KR101679018B1 - Readout integrated circuit comprising testing circuit of vacumm status and resistance deviation and test apparatus comprising thereof - Google Patents
Readout integrated circuit comprising testing circuit of vacumm status and resistance deviation and test apparatus comprising thereof Download PDFInfo
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- KR101679018B1 KR101679018B1 KR1020150114797A KR20150114797A KR101679018B1 KR 101679018 B1 KR101679018 B1 KR 101679018B1 KR 1020150114797 A KR1020150114797 A KR 1020150114797A KR 20150114797 A KR20150114797 A KR 20150114797A KR 101679018 B1 KR101679018 B1 KR 101679018B1
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- resistance value
- vacuum state
- bolometer sensor
- dummy cells
- cells
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- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 claims description 12
- 238000005070 sampling Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0023—Measuring currents or voltages from sources with high internal resistance by means of measuring circuits with high input impedance, e.g. OP-amplifiers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0207—Bolometers
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
A readout integrated circuit having a test circuit according to an embodiment of the present invention is a readout integrated circuit for reading out a resistance value deviation between active cells included in a vacuum state and a bolometer sensor inside a bolometer sensor, And a switch module for sequentially switching dummy cells and outputting a resistance value varying by a bias power source as a voltage, wherein a change in a resistance value of the dummy cells includes a resistance value deviation between the active cells and a vacuum state inside the bolometer sensor Lt; / RTI >
Description
The present application relates to a device for testing the vacuum state inside a bolometer sensor and the resistance variation between active cells.
In general, the infrared sensor module is composed of a micro-bolometer and a read out integrated circuit (ROIC). When the infrared energy enters the bolometer, the resistance of the bolometer changes and the changed resistance value is converted into an electrical signal To detect infrared rays.
The above-described infrared sensor module monolithically fabricates a bolometer using MEMS technology on a readout integrated circuit. To detect infrared radiation, a bolometer sensor integrated with a readout integrated circuit must be packaged in a vacuum state. The above-mentioned bolometer consists of active cells responsive to infrared rays and dummy cells for reducing resistance variation.
In particular, it is ideal that the aforementioned active cells are fabricated with the same resistance value. However, due to the nature of the manufacturing process, it is difficult to manufacture with the same resistance value, so there is a resistance value deviation between the active cells. It is very important to test the deviation of the resistance of the bolometer to accurately analyze the response of the infrared signal output through the infrared reading integrated circuit.
In order to accurately detect an infrared signal, it is necessary to test whether the vacuum state inside the bolometer sensor is good because the inside of the bolometer sensor including the active cells is required to maintain a constant vacuum state.
Related technology is disclosed, for example, in Korean Patent Laid-Open Publication No. 2009-0030768 (" IR signal detection circuit and detection method using a bolometer ", published on March 25, 2009).
According to one embodiment of the present invention, there is provided a readout integrated circuit having a test circuit capable of testing a resistance value deviation between active cells and a vacuum state inside a bolometer sensor at a wafer level, and a test apparatus including the readout integrated circuit.
According to one embodiment of the present invention, in a readout integrated circuit for reading a vacuum state inside a bolometer sensor and a resistance value deviation between active cells included in the bolometer sensor, when the bias power is applied, the dummy cells are sequentially And a switch module for outputting a resistance value varying by the bias power source as a voltage, wherein a change in a resistance value of the dummy cells includes at least a resistance value deviation between the active cells and a vacuum state inside the bolometer sensor A readout integrated circuit used to determine one is provided.
According to another aspect of the present invention, there is provided a test apparatus for reading a vacuum state inside a bolometer sensor and a resistance value deviation between active cells included in the bolometer sensor, comprising: a bias power source; A switch module for sequentially switching the dummy cells when the bias power is applied and outputting a variable resistance variable by the bias power source; And a determination module for determining at least one of a resistance value deviation between the active cells and a vacuum state inside the bolometer sensor based on a change in resistance value of the dummy cells.
According to the embodiment of the present invention, by using the change in the resistance value of the dummy cells variable by the bias power source, the resistance value deviation between the active cells and the vacuum state inside the bolometer sensor can be tested at the wafer level.
In addition, according to an embodiment of the present invention, by using the resistance value change of a plurality of dummy cells, even when some dummy cells are damaged, the resistance value deviation of the active cell can be estimated using the remaining dummy cells, The internal vacuum can be tested.
1 is a configuration diagram of a readout integrated circuit having a test circuit according to an embodiment of the present invention and a test apparatus including the readout integrated circuit.
2 is a diagram illustrating a bolometer sensor including dummy cells according to an embodiment of the present invention.
3 to 4 are diagrams showing switching timing charts according to an embodiment of the present invention.
5 is a diagram illustrating a resistance value deviation of dummy cells according to an embodiment of the present invention.
FIG. 6 is a diagram for explaining a method for determining a vacuum state inside the bolometer sensor based on a resistance value change amount of one dummy cell.
FIG. 7 is a diagram showing a resistance value change amount according to a vacuum state according to an embodiment of the present invention. FIG.
8 is a view showing a thermal conductivity according to a vacuum state according to an embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The shape and the size of the elements in the drawings may be exaggerated for clarity and the same elements are denoted by the same reference numerals in the drawings.
1 is a configuration diagram of a readout integrated circuit having a test circuit according to an embodiment of the present invention and a test apparatus including the readout integrated circuit. FIG. 2 is a view showing a bolometer sensor including dummy cells according to an embodiment of the present invention.
1, a
First, a read out integrated circuit (ROIC) 120 is a detection circuit that converts the resistance values of a plurality of active cells and dummy cells that change with temperature to an electrical signal. Since the specific configuration of the above-described readout integrated circuit is generally known, a detailed description of a general readout integrated circuit is omitted for simplification of the invention.
On the other hand, the read integrated
Meanwhile, a plurality of
One end of each of the
FIG. 2 is a diagram illustrating a
2 (a), the
Referring again to FIG. 1, the
That is, as shown in Figs. 1 and 3, each of the switches Q1 to Q40 of the
On the other hand, FIG. 4 shows the operation by the
As shown in FIG. 4, the
Referring again to FIG. 1, the
The
Lastly, the
The above-described
Hereinafter, a method of determining a resistance value deviation between active cells and a vacuum state inside a bolometer sensor according to an embodiment of the present invention will be described with reference to FIGS. 5 to 7. FIG.
5 is a diagram showing a resistance value deviation of dummy cells according to an embodiment of the present invention.
5, when the bias power source Vbias is applied, the resistance value of each of the dummy cells R1 to R40 tends to decrease with time, and the
The reason why the resistance value deviations DELTA R1 to DELTA R40 of the
On the other hand, the inside of the
Referring to FIG. 6, the first dummy cell R1 is referred to as a reference. When the bias power source Vbias is applied, the resistance value of the first dummy cell R1 varies with time It can be judged that the vacuum state of the readout integrated
That is, when the bias power is applied, the resistance value of the first dummy cell Rl can be changed according to the following equation (1).
[Equation 1]
Where R is the resistance of the first dummy cell R1 measured at a certain point in time,? Is the temperature coefficient of resistance (TCR), V is the bias voltage, R0 is the initial resistance of the first dummy cell R1 Value, G is the thermal conductivity, τ EFF is the effective thermal time constant, and t is the time.
More specifically, the
7 shows the relationship between the resistance value change amount and the internal pressure of the bolometer sensor. The X-axis in FIG. 7 is closer to the atmospheric pressure as the pressure P inside the bolometer sensor goes to the right. State is high, and the Y-axis is the resistance value change amount.
As shown in FIG. 7, the vacuum state inside the bolometer sensor and the resistance value change amount are in inverse proportion, and when the resistance value change amount is equal to or larger than a predetermined value, it can be judged that the vacuum state is good.
8 is a diagram showing a vacuum state and a thermal conductivity in the bolometer sensor according to an embodiment of the present invention. The X-axis approaches the atmospheric pressure toward the right as the pressure P inside the bolometer sensor, The vacuum state is high, and the Y-axis is the thermal conductivity.
The thermal conductivity is affected by the air and solid inside the bolometer sensor (see 200 in FIG. 2). When the inside of the bolometer sensor (see 200 in FIG. 2) is in a vacuum state, if the air is sparse inside the
Therefore, according to another embodiment of the present invention, the
&Quot; (2) "
Where R is the resistance value of the dummy cell measured at a certain point in time, and τ EFF is the resistance of the dummy cell measured at an arbitrary point in time. Here, G is the thermal conductivity, α is the temperature coefficient of the TCR, V is the bias voltage, Effective thermal time constant, t is time. The initial resistance value R0 and the temperature coefficient? Are values determined when the bolometer sensor is manufactured, the resistance value R is a value measured at a certain point in time, and? EFF is a constant.
More specifically, the
However, the above-described predetermined thermal conductivity (G) of 10 - Considering that 7 very small extent, if they meet the following conditions even when the thermal conductivity (G) obtained from the equation (2) is greater than in the predetermined thermal conductivity It can be determined that the vacuum state inside the
That is, when the thermal conductivity G determined by the formula (2) exceeds the predetermined thermal conductivity, the
As described above, according to the embodiment of the present invention, by using the change in the resistance value of the dummy cells variable by the bias power source, it is possible to judge the resistance value deviation between the active cells at the wafer level and the vacuum state inside the bolometer sensor .
In addition, according to an embodiment of the present invention, by using the resistance value change of a plurality of dummy cells, even when some dummy cells are damaged, the resistance value deviation of the active cell can be estimated using the remaining dummy cells, It is possible to judge the internal vacuum state.
The present invention is not limited to the above-described embodiments and the accompanying drawings. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be self-evident.
100: Test device 110: Reference resistance having a fixed value
120: reading integrated circuit (test circuit) 121: dummy cell
122: Switch module 123: Switching control module
124: Voltage follower 125: Sample holder
126: Multiplexer 127: Analog-to-digital converter
130: Judgment module 140: Frame memory
Vbias: bias power
Claims (14)
And a switch module for sequentially switching the dummy cells and outputting a voltage having a variable value by the bias power source when the bias power is applied,
Wherein the change in the resistance value of the dummy cells is used to determine at least one of a resistance value deviation between the active cells and a vacuum state inside the bolometer sensor,
When the thermal conductivity obtained based on the resistance value change of the dummy cells is less than a preset value, it is determined that the vacuum state inside the bolometer sensor is good,
The thermal conductivity is expressed by the following Equation 1:
R is the resistance value of the dummy cell measured at an arbitrary point in time, and τ is the resistance of the dummy cell measured at a certain point in time. EFF is the effective thermal time constant, and t is the time.
The resistance value deviation between the dummy cells
And a resistance value deviation between the active cells.
When the amount of change in the resistance value of the dummy cells is equal to or greater than a predetermined value,
The vacuum state of the bolometer sensor is judged to be good.
Even when the thermal conductivity obtained based on the change in the resistance value of the dummy cells exceeds a preset value,
Wherein the vacuum state inside the bolometer sensor is judged to be good when N times the predetermined value (where N is a positive number of 9 or less).
The readout integrated circuit includes:
A voltage follower receiving a voltage output from the switch module;
A sample holder for sampling the output of the voltage follower;
An analog-to-digital converter for converting the output of the sample holder into a digital value; And
And a frame memory for storing an output of the analog-to-digital converter.
Bias power;
A switch module for sequentially switching dummy cells and outputting a variable resistance variable by the bias power source when the bias power is applied; And
And a determination module for determining at least one of a resistance value deviation between the active cells and a vacuum state inside the bolometer sensor based on a resistance value change of the dummy cells,
Wherein the determination module determines that the vacuum state inside the bolometer sensor is good when the thermal conductivity obtained based on the resistance value change of the dummy cells is less than a preset value,
The thermal conductivity is expressed by the following Equation 1:
R is the resistance value of the dummy cell measured at an arbitrary point in time, and τ is the resistance of the dummy cell measured at a certain point in time. EFF is the effective thermal time constant, and t is the time.
Wherein the determination module comprises:
And a resistance value deviation between the dummy cells is estimated as a resistance value deviation between the active cells.
Wherein the determination module comprises:
And determines that the vacuum state inside the bolometer sensor is good when the change amount of the resistance value of the dummy cells is equal to or greater than a preset value.
Wherein the determination module comprises:
Even if the thermal conductivity obtained based on the change in the resistance value of the dummy cells exceeds a predetermined value, if the vacuum state inside the bolometer sensor is N times (N is positive or negative) A test device that is judged to be good.
The test apparatus includes:
A voltage follower receiving a voltage output from the switch module;
A sample holder for sampling the output of the voltage follower;
An analog-to-digital converter for converting the output of the sample holder into a digital value; And
And a frame memory for storing an output of the analog-to-digital converter.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108267688A (en) * | 2018-01-15 | 2018-07-10 | 温州大学苍南研究院 | A kind of new method for measuring miniature circuit breaker thermal time constant |
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JP2003240740A (en) * | 2002-02-18 | 2003-08-27 | Matsushita Electric Ind Co Ltd | Electron device, system, and method for judging degree of vacuum |
JP2008268155A (en) | 2007-04-25 | 2008-11-06 | Mitsubishi Electric Corp | Thermal type infrared solid-state imaging element |
KR101383918B1 (en) | 2013-03-14 | 2014-04-08 | 한국과학기술원 | Microbolometer type wide range vaccum sensor and ir sensor including the same |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003240740A (en) * | 2002-02-18 | 2003-08-27 | Matsushita Electric Ind Co Ltd | Electron device, system, and method for judging degree of vacuum |
JP2008268155A (en) | 2007-04-25 | 2008-11-06 | Mitsubishi Electric Corp | Thermal type infrared solid-state imaging element |
KR101383918B1 (en) | 2013-03-14 | 2014-04-08 | 한국과학기술원 | Microbolometer type wide range vaccum sensor and ir sensor including the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108267688A (en) * | 2018-01-15 | 2018-07-10 | 温州大学苍南研究院 | A kind of new method for measuring miniature circuit breaker thermal time constant |
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