KR101697626B1 - Spacer for gas insulated switchgear and manufacturing method of this - Google Patents

Abstract

To an insulating spacer for a gas insulated switchgear and a method of manufacturing the same. The present invention provides a battery pack comprising a case (10) for forming a sealed space filled with an insulating gas therein, a central conductor (300) extending in a longitudinal direction of the case (10) An epoxy molding part 120 for supporting the center conductor 300 in a closed space and an insulating layer 200 provided between the epoxy molding part 120 and the center conductor 300. The outer surface of the central conductor 300 contacting the insulation layer 200 and the outer surface of the epoxy molding part 120 are each formed in a plane and the insulation layer 200 is coated on the center conductor 300 As shown in Fig. In the present invention as described above, an insulating layer, which is a high-performance epoxy coating layer, is provided between the central conductor 300 and the insulating spacer constituting the gas-insulated switchgear, thereby improving the adhesion of the joint surface. It is not necessary to design the outer surface of the center conductor 300 in a round shape in order to increase the adhesion area.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an insulating spacer for gas insulated switchgear,

The present invention relates to an insulator for a gas insulated switchgear, and more particularly to an insulated spacer for a gas insulated switchgear having an insulating layer between a central conductor and an epoxy molding part.

In general, a gas insulated switchgear (GIS) is a type of gas insulated switchgear (GIS) that uses insulation gas (SF6), which is excellent in insulation performance and softening function, And is composed of various components such as a breaker, a disconnector, and a ground switch.

Particularly, the gas-insulated switchgear is provided with an insulating spacer, and the insulating spacer is provided in the sealed container so that the central conductor, through which a high-voltage current flows, does not contact the inner wall of the closed container, In addition, it divides the compartment of the hermetically sealed container and also plays a role of preventing leakage of the insulated gas.

In the conventional insulating spacer for a gas insulated switchgear, there is a contact portion (triple point) where the epoxy molding portion, the center conductor and the insulating gas meet each other. In this case, the contact part where the three different media meet is a part where the electric field is concentrated due to the current at the time of energization, and when there is a void in the vicinity of the joint part of the central conductor and the epoxy molding part, Thereby causing insulation breakdown.

In order to solve this problem, there is a method of sanding the surface of the central conductor so as to improve the adhesion between the central conductor and the epoxy molding part, or designing the outer surface of the central conductor as a curved surface for enlarging the interfacial adhesion area and avoiding electric field concentration Respectively.

However, the sanding of the central conductor surface requires additional machining of the center conductor, and the curved surface design of the outer conductor of the center conductor makes a difference between the structural analysis and the experimental value, so that accurate data on the interfacial bonding portion can not be obtained easily, There is a difficult problem.

Korean Patent No. 0945277

It is an object of the present invention to simplify the shape of the central conductor constituting the insulating spacer and to improve the adhesion between the center conductor and the epoxy molding part.

According to an aspect of the present invention for achieving the above-described object, the present invention provides an air conditioner comprising: a case defining a closed space filled with an insulating gas therein; An epoxy molding part for supporting the center conductor in the closed space; and an insulating layer provided between the epoxy molding part and the center conductor.

Here, the outer surface of the central conductor and the outer surface of the epoxy molding part, which are in contact with the insulating layer, are each formed in a plane.

The insulating layer is attached to the outer surface of the center conductor through a coating.

The insulating layer is made of a material having a higher dielectric constant than the epoxy molding portion.

The insulating layer may include an organic additive or an inorganic additive in the epoxy. The organic additive may include a material capable of improving adhesion between the center conductor and the epoxy molding, such as a rubber material, a heteroepitaxial epoxy, The inorganic additive includes alumina, silica or a composite thereof or a ceramic material.

The epoxy molding part may be coupled to the outer surface of the center conductor while surrounding the insulation layer so that the insulation layer is not exposed to the outside.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: masking an outer surface of a center conductor; masking the outer surface of the center conductor with an insulating layer; And a molding step in which an epoxy molding part is molded.

In addition, a stepped portion relatively protruding is provided on both side edges of the central conductor, and the insulating layer may be formed to fill the space between the stepped portions in the coating step.

In the molding step, the molding range of the epoxy resin is formed to be larger than the width of the insulating layer.

The following effects can be expected in the insulating spacer for a gas insulated switchgear according to the present invention as described above and the manufacturing method thereof.

In the present invention, an insulation layer, which is a high-performance epoxy coating layer, is provided between the central conductor and the epoxy molding part constituting the insulating spacer, thereby improving the durability of the product because the bonding strength of the joint surface is improved and the surface of the conductor is sandblasted There is no need to design the outer surface of the center conductor in a round shape in order to increase the bonding area, and thus the manufacturing process of the insulating spacer is simplified.

In the present invention, the outer surface of the central conductor in contact with the insulating layer and the outer surface of the epoxy molding part are each formed in a plane, so that the design is simplified, and the structure analysis of the adhesive force of the bonding surface is facilitated by a simple outer surface.

In addition, in the present invention, various organic / inorganic materials are added to an insulating layer to improve mechanical / electrical characteristics, thereby improving operation reliability and durability.

In the present invention, an insulating layer having a dielectric constant higher than that of the epoxy molding part of the insulating spacer is provided between the center conductor and the epoxy molding part, thereby dispersing the electric field concentration generated near the triple point.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing a configuration of a preferred embodiment of an insulating spacer for a gas-insulated switchgear according to the present invention; FIG.
Fig. 2 is a sectional view showing a configuration of a center conductor, an epoxy molding part, and an insulating layer constituting an embodiment of the present invention. Fig.
3 is a cross-sectional view showing a main configuration of a center conductor, an epoxy molding part, and an insulating layer constituting an embodiment of the present invention.
4 is a cross-sectional view showing a main configuration of a center conductor, an epoxy molding part and an insulating layer constituting another embodiment of the present invention.
5 is a flowchart showing a process for sequentially manufacturing processes for manufacturing an insulating spacer for a gas insulated switchgear according to the present invention.
6 is a flowchart showing another example of a process for manufacturing an insulating spacer for a gas insulated switchgear according to the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference numerals whenever possible, even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the understanding why the present invention is not intended to be interpreted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected," "coupled," or "connected. &Quot;

Fig. 1 is a cross-sectional view of a preferred embodiment of a gas insulated switchgear according to the present invention. Fig. 2 is a cross-sectional view of the constitution of a center conductor, an epoxy molding part and an insulating layer constituting an embodiment of the present invention have.

As described above, the gas-insulated switchgear according to the present invention forms a skeleton and an appearance of a case 10 forming a predetermined closed space therein. The case 10 is a sealed container formed in a cylindrical shape of a metal forming a constant diameter and serves as a ground, and a plurality of cases 10 are installed to be connected to each other by a flange 25.

The insulating spacer 100 to be described below is provided inside the flange 25 provided in the epoxy molding part 120 of the case 10 and the case 10, And serves to divide the succeeding internal space 20 into a plurality of sealed spaces.

Insulating gas (SF ₆ ), which is an insulating medium, is filled in the inner space (20) of the case (10). Although not shown, various other devices such as a circuit breaker and a disconnecting switch are installed.

Accordingly, the gas insulated switchgear utilizes the excellent insulating performance of sulfur hexafluoride (SF ₆ ), which is an inert gas having a relatively higher permittivity than air, so that it can be safely opened and closed even in abnormal conditions such as a steady- System protection function can be performed.

A flange 25 is provided on the epoxy molding part 120 of the case 10 and the case 10. The flange 25 is tightened and fastened by a fastener B such as a bolt. The flange 25 is configured to surround the outer circumferential surface of the case 10. Although not shown, an O-ring is provided between the flange 25 and the epoxy molding part 120.

The inner space 20 is provided with an epoxy molding part 120 and a center conductor 300. For convenience of explanation, the center conductor 300 will be described first. The center conductor 300 connects the line through which a high-voltage current flows. The center conductor 300 is provided along the central axis of the case 10, And is held by the epoxy molding part 120 in a state of being supported by the inner space 20 of the case 10 and spaced apart from the inner circumferential surface of the case 10 by a predetermined distance.

As shown in FIGS. 1 and 2, the center conductor 300 is formed into a substantially cylindrical shape or a disk shape. Although not shown, a separate connection conductor may be connected to the center conductor 300 and the connection conductor may extend along the longitudinal direction of the internal space 20. [ Between the center conductor 300 and the connection conductor, a cast conductor or the like may be provided as a medium. Reference numeral 305 denotes a fastening hole to which the connection conductor can be coupled.

An epoxy molding part 120 is provided around the outer circumferential surface of the center conductor 300. One end of the epoxy molding part 120 is connected to the flange 25 and the other end of the epoxy molding part 120 is connected to the center conductor 300 so that the center conductor 300 is supported at the center part of the inner space 20 , And serves to divide the internal space 20 into a plurality of sealed spaces again as described above.

The insulating spacer 100 according to the present invention may be formed in a cone shape or in a disc shape. In this embodiment, the insulating spacer 100 is formed in a conical shape. That is, the insulating spacer 100 is coupled to the inside of the flange 25 with the center conductor 300 at the center and the outer edge thereof being inclined to one side. The epoxy molding part 120 is made of an insulating material such as an epoxy resin.

The insulating spacer 100 includes an epoxy molding part 120 connecting the insulating spacer 100 to the flange 25. An O-ring groove 150 is formed at one end of the epoxy molding part 120, Can be inserted. Reference numerals 130 and 135 denote a coupling portion and a coupling hole of the insulating spacer 100, respectively.

A junction A is formed between the epoxy molding part 120 and the center conductor 300. The junction A is a part where the epoxy molding part 120 and the center conductor 300 and the insulating gas meet , Three different types of medium are encountered, so that the electric field generated inside the gas insulated switchgear is concentrated at the time of energization. Accordingly, the junction A corresponds to a portion where the insulation performance is lowered or insulation breakdown is likely to occur.

Therefore, an insulating layer 200 is provided between the epoxy molding part 120 and the central conductor 300 in order to complement the joint part A. The insulating layer 200 is provided between the epoxy molding part 120 and the center conductor 300 to connect the two and has an approximately ring shape surrounding the outer circumferential surface of the center conductor 300. In this embodiment, the insulating layer 200 is coated on the outer circumferential surface of the center conductor 300 and is formed to have a thickness greater than 2 mm.

The insulating layer 200 may be made of a material having a relatively larger dielectric constant than the epoxy molding part 120. This is because the insulating layer 200 has a dielectric constant larger than that of the epoxy molding part 120 so that the electric field concentration generated in the joint part A can be dispersed outward from the center of the epoxy molding part 120.

In this embodiment, the insulating layer 200 is formed of a high-performance epoxy coating layer. The insulating layer 200 may include an organic additive or an inorganic additive in the epoxy resin. Herein, the organic additive includes a rubber material or a transfer epoxy, and the inorganic additive includes alumina (Al ₂ O ₃ ), silica (SiO ₂ ), a composite thereof, or a ceramic material. The organic additive and the inorganic additive may be contained in the insulating layer 200 in powder form, and both the organic additive and the inorganic additive may be included.

Accordingly, the insulating layer 200 is relatively superior in mechanical / electrical characteristics to the epoxy molding part 120. For example, the insulating layer 200 is excellent in dielectric strength, heat resistance, impact resistance, and the like due to addition of an organic additive. Through the addition of the inorganic additive, it is possible to alleviate the field concentration relaxation on the bonding surface. In some cases, the insulating layer 200 may also perform a function of compensating for the impact through the inclusion of the elastomeric filler.

Since the insulating layer 200 is a high-performance epoxy coating layer, the insulating layer 200 has a relatively higher adhesive strength than the epoxy molding part 120, and thus enhances the bonding force between the epoxy molding part 120 and the center conductor 300 . Accordingly, the epoxy molding part 120 and the center conductor 300 are prevented from weakening in bonding strength or insulation breakdown due to various factors such as electric field concentration.

3, the epoxy molding part 120 is connected to the central conductor 300 through the insulating layer 200. As shown in FIG. 4, And one end may be coupled to the outer surface of the center conductor 300 while surrounding the insulating layer 200. That is, a part of the epoxy molding part 120 may be directly connected to the center conductor 300.

Hereinafter, a process of manufacturing the insulating spacer for a gas insulated switchgear according to the present invention will be described.

As shown in FIG. 5, the center conductor 300 is first prepared to manufacture the gas insulated switchgear. The center conductor 300 is formed in a columnar shape, and the upper surface and the lower surface are respectively formed in a plane. In this embodiment, a separate sandblasting step is omitted on the outer circumferential surface of the center conductor 300. And relatively protruding steps 310 and 320 may be provided on both side edges of the center conductor 300.

A masking operation is performed on the outer circumferential surface of the center conductor 300. Here, the masking operation is performed on the stepped portions 310 and 320 of the outer circumferential surface of the central conductor 300. The masking operation is to cover the portion of the outer surface of the central conductor 300 that is not coated with the insulating layer 200 in the coating step to be performed below.

The masking operation may be performed by winding the stepped portions 310 and 320 of the center conductor 300 using a masking tape. Accordingly, the masking portion M having the masking has a predetermined thickness, which may correspond to the thickness of the insulating layer 200 in the following coating step.

The masking step is followed by a coating step. The insulating layer 200 may be formed by coating an insulating layer 200 on the outer circumferential surface of the central conductor 300. The insulating layer 200 may have a relatively larger dielectric constant than the epoxy molding portion 120, It is preferable to be made of a material. In this embodiment, the insulating layer 200 is formed of a high-performance epoxy coating layer. The insulating layer 200 may include an organic additive or an inorganic additive in the epoxy resin. That is, it can be coated on the outer circumferential surface of the center conductor 300 in a state of containing an additive such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ) or a composite thereof or a ceramic material in the epoxy resin.

In the coating step, the insulating layer 200 may be formed to have a protruding thickness of the masking portion M previously masked. That is, the portion 303 between the masking portions M is filled with the insulating layer 200 through the coating, and through this, the thickness of the insulating layer 200 originally designed is reduced through the steps 310 and 320 After setting, the coating operation can be carried out according to this.

Next, a molding step for molding the epoxy resin is performed on the outer side of the insulating layer 200. In the molding step, the epoxy molding part 120 of the epoxy resin material is molded. Since the epoxy molding part 120 is molded directly on the insulating layer 200 without being directly molded on the center conductor 300, a relatively firm adhesion can be achieved. Of course, since the insulating layer 200 forms a high-performance epoxy coating layer, the epoxy molding part 120 is relatively directly adhered to the center conductor 300.

When the epoxy molding part 120 is molded as described above, the epoxy molding part 120 maintains the central conductor 300 in the inner space 20 in a state of being separated from the inner circumferential surface of the case 10.

On the other hand, Fig. 6 shows an embodiment different from the embodiment shown in Fig. As described above, in the masking step, the masking can be performed by a primer. That is, a primer is applied to form a masking on the central conductor 300.

Subsequently, as described above, the masking step is followed by a coating step. The insulating layer 200 may be formed by coating an insulating layer 200 on the outer circumferential surface of the central conductor 300. The insulating layer 200 may have a relatively larger dielectric constant than the epoxy molding portion 120, It is preferable to be made of a material.

6 (c), since the outer circumferential surface of the central conductor 300 has the same height throughout the insulating layer 200, the insulating layer 200 has a relatively larger thickness than the masking portion M. In this embodiment, .

In addition, a molding step for molding an epoxy resin is performed on the outer side of the insulating layer 200 as described above. In the molding step, the epoxy molding part 120 of the epoxy resin material is molded.

5 (d) and 6 (d), X represents a section in which the epoxy resin is molded. As shown here, the molding range of the epoxy resin in the molding step is larger than the width of the insulating layer 200 . Accordingly, as shown in FIG. 4, one end of the insulation spar may be coupled to the outer surface of the center conductor 300 while surrounding the insulation layer 200. That is, a part of the epoxy molding part 120 may be directly connected to the center conductor 300.

Of course, the coupling between the insulating layer 200 and the epoxy molding part 120 may be performed as shown in FIG. 3 by adjusting the molding section.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. Furthermore, the terms "comprises", "comprising", or "having" described above mean that a component can be implanted unless otherwise specifically stated, But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the scope of the present invention but to limit the scope of the technical idea of the present invention. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

10: Case 20: Internal space
100: Insulation spacer 120: Epoxy molding part
200: insulation layer 300: center conductor

Claims (9)

A case for forming a closed space filled with insulating gas therein,
A center conductor which is coupled to a connection conductor extending in the longitudinal direction of the case in the closed space of the case,
An epoxy molding part for supporting the center conductor in the closed space,
And an insulating layer provided between the epoxy molding part and the center conductor,
The outer surface of the central conductor and the outer surface of the epoxy molding part, which are in contact with the insulating layer, are each formed as a flat surface or a curved surface,
Wherein the epoxy molding part and the center conductor are connected to each other through the insulation layer without being in direct contact with each other,
Wherein the insulating layer comprises an organic additive or an inorganic additive in epoxy so as to have a higher dielectric constant than the epoxy molding part.
delete The insulated spacer according to claim 1, wherein the insulating layer is attached to an outer surface of the center conductor through a coating.
delete The method of claim 1, wherein the material of the insulating layer comprises an organic additive or an inorganic additive in epoxy, the organic additive includes a rubber material or epoxy, and the inorganic additive includes alumina, silica or Wherein the insulating spacer is made of a composite material or a ceramic material.
delete A masking step of masking the outer surface of the central conductor,
A coating step of coating an outer surface of the center conductor with an insulating layer,
And a molding step of forming an epoxy molding part through molding of an epoxy resin on the outside of the insulating layer,
The outer surface of the central conductor and the outer surface of the epoxy molding part, which are in contact with the insulating layer, are each formed as a flat surface or a curved surface,
Wherein the epoxy molding part and the center conductor are connected to each other through the insulation layer without being in direct contact with each other,
Wherein the insulating layer comprises an organic additive or an inorganic additive in the epoxy so as to have a higher dielectric constant than the epoxy molding part.
The manufacturing method of the insulated spacer for a gas insulated switchgear according to claim 7, wherein stepped portions are formed on opposite side edges of the central conductor, and the insulating layer is formed to fill the gap between the stepped portions in the coating step Way.
8. The method of claim 7, wherein the material of the insulating layer comprises an organic additive or an inorganic additive in the epoxy, the organic additive includes a rubber material or epoxy, and the inorganic additive includes alumina, Wherein the composite material and the ceramic material are included in the insulating spacer.

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