KR101730719B1 - Packaging method and package between light source and waveguide - Google Patents

Packaging method and package between light source and waveguide Download PDF

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Publication number
KR101730719B1
KR101730719B1 KR1020150103277A KR20150103277A KR101730719B1 KR 101730719 B1 KR101730719 B1 KR 101730719B1 KR 1020150103277 A KR1020150103277 A KR 1020150103277A KR 20150103277 A KR20150103277 A KR 20150103277A KR 101730719 B1 KR101730719 B1 KR 101730719B1
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KR
South Korea
Prior art keywords
chip
light source
reflector
integrated
optical waveguide
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Application number
KR1020150103277A
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Korean (ko)
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KR20170012657A (en
Inventor
박효훈
김성환
김종훈
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한국과학기술원
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Priority to KR1020150103277A priority Critical patent/KR101730719B1/en
Publication of KR20170012657A publication Critical patent/KR20170012657A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12176—Etching

Abstract

A packaging method between a light source and an optical waveguide includes forming a hole on a first chip on which an optical waveguide and a grating coupler are integrated; Embedding a second chip in the hole in which a light source emitting a light signal in a vertical direction is integrated; And disposing a reflector for reflecting the optical signal emitted from the light source and transmitting the reflected optical signal to the optical waveguide on the first chip.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a packaging method and a package between a light source and an optical waveguide,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical package including a light source and a packaging method, and more specifically, to a package for packaging a light source chip into a chip on which an optical waveguide is integrated and a packaging method therefor.

Conventional techniques for supplying a light source to a chip on which an existing optical waveguide is integrated use an optical fiber based optical connection method using an external light source. Generally, in the case of supplying light based on an optical fiber, a vertical coupling using an integrated optical lattice coupler and an edge coupling method for directly feeding the integrated optical waveguide section are used .

However, when based on the above optical coupling method, there are disadvantages such as optical loss due to large misalignment, high packaging cost, and packaging volume increase.

Accordingly, the present invention proposes a low-cost / high-efficiency light source-integrated packaging technique that reduces alignment errors based on a semiconductor process.

Embodiments of the present invention provide a packaging method in which a light source chip is embedded in a chip on which an optical waveguide is integrated, and a package manufactured thereby.

More specifically, embodiments of the present invention provide a packaging method in which a light source chip is embedded in a hole formed by etching a part of a chip on which an optical waveguide is integrated based on a semiconductor process technology, and a package manufactured thereby do.

In addition, embodiments of the present invention can be applied to a package that reflects an optical signal emitted from a light source and transmits the reflected light to an optical waveguide using an integrated optical lattice coupler, thereby generating a high efficiency optical coupling between the light source and the optical waveguide. Method and a package manufactured thereon.

According to an embodiment, a packaging method between a light source and a waveguide includes forming a hole on a first chip on which an optical waveguide and a grating coupler are integrated; Embedding a second chip in the hole in which a light source emitting a light signal in a vertical direction is integrated; And disposing a reflector for reflecting the optical signal emitted from the light source and transmitting the reflected optical signal to the optical waveguide on the first chip.

The step of disposing the reflector on the first chip may include disposing at least one of a planar mirror and a spherical mirror on the first chip.

Wherein the step of disposing at least one of the planar reflector and the spherical reflector on the first chip includes disposing at least one of concave micro lenses or convex microlenses based on a semiconductor process when the spherical reflector is disposed on the first chip. And depositing a metal having a reflection characteristic on the first chip in any one of the forms.

The step of disposing the reflector on the first chip may include a step of performing at least one of etching or vapor deposition on at least a part of the upper part of the first chip to dispose the reflector on the first chip can do.

The step of disposing the reflector on the first chip may include a position where the hole is formed on the first chip, a divergence angle of the optical signal emitted from the light source, or a position where the optical grating coupler is integrated on the first chip And arranging the reflector on the first chip based on at least one of the first and second reflectors.

Wherein the step of forming the hole on the first chip on which the optical waveguide and the optical grating coupler are integrated is based on at least one of the size of the second chip or the divergence angle of the optical signal emitted by the light source, And etching at least a portion of the top of the chip.

According to an embodiment, a package in which a light source and an optical waveguide are packaged includes a first chip on which an optical waveguide and a grating coupler are integrated; A second chip embedded in a hole formed on the first chip; a light source emitting a light signal in a vertical direction is integrated in the second chip; And a reflector disposed on the first chip for reflecting the optical signal emitted from the light source and transmitting the reflected optical signal to the optical waveguide.

According to an embodiment, a packaging method between a light source and a waveguide includes forming a hole on a first chip on which the optical waveguide is integrated; Embedding a second chip into the hole, the second chip integrating a light source emitting an optical signal; And forming a reflector on the first chip so as to reflect the optical signal emitted from the light source to be coupled to the end surface of the optical waveguide.

Embodiments of the present invention can provide a packaging method in which a light source chip is embedded in a chip on which an optical waveguide is integrated, and a package manufactured thereby.

Specifically, embodiments of the present invention can provide a packaging method for embedding a light source chip in a hole formed by etching a part of a chip on which an optical waveguide is integrated, and a package manufactured thereby.

In addition, embodiments of the present invention may also be applied to a package that reflects an optical signal emitted by a light source and transmits the reflected light to an optical waveguide using an integrated optical lattice coupler, thereby generating a highly efficient optical coupling between the light source and the optical waveguide. Method and a package made therefrom.

Thus, embodiments of the present invention propose a light source-integrated packaging that reduces alignment errors based on semiconductor processes and low cost / high efficiency.

1 is a view illustrating a packaging method between a light source and an optical waveguide according to an embodiment.
2 is a view showing a package in which a light source and an optical waveguide are packaged according to another embodiment.
3 is a flowchart illustrating a packaging method between a light source and an optical waveguide according to an embodiment.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to or limited by the embodiments. In addition, the same reference numerals shown in the drawings denote the same members.

Also, terminologies used herein are terms used to properly represent preferred embodiments of the present invention, which may vary depending on the user, intent of the operator, or custom in the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, a packaging method between a light source and an optical waveguide is performed by a packaging system. Further, the packaging system performs the packaging method between the light source and the optical waveguide, thereby producing a package in which the light source and the optical waveguide are packaged.

1 is a view illustrating a packaging method between a light source and an optical waveguide according to an embodiment.

Referring to FIG. 1, a packaging system according to one embodiment forms a hole 111 on an optical waveguide and a first chip 110 on which an optical grating coupler 112 is integrated. For example, the packaging system can form the hole 111 by etching a part of the area of the first chip 110 on which the optical waveguide is integrated.

In this case, the packaging system may be configured such that the size of the second chip 120 to be embedded in the first chip 110 or the divergence angle of the optical signal emitted from the light source integrated in the second chip 120, The hole 111 may be formed on the first chip 110 based on at least one of the integrated positions. For example, the packaging system may determine the size of the hole 111 based on the size of the second chip 120 and determine the divergence angle of the optical signal emitted by the light source integrated in the second chip 120, The position where the hole 111 is formed on the first chip 110 can be determined based on the position where the first chip 112 is integrated.

The packaging system then mounts the second chip 120 on which the light source emitting the optical signal in the vertical direction (the direction perpendicular to the first chip 110 in which the second chip 120 is embedded) Built in. In this case, as the light source integrated in the second chip 120, a semiconductor laser diode such as a VCSEL (Vertical Cavity Surface Emitting Laser) that emits an optical signal in a direction perpendicular to the upper surface may be used. However, the present invention is not limited thereto, and various light sources that emit light signals at an arbitrary angle with respect to the first chip 110 may be used as the light source.

Thereafter, the packaging system reflects the optical signal emitted from the light source integrated in the second chip 120 and transmits the reflected optical signal to the optical waveguide integrated in the first chip 110, . For example, the packaging system may include a position where the hole 111 is formed on the first chip 110, a divergence angle of the optical signal emitted by the light source integrated in the second chip 120, The reflector 130 may be disposed on the first chip 110 based on at least one of the positions integrated on the first chip 110. [ The position where the reflector 130 is disposed on the first chip 110 is a position where the hole 111 is formed on the first chip 110 and a position where the light emitted from the light source integrated on the second chip 120 The divergence angle of the signal or the position at which the optical grating coupler 112 is integrated on the first chip 110. [

Here, the packaging system may perform at least one of etching and vapor deposition on a part of the first chip 110 to place the reflector 130 on the first chip 110.

Although a planar mirror having a planar shape with the reflector 130 is shown on the first chip 110, the reflector 130 is not limited thereto and may have various shapes . A detailed description thereof will be described with reference to Fig.

In this case, the process of embedding the second chip 120 in which the light source is integrated into the hole 111 is performed before the process of disposing the reflector 130 on the first chip 110, But may be performed after the process of disposing the reflector 130 on the first chip 110. [

Accordingly, the package manufactured through such a packaging process includes the first chip 110, the second chip 110, and the second chip 110, on which the optical waveguide and the optical coupler 112 - the optical signal reflected by the reflector 130 are transmitted to the optical waveguide, A light source for emitting an optical signal in a vertical direction is integrated in a second chip 120 and a second chip 120 which are embedded in a hole 111 formed on a chip 110, And a reflector 130 disposed at an upper portion of the reflector 130 for reflecting the optical signal emitted from the light source and transmitting the reflected optical signal to the optical waveguide.

As described above, the packaging method according to one embodiment may use the first chip 110 on which the optical waveguide and the optical grating coupler 112 are integrated, but the present invention is not limited thereto, One chip may be used. In this case, the packaging system can perform packaging by forming a reflector 130 on the first chip, which reflects the optical signal emitted by the light source to be coupled to the end face of the optical waveguide. In this case, not only a light source that emits an optical signal in a vertical direction can be used as the light source, but also a light source that emits the light signal in an arbitrary angle to the first chip in which the second chip, A variety of light sources may be used.

2 is a view showing a package in which a light source and an optical waveguide are packaged according to another embodiment.

Referring to FIG. 2, a packaging system according to another embodiment includes a concave mirror as a reflector 210.

Specifically, the spherical reflector 210 may have a height half that of the spherical radius, so that the focus of the spherical reflector is located on the surface of the first chip 220. At this time, the packaging system can control the shape of the light incident on the optical grating coupler by adjusting the radius of the spherical reflector 210.

The spherical reflector 210 may be formed by depositing a metal having a reflection characteristic on the first chip 220 in the form of a concave microlens or a convex microlens based on a semiconductor process. However, the present invention is not limited thereto. The reflector 210 reflects an optical signal emitted from a light source integrated in the second chip 230 and transmits the optical signal to the optical waveguide 220 integrated in the first chip 220 .

3 is a flowchart illustrating a packaging method between a light source and an optical waveguide according to an embodiment.

Referring to FIG. 3, a packaging system according to an exemplary embodiment forms a hole 310 on a first chip on which an optical waveguide is integrated. For example, the packaging system can form a hole by etching a part of the first chip on which the optical waveguide is integrated.

At this time, on the basis of at least any one of the size of the second chip to be embedded in the first chip or the position at which the light grid coupler is integrated or the divergence angle of the optical signal emitted by the light source integrated in the second chip, A hole can be formed on one chip.

Next, the packaging system embeds a second chip integrated with the light source emitting the optical signal in the vertical direction in the hole (320).

Thereafter, the packaging system arranges a reflector for reflecting the optical signal emitted by the light source integrated on the second chip to the optical waveguide integrated on the first chip (330) on the first chip. For example, the packaging system may include at least one of a position where the hole is formed on the first chip, a divergence angle of the optical signal emitted by the light source integrated on the second chip, or a position where the optical grating coupler is integrated on the first chip The reflector can be disposed on the first chip.

At this time, the packaging system may perform at least one of etching and vapor deposition on a part of the first chip so that the reflector is disposed on the first chip. Here, the packaging system may use at least one of a planar reflector and a spherical reflector as the reflector.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

Claims (8)

In a packaging method between a light source and an optical waveguide,
Forming a hole on the first chip on which the optical waveguide and the optical grating coupler are integrated;
Embedding a second chip in the hole in which a light source emitting a light signal in a vertical direction is integrated; And
Placing a reflector for reflecting the optical signal emitted from the light source and transmitting the reflected optical signal to the optical waveguide on the first chip
≪ / RTI > The method according to claim 1,
The step of disposing the reflector on top of the first chip
Placing at least one of a planar mirror or a spherical mirror on top of the first chip,
≪ / RTI > 3. The method of claim 2,
The step of disposing at least one of the planar reflector or the spherical reflector on the first chip
Depositing a metal having a reflection characteristic in the form of at least one of a concave microlens or a convex microlens on the first chip based on a semiconductor process when the spherical reflector is disposed on the first chip,
≪ / RTI > The method according to claim 1,
The step of disposing the reflector on top of the first chip
Performing at least one of etching and vapor deposition on at least a part of the upper surface of the first chip to dispose the reflector on the first chip
≪ / RTI > The method according to claim 1,
The step of disposing the reflector on top of the first chip
The reflector is disposed on the first chip based on at least one of a position where the hole is formed on the first chip, a divergence angle of the optical signal emitted from the light source, or a position where the optical grating coupler is integrated on the first chip, Step of placing on one chip
≪ / RTI > The method according to claim 1,
Wherein the step of forming the hole on the first chip on which the optical waveguide and the optical grating coupler are integrated
Etching at least a portion of the upper portion of the first chip based on at least one of a size of the second chip or a divergence angle of an optical signal emitted by the light source
≪ / RTI > delete In a packaging method between a light source and an optical waveguide,
Forming a hole on the first chip on which the optical waveguide is integrated;
Embedding a second chip into the hole, the second chip integrating a light source emitting an optical signal; And
Forming a reflector on the first chip so as to reflect the optical signal emitted from the light source to be coupled to the end face of the optical waveguide
≪ / RTI >
KR1020150103277A 2015-07-21 2015-07-21 Packaging method and package between light source and waveguide KR101730719B1 (en)

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KR101730719B1 true KR101730719B1 (en) 2017-04-28

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342960B1 (en) 1998-12-18 2002-01-29 The Boeing Company Wavelength division multiplex transmitter
JP2003318474A (en) * 2002-04-19 2003-11-07 Ricoh Co Ltd Semiconductor laser unit
JP2010164886A (en) * 2009-01-19 2010-07-29 Oki Electric Ind Co Ltd Optical transmission module, optical transmission/reception module and optical module for two-way communication

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342960B1 (en) 1998-12-18 2002-01-29 The Boeing Company Wavelength division multiplex transmitter
JP2003318474A (en) * 2002-04-19 2003-11-07 Ricoh Co Ltd Semiconductor laser unit
JP2010164886A (en) * 2009-01-19 2010-07-29 Oki Electric Ind Co Ltd Optical transmission module, optical transmission/reception module and optical module for two-way communication

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