KR101722424B1 - Temperature sensor assembly - Google Patents

Temperature sensor assembly Download PDF

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Publication number
KR101722424B1
KR101722424B1 KR1020150045387A KR20150045387A KR101722424B1 KR 101722424 B1 KR101722424 B1 KR 101722424B1 KR 1020150045387 A KR1020150045387 A KR 1020150045387A KR 20150045387 A KR20150045387 A KR 20150045387A KR 101722424 B1 KR101722424 B1 KR 101722424B1
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KR
South Korea
Prior art keywords
cover
electrode
lead wire
case
sensor module
Prior art date
Application number
KR1020150045387A
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Korean (ko)
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KR20160117812A (en
Inventor
이명헌
임종대
김정민
권택만
최경희
Original Assignee
인지컨트롤스 주식회사
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Priority to KR1020150045387A priority Critical patent/KR101722424B1/en
Publication of KR20160117812A publication Critical patent/KR20160117812A/en
Application granted granted Critical
Publication of KR101722424B1 publication Critical patent/KR101722424B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2205/00—Application of thermometers in motors, e.g. of a vehicle

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

The present invention relates to a temperature sensor assembly, which comprises a sensor element, a pair of lead wires electrically connected to the sensor element, and an insulator surrounding the lead wire and the sensor element, wherein a part of the lead wire is led out to the outside of the insulator A case formed of a first cover and a second cover which are respectively assembled to the upper and lower parts of the sensor module to shield the sensor module and a case where the leading end is connected to the lead wire located inside the case and the base end is taken out to the outside of the case A temperature sensor assembly comprising an electrode, wherein the lead wire and the electrode are connected by resistance welding.

Description

Temperature sensor assembly {TEMPERATURE SENSOR ASSEMBLY}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature sensor assembly, and more particularly, to a temperature sensor assembly capable of thinning a connection between a lead wire drawn out from a sensor element and an electrode extended to the outside of a case.

Generally, a thermistor temperature sensor employing a thermistor as a sensor element is widely used. In particular, in recent years, a slim temperature sensor is required to detect the temperature of the exhaust gas of a hybrid vehicle.

A conventional type of temperature sensor having a slim structure is a film type temperature sensor. This is a form in which a thermistor is provided as a sensor element, and a sensor element and leads are wrapped by a film such as polyimide.

Since such a film type temperature sensor is thin film type, it can be applied to various positions requiring a slim structure. However, since the film type temperature sensor has a relatively weak film appearance, it is difficult to use it in a harsh environment such as a battery cell of a hybrid car.

Therefore, a temperature sensor using an insert injection has appeared as a prior art to replace the film type temperature sensor. The temperature sensor using the insert injection has a method of inserting the sensor into the housing using the insert injection, filling the liquid compound and curing the liquid. However, such an insert injection method or a housing encapsulation method has a problem of high manufacturing cost.

Another prior art for improving this is the "Temperature sensor assembly" of Korean Patent No. 10-1133886. This will be described with reference to Fig.

1 is a plan view of a temperature sensor assembly according to the prior art. A temperature sensor assembly according to the prior art includes a sensor element 110 and leads 120 connected to the sensor element 110 and a sensor element 110 to expose a portion of the leads 120. [ And a film member 130 surrounding the leads 120. The lead wires 120 are connected to the leads 120 through the sensor body 110, A groove for receiving a structure interposed between the upper plate 210 and the lower plate 220 and an inner surface of at least one of the upper plate 210 and the lower plate 220 is formed, And a plastic case 20 having an engaging protrusion 225 and an engaging recess 226 formed to correspond to each other to define a coupling position between the lower plate 220 and the lower plate 220, 211, 221 and grooves 212, 222 for leads.

However, the prior art as described above has a structure in which the lead 120 connected to the sensor element is fixed by soldering so as to be in contact with the lead 30 as shown in FIG. When the solder is used to connect the lead 120 and the lead 30, the solder surrounds the lead 120, so that the thickness h2 of the soldered portion is greater than the thickness of the lead h1, There is a problem of increasing the overall thickness of the sensor assembly.

KR 10-1133886 B (March 29, 2012)

It is an object of the present invention to provide a temperature sensor assembly capable of further reducing the overall thickness of the temperature sensor assembly by preventing the thickness of the leads from being increased when the leads are connected.

According to an aspect of the present invention, there is provided a sensor comprising: a sensor element; a pair of lead wires electrically connected to the sensor element; and an insulator surrounding the lead element and the sensor element, A case including a first cover and a second cover which are respectively assembled to upper and lower portions of the sensor module to shield the sensor module, and a case having a front end connected to a lead wire located inside the case, And an electrode extending to the outside of the case, wherein the lead wire and the electrode are connected by resistance welding.

The first cover is formed with a first shielding wall which surrounds the periphery of the sensor module on the surface facing the second cover, and the second cover has a first shielding wall on the surface facing the first cover, It is preferable that a second shielding wall is formed to surround the first shielding wall formed on the cover.

The first cover may further include an alignment protrusion for aligning a position of the second shielding wall when the first cover and the second cover are assembled to the outside of the first shielding wall.

At this time, it is preferable that the alignment protrusion has a curvature such that its upper end has a rounded shape.

The second cover may be formed with an insulating wall that separates and isolates between the electrodes connected to the pair of lead wires, and the insulating wall has a thickness larger than the thickness of the electrode from the inner surface of the second cover toward the first cover And an upper end bent at an end of the insulating wall is formed, so that the electrode is interposed between the inner surface of the second cover and the bent portion.

The electrode may be formed in a rod shape, and the electrode may include a contact portion connected to the lead wire by resistance welding, and an extension portion extending from the contact portion to be exposed to the outside of the case.

According to the temperature sensor assembly of the present invention, the lead wire drawn out from the sensor element and the electrode drawn out to the outside of the case are electrically connected by resistance welding, so that the thickness of the temperature sensor assembly can be further reduced.

In addition, a first shielding wall and a second shielding wall are formed on the first cover and the second cover, respectively, of the case on which the sensor module is mounted, thereby doubly shielding the sensor module, thereby further protecting the sensor module.

In addition, since the alignment protrusions are formed on the first cover, not only the first cover and the second cover can be easily assembled, but also the bending portion is formed in the insulation wall that divides the electrode and the electrode, Can be stably supported.

1 is a plan view of a temperature sensor assembly according to the prior art.
2 is a cross-sectional view showing the soldering of leads and leads according to the prior art.
3 is an exploded perspective view showing a temperature sensor assembly according to the present invention.
4 is a perspective view showing a state in which a sensor module of the temperature sensor assembly according to the present invention is mounted on the second cover.
5 is a perspective view of the first cover of the temperature sensor assembly according to the present invention.
6 is a plan view of a temperature sensor assembly according to the present invention.
7 is a cross-sectional view illustrating a connection between a lead wire and an electrode in the temperature sensor assembly according to the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor may properly define the concept of the term to describe its invention in the best possible way And should be construed in accordance with the principles and meanings and concepts consistent with the technical idea of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is an exploded perspective view illustrating a temperature sensor assembly according to the present invention, and FIG. 4 is a perspective view illustrating a state in which a sensor module is mounted on a second cover among temperature sensor assemblies according to the present invention.

The temperature sensor assembly according to the present invention is assembled to upper and lower parts of a sensor module 4 including a sensor element 1, a lead wire 2 and an insulator 3 and a sensor module 4, respectively, A case 7 composed of a first cover 5 and a second cover 6 for shielding the sensor module 4 and a lead wire 2 located inside the case 7 and connected to the outside of the case And an electrode 8 drawn out to the outside.

In particular, the temperature sensor assembly of the present invention having the above configuration can reduce the overall thickness of the temperature sensor assembly by connecting the lead wire 2 and the electrode 8 by resistance welding.

The sensor module 4 made of the sensor element 1, the lead wire 2 and the insulator 3 has a negative temperature coefficient thermistor (NTC) whose resistance decreases when the temperature rises and a PTC a positive temperature coefficient thermistor, and a critical temperature resistor (CTR) whose resistance value rapidly changes at a certain temperature, and the sensor element 1 is electrically connected to the pair of lead wires 2 .

The sensor element 1 and the lead wire 2 are covered with the insulator 3 and a part of the lead wire 2 is drawn out of the insulator 3 and electrically connected to the electrode 8. The lead wire 2 drawn out from the insulator 3 is connected to the electrode 8, which is made of a material having excellent conductivity such as copper.

The electrode 8 is formed in a rod shape as shown in Figs. 3 and 4. The electrode 8 preferably has a contact portion 8a electrically connected to the lead wire 2 and a contact portion 8a electrically connected to the lead wire 2 And an extended portion 8b which is extended to the outside of the case 7.

At this time, the width of the contact portion 8a is formed to be larger than the width of the extended portion 8b, and when the electrode 8 is viewed from the plane (see FIG. 6), a step is formed between the contact portion 8a and the extended portion 8b And the bent portion 6c formed in the insulating wall 6b of the second cover 6, which will be described below, is located at the stepped portion.

In particular, when the contact portion 8a is connected to the lead wire by resistance welding, the thickness of the connection portion between the lead wire 2 and the electrode 8 can be reduced.

In this way, when the lead wire 2 and the electrode 8 are connected by resistance welding, the lead wire 2 and the electrode 8 can be more firmly connected by contact by resistance welding at least two places.

In other words, the resistance welding causes a current to flow through the electrode 8 and melts a part of the electrode with the heat generated by the contact resistance with the lead wire 2, so that the lead wire 2 and the electrode 8 are pressed and integrally connected.

When the lead wire 2 and the electrode 8 are welded by such resistance welding, a part of the electrode 8 is melted and the lead wire 2 is welded to the molten electrode 8 as shown in Fig. 7, The thickness h3 of the connecting portion between the lead wire 2 and the electrode 8 can be reduced so that the lead wire 2 is recessed into the molten portion of the electrode 8 to enclose the sensor module 4 7 can be made thinner and the reliability of the contact portion between the lead wire 2 and the electrode 8 can be improved and the defective product can be reduced.

The sensor module 4 configured as described above is shielded by the case 7. The case 7 includes a first cover 5 and a second cover 5 which are respectively assembled to the upper and lower portions of the sensor module 4, (6).

The sensor module 4 is mounted in the case 7 and the base end of the electrode 8 drawn out from the sensor module 4 is inserted into the case 7 And is exposed to the outside.

The case 7 in which the sensor module 4 is mounted will be described with reference to Figs. 5 and 6. Fig.

FIG. 5 is a perspective view of a first cover of a temperature sensor assembly according to the present invention, and FIG. 6 is a plan view of a temperature sensor assembly according to the present invention.

The case 7 includes a first cover 5 and a second cover 6. The first cover 5 and the second cover 6 are connected to a sensor module The first cover 5 and the second cover 6 are formed to have a rectangular parallelepiped shape in which the sensor module 4 can be mounted when the first cover 5 and the second cover 6 are assembled so that the first cover 5 and the second cover 6 can be shielded. 2 cover 6 are joined together.

That is, the first cover 5 has the shape of a flat plate having a larger area than the sensor module 4, and has a first shielding wall 5 which surrounds the periphery of the sensor module 4 on the surface facing the second cover 6, (5a) is formed. The second cover 6 has the same shape as the first cover 5 and has a flat shape. The second cover 6 surrounds the first shielding wall 5a on the surface facing the first cover 5, A wall 6a is formed.

At this time, the second shielding wall 6a formed on the second cover 6 is formed along the rim of the second cover 6 so that when the first cover 5 and the second cover 6 are assembled, The second shielding wall 6a of the first cover 5 is located on the outer side of the first shielding wall 5a and the first shielding wall 5a of the first cover 5 is located on the inner side, The first shielding wall 5a and the second shielding wall 6a are sequentially formed around the sensor module 4 so that the sensor module 4 can be doubly shielded and the sensor module 4 can be more safely protected.

An alignment protrusion 5b is formed on the first cover 5 having the first shielding wall 5a formed on the surface facing the second cover 6 so as to facilitate the assembly with the second cover 6. [ do. The alignment protrusions 5b are formed in the shape of "a" at the outer edge of the first shielding wall 5a as shown in Figs. 5 and 6.

The alignment protrusions 5b are formed on the first cover 5 so as to be in close contact with the inner surface of the second shielding wall 6a formed on the second cover 6 so that the first cover 5 and the second cover The alignment protrusions 5b guide the second shielding wall 6a to facilitate the assembly of the first cover 5 and the second cover 6 when the first cover 5 and the second cover 6 are assembled.

The alignment protrusion 5b guiding the first shielding wall 5a and facilitating the assembly of the first cover 5 and the second cover 6 has a curved shape at the upper end thereof, The first shielding wall 5a is guided along the curvature formed on the upper end of the alignment protrusion 5b so that the first cover 5 and the second cover 5 can be guided, It is possible to further facilitate the assembly of the base 6.

On the other hand, the second cover 6 is provided with an insulating wall 6b for partitioning between the pair of lead wires 2 and the electrodes 8 connected thereto to prevent sparks from occurring. 3 and 4, the insulating wall 6b is provided on the inner surface of the second cover 6 so as to be in close contact with the side surface of the electrode 8 connected to the pair of lead wires 2, (5).

The insulating wall 6b protruding from the inner surface of the second cover 6 toward the first cover 5 is formed so as to be thicker than the thickness of the electrode 8 on the inner surface of the second cover 6, 5 so as to prevent the pair of electrodes 8 from contacting each other.

The insulating wall 6b may be formed corresponding to each electrode 8 so as to maintain a predetermined distance between the pair of electrodes 8 as shown in Figs. 3 and 4, The second cover 6 protrudes from the inner surface of the second cover 6 located between the electrode 8 and the electrode 8 toward the first cover 5 and an empty space is formed between the electrode 8 and the electrode 8 The insulating walls 6b may be integrally formed.

As described above, the insulating wall 6b separating the electrode 8 and the electrode 8 is provided with a bent portion 6c at the upper end of the insulating wall 6b so as to support each electrode 8 . The bent portion 6c is formed to be positioned at a portion corresponding to the contact portion 8a of the electrode 8 connected to the lead wire 2 of the sensor module 4. [

That is, the bent portion 6c is formed such that the insulating wall 6b is bent in a direction intersecting the direction from the inner surface of the second cover 6 to the first cover 5, The bent portion 6c is located on the upper surface of the electrode 8 when the electrode 8 is mounted on the first cover 6 and prevents the electrode 8 from oscillating in the space between the first cover 5 and the second cover 6 do.

Although the bent portion 6c may be formed at the tip of the insulating wall 6b as shown in the figure, in some cases, the bent portion 6c is located above the extended portion 8b of the electrode 8 They may be formed continuously along the insulating wall or may be formed at regular intervals.

The second cover 6 has a support protrusion 6d for supporting one end of the insulator 3 in a direction opposite to the direction in which the electrode 8 of the sensor module 4 is drawn out of the case 7 The support protrusion 6d protrudes from the inner surface of the second cover 6 toward the first cover 5 so that one side of the insulator 3 of the sensor module 4 is supported by the support protrusion 6d.

The second cover 6 is formed with a draw-out groove 6e in which a part of the second shielding wall 6a is opened so that the electrode 8 can be drawn out of the case 7, 6e are formed on the second shielding wall 6a opposite to the support protrusions 6d.

The lead wire 2 drawn out from the sensor element 1 and the electrode 8 drawn out to the outside of the case 7 are electrically connected by resistance welding The thickness of the temperature sensor assembly can be further reduced.

A first shielding wall 5a and a second shielding wall 6a are formed in the first cover 5 and the second cover 6 of the case 7 in which the sensor module 4 is mounted, The sensor module 4 can be doubly shielded and the sensor module 4 can be protected more safely.

Since the alignment protrusions 5b are formed on the first cover 5, not only the first cover 5 and the second cover 6 can be easily assembled with each other, A bending portion 6c is formed in the insulating wall 6b for partitioning the electrode 8 and the electrode 8 so that the electrode can be stably supported.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. .

1: Sensor element 2: Lead wire
3: Insulator 4: Sensor module
5: first cover 5a: first shielding wall
5b: alignment protrusion 6: second cover
6a: second shielding wall 6b: insulating wall
6c: bent portion 6d: supporting projection
6e: withdrawal groove 7: case
8: electrode 8a:
8b: extension part

Claims (5)

A sensor module including a sensor element, a pair of lead wires electrically connected to the sensor element, and an insulator surrounding the lead wire and the sensor element, wherein a part of the lead wire is drawn out to the outside of the insulator;
A case formed of a first cover and a second cover which are respectively assembled to upper and lower portions of the sensor module to shield the sensor module; And
And an electrode whose tip end is connected to a lead wire located inside the case and whose base end is led out to the outside of the case,
The lead wire and the electrode are connected by resistance welding,
The second cover
An insulating wall for separating and insulating the pair of lead wires and electrodes connected to each other is formed,
Wherein the insulation wall is protruded from the inner surface of the second cover toward the first cover to a thickness larger than the thickness of the electrode and the upper end is bent to end the insulation wall, Wherein the temperature sensor assembly is interposed between the upper and lower portions.
The method according to claim 1,
The first cover
A first shielding wall for shielding the periphery of the sensor module is formed on a surface facing the second cover,
Wherein a second shielding wall is formed on a surface of the second cover facing the first cover so as to surround the first shielding wall formed on the first cover.
The method of claim 2,
The first cover
And an alignment protrusion for aligning the position of the second shielding wall when the first cover and the second cover are assembled to the outside of the first shielding wall.
delete The method according to claim 1,
The electrode is formed in a rod shape,
Wherein the electrode comprises: a contact portion connected to the lead wire by resistance welding; And
And an extension part extending from the contact part and exposed to the outside of the case.
KR1020150045387A 2015-03-31 2015-03-31 Temperature sensor assembly KR101722424B1 (en)

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Application Number Priority Date Filing Date Title
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KR101722424B1 true KR101722424B1 (en) 2017-04-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230020268A (en) * 2021-08-03 2023-02-10 (주) 래트론 Flat-type Temperature Sensor and The Manufacturing Method for Thereof
KR102614011B1 (en) 2023-06-09 2023-12-14 한국쎄미텍 주식회사 Structure of temperature sensor assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007101334A (en) 2005-10-04 2007-04-19 Oizumi Seisakusho:Kk Temperature sensor for hot water supply apparatus
JP2014016280A (en) 2012-07-10 2014-01-30 Denso Corp Liquid temperature detection device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203803B2 (en) * 1992-09-01 2001-08-27 株式会社デンソー Thermistor type temperature sensor
KR101133886B1 (en) 2009-12-08 2012-04-09 한국쎄미텍 주식회사 Temperature sensor assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007101334A (en) 2005-10-04 2007-04-19 Oizumi Seisakusho:Kk Temperature sensor for hot water supply apparatus
JP2014016280A (en) 2012-07-10 2014-01-30 Denso Corp Liquid temperature detection device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230020268A (en) * 2021-08-03 2023-02-10 (주) 래트론 Flat-type Temperature Sensor and The Manufacturing Method for Thereof
KR102696676B1 (en) * 2021-08-03 2024-08-20 (주) 래트론 Flat-type Temperature Sensor and The Manufacturing Method for Thereof
KR102614011B1 (en) 2023-06-09 2023-12-14 한국쎄미텍 주식회사 Structure of temperature sensor assembly

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