KR101710550B1 - Method for assorting electronic scrap - Google Patents
Method for assorting electronic scrap Download PDFInfo
- Publication number
- KR101710550B1 KR101710550B1 KR1020150143701A KR20150143701A KR101710550B1 KR 101710550 B1 KR101710550 B1 KR 101710550B1 KR 1020150143701 A KR1020150143701 A KR 1020150143701A KR 20150143701 A KR20150143701 A KR 20150143701A KR 101710550 B1 KR101710550 B1 KR 101710550B1
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- South Korea
- Prior art keywords
- sorting
- hole
- usable
- product
- unit
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C23/00—Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in preceding groups or not specially adapted to apparatus covered by a single preceding group
- B02C23/08—Separating or sorting of material, associated with crushing or disintegrating
- B02C23/14—Separating or sorting of material, associated with crushing or disintegrating with more than one separator
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/28—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/28—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
- B07B1/34—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens jigging or moving to-and-fro perpendicularly or approximately perpendiculary to the plane of the screen
- B07B1/343—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens jigging or moving to-and-fro perpendicularly or approximately perpendiculary to the plane of the screen with mechanical drive elements other than electromagnets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C2201/00—Codes relating to disintegrating devices adapted for specific materials
- B02C2201/06—Codes relating to disintegrating devices adapted for specific materials for garbage, waste or sewage
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- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to an electronic scrap sorting method, and more particularly, to an electronic scrap sorting method capable of quickly and easily classifying electronic scrap according to oil price without consuming excessive time for accurate classification of electronic scrap.
Up to now, a process technology for concentrating and recovering valuable metals has been developed steadily from waste electronic scrap discharged from domestic computers, waste mobile phones, cameras, MP3, and other waste electronic devices.
It is known that waste electronic scrap discharged from various waste electronic devices generated in Korea contains not only precious metals such as Au, Ag and Pd but also valuable metals such as Cu, Fe, Sn, Ni, Zn and Pb.
Such waste electronic scrap has different treatment routes and methods depending on the source. Generally, the scrap of waste electrons generated in the manufacturing process is entrusted to the manufacturer by the manufacturer. In this case, scrap metal scrap generated after gold plating is sold by competitive bidding or number contract, and the disposal of the gold is recovered by the disposal company and final disposal is done such as incineration / landfill. In the case of waste electronic scrap generated before gold plating, copper was recovered by wet method, and incineration / landfill was finally disposed. Waste electronic scrap Approximately 32% of the total amount recovered by the recycler, local governments, and the electronics industry is collected and processed in the non-institutional areas such as small-sized commodities, assembled PC vendors, and specialized exporters.
Electronic scrap, which is processed through various routes and subjects, has an irrational problem because it is not easy to dispose of at an appropriate cost due to the relatively poor classification procedure, although accurate classification is necessary in disposal.
Particularly, in order to improve accuracy in the disposal of electronic scrap, it is necessary to invest a great amount of time, but the efficiency of the time-to-date sorting is remarkably reduced.
Therefore, there is a disadvantage that both the side to which the electronic scrap is transferred and the side to which it is transferred are not easy to dispose of the electronic scrap quickly and accurately.
It is an object of the present invention to provide an electronic scrap sorting method capable of disposing electronic scrap at an appropriate cost through accurate classification in disposing electronic scrap processed through various paths and subjects.
It is another object of the present invention to provide an electronic scrap sorting method capable of classifying electronic scrap quickly and easily according to the degree of oil price without spending excessive time in addition to accurate classification for disposal of electronic scrap.
According to the present invention, there is provided a method of manufacturing a printed circuit board, comprising the steps of: preparing a printed circuit board; disposing a printed circuit board in the first decomposing unit and decomposing the printed circuit board into a first decomposed product; A screening step of screening the first degradation products of the different sizes based on the through holes in a screening unit provided with a plurality of structures having through holes of different sizes; And a collecting step of collecting each of the sorted products in the collecting unit.
In addition, in the selecting step, the first decomposition product is introduced into the first usable goods sorting portion having the mesh-like structure formed with the first through-hole, and the first decomposition product is introduced into the first through-hole based on the first through- A first usable goods sorting step of sorting into a first usable item and a low-grade usable item passing through an upper side of the first through-hole, and a second usable goods sorting part provided with a net- And a second usable goods sorting step in which the first usable item is charged and the first usable item is sorted into the second usable items according to the size based on the second through hole, And the recovery step may be a step of sequentially or non-sequentially recovering the low-priced and second-use products sorted by size.
In the second usable goods sorting step, the first usable goods are the first to-be-sorted products which are introduced into the first selection unit in which the second-first through-hole is formed and are introduced into the second- A first sorting step of sorting the first and second sorting products passed through the upper side of the through hole 2-1 and a second sorting step of sorting the first and second sorting products into a second sorting part having the second through hole 2, A second sorting step of sorting into a second-order first-order product introduced into the second through-hole by the through-hole and a second-order second-order product passed through the upper side of the second through-hole; And the size of the second through hole may be smaller than that of the second through hole.
Further, in the first decomposition step, a cutting step of cutting the printed circuit board; And a crushing step of crushing the cut printed circuit board.
Also, the second-order disassembling step may include a second disassembling step in which the low-priced consumable product is milled by the second disassembling section.
In addition, between the first decomposing step and the first usable goods sorting step, an initial recovery step in which a predetermined metal is initially recovered from the first decomposition product by the magnetic force sorting part may be included.
In addition, in the first-order usable goods sorting section, vibration is applied by the vibrating section to advance the charged first decomposition product forward, or the second available product sorting section is disposed in the second- Vibration may be imparted by the vibrating part to advance the first usable item forward.
In addition, the apparatus may further include at least one support portion for supporting the selector portion, and the support portion may be provided with an elastic means for doubling up and down vibration of the vibration portion.
Also, the first usable goods sorting unit or the second usable goods sorting unit may be inclined at a predetermined angle toward the front.
The electronic scrap sorting method according to the present invention has the following effects.
First, electronic scrap can be disposed of at an appropriate cost through accurate classification in disposing electronic scrap through various paths and subjects.
Second, in addition to accurate classification for disposal of electronic scrap, electronic scrap can be classified quickly and easily according to oil price without consuming excessive time.
1 is a block diagram showing the configuration of an electronic scrap sorting system according to an embodiment of the present invention.
2 is a view showing a schematic process of the electronic scrap sorting system according to FIG.
FIG. 3 is a perspective view showing a first-use discriminating unit of the electronic scrap sorting system according to FIG. 1. FIG.
FIG. 4 is a perspective view showing a second usable goods sorting unit of the electronic scrap sorting system according to FIG. 1;
5 is a flowchart sequentially illustrating an electronic scrap sorting method according to another embodiment of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which: FIG. It is to be understood, however, that the present invention is not limited to the illustrated embodiments, and that various changes and modifications may be made without departing from the spirit and scope of the present invention as defined by the following claims.
FIG. 1 is a block diagram of an electronic
1 to 4, the electronic
The first
The crushing
The magnetic force sorting section M can recover a predetermined metal from the first decomposition product S that has passed through the
The
The plurality of first usable
The plurality of second usable
More specifically, the
The
At this time, the second-order sorted
The
The
Vibrations may be imparted to the first usable
The sorting
FIG. 5 is a flow chart sequentially showing an electronic scrap sorting method (S100) according to an embodiment of the present invention. Hereinafter, the electronic scrap sorting method (S100) will be described in detail with reference to FIG.
Referring to FIG. 5, first, in a substrate preparation step (S110), a printed circuit board corresponding to an electronic scrap may be prepared.
Next, in the first decomposition step (S120), the printed circuit board may be inserted into the first decomposition section (110) and decomposed into the first decomposition product (S). The first decomposition step S120 may include a cutting step S121 in which the printed circuit board is cut and a breaking step S122 in which the cut printed circuit board is broken.
Next, in the initial recovery step (S130), the predetermined metal may be initially recovered from the first decomposition product (S) by the magnetic force sorting section (M).
Next, in the sorting step S140, the first degradation product S in the sorting
In the first usable goods sorting step S141, the first decomposition product S is introduced into the first usable
The low-
In the second usable goods sorting step S142, the first
Here, the second-stage free goods selection step S142 may include a first selection step S142a and a second selection step S142b. In the first sorting step S142a, the first
In the second sorting step S142b, the 1-2
The second through hole H2 formed in the
Lastly, in the collecting step S150, the low-priced
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.
110: first decomposing unit 111:
112: crushing unit 115:
120: first available goods sorting unit 130: second available goods sorting unit
131: first selector 132: second selector
140: recovery unit 141: first recovery unit
142: second recovering unit 143: third recovering unit
144: fourth recovering unit 150: second decomposing unit
160: vibrating part 170: elastic member
180: Support
Claims (9)
In the selecting step,
Wherein the first decomposition product is introduced into a first primary product sorting section provided with a mesh-like structure having a first through-hole formed therein, and the first decomposition product is introduced into the first through-hole based on the first through- A second usable goods sorting step of sorting the first usable goods into the first usable goods sorted by the tea usable item and the lower usable item passed through the upper side of the first through-hole, And a second usable goods sorting step in which the first usable item is charged and the first usable item is sorted into second usable goods of different sizes based on the second through holes, Is formed smaller than the size of the first through hole,
Wherein the collecting step is a step of sequentially or non-sequentially collecting the low-priced usable goods and the secondarily-usable goods sorted by size,
The second usable goods selection step comprises:
Wherein the first-order usable product is a first-order product which is introduced into the first selection unit having the second-first through-hole formed therein and flows into the second-first through-hole, And a second sorting step of sorting the first and second sorting products into a first sorting step and a second sorting step; And a second sorting step of sorting into a second-order first-order product introduced into the second through hole and a second-order second-order product passed through the upper side of the second through-hole, -1 size of the through hole is smaller than the size of the second through hole,
Wherein the first decomposition step comprises:
A cutting step of cutting the printed circuit board; and a crushing step of crushing the cut printed circuit board,
The first through hole is formed as a square through hole having a size of 3 x 1.5 Cm, the second through hole is formed as a square through hole having a size of 1 x 1.5 cm, and the second through hole has a square shape having a size of 2 x 1.5 cm And is formed as a through hole,
Wherein the first sorting unit is supported from a ground surface with a first support part at a front end and a second support part at a lower end, the first sorting part is supported from a ground surface with a second support part at a rear end of a lower part thereof, And a fourth support portion provided at a lower portion between the first sorting portion and the second sorting portion and supported from the ground surface, ,
Wherein the first supporting portion to the fourth supporting portion are each provided with an oscillating portion above the oscillating portion in order to generate vibration for sorting and each of the elastic supporting means is provided with an elastic means for doubling the oscillation below the oscillating portion, And the product sorting portion is located above the second usable goods sorting portion.
In the first decomposition step,
A cutting step of cutting the printed circuit board,
And breaking the cut printed circuit board.
Further comprising a second decomposing step in which the low-temperature use product is pulverized by a second decomposing unit by a milling method.
And an initial recovery step in which a predetermined metal is initially recovered from the first decomposition product by the magnetic force selection part.
Wherein the first or second usable goods sorting unit or the second usable goods sorting unit is inclined forward at a predetermined angle.
Priority Applications (1)
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KR1020150143701A KR101710550B1 (en) | 2015-10-14 | 2015-10-14 | Method for assorting electronic scrap |
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KR1020150143701A KR101710550B1 (en) | 2015-10-14 | 2015-10-14 | Method for assorting electronic scrap |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111992491A (en) * | 2020-08-17 | 2020-11-27 | 惠州市源德智科技有限公司 | Grinding equipment for soldering flux tin paste |
CN112024379A (en) * | 2020-08-28 | 2020-12-04 | 王睿 | Western medicine medicament sieving mechanism |
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KR100459316B1 (en) * | 2002-11-25 | 2004-12-03 | 주식회사 스페코 | apparatus for sorting aggregate |
JP5162819B2 (en) * | 2004-12-10 | 2013-03-13 | 東京電力株式会社 | Material recycling method for waste optical fiber cable |
KR20140045199A (en) | 2012-10-08 | 2014-04-16 | 한국지질자원연구원 | Method for recovering precious metals from printed circuit boards scrap of end-of-life mobile phones |
KR20140103209A (en) * | 2013-02-14 | 2014-08-26 | 이종관 | Crushing and sorting system for regenerating refuse and scrap iron |
-
2015
- 2015-10-14 KR KR1020150143701A patent/KR101710550B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100459316B1 (en) * | 2002-11-25 | 2004-12-03 | 주식회사 스페코 | apparatus for sorting aggregate |
JP5162819B2 (en) * | 2004-12-10 | 2013-03-13 | 東京電力株式会社 | Material recycling method for waste optical fiber cable |
KR20140045199A (en) | 2012-10-08 | 2014-04-16 | 한국지질자원연구원 | Method for recovering precious metals from printed circuit boards scrap of end-of-life mobile phones |
KR20140103209A (en) * | 2013-02-14 | 2014-08-26 | 이종관 | Crushing and sorting system for regenerating refuse and scrap iron |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111992491A (en) * | 2020-08-17 | 2020-11-27 | 惠州市源德智科技有限公司 | Grinding equipment for soldering flux tin paste |
CN112024379A (en) * | 2020-08-28 | 2020-12-04 | 王睿 | Western medicine medicament sieving mechanism |
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