KR101676006B1 - molding device - Google Patents

Abstract

The present invention relates to a molding apparatus for packaging an electronic circuit or a semiconductor element mounted on a substrate using a liquid molding material.
According to an embodiment of the present invention, there is provided a molding apparatus for performing molding in a light emitting semiconductor element, the molding apparatus comprising: a cylinder defining a chamber into which a molding material flows; A cylinder rod for pressurizing a molding material in the chamber to supply a molding material to the light emitting semiconductor element; A piston seal configured to prevent the molding material from flowing into the cylinder from the chamber, the piston seal being made of an elastic material; And a sealing pressurizing portion that is provided to increase the adhesion between the piston seal and the inner wall of the cylinder as the engaging force of the piston rod increases.

Description

Molding device

The present invention relates to a molding apparatus for packaging an electronic circuit or a semiconductor element mounted on a substrate using a liquid molding material.

A specific electronic circuit is mounted on the circuit board, and the electronic circuit is packaged using a packaging material supplied to the electronic circuit. Recently, an LED lighting device employing an LED element as a light source has been introduced. An LED (light emitting diode) device can generate a small number of injected carriers (electrons or holes) using a p-n junction structure of a semiconductor and emit light by recombination thereof. The light emitting diode is smaller in size than the conventional light source (light source), has a long life span, and the electric energy is directly converted into light energy, so the electric power is low and the efficiency is good. In the case of an LED lighting device employing the LED element as a light source, the LED element is mounted on the substrate and the LED element is packaged. That is, the LED element becomes an electronic circuit to be packaged.

However, unlike a general semiconductor device, an LED device is used as a light source, so it is difficult to use an opaque material as a packaging material. Therefore, a transparent packaging material of a light-transmitting material is used. Such a packaging material may typically be a molding material of silicon material.

Since the raw material of the silicon material is in a liquid state, a conventional transfer molding apparatus can not be used. Therefore, a molding apparatus for supplying a molding material in a liquid state through a cylinder is used. In addition, a molding apparatus for supplying a molding material through a cylinder is used in order to accurately supply the amount of molding material required for molding.

Inside the cylinder, a reciprocating cylinder rod is provided. As the cylinder rod moves, the molding material flows into the cylinder and flows out again. At this time, a sealing ring is provided on the outer circumferential surface of the cylinder rod, and the molding material is prevented from flowing out from the cylinder into the cylinder rod through the sealing. That is, the molding material is prevented from flowing through the gap between the cylinder and the cylinder rod.

The sealing is formed in a circular or square shape in cross section and mounted on the outer circumferential surface of the cylinder rod. Therefore, the adhesion between the inner wall of the cylinder and the seal is determined by the shape, material, and size of the seal, and the adhesion is deteriorated over time. Further, there is a problem that it is impossible to increase the adhesion again after the sealing is mounted. In addition, when a large amount of molding material is supplied, the movement distance of the cylinder rod is relatively large as compared with the case where a small amount of molding material is supplied.

On the other hand, a molding material for packaging an LED element may be mixed with an additive of a glass component to the base material such as silicon in order to impart the directionality of the light source. That is, the additive for imparting the directionality of the light source by reflecting the light to the transparent base material may be mixed. Such a molding material may be used not only for the upper molding portion covering the upper portion of the LED element but also for the lower molding portion for supporting the lower portion of the LED element.

The lower molding part may perform a function of emitting heat generated from the LED element or a reflector functioning to reflect the light source of the LED element to the upper part.

Such additives can easily damage the seal and reduce the durability of the molding apparatus, which results in inefficiencies in the work process. Particularly, when the additive for the glass component is used, since the hardness is very high, the inner wall of the cylinder and the outer circumferential surface of the cylinder rod are worn, the durability of the molding apparatus may be considerably deteriorated, .

Further, not only the durability degradation of the molding apparatus but also the molding defects can be remarkably increased. This is because the fragments of the cylinder and the cylinder rod due to abrasion can be mixed with the molding material and supplied to the LED element.

Accordingly, there is a great need to provide a molding apparatus for supplying a liquid molding material which can significantly reduce durability and molding defects.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the problems of the conventional molding apparatus.

According to the embodiment of the present invention, the cross-sectional area of the sealing ring can be varied to significantly reduce the distance by which the sealing ring can be elastically deformed radially inward, thereby preventing the molding material from flowing through the outer circumferential surface of the sealing ring.

According to the embodiment of the present invention, it is intended to improve the adhesion between the sealing ring and the inner wall of the cylinder according to the pressing force for pressing the sealing ring.

According to the embodiment of the present invention, it is possible to easily increase the sealing force by increasing the pressing force, thereby improving the durability of the apparatus and significantly reducing the maintenance cost of the apparatus.

According to the embodiment of the present invention, it is intended to significantly reduce the defective rate of the molding process.

According to an embodiment of the present invention, there is provided a molding apparatus for performing molding in a light emitting semiconductor element, comprising: a cylinder having a chamber through which a molding material flows; A cylinder rod for pressing the molding material in the chamber to discharge the molding material; A piston seal adapted to prevent a molding material from entering the chamber through a gap between the cylinder and the cylinder rod; And a sealing pressurizing portion provided to press the piston seal to deform the piston seal.

According to an embodiment of the present invention, there is provided a molding apparatus for performing molding in a light emitting semiconductor element, comprising: a cylinder defining a chamber into which a molding material flows; A cylinder rod for pressurizing a molding material in the chamber to supply a molding material to the light emitting semiconductor element; A piston seal configured to prevent the molding material from flowing into the cylinder from the chamber, the piston seal being made of an elastic material; And a sealing pressurizing portion that is provided to increase the adhesion between the piston seal and the inner wall of the cylinder as the engaging force of the piston rod increases.

It is preferable that an area of contact between the piston seal and the inner wall of the cylinder is increased as the pressing force of the sealing pressurizing portion is increased.

The sealing pressurizing portion may be formed with a downward sloped surface so as to have a smaller radius in the radial direction, and an upward sloped surface may be formed in the piston seal such that the radius corresponds to the downward sloped surface and the radius is increased radially outward.

The downwardly inclined surface and the upwardly inclined surface may be configured to be closely contacted with each other before or after the elastic deformation of the piston seal. It is possible to remarkably reduce the thickness or the width of the piston seal near the chamber due to the shape characteristics of the downward inclined face and the upward inclined face. This makes it possible to effectively prevent the molding material from leaking on the piston seal.

The sealing pressurizing portion may be provided with a sealing pressurizing critical surface provided radially inward of the downwardly sloping surface so that the sealing pressurizing portion is in close contact with the piston seal at a first threshold value of a force to be coupled to the cylinder rod. The piston seal may be provided with a piston sealing critical surface corresponding to a critical surface of the sealing pressing portion. As a result, the relationship between the pressing force through the sealing pressurizing portion and the sealing force of the piston seal can be easily predicted. Then, the later maintenance time can be easily predicted, and the maintenance can be made very easy.

A groove may be formed in the piston seal between the upward sloping surface and the piston sealing critical surface to facilitate elastic deformation of the upward sloping surface radially outward.

Wherein the sealing pressurizing portion includes: a sealing lid provided to cover the piston seal; And a coupling member for coupling the sealing lid to the cylinder rod. And the engaging member may be a bolt.

The molding apparatus may include a rod stopper for adjusting the amount of the molding material flowing into the chamber by limiting a separation distance of the loader of the cylinder.

According to an aspect of the present invention, there is provided a molding apparatus for molding a light emitting semiconductor device, the molding apparatus comprising: a cylinder having a chamber through which a molding material flows; A cylinder rod for pressurizing the molding material in the chamber to supply the molding material; A piston seal adapted to prevent the molding material from entering the chamber through a gap between the cylinder and the cylinder rod; A sealing lid provided to cover at least a part of the piston seal and configured to press and elastically deform the piston seal; And a coupling member coupled to the cylinder lid so as to increase the adhesion between the piston seal and the inner wall of the cylinder as the coupling force of the cylinder lid increases. .

The sealing lid is formed with a downward sloped surface so as to narrow its radius radially inward, and the piston seal may be provided with an upward sloped surface corresponding to the downward sloped surface and having a radially outward radial width.

The downwardly inclined surface and the upwardly inclined surface may be configured to be closely contacted with each other before or after the elastic deformation of the piston seal.

The sealing lid may be provided with a sealing lid critical surface provided radially inward of the downward sloping surface so that the sealing lid is in close contact with the piston seal at a first threshold value of a force pressing the piston seal.

The piston seal may be provided with a piston sealing critical surface corresponding to the sealing lid critical surface.

A groove may be formed in the piston seal between the upward sloping surface and the piston sealing critical surface to facilitate elastic deformation of the upward sloping surface radially outward.

The sealing lid critical surface and the piston sealing critical surface may be vertical surfaces with respect to the direction of movement of the cylinder rod.

The molding apparatus may include a rod stopper provided outside the cylinder and controlling the amount of the molding material flowing into the chamber by limiting a separation distance of the loader of the cylinder.

The present invention can basically solve the problems of the above-described conventional molding apparatus.

According to the embodiment of the present invention, the cross-sectional area of the sealing ring can be varied to significantly reduce the separation distance at which the sealing ring can be elastically deformed radially inwardly, thereby effectively preventing the molding material from flowing through the outer peripheral surface of the sealing ring.

According to the embodiment of the present invention, the adhesion between the sealing ring and the inner wall of the cylinder can be effectively enhanced according to the pressing force for pressing the sealing ring.

According to the embodiment of the present invention, it is possible to easily increase the pressing force on the sealing, thereby significantly increasing the replacement period of the sealing, thereby improving the durability of the device and significantly reducing the maintenance cost of the device.

According to the embodiment of the present invention, the defective rate of the molding process can be remarkably reduced.

According to the embodiment of the present invention, the liquid molding material can be supplied in a large quantity and can be supplied in a fixed amount. This is because leakage of the molding material through the piston seal is effectively prevented, so that the liquid molding material supplied to the chamber inside the cylinder can be supplied. In addition, since the wear of the piston seal can be significantly reduced, the liquid molding material can be supplied in a large volume by increasing the volume of the chamber.

1 is a sectional view of a molding apparatus according to a preferred embodiment of the present invention;
FIG. 2A is a partial cross-sectional view showing the initial pressure of the piston seal shown in FIG. 1; FIG.
FIG. 2B is a partial cross-sectional view showing the state after pressurization of the piston seal shown in FIG. 1; FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The cylinder, cylinder rod, and some other configurations described may be the same or similar to conventional molding devices. However, the features and effects of the present embodiment, which will be described in detail, and the effects caused thereby can be significantly improved.

As shown in FIG. 1, the molding apparatus 10 according to the present embodiment may be an apparatus for supplying a molding material. Accordingly, the molding apparatus 10 can be referred to as a molding material supply apparatus, and it is possible to construct a molding apparatus including other apparatuses such as a device for supplying a molding material and a substrate transfer apparatus for molding.

Specifically, the molding apparatus 10 according to the present embodiment can be used as a part of a compression molding apparatus and a transfer molding apparatus. That is, it can be used irrespective of the type of molding apparatus.

That is, the present invention relates to a molding material supply apparatus for supplying a molding material to a light emitting semiconductor element seated on a metal mold in a compression molding apparatus or supplying a molding material to a port in a transfer molding apparatus, The present invention can be applied variously regardless of the type of the apparatus and the molding method.

Since the compression molding apparatus or the transfer molding apparatus is a well-known molding apparatus and method, a detailed description thereof will be omitted.

The molding apparatus 10 may include a cylindrical cylinder 100. And a cylinder union 200 covering an upper portion of the cylinder 100. A cylinder rod 300 reciprocating within the cylinder 100 may be provided.

The inside of the cylinder (100) is provided with a chamber (20) through which a molding material flows and is poured out. The chamber 20 is provided at one side of the cylinder rod 300, and the volume of the chamber 20 varies according to the reciprocating motion of the cylinder rod 300.

As shown in FIG. 1, when the cylinder rod 300 is relaxed to the maximum, for example, when the cylinder rod 300 moves to the maximum, its volume becomes maximum. When the cylinder rod 300 is compressed to the maximum, for example, when moving to the uppermost position, the volume is minimized. Therefore, when the cylinder rod 300 is loosened, the molding material flows into the chamber 20, and the molding material in the chamber 20 flows out and is supplied to the semiconductor devices.

The cylinder union 200 may communicate with the chamber 20 and may be provided with a molding material from the outside and supply the molding material to the outside. An inlet 210 may be formed at one side, and an outlet 220 may be formed at the other side. An on / off valve 211 is provided in the vicinity of the inlet 210 to determine a time when the molding material is supplied to the inlet 210 and a time when the molding material is supplied. An on / off valve 221 is provided in the vicinity of the outlet 220 to determine a time point at which the molding material flows out from the outlet 220 and a time point at which the outlet is completed. The cylinder union 200 is provided with a communication hole 230 communicating with the chamber 20 and the communication hole 230 communicates with the inlet 210 and the outlet 220.

When the cylinder rod 230 is loosened, the on / off valve 211 is opened and the chamber 20 is opened through the inlet 210 and the communication hole 230 in a state where the on / off valve 221 is closed. ). ≪ / RTI > When the cylinder rod 230 is compressed, the on / off valve 211 is closed while the on / off valve 221 is opened and the chamber 20 is closed through the communication port 230 and the outflow port 220, The molding material may be supplied to the semiconductor element through the nozzle 240.

Here, the reciprocating distance of the cylinder rod 300 is related to the volume of the chamber 20. The volume of the chamber 20 is also related to the amount of the molding material. Therefore, in order to determine the amount of the molding material supplied to the semiconductor device, the reciprocating distance of the cylinder rod 300 should be determined. For this purpose, a rod stopper 400 is preferably provided for limiting or determining the reciprocating distance of the cylinder rod 300, that is, the maximum moving range.

Specifically, the cylinder rod 300 may include a pressing portion 310 and a rod shaft 320 integrally formed with the pressing portion 310. The rod shaft 320 may be provided through the cylinder 100. Therefore, it is possible to limit the moving distance of the pressing portion 310 by limiting the moving distance of the rod shaft 320. [

In order to limit the movement distance, the rod stopper 400 may be provided to limit the movement distance of the rod shaft 320. [ For example, the rod stopper 400 may be provided outside the cylinder 100, and a maximum separation distance between the rod stopper 400 and the rod shaft 320 may be adjusted through adjustment of the user.

That is, the stopper 400 may be provided to adjust the distance between the stopper 400 and the rod shaft 320. When the cylinder rod 300 is retracted, the rod shaft 320 is also retracted. The distance that the cylinder rod 300 can be retracted can be varied by varying the distance that the rod shaft 320 can be retracted. This retractable distance causes the volume of the chamber to vary. As a result, it is possible to adjust the amount of the molding material flowing into the chamber by adjusting the distance between the stopper 400 and the rod shaft 320. That is, by adjusting the position of the stopper 400, the retraction distance of the rod shaft 32 can be varied to adjust the amount of the molding material flowing into the chamber.

Although not shown, adjustment of the rod stopper 400 may be possible through driving means such as a motor or the like, and adjustment of the rod stopper 400 may be possible by manually turning it into a screw shape. That is, the volume of the chamber can be varied by advancing or retracting the stopper.

Meanwhile, by controlling the reciprocating distance of the cylinder rod 300 using a motor, the amount of the molding material flowing into the chamber can be adjusted without using the stopper 400.

The driving means for reciprocating the cylinder rod 300 may be various engines, and may be a motor, a pneumatic or hydraulic device. Fig. 1 shows a pneumatic pressure as an example of the driving means. That is, when air flows into the cylinder from the outside, the cylinder rod 300 is compressed due to the air pressure, and then the cylinder rod 300 is relaxed when the air pressure is released. Of course, the cylinder rod 300 may be relaxed by the injection pressure of the molding material supplied into the chamber 20. That is, when the molding material is injected into the chamber 20, it is preferable that the air pressure in the cylinder 10 is eliminated.

 Here, the space through which the air pressure flows may be referred to as an air chamber 30. The cross-sectional area of the air chamber 30 is preferably higher than the cross-sectional area of the chamber 20. This is because the force for moving the cylinder rod 300 is proportional to the pressure and the cross-sectional area. Therefore, even if the pressure difference between the air chamber 30 and the chamber 20 is small, the molding material in the chamber 20 can be pressurized and discharged through a larger force due to the difference in sectional area.

The reciprocating movement of the cylinder rod 300 may be realized by driving the motor in addition to the hydraulic pressure or the air pressure. In other words, the rotational force of the motor may be transmitted to the cylinder rod 300 through a driving force transmitting means such as a ball screw, a crankshaft or a cam. Therefore, the driving method of the cylinder rod 300 in the present embodiment can be variously modified.

In order to perform the inflow and outflow mechanism of the molding material, it is preferable that the chamber 20 and the air chamber 30 are partitioned from each other through the cylinder rod 300, particularly, the pressing portion 310. This prevents the molding material and air from entering the other chamber. Further, it is preferable that an air seal 330 is provided on the outer circumference of the pressing portion 310. It is possible to generate a sufficient pressing force without leakage of the air pressure through the air sealing 300. Further, the sealing between the chambers 20 and 30 can be further maintained through the piston seal 500 described later.

Hereinafter, the structure of the piston seal 500 and its mounting structure will be described in detail with reference to FIGS. 1, 2A, and 2B.

The piston seal 500 is a structure for preventing the molding material, which is pressed in the chamber 20, from entering or leaking into the cylinder rod 300. The piston seal 500 is provided between the outer periphery of the cylinder rod 300 and the inner wall of the cylinder 100 in consideration of the shapes of the cylinder 100 and the cylinder rod 300. [ Accordingly, the piston seal 500 prevents the molding material from leaking through the space between the inner wall of the cylinder 100 and the cylinder rod 300.

The piston seal 500 is a means for sealing and moving integrally with the cylinder rod 300. Accordingly, the piston seal 500 is preferably formed of an elastic material, and may be formed of a silicon material, a natural rubber, or a synthetic rubber material.

In addition, since the piston seal 500 is advanced and retracted while maintaining the hermetic state, it is preferable that the piston seal 500 is made of a self-lubricating material to prevent damage due to frictional force. Examples of such self-lubricating materials include ethylene tetrafluoride and graphite, and such self-lubricating materials can be mixed with elastic materials.

Accordingly, it is preferable that the piston seal 500 according to the present embodiment is formed of a material having elasticity and self-lubricating properties.

It is preferable that the piston seal 500 is not directly mounted on the cylinder rod 300 but is coupled to or mounted on the cylinder rod 300 through the seal pressing portion 510. [ The sealing press portion 510 is preferably coupled to or mounted on the cylinder rod 300. That is, when the sealing press portion 510 is coupled to or mounted on the cylinder rod 300, the piston seal 500 is preferably coupled to or mounted on the cylinder rod 300.

The coupling force to which the sealing press portion 510 is coupled to the cylinder rod 300 can be varied. This is because the resilient deformation displacement of the piston seal 500 of the elastic material may vary as the coupling force is varied. This means that the elastic deformation displacement of the piston seal increases as the coupling force to which the sealing press portion 510 is coupled to the cylinder rod increases. As a result, the sealing force between the piston seal 500 and the inner wall of the cylinder 100 increases as the coupling force of the sealing presser 510 to the cylinder rod increases. This increase in adhesion may be an increase in the pushing force of the inner wall of the cylinder in the radial direction of the piston seal 500 and may be an increase in the contact area between the piston seal 500 and the inner wall of the cylinder.

The pressing force applied to the piston seal 500 by the sealing pressing portion 510, that is, the coupling force between the sealing pressing portion 510 and the cylinder rod 300, 100) inner wall is preferably increased. For this purpose, it is preferable that the shape of the sealing presser 510 and the shape of the piston seal 500 correspond to each other.

A downward inclined surface 511 may be formed in the sealing press portion 510 so that the radius is reduced radially inward. The piston seal 500 may be formed with an upward sloping surface 501 corresponding to the downward sloping surface 511 and having a larger radial outer radius.

The downward inclined face 511 and the upward inclined face 501 may be in close contact with each other before or after the elastic deformation of the piston seal 500. The state at this time is shown in Fig.

That is, at the initial stage when the sealing press portion 510 is coupled to the cylinder rod 300, the downward inclined face 511 and the upward inclined face 501 are in close contact with each other without pressing the piston seal 500. The force for the sealing press portion 510 to be coupled to the cylinder rod 300 is not so great until such contact is made. This is because a force for pressing the piston seal 500 is not applied. The force applied to the cylinder rod 300 by the seal pressing portion 510 until the downward inclined face 511 and the upward inclined face 501 are closely contacted can be regarded as a first critical value.

However, if the downward slope 511 and the upward slope 501 are in close contact with each other before or very early on, such a first threshold value can be ignored. Since in this case the primary threshold is independent of the elastic deformation of the piston seal 500. Therefore, the critical value related to the elastic deformation of the piston seal 500, which will be described later, can be regarded as a first critical value.

In other words, when the abrupt change of the force for pressing the piston seal 500 through the sealing presser 510 while elastically deforming is generated, the first threshold may be the first threshold, Especially in the maintenance of the piston seal 500. In order to form such a first threshold value, the sealing pressurizing portion 510 may be provided with a sealing pressurizing critical surface 512 and a piston sealing ceiling surface 512 corresponding to the sealing pressurizing critical surface 512 502 are preferably provided.

The two critical surfaces 502 and 512 are facing each other at a distance d2 before the elastic deformation of the piston seal 500. The two critical surfaces 502 and 512 may be provided radially inward of the downwardly inclined surface 511 and the upwardly inclined surface 501, respectively. Preferably, the two critical surfaces 502 and 512 are formed as vertical surfaces with respect to the moving direction of the cylinder rod 300.

When the two critical surfaces 502 and 512 are in close contact with each other, a gap d3 may be formed between the sealing press portion 510 and the cylinder rod 300. [ This is a distance at which a force for pressing the sealing presser 510 can be further applied. The interval d3 is preferably larger than the interval d2 between the critical surfaces.

Therefore, when the piston seal 500 is elastically deformed, elastic deformation occurs only in the upward sloping surface 501. When the two critical surfaces 502 and 512 are in close contact with each other, elastic deformation occurs in the entire piston seal 500 . Therefore, a very large force must be applied after the two critical surfaces 502 and 512 are brought into close contact with each other, thereby further causing the elastic deformation of the piston seal 500. Therefore, the coupling force between the sealing presser 510 and the cylinder rod 300 when the two critical surfaces 502 and 512 are in close contact can be regarded as a first critical value.

Before the elastic deformation of the piston seal 500, a gap d1 is formed between the piston seal 500 and the inner wall of the cylinder 100. That is, it is preferable that the interval d1 is maintained until the upward sloping surface 501 and the downward sloping surface 511 are in close contact with each other. This is because the adhesion force of the piston seal 500 can be predicted according to the pressing force of the sealing press portion 510, and the pressing force that should be increased over time can be predicted.

As shown in FIG. 2B, the radius of the piston seal 500 increases when the sealing press portion 310 presses the piston seal 500 to the first critical level. Therefore, the adhesion between the piston seal 500 and the inner wall of the cylinder 100 is increased. It is possible to prevent the molding material from leaking to the cylinder rod 300 side.

Here, a gap d4 is formed between the sealing press portion 510 and the cylinder rod 300 at the first threshold value. This is narrower than the interval d3 described above. The spacing d4 may leave the room at which the piston sealings 500 can be further pressed at the primary threshold and may further press the piston sealings 500 until the spacing d4 is zero at the primary threshold . Therefore, when the interval d4 becomes zero, it can be regarded as the secondary threshold value.

Maintenance of the piston seal, which will be described later, may be performed until applying the pressing force to the secondary threshold value.

On the other hand, the vertical force of the sealing pressing portion can be easily changed radially outward of the piston seal 500 due to the shape characteristic of the downward inclined face 511 and the upward inclined face 502. Of course, this means that the deformation displacement of the piston seal 500 can be easily increased as the vertical force is increased. Therefore, the adhesion force between the piston seal 500 and the cylinder inner wall can be easily predicted through the pressing force of the sealing pressing portion.

Specifically, the sealing pressurizing portion 310 may be configured to be coupled to the cylinder rod 300 directly as a single member. The sealing pressurizing portion 310 is to be coupled to the cylinder rod 300 at a predetermined position. It is preferable that an insertion portion 515 is formed in the sealing pressing portion 310 and a receiving portion 305 for inserting the insertion portion 515 is formed in the cylinder rod 300.

The outer peripheral surface of the insertion portion 515 and the receiving portion 305 can be screwed together. Of course, the position of the insertion portion and the position of the receiving portion may be mutually changed. In this case, the force by which the sealing press portion 510 is directly coupled to the cylinder rod 300 is a force that the sealing press portion 510 presses the piston seal 500.

Alternatively, unlike the above, it is also possible that the sealing presser 510 is coupled to the cylinder rod 300 via a separate engaging member. 1, bolt 520 is shown as a separate engaging member. It will be appreciated, however, that other configurations other than bolts 520 may be used as coupling members.

In this case, the sealing press portion 510 may include a sealing lid 516 configured to cover the piston seal 500, and the engaging member may engage the sealing lid 516 with the cylinder rod do.

In addition, the sealing pressing portion 510 may be formed with a fastening portion 516 in which a coupling member is located, and the fastening portion may be formed in the center of the sealing lid 516. Specifically, the sealing press portion 510 may be coupled to the cylinder rod 300 through a bolt through a part or the whole of the coupling portion 516 and the center of the cylinder rod 300.

Here, the downward inclined face 511 of the sealing press portion 510 and the upward inclined face 501 of the piston seal 500 have the following meaning. That is, due to the shape characteristic, the closer to the chamber 20 the smaller the thickness of the piston seal 500 is.

The larger the width of the elastic material, the larger the distance that the elastic material can be elastically deformed in the width direction. On the other hand, the narrower the width of the elastic material, the smaller the distance that can be elastically deformed in the width direction. This also means that the force for generating the same elastic deformation distance varies significantly with the width of the elastic material.

As shown, the width of the piston seal 500 becomes significantly narrower toward the chamber 20 side. Therefore, the elastic deformation distance of the piston seal 500, which may be generated from the upper portion of the piston seal 500 to between the sealing press portion 510 and the cylinder inner wall, is very narrow. Thus, it is possible to effectively prevent the molding material from flowing into the cylinder inner wall beyond the piston seal 500.

A groove 508 may be formed in the piston seal 500 between the upward sloping surface 501 and the piston sealing critical surface 502. The grooves 508 serve to reduce the radial thickness of the upward sloping surface 501. As a result, the portion of the upward sloping surface 501 is elastically deformed radially outwardly.

On the other hand, if the piston seal 500 is to be in close contact with the inner wall of the cylinder 100, such an adhesion force will be reduced according to the use time of the molding apparatus. In this case, an adhesion holding member for holding or enhancing adhesion when the adhesion is decreased may be further provided.

This adherence can be maintained through a force pushing the piston seal 500 in the radial direction. Further, the sealing force may be maintained by increasing the pressing force of the sealing pressing portion 510. Therefore, the adhesion holding member may be provided to compensate for the reduced adhesion force, specifically, to compensate the pressing force of the sealing pressing portion 510. [

The sealing presser 510 and the piston seal 500 may be coupled through an adhesion holding member that maintains a constant pressure between the sealing presser 510 and the piston seal 500. Specifically, the portion for pressing the piston seal 500 at the sealing pressing portion 510 may be formed to have elasticity. Of course, the elastic modulus of this portion is preferably higher than the elastic modulus of the piston seal 500. Accordingly, when the piston seal 500 is pressed, a part of the sealing press portion 510 is also elastically deformed to apply an elastic force in the restoring direction.

As the time passes, the adhesion of the piston seal 500 is reduced and the pressure that presses the piston seal 500 through a portion of the sealing press portion 510, in particular, the resilient restoring force of the adhesion retaining member, will be.

10: Molding apparatus 100: cylinder
200: cylinder union 300: cylinder rod
400: Rod stopper 500: Piston sealing
510: sealing press portion 520: engaging member

Claims (8)

A molding apparatus for supplying a molding material to a light emitting semiconductor element,
A cylinder provided with a chamber through which the molding material flows;
A cylinder rod for pressing the molding material in the chamber to discharge the molding material;
A piston seal adapted to prevent the molding material from entering the chamber through a gap between the cylinder and the cylinder rod; And
And a sealing press portion provided to press the piston seal to deform the piston seal,
Wherein the seal pressing portion is formed with a downwardly inclined surface such that the radius is reduced radially inwardly and the piston seal has an upwardly inclined surface corresponding to the downwardly inclined surface and having a radially outer radius,
Wherein a groove is formed in the piston seal to facilitate elastic deformation of a radially outward side of an upward inclined surface. delete delete The method according to claim 1,
Wherein the piston seal is made of a self-lubricating material. The method according to claim 1 or 4,
Wherein a sealing area between the piston seal and the inner wall of the cylinder increases as the pressing force of the sealing pressurizing portion increases. 6. The method of claim 5,
Wherein the sealing pressurizing portion and the piston seal are coupled with an adhesion holding member that maintains a constant pressure between the sealing pressurizing portion and the piston seal. The method according to claim 1 or 4,
Wherein the cylinder supplies a liquid molding material to a port of the transfer molding apparatus. A molding apparatus for performing molding in a light emitting semiconductor element,
A cylinder provided with a chamber through which the molding material flows;
A cylinder rod for pressing the molding material in the chamber to discharge the molding material;
A piston seal adapted to prevent the molding material from entering the chamber through a gap between the cylinder and the cylinder rod;
A sealing lid provided to cover at least a part of the piston seal and configured to press and elastically deform the piston seal; And
And a coupling member coupling the sealing lid to the cylinder rod and increasing the bonding force between the piston seal and the inner wall of the cylinder as the coupling force to be coupled to the cylinder rod increases.

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