04-03 2015-11-09 株式会社村田製作所 Method of manufacturing electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220170399A (en) 2021-06-22 2022-12-30 삼화콘덴서공업주식회사 Conductive paste composition for termination electrode of multilayer ceramic capacitor
US11682522B2 (en) 2021-06-22 2023-06-20 Samhwa Capacitor Co., Ltd. Conductive paste composition for external electrode of multilayer ceramic capacitor
KR102478423B1 (en) 2021-09-08 2022-12-19 삼화콘덴서공업 주식회사 Multi-layer ceramic capacitor manufacturing method

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