KR101752871B1 - Thermally Conductive Silicone Sheet - Google Patents

Thermally Conductive Silicone Sheet Download PDF

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Publication number
KR101752871B1
KR101752871B1 KR1020150124934A KR20150124934A KR101752871B1 KR 101752871 B1 KR101752871 B1 KR 101752871B1 KR 1020150124934 A KR1020150124934 A KR 1020150124934A KR 20150124934 A KR20150124934 A KR 20150124934A KR 101752871 B1 KR101752871 B1 KR 101752871B1
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silicon layer
thermally conductive
weight
parts
silicone sheet
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KR1020150124934A
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KR20170028091A (en
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강순만
이수영
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주식회사 이에스디웍
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08K3/0033—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2383/00—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention relates to a thermally conductive silicone sheet, which is a heat transfer member attached to a heat generating element and transferring heat, the layer having a first adhesive force of a predetermined value and a hardness of 30 to 70 Shore 00 value, A first silicon layer comprising a thermally conductive filler having a thermal conductivity of at least a predetermined value; A layer having a second adhesive force less than or equal to the first adhesive force and a hardness of 70 to 100 Shore 00 value, the second adhesive layer being disposed on the first silicon layer, the second polysiloxane having a thermal conductivity of not less than a predetermined value, And a second silicon layer including a thermally conductive filler.
According to the present invention, there is a "two-layer structure" in which the second silicon layer has a relatively large hardness and tensile strength as compared to the first silicon layer. The shape of the product is easily deformed And the shape-retaining property is improved.

Description

[0001] Thermally Conductive Silicone Sheet [0002]

The present invention relates to a thermally conductive silicone sheet, and more particularly to a thermally conductive silicone sheet which has a "two-layer structure" comprising a first silicon layer and a second silicon layer having a relatively high hardness and tensile strength, Is easily deformed or stretched, and is excellent in shape retention.

BACKGROUND ART LSI chips (large scale integrated circuit chips) such as CPUs and memories used in electronic devices such as personal computers, digital video disks, mobile phones and the like are used to generate a large amount of heat by themselves in accordance with high performance, high speed, miniaturization, And the temperature rise of the chip due to the heat causes the operation failure and destruction of the chip. Therefore, various heat conduction members for suppressing the temperature rise of the operating chip have been used.

Since such a thermally conductive member must have both a high insulating property and a high thermal conductivity, many thermally conductive pads made of silicon have been used in many conventional electronic devices.

However, since the conventional thermally conductive silicone pad is composed of one layer, the shape of the product is easily deformed or stretched at the time of automatic cutting by the high-speed cutting machine, and physical properties such as shape retention, dimensional retention and durability There was a bad problem.

In order to solve this problem, a product having a reinforcing material such as glass fiber inserted in the inside of the silicon pad has been developed. However, in the case of this product, the entire manufacturing process is complicated and the thermal conductivity is decreased due to the glass fiber It still remains.

The object of the present invention is to provide a thermally conductive silicone sheet whose structure is improved so that the shape of the product is not easily deformed or stretched at the time of processing by a high-speed cutting machine, .

In order to achieve the above object, a thermally conductive silicone sheet according to the present invention is a heat transfer member which is attached to a heat generating element and transfers heat, and has a first adhesive strength of a predetermined value and a hardness of 30 to 70 Shore 00, A first silicon layer comprising a first polysiloxane and a thermally conductive filler having a thermal conductivity equal to or greater than a predetermined value; A layer having a second adhesive force less than or equal to the first adhesive force and a hardness of 70 to 100 Shore 00 value, the second adhesive layer being disposed on the first silicon layer, the second polysiloxane having a thermal conductivity of not less than a predetermined value, And a second silicon layer including a thermally conductive filler.

Wherein the first polysiloxane of the first silicon layer and the second polysiloxane of the second silicon layer preferably comprise a vinyl terminated dimethyl polysiloxane.

Wherein the first silicon layer comprises 5 to 30 parts by weight of the first polysiloxane and 65 to 95 parts by weight of the thermally conductive filler and the second silicon layer comprises 10 to 40 parts by weight of the second polysiloxane, And 50 to 80 parts by weight of the thermally conductive filler.

The first silicon layer may include 0.005 to 5 parts by weight of a platinum compound, 0.01 to 5 parts by weight of methylhydrogenpolysiloxane, 0.01 to 5 parts by weight of a pigment, and 0.003 to 2 parts by weight of a retarder.

The second silicon layer preferably includes 0.005 to 5 parts by weight of a platinum compound, 0.01 to 5 parts by weight of methylhydrogenpolysiloxane, 0.01 to 5 parts by weight of a pigment, and 0.003 to 2 parts by weight of a retarder.

The thermally conductive filler preferably includes at least one selected from the group consisting of alumina, boron nitride, aluminum nitride, silicon carbide, aluminum hydroxide, magnesium oxide, graphite, and carbon black.

Here, it is preferable that a protective film is attached to at least one of the lower surface of the first silicon layer and the upper surface of the second silicon layer.

Here, it is preferable that the compression ratio is 70 to 98%.

Here, the specific gravity is preferably 2 to 4.

Here, the first adhesive force is preferably 50 to 500 gf / 10 mm 2 .

Here, the thermal conductivity is preferably 1 to 5 W / mK.

Here, the thickness is preferably 0.2 to 5 mm.

Here, it is preferable that the hardness is 30 to 80 Shore 00.

Here, the usable temperature is preferably -60 to 200 ° C.

According to the present invention, there is provided a layer having a first adhesive force of a predetermined value and a hardness of a value of 30 to 70 Shore 00, comprising a first polysiloxane and a first silicon layer including a thermally conductive filler having a thermal conductivity of a predetermined value or higher, And a hardness of 70 to 100 Shore 00 value, wherein the layer is disposed on the upper side of the first silicon layer and has a second polysiloxane and a thermal conductivity equal to or higher than a predetermined value Layer structure having the second silicon layer having a relatively large hardness and tensile strength as compared with the first silicon layer, and a high-speed cutting machine having a " two-layer structure " The shape of the product is not easily deformed or stretched at the time of processing by the extruder.

1 is a cross-sectional view of a thermally conductive silicone sheet according to an embodiment of the present invention.
Fig. 2 is a view showing the state of use of the thermally conductive silicone sheet shown in Fig. 1. Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a thermally conductive silicone sheet according to an embodiment of the present invention, and FIG. 2 is a view showing the state of use of the thermally conductive silicone sheet shown in FIG.

1 and 2, a thermally conductive silicone sheet 100 according to a preferred embodiment of the present invention is attached to a heating element H of an electronic device that generates high-temperature heat such as a CPU or an LSI chip, A first silicon layer 10, a second silicon layer 20, and a protective film 30. The first silicon layer 10, the second silicon layer 20,

2, the first silicon layer 10 includes a first polysiloxane and a thermally conductive filler having a thermal conductivity of at least a predetermined value, which is a portion attached to the surface of the heating element H .

The first polysiloxane is a compound in which a silicon atom and an oxygen atom are alternately bonded to form a chain structure. In this embodiment, the first polysiloxane includes a vinyl-terminated dimethylpolysiloxane.

Silicone resin as a main material of the first silicon layer 10 can be used stably at a temperature of -260 to -80 ° C. 2. It can be used as a mold release agent when molding a plastic or metal. (3) the action of removing bubbles from most of the solvents is large; (4) water repellency (water repellency) is imparted to inorganic or organic matters; ⑤ It is physiologically harmless, so it can be used as a cosmetic or medicine. ⑥ It has good electrical insulation. ⑦ It has the highest heat resistance when the organic group is methyl group. ⑧ It substitutes other alkyl or allyl group. Has a somewhat falling feature.

Wherein the thermally conductive filler is a powdery material that is mixed to be evenly distributed inside the first polysiloxane and is made of a material selected from the group consisting of alumina, boron nitride, aluminum nitride, silicon carbide, aluminum hydroxide, magnesium oxide, graphite, ≪ / RTI >

The thermally conductive filler preferably has a particle size of 1 to 120 mu m, and is preferably used in a mixture of a small particle size to a large one for the purpose of improving thermal conductivity.

In this embodiment, the first silicon layer 10 comprises 5 to 30 parts by weight of the vinyl-terminated dimethylpolysiloxane, 65 to 95 parts by weight of the thermally conductive filler, 0.005 to 5 parts by weight of a platinum compound, 0.01 to 5 parts by weight of methylhydrogenpolysiloxane 0.01 to 5 parts by weight of pigment, and 0.003 to 2 parts by weight of retardant.

The methylhydrogenpolysiloxane serves as a cross-linker and a chain extender, and increases the degree of polymerization of the silicone resin, and has the function of improving water repellency and flowability and reducing the formation of agglomerates.

When the content of the methylhydrogenpolysiloxane relative to the content of the vinyl-terminated dimethylpolysiloxane is increased, the adhesion of the first silicon layer 10 is decreased. Conversely, the content of the methylhydrogenpolysiloxane relative to the content of the vinyl- The adhesion of the first silicon layer 10 increases.

To increase the adhesion of the first silicon layer 10, silanol (Si-OH) or methyl-Si may be added.

The platinum compound is a catalyst for accelerating the curing of the silicone resin. The platinum compound is a catalyst for promoting the curing of the silicone resin. Examples of the platinum compound include platinum fine powder, platinum black, silica fine powder containing platinum, platinum-containing activated carbon, chloroplatinic acid, platinum tetrachloride, an alcohol solution of chloroplatinic acid, And a complex of an alkenylsiloxane (e.g., divinyltetramethyldisiloxane).

The retarder is a retarder for controlling the curing rate of the silicone resin and is a material for ensuring a proper curing time necessary for the entire working process.

The retarder may be an organic compound having a triple bond or a double bond at the terminal, and examples thereof include ethynylcyclohexanol, phenylbutynol, 2-methyl-3-butyn- 5-dimethyl-1-hexyn-3-ol and the like.

The first silicon layer 10 has a first adhesion of 50 to 500 gf / 10 mm 2 . Here, the first adhesive force is an adhesive shear force, and the first silicon layer 10 is made of a square specimen having a width of 10 mm and a width of 10 mm, which is adhered to both sides of a stainless steel plate (SUS 304) The load is applied for 10 seconds, and the maximum force applied while peeling in the vertical direction at a rate of 12 mm / min is measured and calculated.

The first silicon layer 10 has a hardness of 30 to 70 Shore 00 values. The hardness measurement method here is in accordance with ASTM D 2240.

The first silicon layer 10 may have a thickness of 50 to 5000 탆, and in this embodiment, it has a thickness of 350 탆. The thickness measurement method is in accordance with ASTM D 3652.

The second silicon layer 20 is a layer disposed on the upper side of the first silicon layer 10 as shown in FIG. 2, and includes a second polysiloxane and a thermally conductive filler having a thermal conductivity of a predetermined value or higher .

The second polysiloxane is a compound in which a silicon atom and an oxygen atom are alternately bonded to form a chain structure. In this embodiment, the second polysiloxane includes a vinyl-terminated dimethylpolysiloxane.

Wherein the thermally conductive filler is a powdery material which is mixed to be evenly distributed inside the second polysiloxane and is composed of alumina, boron nitride, aluminum nitride, ≪ / RTI >

In this embodiment, the second silicon layer 20 comprises 10 to 40 parts by weight of the vinyl-terminated dimethylpolysiloxane, 50 to 80 parts by weight of the thermally conductive filler, 0.005 to 5 parts by weight of a platinum compound, 0.01 to 5 parts by weight of methylhydrogenpolysiloxane 0.01 to 5 parts by weight of pigment, and 0.003 to 2 parts by weight of retardant.

The second silicon layer 20 is a low adhesive layer having a second adhesive strength that is less than or equal to the first adhesive strength of the first silicon layer 10 and is greater than the hardness of the first silicon layer 10 70 to 100 Shore 00 value. The hardness measurement method here is in accordance with ASTM D 2240.

Since the second silicon layer 20 has a greater hardness than the first silicon layer 10 in the present embodiment, the tensile strength per unit cross section is larger than that of the first silicon layer 10 I have. Here, the numerical values obtained by comparing the tensile strengths of the second silicon layer 20 and the first silicon layer 10 are not given, but if the remaining conditions are the same, the specific gravity or hardness of each layer determines the tensile strength value of each layer It is an element.

The second silicon layer 20 may have a thickness of 20 to 500 탆, and in this embodiment, it has a thickness of 150 탆.

In this embodiment, the content ratio of the vinyl-terminated dimethylpolysiloxane of the first silicon layer 10 is smaller than that of the vinyl-terminated dimethylpolysiloxane of the second silicon layer 20, and the thermal conductivity of the first silicon layer 10 The content ratio of the filler is larger than the content ratio of the thermally conductive filler of the second silicon layer (20).

The protective film 30 is a thin protective film made of a transparent synthetic resin material and is attached to the lower surface of the first silicon layer 10 and the upper surface of the second silicon layer 20, respectively.

The protective film 30 may have a thickness of 30 to 70 mu m, and in this embodiment, it has a thickness of 50 mu m.

As the protective film 30, a synthetic resin of various materials may be used. In this embodiment, polyethylene terephthalate (PET) is used.

The thermally conductive silicone sheet 100 may be manufactured to have a thickness of 0.2 to 5 mm, but has a thickness of 0.6 mm in the present embodiment.

It is preferable that the thermally conductive silicone sheet 100 is manufactured such that the compressive decompression ratio is 70 to 98% in a state where the protective film 30 is removed.

Here, the compressive decompression ratio was obtained by preparing a specimen of 8.5 mm in thickness having the same material as that of the thermally conductive silicone sheet 100 from which the protective film 30 was removed, and then mounting the specimen on the compression jig so as to have a thickness of 7.6 mm, 6.8 mm, Each is compressed and put in an oven and aged at 100 ° C for 100 hours. The deformed thickness after 4 hours of storage is measured and compared with the original thickness.

It is preferable that the thermally conductive silicone sheet 100 is manufactured such that the specific gravity is 2 to 4 in a state where the protective film 30 is removed. Here, the specific gravity measurement method is in accordance with ASTM D 792 test standard.

It is preferable that the thermally conductive silicone sheet 100 is manufactured such that the thermal conductivity is 1 to 5 W / mK with the protective film 30 removed. Here, the thermal conductivity measurement method is in accordance with ASTM E 1530 test standard.

It is preferable that the thermally conductive silicone sheet 100 is manufactured such that the hardness is 30 to 80 Shore 00 in a state where the protective film 30 is removed. The hardness measurement method here is in accordance with ASTM D 2240.

It is preferable that the thermally conductive silicone sheet (100) is manufactured so that the usable temperature is -60 to 200 占 폚.

The thermally conductive silicone sheet (100) has a volume resistivity of 10 < 11 > . Here, the volume resistance measurement method is in accordance with the ASTM D 257 test standard.

Hereinafter, an example of a method of manufacturing and using the thermally conductive silicone sheet 100 having the above-described structure will be described.

First, 0.01 to 5 parts by weight of a pigment is added to 5 to 30 parts by weight of the vinyl-terminated dimethylpolysiloxane, then 0.003 to 2 parts by weight of a retarder is added, and 65 to 95 parts by weight of the thermally conductive filler is added. 0.01 to 5 parts by weight of polysiloxane is added, and then 0.005 to 5 parts by weight of a platinum compound is added.

When the components of the first silicon layer 10 thus compounded are mixed well for about 0.5 to 4 hours and then subjected to a defoaming process for about 0.5 to 8 hours, a liquid first composition is prepared.

Similarly, 0.01 to 5 parts by weight of pigment is added to 10 to 40 parts by weight of the vinyl-terminated dimethylpolysiloxane, then 0.003 to 2 parts by weight of retardant is added, and 50 to 80 parts by weight of the thermally conductive filler is added. Then, methylhydrogenpolysiloxane 0.01 to 5 parts by weight, and then 0.005 to 5 parts by weight of a platinum compound.

When the components of the second silicon layer 20 thus compounded are mixed well for about 0.5 to about 4 hours and then subjected to a defoaming process for about 0.5 to 8 hours, a liquid second composition is prepared.

Next, the second composition is coated on one surface of the protective film 30 to a predetermined thickness. At this time, a comma coating technique or a roll to roll coating technique can be used.

Thereafter, the first composition is coated on the upper surface of the second composition to a predetermined thickness. At this time, a comma coating technique or a roll to roll coating technique can be used.

Next, the first composition and the second composition are dried using hot air, infrared (IR), or near-infrared (NIR), and the remaining one of the protective films 30 is attached to the upper surface of the first silicon layer 10 And the thermally conductive silicone sheet 100 cured by using a sheet rewinder is rolled in the form of a roll and is stored.

The thermally conductive silicone sheet 100 is used after removing the protective films 30 as shown in FIG. 2 and is disposed between the gaps G formed between the heat generating body H and the low temperature body C . It is preferable that a method of attaching the thermally conductive silicone sheet 100 to the heating element H and then attaching the low temperature body C to the second silicon layer 20 is adopted.

At this time, the thickness T of the thermally conductive silicone sheet 100 when used is disposed in the gap G in a slightly compressed state so as to have a thickness of 70% to 80% of the original thickness.

The thermally conductive silicone sheet 100 having the above-described structure is a layer having a first adhesive force of a predetermined value and a hardness of 30 to 70 Shore 00 value, and is composed of a first polysiloxane and a thermally conductive And a hardness of 70 to 100 Shore 00 value, wherein the first silicon layer (10) comprises a filler, and a second adhesive force, which is less than or equal to the first adhesion force, And includes a second silicon layer 20 including a second polysiloxane and a thermally conductive filler having a thermal conductivity equal to or greater than a predetermined value so that the hardness and tensile strength of the first silicon layer 10 are relatively high Layer structure having the second silicon layer 20 having a large size, the shape of the product is not easily deformed or stretched at the time of processing by the high-speed cutting machine, and the shape-retaining property is excellent.

Since the first polysiloxane of the first silicon layer 10 and the second polysiloxane of the second silicon layer 20 comprise a vinyl-terminated dimethyl polysiloxane, the thermally conductive silicone sheet 100 is excellent in heat resistance, Electrical properties, and weather resistance.

The thermally conductive silicone sheet (100) is characterized in that the first silicon layer (10) comprises 5 to 30 parts by weight of the first polysiloxane and 65 to 95 parts by weight of the thermally conductive filler, 20 comprises 10 to 40 parts by weight of the second polysiloxane and 50 to 80 parts by weight of the thermally conductive filler so that the heat generated from the heating element H is accumulated in the first silicon layer 10 and the second silicon layer 20 can be quickly conducted to the outside.

The thermally conductive silicone sheet 100 is characterized in that the first silicon layer 10 and the second silicon layer 20 comprise 0.005 to 5 parts by weight of a platinum compound, 0.01 to 5 parts by weight of methylhydrogenpolysiloxane, 0.01 to 5 parts by weight of a pigment, And 0.003 to 2 parts by weight of a retarder, the first silicon layer 10 has an excellent water repellency and flowability.

The thermally conductive silicone sheet (100) is characterized in that the thermally conductive filler is at least one selected from the group consisting of alumina, boron nitride, aluminum nitride, silicon carbide, aluminum hydroxide, magnesium oxide, graphite, So that there is an advantage that the silicone resin and the thermally conductive filler are easily mixed.

Since the protective film 30 is attached to at least one of the lower surface of the first silicon layer 10 and the upper surface of the second silicon layer 20 in the thermally conductive silicone sheet 100, There is an advantage that the layer 10 and the second silicon layer 20 can be prevented from being contaminated before use.

2, the thermally conductive silicone sheet 100 is stably mounted between the gaps G formed between the heating element H and the low temperature body C, as shown in Fig. 2, since the compression ratio is 70 to 98% And is not separated from the gap G even if an external impact is applied.

The thermally conductive silicone sheet 100 has a specific gravity of 2 to 4 and is relatively lightweight. Therefore, there is an advantage that the weight of an electronic product to be mounted is hardly increased.

In addition, since the first adhesive force of the first silicon layer 10 is 50 to 500 gf / 10 mm 2 , the thermally conductive silicone sheet 100 can be easily detached and separated from the heating element H even when an external impact is applied thereto There is no advantage.

Since the thermal conductive silicone sheet 100 has a thermal conductivity of 1 to 5 W / mK, heat generated from the heating element H can be rapidly conducted to the low temperature body C.

Further, since the thermally conductive silicone sheet 100 has a thickness of 0.2 to 5 mm, the thermally conductive silicone sheet 100 can be easily mounted on a very thin electronic equipment such as a smart phone.

Further, since the thermally conductive silicone sheet 100 has a hardness of 30 to 80 Shore 00, it is advantageous in that even if the surface of the heating element H is curved, it is easy to adhere.

Since the heat-conductive silicone sheet 100 has a usable temperature of -60 to 200 ° C, the heat-conductive silicone sheet 100 can be used for a heating element H that generates high heat and can be used for conduction of cold air.

The technical scope of the present invention is not limited to the contents described in the above embodiments, and the equivalent structure modified or changed by those skilled in the art can be applied to the technical It is clear that the present invention does not depart from the scope of thought.

[Description of Reference Numerals]
100: thermally conductive silicone sheet 10: first silicon layer
20: second silicon layer 30: protective film
C: low temperature body G:
H: Heating element

Claims (14)

A heat transfer member attached to a heating element for transferring heat,
A first silicon layer comprising a first polysiloxane and a thermally conductive filler having a thermal conductivity of a predetermined value or higher as a layer having a first adhesive force of a predetermined value and a hardness of 30 to 70 Shore 00 value;
A layer having a second adhesive force less than or equal to the first adhesive force and a hardness of 70 to 100 Shore 00 value, the second adhesive layer being disposed on the first silicon layer, the second polysiloxane having a thermal conductivity of not less than a predetermined value, A second silicon layer comprising a thermally conductive filler;
And a thermally conductive silicone sheet The method according to claim 1,
Wherein the first polysiloxane of the first silicon layer and the second polysiloxane of the second silicon layer comprise a vinyl terminated dimethyl polysiloxane. The method according to claim 1,
Wherein the first silicon layer comprises 5 to 30 parts by weight of the first polysiloxane and 65 to 95 parts by weight of the thermally conductive filler,
Wherein the second silicon layer comprises 10 to 40 parts by weight of the second polysiloxane and 50 to 80 parts by weight of the thermally conductive filler. The method of claim 3,
Wherein the first silicon layer comprises:
0.005 to 5 parts by weight of a platinum compound, 0.01 to 5 parts by weight of methylhydrogenpolysiloxane, 0.01 to 5 parts by weight of a pigment, and 0.003 to 2 parts by weight of a retarder. The method of claim 3,
Wherein the second silicon layer comprises:
0.005 to 5 parts by weight of a platinum compound, 0.01 to 5 parts by weight of methylhydrogenpolysiloxane, 0.01 to 5 parts by weight of a pigment, and 0.003 to 2 parts by weight of a retarder. The method according to claim 1,
Wherein the thermally conductive filler comprises:
Wherein the heat conductive silicone sheet comprises at least one selected from the group consisting of alumina, aluminum oxide, aluminum oxide, aluminum oxide, aluminum oxide, aluminum oxide, aluminum nitride, aluminum nitride, aluminum nitride, silicon carbide, aluminum hydroxide, magnesium oxide, graphite, The method according to claim 1,
Wherein a protective film is attached to at least one of a lower surface of the first silicon layer and an upper surface of the second silicon layer. The method according to claim 1,
And a compressive decomposition ratio of 70 to 98%. The method according to claim 1,
And a specific gravity of 2 to 4. The thermally conductive silicone sheet The method according to claim 1,
Wherein the first adhesive force is 50 to 500 gf / 10 mm < 2 > The method according to claim 1,
Wherein the thermally conductive silicone sheet has a thermal conductivity of 1 to 5 W / The method according to claim 1,
Wherein the thermally conductive silicone sheet has a thickness of 0.2 to 5 mm. The method according to claim 1,
And a hardness of 30 to 80 Shore < RTI ID = 0.0 > 00. ≪ The method according to claim 1,
And the usable temperature is -60 to 200 DEG C. The thermally conductive silicone sheet
KR1020150124934A 2015-09-03 2015-09-03 Thermally Conductive Silicone Sheet KR101752871B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110066517A (en) * 2019-04-29 2019-07-30 力王新材料（惠州）有限公司 Big specific heat capacity thermally conductive sheet, preparation method and applications

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092018A (en) 2001-09-19 2003-03-28 Keiwa Inc Reflection sheet and backlight unit using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092018A (en) 2001-09-19 2003-03-28 Keiwa Inc Reflection sheet and backlight unit using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110066517A (en) * 2019-04-29 2019-07-30 力王新材料（惠州）有限公司 Big specific heat capacity thermally conductive sheet, preparation method and applications

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