KR101707143B1 - PCB assembly having gasket and manufacturing method thereof - Google Patents

PCB assembly having gasket and manufacturing method thereof Download PDF

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Publication number
KR101707143B1
KR101707143B1 KR1020150134404A KR20150134404A KR101707143B1 KR 101707143 B1 KR101707143 B1 KR 101707143B1 KR 1020150134404 A KR1020150134404 A KR 1020150134404A KR 20150134404 A KR20150134404 A KR 20150134404A KR 101707143 B1 KR101707143 B1 KR 101707143B1
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KR
South Korea
Prior art keywords
gasket
circuit board
printed circuit
mounting component
mounting
Prior art date
Application number
KR1020150134404A
Other languages
Korean (ko)
Inventor
오승택
Original Assignee
한국단자공업 주식회사
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Application filed by 한국단자공업 주식회사 filed Critical 한국단자공업 주식회사
Priority to KR1020150134404A priority Critical patent/KR101707143B1/en
Application granted granted Critical
Publication of KR101707143B1 publication Critical patent/KR101707143B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

Abstract

The present invention relates to a substrate assembly having a gasket (50) and a method of manufacturing the same. The present invention relates to a printed circuit board (10), a mounting part electrically connected to the printed circuit board (10), a gasket (20) which is an insulator coupled to surround the connection part of the printed circuit board (50), and a main housing that encloses the printed circuit board (10) through low pressure injection. According to the present invention, since the gasket 50 is provided on the substrate assembly to protect the joint portion between the printed circuit board 10 and the mounting component, the resin can be prevented from flowing into the components during the low- And the defective rate can be lowered.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate assembly having a gasket,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate assembly, and more particularly, to a substrate assembly manufactured through a low-pressure injection with a gasket between a printed circuit board and a substrate mounting component, and a method for manufacturing the same.

A battery used in an electric vehicle includes a plurality of battery cells to form a battery pack. At the time of charging, each of these battery cells is charged. Therefore, it is possible to detect the state of each battery cell to obtain necessary information, and to take necessary measures according to the information. For example, it is necessary to check the degree of charging of each battery cell, check whether overcharging occurs, and take necessary measures.

Such a battery cell includes a substrate assembly, which includes a printed circuit board and a connector mounted thereon. The connector is mounted directly on a printed circuit board and then soldered, which is also fabricated through low pressure injection. The low-pressure injection is to form the housing by low-pressure injection while the substrate assembly or the like is positioned inside the mold.

In such a low-pressure injection process, a phenomenon that a molding material (resin) comes into contact with a gap existing in the component, for example, an undercut of the product or a gap around the terminal of the connector tends to occur. Therefore, in order to prevent this, there is an inconvenience in sealing each gap between the printed circuit board and the connector and other parts in order to perform an accurate sealing operation. Of course, it is possible to perform a sealing operation through a separate automatic equipment, but this poses a problem that the manufacturing cost is greatly increased.

Korean Patent No. 10-0395392

It is an object of the present invention to provide a gasket in a substrate assembly in order to prevent resin from flowing between parts during a low pressure injection process.

Another object of the present invention is to produce gaskets in the low pressure injection process and to use them in the next low pressure injection process.

According to an aspect of the present invention for achieving the above object, the present invention provides a printed circuit board, a mounting part electrically connected to the printed circuit board, and a connection part between the printed circuit board and the mounting part, And a main housing enclosing the printed circuit board through a low pressure injection, wherein the gasket includes a gasket body having a through hole through which the mounting component passes, the gasket body including: And a terminal protecting portion that is inserted into one side of the main housing and surrounds the terminal of the mounting component. The gasket is made of the same material as the injection material for low pressure injection molding the main housing together in the main housing manufacturing process.

The gasket body surrounds the joint portions of the printed circuit board and the mounting component, and the terminal protector is formed on the upper and lower portions of the gasket body, respectively.

The portion of the gasket that is in contact with the printed circuit board and the mounting component is heated in the low pressure injection process to fill a gap formed in a portion where the melted portion is joined to the adjacent printed circuit board and the mounting component.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board, comprising: mounting a component on a printed circuit board; mounting a gasket on a connecting portion of the printed circuit board and the mounting component; And a low pressure injection step in which the printed circuit board, the mounting parts and the gasket assembly are injected at a low pressure together with the injection material, wherein the runners generated in the low pressure injection step Further comprising a gasket manufacturing step wherein the gasket is molded together, the gasket being separated from the runner and used in the next process.

Wherein the gasket includes a gasket body having a through hole through which the mounting component passes, and a terminal protector that is inserted into one side of the gasket body and surrounds the terminal of the mounting component, And a portion of the molten portion which is heated together fills the joint portion between the adjacent printed circuit board and the mounting component.

The substrate assembly having the gasket according to the present invention as described above and the method of manufacturing the same have the following effects.

In the present invention, since the gasket is provided on the substrate assembly to protect the joint portion between the printed circuit board and the mounting component, the resin can be prevented from flowing into the components during the low-pressure injection of the substrate assembly, have.

In particular, since the gasket is heated together with the gasket during the low-pressure injection process, the portion of the molten gas hits the gap formed between the adjacent printed circuit board and the mounting component, so that sealing of the product can be performed naturally without a separate sealing process. The completeness and the durability can be further improved.

In the present invention, since the gasket is formed together with the runner generated in the low-pressure injection process, a separate manufacturing process for manufacturing the gasket can be omitted, and since the gasket is made of the same material as the material used for low-pressure injection, In the process, it can be melted together without any sense of heterogeneity and accurate sealing can be achieved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a gasket separated from a gasket according to one embodiment of the present invention. FIG.
FIG. 2 is a perspective view showing a gasket constituting an embodiment of the present invention bonded to a substrate assembly. FIG.
3 is a perspective view showing the configuration of a gasket constituting an embodiment of the present invention.
FIG. 4 is a plan view showing a runner and a gasket generated in a process of manufacturing a substrate assembly having a gasket according to the present invention. FIG.
FIG. 5 is a flowchart sequentially showing the configuration of an embodiment of a method of manufacturing a substrate assembly having a gasket according to the present invention. FIG.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference numerals whenever possible, even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the understanding why the present invention is not intended to be interpreted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected," "coupled," or "connected. &Quot;

FIG. 1 is an exploded perspective view of an embodiment of a substrate assembly having a gasket according to the present invention. As can be seen, the substrate assembly includes a printed circuit board 10 and mounting components mounted thereon. Here, the mounting parts are electrically connected with the printed circuit board 10, and may be various electrical parts. In the present embodiment, the mounting component is formed of a connector 30. [

The outside of the board assembly composed of the printed circuit board 10 and the connector 30 can be wrapped by a main housing (not shown). The main housing may form a kind of electric box or an electric block, and various modifications are possible according to the environment in which the substrate assembly is applied. In this embodiment, the main housing forms an appearance and a skeleton of a battery pack for an electric vehicle.

The connector 30 is provided with a plurality of terminals 35 inside the housing. One end of the terminal 35 protruding outside the housing is soldered and coupled to the printed circuit board 10 and electrically connected thereto. Of course, it is possible to prevent the connector 30 from being fixed and separated from the printed circuit board 10 through soldering.

When the connector 30 is coupled to the printed circuit board 10, fine gaps exist between the connector 30 and the printed circuit board 10, and in particular, The clearance between the mounting component and the printed circuit board 10 also becomes large. Therefore, if the clearance between the connector 30 and the printed circuit board 10 is not shielded, a resin, which is an injection material, may flow into the gap when low-pressure injection, which will be described later, may occur.

To this end, a gasket (50) is coupled to a joint portion between the connector (30) and the printed circuit board (10). The gasket 50 shields the joint portion between the connector 30 and the printed circuit board 10 and prevents injection of the injection material therebetween. The gasket 50 is made of an insulator such as a synthetic resin because it should not be electrically connected to the terminal 35 of the connector 30 or the printed circuit board 10. 2 shows a gasket 50 joined to the joint portion between the connector 30 and the printed circuit board 10. In Fig.

As shown in FIG. 3, the gasket 50 has a gasket body 51 formed with a through hole 51 'through which the connector 30 passes. The gasket body 51 has an outer appearance and a skeleton. In this embodiment, the gasket body 51 is formed in a substantially rectangular shape, and the through-hole 51 'is formed in a shape that the housing of the connector 30 passes through when the gasket 50 is engaged with the connector 30 Section. Of course, when the gasket 50 is moved to the lower portion of the connector 30 and seated, the gasket 50 covers the joint portion between the connector 30 and the printed circuit board 10, thereby shielding it.

The gasket body 51 is formed with a terminal protecting portion 52. The terminal protecting portion 52 is a portion where the terminal 35 of the connector 30 is located when the gasket 50 surrounds the joint portion between the connector 30 and the printed circuit board 10, So as to prevent interference with the gasket body (51).

In this embodiment, the terminal protecting portion 52 is formed on the upper and lower portions of the gasket body 51, respectively, so that the shape of the upper portion and the lower portion of the gasket 50 are the same. The gasket 50 can be coupled to the joint portion between the connector 30 and the printed circuit board 10 without any directionality.

A guide groove 53 is formed in the gasket 50. The guide groove 53 corresponds to a guide rib provided on the outer surface of the connector 30. The guide groove 53 is formed in the guide groove 53 when the gasket 50 is coupled to the connector 30, Can be guided to the guide rib.

In the present invention, the gasket 50 is made of the same material as the main housing that surrounds the connector 30 and the printed circuit board 10. That is, the gasket 50 is made of the same material as the injection material for low-pressure injection molding of the main housing. This is because the gasket 50 is manufactured together on one side of the runner R in the low- to be.

The gasket 50 is heated together with the outer portion of the gasket 50 during the low-pressure injection process, so that the melted portion fills the joint portion between the adjacent printed circuit board 10 and the mounting component. That is to say, the melted portion of the gasket 50 fills the gap between the gasket 50 and the printed circuit board 10 and the mounting component, so that the injection material is prevented from being deformed by the undercut of the mounting component such as the connector 30, It is possible to prevent the phenomenon of flowing into the peripheral portion and coming out. Further, the gasket 50 can be more firmly coupled to the printed circuit board 10 and the connector 30 by melting a part thereof. Part A of FIG. 2 shows a portion where the gasket 50 is partially melted and sealed between the printed circuit board 10 and the gasket 50.

Hereinafter, a process of manufacturing a substrate assembly having a gasket according to the present invention will be described.

First, a component mounting step in which the connector 30 is mounted on the printed circuit board 10 is preceded. When the terminals 35 of the connector 30 are soldered to the printed circuit board 10 in a state where the connector 30 is seated on the printed circuit board 10, So that the connector 30 is fixed to the printed circuit board 10.

In this state, a gasket assembly step is performed in which the gasket 50 is coupled from the top of the connector 30. The gasket 50 is coupled from the upper portion of the connector 30 and is seated and attached to the connection portion of the printed circuit board 10 and the connector 30. The gap between the gasket 50 and the outer surface of the connector 30 is small so that the gasket 50 can be held in a state of being seated at the connection portion of the printed circuit board 10 and the connector 30.

Subsequently, a substrate mounting step in which the printed circuit board 10 and the connector 30 assembly are seated in the mold is performed. Here, the printed circuit board 10 and the connector 30 assembly are seated inside the injection mold for molding the main housing that surrounds the printed circuit board 10 and the connector 30 assembly. Of course, the previously assembled gasket 50 is also placed in the mold together with the printed circuit board 10 and the connector 30 assembly.

In this state, the low pressure injection step is followed. More precisely, the assembly consisting of the printed circuit board 10, the connector 30 and the gasket 50 is injected at low pressure with the injection material. Whereby the main housing is made through low pressure injection with the substrate assembly positioned inside the mold. That is, the printed circuit board 10 is prevented from being exposed to the outside by surrounding the substrate assembly, and maintenance of the printed circuit board 10 is impossible. However, it is possible to prevent the printed circuit board 10 from being influenced by the external environment.

On the other hand, in the previous low-pressure injection step, the gasket 50 is heated together and a portion thereof melted so as to fill the joint portion of the adjacent printed circuit board 10 and the connector 30. Since the gasket 50 is made of the same material as the low-pressure injection material, a part of the outer surface can be naturally melted in the low-pressure injection process, and the melted portion is melted by the gasket 50, the printed circuit board 10, the gasket 50, (30) so that the sealing is performed naturally.

Of course, the gasket 50 can be completely bonded to the printed circuit board 10 and the connector 30 through melting of the gasket 50. In other words, since the gasket 50 undergoes low-pressure injection without any separate sealing process, the sealing of the product is naturally performed, so that the completeness and durability of the product can be improved. In addition, since the gasket is made of the same material as the material used for the low-pressure injection, the low-pressure injection process can melt together without any sense of heterogeneity to achieve accurate sealing.

At this time, the gasket manufacturing step is performed simultaneously in the low-pressure injection step. More precisely, as shown in Fig. 4, the gasket 50 is molded together with the runner R generated in the injection portion of the injection material in the low-pressure injection step. Therefore, the gasket 50 does not require a separate manufacturing process, and can be naturally made of the same material as the injection material. Of course, the process of separating the gasket 50 from the connecting portion R 'of the runner R must be performed.

In this embodiment, two gaskets 50 are produced in a single low pressure injection process, with one gasket 50 or three or more gaskets 50 being produced in a single low pressure injection process. The low-pressure injection mold may be provided with a mold of a gasket (50) in the vicinity of the injection part of the runner (R) for manufacturing the gasket (50).

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. Furthermore, the terms "comprises", "comprising", or "having" described above mean that a component can be implanted unless otherwise specifically stated, But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the scope of the present invention but to limit the scope of the technical idea of the present invention. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

10: printed circuit board 30: connector
35: Terminal 50: Gasket
R: Runner

Claims (7)

A printed circuit board,
A mounting component mounted on the printed circuit board and electrically connected thereto,
A gasket, which is an insulator coupled to the connection portion of the printed circuit board and the mounting component,
And a main housing which is manufactured through low pressure injection and surrounds the printed circuit board,
Wherein the gasket includes a gasket body having a through hole through which the mounting component passes, and a terminal protector that is inserted into one side of the gasket body and surrounds the terminal of the mounting component, A substrate assembly comprising a gasket made from the same material as the injection material for low-pressure injection molding, the gasket being made together in the main housing manufacturing process.

delete The substrate assembly of claim 1, wherein the gasket body surrounds a joint portion of the printed circuit board and the mounting component, and the terminal protector includes a gasket formed on upper and lower portions of the gasket body, respectively.
The gasket according to any one of claims 1 to 3, wherein the portion of the gasket that is in contact with the printed circuit board and the mounting component is heated in a low-pressure injection process to fill a gap formed in a portion where the melted portion is joined to the adjacent printed- A substrate assembly having a gasket.
A component mounting step of mounting a mounting component on a printed circuit board;
A gasket joining step of joining a gasket to a connection portion of the printed circuit board and the mounting component;
A substrate mounting step in which the printed circuit board and the mounting component assembly are seated inside the mold;
And a low pressure injection step in which the printed circuit board, the mounting parts, and the gasket assembly are injected at low pressure with the injection material to form the main housing,
The method of manufacturing a substrate assembly according to any one of the preceding claims, further comprising a gasket manufacturing step in which a gasket is molded together with the runner generated in the low pressure injection step, wherein the gasket is separated from the runner and provided with a gasket used in the next process.
The gasket as claimed in claim 5,
A gasket body having a through hole through which the mounting component passes,
And a terminal protecting part which is inserted into one side of the gasket body and surrounds the terminal of the mounting part,
Wherein the gasket is provided with a gasket which is heated together in a low-pressure injection process so that a molten portion of the gasket fills an engagement portion of the printed circuit board and the mounting component adjacent to each other.
delete
KR1020150134404A 2015-09-23 2015-09-23 PCB assembly having gasket and manufacturing method thereof KR101707143B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11411333B2 (en) 2019-11-05 2022-08-09 Molex, Llc Connector assembly
US11424565B2 (en) 2019-11-05 2022-08-23 Molex, Llc Connector assembly and connector pair
TWI795689B (en) * 2019-11-05 2023-03-11 美商莫仕有限公司 Connector Assemblies and Connector Pairs

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395392B1 (en) 2000-07-12 2003-08-21 몰렉스 인코포레이티드 Emi gasket for connector assemblies
KR20120095203A (en) * 2011-02-18 2012-08-28 이승수 An electric apparatus having three-dimensional rotating electrode
JP2013110411A (en) * 2011-11-22 2013-06-06 Daehantrans Co Ltd Optical element module having waterproof function and surface light source device using the same
KR101276353B1 (en) * 2011-12-09 2013-06-24 주식회사 비에스이 Multi-function microphone assembly and method of making the same
CN204130728U (en) * 2014-09-01 2015-01-28 联想(北京)有限公司 Wire and cable connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395392B1 (en) 2000-07-12 2003-08-21 몰렉스 인코포레이티드 Emi gasket for connector assemblies
KR20120095203A (en) * 2011-02-18 2012-08-28 이승수 An electric apparatus having three-dimensional rotating electrode
JP2013110411A (en) * 2011-11-22 2013-06-06 Daehantrans Co Ltd Optical element module having waterproof function and surface light source device using the same
KR101276353B1 (en) * 2011-12-09 2013-06-24 주식회사 비에스이 Multi-function microphone assembly and method of making the same
CN204130728U (en) * 2014-09-01 2015-01-28 联想(北京)有限公司 Wire and cable connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11411333B2 (en) 2019-11-05 2022-08-09 Molex, Llc Connector assembly
US11424565B2 (en) 2019-11-05 2022-08-23 Molex, Llc Connector assembly and connector pair
TWI795689B (en) * 2019-11-05 2023-03-11 美商莫仕有限公司 Connector Assemblies and Connector Pairs

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