KR101680443B1 - Stretchable substrates with locally varied stiffness and stretchable electronics packages produced using the same substrates and Producing Method Thereof - Google Patents
Stretchable substrates with locally varied stiffness and stretchable electronics packages produced using the same substrates and Producing Method Thereof Download PDFInfo
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- KR101680443B1 KR101680443B1 KR1020150006419A KR20150006419A KR101680443B1 KR 101680443 B1 KR101680443 B1 KR 101680443B1 KR 1020150006419 A KR1020150006419 A KR 1020150006419A KR 20150006419 A KR20150006419 A KR 20150006419A KR 101680443 B1 KR101680443 B1 KR 101680443B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flexible substrate, a flexible substrate, a stretchable electronic device package and a stretchable / flexible electronic package, and more particularly, to a flexible substrate having a low stiffness And a stiffness local conversion portion formed of a polymer having high rigidity locally on the substrate, and a flexible electronic device package using the same.
Description
The present invention relates to a stiffness local conversion flexible substrate for use in a stretchable electronic device such as a skin patch type electronic device, an electronic skin, a smart garment, a wearable electronic device, a slap-on device, a smart watch and the like, and a stretchable electronic device package using the same.
Electronic devices are becoming increasingly smaller, lighter, faster, and more versatile. However, conventional electronic devices such as smart phones, cell phones, tablet PCs, and notebook computers have difficulty in flexing and stretching due to the mounting of silicon (Si) based semiconductor chips on a rigid substrate such as a PCB.
Recently, a flexible substrate such as a PCB is replaced with a flexible substrate such as FPCB, and a thin semiconductor chip having a very thin thickness is mounted on the flexible substrate. However, in this case, It has been difficult to impart elasticity to the electronic device.
However, for use in such applications as smart clothing, skin patch type electronic devices, electronic skin, wearable electronic devices, slap-on devices, smart watches, etc., implementation of electronic devices having elasticity is required.
Flexible substrates, stretchable circuits and flexible electronic components are required to implement fully stretchable electronic devices. However, since the electronic parts including the semiconductor chip are hard and have no elasticity, the metal thin films used for the formation of the circuit wiring have a problem in that the elasticity is remarkably lower than that of the elastic polymer used as the flexible substrate and there is no elasticity required in the flexible electronic device.
In order to solve the above problems, as shown in FIG. 1,
However, in the conventional method as described above, since the expansion and contraction of the
In addition, in the above-described conventional method, as the elongation and contraction of the
In addition, since the width of the
In order to solve these problems, the inventor of the present invention has applied for a patent on Korean Patent Application No. 10-2013-0027166 entitled "Stiffness gradient type stretchable substrate and method of manufacturing the same". This prior patent relates to a flexible substrate having a polymer layer having a relatively high stiffness laminated on a polymer layer having a low stiffness. In the case of such a flexible substrate, in the case where a large amount of external force is transmitted to a polymer layer having a high stiffness And it is necessary to manufacture a more stable substrate by improving such a problem.
The present invention relates to an existing flexible electronic device package which forms a wavy-patterned metal thin-
According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, including the steps of: (a) forming a base substrate with a polymer having a low stiffness; (b) locally etching the base substrate to form an etching portion for forming a stiffness local conversion portion; (c) filling the etching portion for forming the stiffness local conversion portion with a polymer having a stiffness relatively higher than that of the polymer having a low stiffness to provide a stiffness local conversion portion; The present invention provides a method of manufacturing a rigid-body local conversion flexible substrate.
Preferably, the stiffness local conversion unit has a smaller area than the base substrate.
Preferably, the manufacturing method of the stiffness local conversion flexible substrate further comprises the steps of: (d) locally etching the stiffness local conversion portion to provide an etching portion for forming an additional stiffness local conversion portion; (e) A step of providing a stiffness local conversion unit by filling a high-stiffness polymer with a relatively higher stiffness than the high-stiffness polymer; And further comprising:
Preferably, the step (d) and the step (e) are repeatedly performed so that the stiffness local conversion unit includes a polymer portion having relatively high stiffness sequentially in the polymer portion having a relatively low stiffness.
Preferably, the base substrate and the stiffness local conversion unit are at least one selected from the group consisting of PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, Of a polymer.
Preferably, the base substrate and the stiffness local conversion unit are at least one selected from the group consisting of PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, Wherein the content of the curing agent mixed in the polymer matrix is controlled to adjust the stiffness.
Preferably, the stiffness local conversion unit is at least one selected from the group consisting of PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, and Teflon do.
Preferably, the surface of the stiffness local conversion unit and the surface of the base substrate have the same height.
Preferably, the surface of the stiffness local conversion portion has a height higher than the surface of the base substrate.
Preferably, the surface of the stiffness local conversion portion has a lower height than the surface of the base substrate.
The present invention also provides a stiffness local conversion flexible substrate manufactured by the manufacturing method according to any one of the above-described features.
According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: (a) forming a base substrate with a polymer having a low stiffness, (b) locally etching the base substrate to form an etching portion for forming a stiffness local conversion portion, A step of forming a stiffness local conversion flexible substrate by filling the etching portion for forming the local conversion portion with a polymer having a stiffness relatively higher than that of the polymer having the low stiffness to provide a stiffness local conversion portion; (d) forming a circuit wiring on the stiffness local conversion flexible substrate; (e) mounting the electronic component on the stiffness local conversion flexible substrate; The present invention also provides a method of manufacturing a flexible electronic device package.
Preferably, the circuit wiring is formed of a material selected from the group consisting of Au, Cu, Sn, Ag, Al, Ni, Pt, At least one metal selected from the group consisting of chromium (Cr), titanium (Ti), tantalum (Ta), and tungsten (W).
Preferably, the circuit wiring is formed of a material selected from the group consisting of Au, Cu, Sn, Ag, Al, Ni, Pt, At least one metal selected from the group consisting of chromium (Cr), titanium (Ti), tantalum (Ta), and tungsten (W).
Preferably, the circuit wiring is characterized in that at least one member selected from the group consisting of a carbon nanotube, a metal powder, a nano metal powder, a graphene, and a conductive ceramic powder is contained in the polymer to impart conductivity thereto.
Preferably, the circuit wiring is formed into a circuit wiring shape using at least one selected from the group consisting of carbon nanotubes, metal powders, nano metal powders, graphenes, and conductive ceramic powders, and is impregnated with a polymer to impart elasticity .
Preferably, the metal powder or nano metal powder is at least one selected from the group consisting of gold (Au), copper (Cu), tin (Sn), silver (Ag), aluminum (Al), nickel (Ni), platinum (Fe), chromium (Cr), titanium (Ti), tantalum (Ta), and tungsten (W).
Preferably, the circuit wiring is formed of a material selected from the group consisting of Au, Cu, Sn, Ag, Al, Ni, Pt, A metal powder, a nano metal powder, a graphene powder, or a mixture thereof is formed on a single layer or a multilayer metal thin film composed of at least one metal selected from the group consisting of Cr, Ti, Ta, , And a conductive ceramic powder, and is provided with a polymer circuit wiring to which conductivity is imparted.
Preferably, the circuit wiring is formed of a material selected from the group consisting of Au, Cu, Sn, Ag, Al, Ni, Pt, A metal powder, a nano metal powder, a graphene powder, or a mixture thereof is formed on a single layer or a multilayer metal thin film composed of at least one metal selected from the group consisting of Cr, Ti, Ta, , Conductive ceramic powder, and is made into a circuit wiring shape, and is impregnated with a polymer to impart stretchability.
Preferably, the circuit wiring is formed in a linear shape or a wavy pattern.
Preferably, the method of manufacturing the flexible electronic component package includes the steps of forming a circuit wiring on a stiffness local conversion flexible substrate, mounting the electronic component thereon, and thereafter forming a flexible wiring board having the same or smaller size as the stiffness local conversion unit constituting the stiffness local conversion flexible substrate Size encapsulation of the encapsulation layer.
Preferably, the encapsulation is selected from the group consisting of epoxy molding compound (EMC), PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, And at least one selected from the above.
Preferably, the manufacturing method of the flexible electronic device package includes the steps of forming a circuit wiring on a stiffness local conversion flexible substrate, mounting an electronic component thereon, and then forming encapsulation having a size equal to or smaller than that of the base substrate And further comprising:
Preferably, the encapsulation is selected from the group consisting of epoxy molding compound (EMC), PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, And at least one selected from the above.
Preferably, the manufacturing method of the flexible electronic device package further includes the step of forming a circuit wiring on the stiffness local conversion flexible substrate and mounting an electronic part, followed by forming an encapsulation having the stiffness local conversion part thereon .
Also, according to the present invention, there is provided a flexible electronic device package manufactured by the manufacturing method according to any one of the above-described features.
According to another aspect of the present invention, there is provided a semiconductor device comprising: a base substrate made of a polymer having a low stiffness; A stiffness local conversion unit formed locally in a part of the base substrate; Wherein the stiffness local changing portion is made of a polymer having a stiffness relatively higher than that of the polymer having the low stiffness.
Preferably, the stiffness local conversion unit has a smaller area than the base substrate.
Preferably, the stiffness local conversion flexible substrate further comprises: an additional stiffness local conversion unit formed locally in a part of the stiffness local conversion unit; And the stiffness local conversion unit is made of a polymer having a stiffness relatively higher than that of the stiffness local conversion unit.
According to the present invention, in a stiffness local conversion flexible substrate, a base substrate portion made of a polymer having a low stiffness is stretched to a desired large strain, and at the same time, a tensile strain is suppressed to a very low level in a stiffness local conversion portion made of a polymer having a high stiffness, It is possible to prevent breakage and peeling of the circuit wiring provided on the flexible substrate and to prevent the mounted electronic parts from being broken.
Further, since the shape of the circuit wiring provided in the stiffness local conversion flexible substrate can be changed from the existing wavy pattern to the linear shape, the density of the flexible electronic device package can be increased.
In addition, the stress transmission due to external force is relatively low as compared with the existing stiffness gradient type stretch substrate, and the direction of external force that can be directly transmitted to the high stiffness polymer layer is also limited, so that a more stable substrate can be provided.
1 is a schematic diagram of a flexible electronic device package 14 according to a conventional method in which a wavy patterned
FIG. 2 is a cross-sectional view of a high-rigidity
FIG. 3 is a cross-sectional view of a
FIG. 4 is a schematic view of a stiffness local conversion flexible substrate according to the present invention and a conventional stiffness gradient flexible substrate before and after bending deformation. FIG.
5 is a schematic view showing a flexible
6 is a diagram showing the stiffness
7 shows a flexible
8 is a schematic view showing a state in which the
9 is a schematic view showing a state in which an
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.
In this embodiment, PDMS (polydimethyl siloxane) is used as the polymer materials for forming the
In the present embodiment, a
A portion of the
In this embodiment, PDMS having an elastic modulus of 250 kPa in which 5% of a curing agent is added to a silicone elastomer base is filled in the
3 (d) and FIG. 3 (d) are obtained by etching the region where the stiffness is to be locally higher in the stiffness
In the stiffness local conversion /
This tensile strain inhibiting effect was evaluated to be relatively higher than that of the inventor's prior patent, "Stiffness gradient type stretch substrate". Since the stretchable substrate of the present invention forms a polymer layer having a high stiffness locally within a polymer layer having a low stiffness, it can be evaluated that the stress transmission due to an external force is relatively low as compared with the existing stiffness gradient type stretch substrate.
The stiffness local conversion flexible substrate according to the present invention is superior in reliability against bending stretch deformation and has a higher degree of bending deformation than the stiffness gradient type stretch substrate according to the prior art.
FIG. 4 is a schematic view of a stiffness local conversion flexible substrate according to the present invention and a conventional stiffness gradient flexible substrate before and after bending deformation.
The stiffness local conversion / stretchable substrate according to the present invention has a much lower stress generated at the portion of the substrate having high rigidity due to the same bending, thereby improving the bending stretch deformation reliability. Therefore, even if the operation of bending and spreading is repeated a lot, interfacial peeling between substrate portions having different stiffness from the stretchable substrate can be prevented.
The stress generated in the portion of the substrate having high rigidity in the flexible substrate by the bending deformation is expressed by Equation (1).
In Equation (1), E is the modulus of elasticity of the high-stiffness polymer layer, Ro is the radius of curvature of curvature, and d is the total thickness of the stretchable substrate.
In general, since R o and d, Equation (1) can be expressed as Equation (2).
As shown in Equation 2, the stress generated at each portion of the substrate having different stiffness by bending the flexible substrate is proportional to the elastic modulus E of the substrate portion and the total thickness d of the flexible substrate, and is inversely proportional to the bending radius of curvature R o .
Assuming that the thickness of the substrate portion having the lowest stiffness is 1, the thickness of the substrate portion having the intermediate stiffness is 1/2, and the thickness of the substrate portion having the highest stiffness is 1/4 in the stiffness local conversion substrate and the stiffness gradient substrate, The stress generated in the stiffness local conversion substrate is reduced to 4/7 times that of the stiffness gradient substrate.
The stress generated in bending flexural deformation should be supported at the interface between the substrate portions having different stiffness. If the stress due to the bending stretching deformation becomes higher than the threshold value, the substrate is broken due to the interface delamination.
In the stiffness local conversion substrate, the interfaces of the substrate portions having different stiffnesses are formed not only at the upper and lower bonding portions but also at the side bonding portions. On the other hand, in the stiffness type substrate, the interfaces of the substrate portions having different stiffness are formed only at the upper and lower bonding portions.
Therefore, the stiffness local conversion substrate according to the present invention has a much lower stress caused by the bending stretching deformation than the stiffness gradient substrate according to the conventional technique, and the area of the bonding interface that can sustain this stress is much larger. The reliability of the system is greatly increased.
In addition, the stiffness local conversion flexible substrate according to the present invention can apply even more severe bending deformation, thereby widening the utilization of the flexible substrate.
The stress generated in the flexible substrate by the bending deformation in Equation (2) increases as the entire thickness of the substrate is thicker and the bending radius of curvature R o is smaller. Since the total thickness d is smaller than that of the stiffness gradient type stretch substrate according to the present invention, the stiffness local conversion and stretch substrate according to the present invention can prevent the peeling on the substrate interface while reducing the bending radius R o to a smaller value, Quot ;. < / RTI >
Therefore, it is possible to use the stiffness local conversion flexible substrate according to the present invention for applications requiring severe bending, which was constrained in the stiffness gradient type stretchable substrate by the conventional technique.
5, since the tensile strain of the
5, it is preferable that the stiffness
In the package using the
In this embodiment, the surface height of the
According to the present invention, the
8, the
9, the
In the present embodiment, the stiffness
In the present embodiment, the stiffness
In this embodiment, in addition to the polymer having a low stiffness constituting the
In the present invention, it is also possible to select one polymer material among PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone and Teflon, The
In the present invention, gold (Au), copper (Cu), tin (Sn), silver (Ag), aluminum (Al), nickel (Ni), platinum (Pt) (13) made of a single layer or a multilayer by combining a metal having a composition containing any one or more of chromium (Cr), titanium (Ti), tantalum (Ta), and tungsten It is possible to constitute the stretchable
In the present invention, a circuit wiring (13) having conductivity imparted by containing any one or two or more of carbon nanotubes, metal powder, nano metal powder, graphene, and conductive ceramic powder in a polymer is applied to the stiffness local conversion flexible substrate It is possible to provide the flexible
In the present invention, the
In the present invention, a
In the present invention, the polymer impregnated into the
In the present invention, the
In the present invention, the
In the present invention, the
The metal powder or nano metal powder used for providing the
In the present invention, as shown in FIG. 7, one or two or more polymeric materials selected from the group consisting of epoxy molding compound (EMC), PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, It is possible to construct the flexible
As described above, an optimal embodiment has been disclosed in the drawings and specification. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.
11. Flexible substrate
12. Electronic components
13. Circuit Wiring
21. Stiffness local conversion flexible substrate
22. Base substrate
23. Stiffness Local Transformation Unit
231. Intermediate stiffness polymer section
232. High Stiffness Polymer Part
31. An etching part for forming a stiffness local conversion part
41. Stiffness Local Conversion Stretch Package
51. Encapsulation
81. Encapsulation with stiffness local conversion section
Claims (28)
(b) locally etching the base substrate to form an etching portion for forming a stiffness local conversion portion;
(c) filling the etching portion for forming the stiffness local conversion portion with a polymer having a stiffness relatively higher than that of the polymer on which the base substrate is formed, and providing a stiffness local conversion portion;
Wherein the stiffness local conversion / stretchable substrate is made of a metal.
Wherein the stiffness local conversion unit comprises:
Wherein the base substrate has a relatively smaller area than the base substrate.
The method of manufacturing the stiffness local conversion /
(d) locally etching the stiffness local transducer to provide an additional stiffness local transducer forming etch portion;
(e) filling the etching portion for forming the additional stiffness local conversion portion with a polymer having a stiffness relatively higher than that of the polymer having a high stiffness to provide a stiffness local conversion portion;
Further comprising the steps of: forming a rigid-local-conversion-and-stretchable substrate;
Wherein the step (d) and the step (e) are repeatedly performed so that the stiffness local conversion part sequentially incorporates a relatively high-stiffness polymer part in the polymer part having a relatively low stiffness.
Wherein the base board and the stiffness local conversion unit
Wherein the flexible substrate is made of at least one polymer selected from the group consisting of PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone and Teflon.
Wherein the base board and the stiffness local conversion unit
The content of the curing agent mixed in at least one polymer matrix selected from the group consisting of PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, Wherein the stiffness local conversion and stretchability of the substrate is controlled by adjusting the stiffness of the substrate.
Wherein the stiffness local conversion unit comprises:
Wherein the flexible substrate has at least one selected from the group consisting of PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone and Teflon.
Wherein the surface of the stiffness local conversion portion and the surface of the base substrate are the same height.
Wherein the surface of the stiffness local conversion portion has a height higher than that of the surface of the base substrate.
Wherein the surface of the stiffness local conversion portion is lower in height than the surface of the base substrate.
(b) locally etching the base substrate to form an etching portion for forming a stiffness local conversion portion;
(c) fabricating the stiffness local conversion / stretch substrate by filling the etching portion for forming the stiffness local conversion portion with a polymer having a stiffness higher than that of the polymer having the base substrate formed thereon, and providing a stiffness local conversion portion;
(d) forming a circuit wiring on the stiffness local conversion flexible substrate;
(e) mounting the electronic component on the stiffness local conversion flexible substrate;
Wherein the flexible electronic device package comprises:
The circuit wiring includes:
(Au), copper (Cu), tin (Sn), silver (Ag), aluminum (Al), nickel (Ni), platinum (Pt), iron (Fe), chromium (Cr) Tantalum (Ta), tungsten (W), and is composed of a single layer or multiple layers.
The circuit wiring includes:
A method for manufacturing a flexible electronic device package, the method comprising: providing at least one selected from the group consisting of a carbon nanotube, a metal powder, a nano metal powder, a graphene, and a conductive ceramic powder in a polymer.
The circuit wiring includes:
Wherein at least one member selected from the group consisting of a carbon nanotube, a metal powder, a nano metal powder, a graphene, and a conductive ceramic powder is used to form a circuit wiring and impregnated with a polymer to impart stretchability thereto.
The metal powder or nano-
(Au), copper (Cu), tin (Sn), silver (Ag), aluminum (Al), nickel (Ni), platinum (Pt), iron (Fe), chromium (Cr) Tantalum (Ta), tungsten (W), and the like.
The circuit wiring includes:
(Au), copper (Cu), tin (Sn), silver (Ag), aluminum (Al), nickel (Ni), platinum (Pt), iron (Fe), chromium (Cr) Tantalum (Ta), and tungsten (W) on a single-layer or multi-layer metal thin film made of at least one metal selected from the group consisting of tantalum (Ta)
Wherein at least one selected from the group consisting of a carbon nanotube, a metal powder, a nano metal powder, a graphene, and a conductive ceramic powder is contained so as to provide conductivity.
The circuit wiring includes:
(Au), copper (Cu), tin (Sn), silver (Ag), aluminum (Al), nickel (Ni), platinum (Pt), iron (Fe), chromium (Cr) Tantalum (Ta), and tungsten (W) on a single-layer or multi-layer metal thin film made of at least one metal selected from the group consisting of tantalum (Ta)
Wherein at least one member selected from the group consisting of a carbon nanotube, a metal powder, a nano metal powder, a graphene, and a conductive ceramic powder is used to form a circuit wiring and impregnated with a polymer to impart stretchability thereto.
The circuit wiring includes:
Wherein the flexible electronic device package has a straight shape or a wavy pattern.
A method of manufacturing the flexible electronic device package,
Forming a circuit wiring on the stiffness local conversion / stretch substrate and mounting an electronic component thereon, and then forming encapsulation having a size equal to or smaller than the size of the stiffness local conversion unit thereon .
Wherein the encapsulation comprises:
A flexible electronic component package comprising at least one selected from the group consisting of an epoxy molding compound (EMC), PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, Way.
A method of manufacturing the flexible electronic device package,
Forming a circuit wiring on the stiffness local conversion / stretch substrate, mounting an electronic component thereon, and then forming encapsulation having a size equal to or smaller than that of the base substrate.
Wherein the encapsulation comprises:
A flexible electronic component package comprising at least one selected from the group consisting of an epoxy molding compound (EMC), PDMS, polyurethane, polyimide, FR4, epoxy, phenol, polyester, polycarbonate, polyarylate, polyether sulfone, Way.
A method of manufacturing the flexible electronic device package,
Forming a circuit wiring on the stiffness local conversion / stretch substrate, mounting an electronic component thereon, and then forming an encapsulation with the stiffness local conversion portion thereon.
A stiffness local conversion unit formed locally in a part of the base substrate;
And,
Wherein the stiffness local conversion unit comprises a polymer having a stiffness relatively higher than that of the polymer forming the base substrate.
Wherein the stiffness local conversion unit comprises:
Wherein the base substrate has a relatively smaller area than the base substrate.
Wherein the stiffness local conversion /
An additional stiffness local conversion unit formed locally in a part of the stiffness local conversion unit;
Further comprising:
Wherein the additional stiffness local conversion unit comprises a polymer having a stiffness relatively higher than that of the stiffness local conversion unit.
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| KR1020150006419A KR101680443B1 (en) | 2015-01-13 | 2015-01-13 | Stretchable substrates with locally varied stiffness and stretchable electronics packages produced using the same substrates and Producing Method Thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101436243B1 (en) | 2013-03-15 | 2014-08-29 | 홍익대학교 산학협력단 | Stretchable substrate with intercalating bumps, manufacturing method of the same substrate, stretchable electronics package produced using the substrate and manufacturing method of the same package |
| KR101450441B1 (en) | 2013-04-04 | 2014-10-13 | 홍익대학교 산학협력단 | Stretchable substrate with intercalating bumps and a substrate-delamination layer, manufacturing method of the same substrate, stretchable electronics package produced using the substrate and manufacturing method of the same package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101436243B1 (en) | 2013-03-15 | 2014-08-29 | 홍익대학교 산학협력단 | Stretchable substrate with intercalating bumps, manufacturing method of the same substrate, stretchable electronics package produced using the substrate and manufacturing method of the same package |
| KR101450441B1 (en) | 2013-04-04 | 2014-10-13 | 홍익대학교 산학협력단 | Stretchable substrate with intercalating bumps and a substrate-delamination layer, manufacturing method of the same substrate, stretchable electronics package produced using the substrate and manufacturing method of the same package |
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