KR101663139B1 - High-efficient rf transmission line structure and its application components - Google Patents

Abstract

The present invention consists of a dielectric film or substrate, an upper conductor arrangement and a lower conductor arrangement for the implementation of a low-loss transmission line, wherein the strips embodied in the dielectric film or substrate serve as internal conductors, and the upper and lower conductor arrangements are electrically Wherein the upper conductor body and the lower conductor body are coupled while holding the dielectric film or the substrate. The present invention relates to an application part employing the air strip transmission line structure.

Description

TECHNICAL FIELD [0001] The present invention relates to a high-efficiency RF transmission line structure and a high-efficiency RF transmission line structure and application components using the above-

The present invention consists of a dielectric film or substrate, an upper conductor arrangement and a lower conductor arrangement for the implementation of a low-loss transmission line, wherein the strips embodied in the dielectric film or substrate serve as internal conductors, and the upper and lower conductor arrangements are electrically Wherein the upper conductor body and the lower conductor body are coupled while holding the dielectric film or the substrate.

The present invention relates to an application part employing the air strip transmission line structure.

The present invention relates to a high efficiency RF transmission line structure and an application part using the above structure, and a line structure for transmitting a high frequency signal will be described with reference to FIG. 1 and FIG.

Conventionally, a line structure for transmitting a high-frequency signal through a wire has a wide variety of methods. As shown in FIG. 1, (a) a microstrip transmission line structure, (b) a strip transmission line structure, (c) a coaxial transmission line structure, and (d) a waveguide transmission line structure, have.

The microstrip transmission line structure of FIG. 1 (a) comprises a ground plane conductor 10 at the bottom, a signal plane conductor 12 at the top, and a dielectric body 11 for uniformly separating the two conductors. The strip transmission line structure shown in FIG. 1 (b) consists of a ground plane conductor 20 at the top and bottom, a signal plane conductor 22 at the center, and a dielectric 21 for uniformly separating the conductor. The coaxial transmission line structure of Fig. 1 (c) is composed of an outer ground plane conductor 30, a signal plane conductor 32 at the center, and a dielectric 31 for uniformly separating the two conductors. The waveguide transmission line structure shown in Fig. 1 (d) consists of a rectangular outer ground plane conductor 40 and an inner air medium 41.

However, the transmission line structure except for the waveguide transmission line structure uses an expensive dielectric or magnetic material to maintain the internal conductor, and the loss characteristic is deteriorated.

Specifically, the dielectric or magnetic material exhibits frequency-specific electrical characteristics, that is, a complex dielectric constant or a complex permeability characteristic. Accordingly, dielectric substrates having a finite thickness are not only expensive (a thick substrate and expensive as the Teflon material increases), but also have different transmission loss characteristics depending on the thickness of the dielectric substrate, the conductivity of the conductor, and the loss tangent value of the dielectric substrate. I can not help it.

Furthermore, in general, the dielectric or magnetic material exhibits different loss characteristics for different frequencies, and loss characteristics deteriorate as the frequency increases. Therefore, high-frequency RF circuits and components using such a transmission line structure exhibit an arbitrary insertion loss characteristic. In the case of the array antenna, the directivity characteristics are increased by enlarging the array size, but due to the large insertion loss characteristics of the array feed line, The gain increase is limited.

Therefore, it is essential to design a low-loss transmission structure to develop high-frequency RF circuits and components with low loss characteristics and to develop high-efficiency array antennas.

(D) Since the waveguide transmission structure generally uses an air medium in the waveguide, a low-loss high-frequency circuit and an array antenna can be designed. However, the waveguide transmission structure is very bulky, heavy, and expensive. Also, since the size of the waveguide required for each frequency is determined, it is necessary to design a heavy and bulky array antenna when designing a low band array antenna.

2 is an idealized low loss air strip transmission line structure in which the outside of the transmission line is surrounded by ground conductors 50 and 60 and the inside is made up of signal conductors 52 and 62 and air media 51 and 61 .

Here, the characteristic impedance of the transmission line is determined by the line width W and the conductor thickness T of the internal signal conductors 52 and 62, the distance variables B ₁ , B ₂ , W _s1 , W _s2 ) and the electrical characteristics (permittivity and permeability) of the internal medium. That is, the cross-sectional geometry of the transmission line and the internal medium characteristics determine the characteristic impedance of the transmission line.

A transmission line structure having an oval cross section of Fig. 2 (a) and a rectangular cross section of Fig. 2 (b) can be used, but a rectangular cross section is more convenient when considered in terms of design and fabrication. However, in order to construct a low-loss transmission line structure, it is necessary to use an air medium as the inside, and it is practically impossible to fix the inner conductor to a predetermined position.

In the prior art for fixing the internal conductor, Korean Patent Publication No. 10-0764604 describes a non-radiation microstrip line structure having a ground plate. The strip line 12 of the copper foil is formed on the dielectric substrate 13 by the photoetching technique and the copper foil pattern 14 for the ground plate is formed on the portions of the strip line 12 which are in contact with the ground jig plates 10, And the through hole 15 is formed.

This is basically characterized in that the ground plate is brought into contact with the dielectric substrate to perform non-radiation, and the through hole 15 is machined to reduce a part of the transmission loss.

In addition, a non-radiation microstrip line is disclosed in Korean Patent Publication No. 10-0739382, which is basically characterized in that a grounding substrate is abutted above and below a dielectric substrate to perform non-radiation.

Japanese Laid-Open Patent Publication No. 10-0775410 discloses a mode conversion connection method in a non-radiation microstrip line using a metal block. Basically, in order to perform non-radiation, the grounding copper foil pattern 4 is formed under the strip pad 13 Lt; / RTI >

As a whole, the prior arts mainly aim at non-radiation of signals, so that the dielectric substrate comes into contact with the ground plane, and the purpose of the signal transmission is to use a substrate having a high dielectric constant.

Therefore, a transmission line structure having a low transmission loss is required while using the ideal structure as described in FIG. 2, in which a strip is formed on a substrate having a low dielectric constant so as to be used for radiation and the substrate is fixed to the outer structure.

Korean Registered Patent No. 10-0764604 (published on October 19, 2007) Korean Registered Patent No. 10-0739382 (2007.07.09 Announcement) Korean Utility Model Registration No. 20-0394514 (August 25, 2005)

An object of the present invention is to provide an optimal transmission line structure capable of overcoming a high insertion loss, a high price and a heavy and bulky volume, which is a problem of the conventional transmission line structure, and its application parts.

The present invention consists of a dielectric film or substrate, an upper conductor arrangement and a lower conductor arrangement for the implementation of a low-loss transmission line, wherein the strips embodied in the dielectric film or substrate serve as internal conductors, and the upper and lower conductor arrangements are electrically In which the upper conductor body and the lower conductor body are coupled while holding the dielectric film or the substrate, so as to solve the technical problem.

The present invention can provide an optimal transmission line structure capable of overcoming a high insertion loss, a high price, and a heavy and bulky volume, which is a problem of a conventional transmission line structure.

The high efficiency RF transmission line structure proposed in the present invention can minimize transmission loss since most of the high frequency transmission medium is used as air. Therefore, it is possible to design a low-loss RF circuit and parts, so that high-performance, light-weight, low-cost products can be developed. In addition, when the patented technology is applied to an array antenna device, it is possible to develop a high-efficiency array antenna of low profile and performance equivalent to that of a reflector antenna exhibiting high efficiency and directivity characteristics.

1 is a view for explaining a conventional high frequency transmission line structure.
2 is a diagram for describing a structure of an air strip transmission line in an ideal form.
3 is a view illustrating an example of a transmission line structure according to the first embodiment of the present invention.
4 is a view illustrating an example of a transmission line structure according to a second embodiment of the present invention.
5 is a view showing an example of a transmission line structure according to a third embodiment of the present invention.
FIG. 6 is a diagram comparing insertion loss simulation results for each transmission line structure.
FIG. 7 is a diagram illustrating an example of a 90-degree hybrid coupler as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.
8 is a view showing an example of a unit antenna element having a slot opening face as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.
9 is a view showing an example of a 2x2 array antenna as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.
10 is a diagram illustrating an example of a 16x16 array antenna as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.
11 is a diagram showing simulation characteristics of the antenna of Fig.
12 is a diagram showing an example of application of a double spur line filter structure as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.
13 is a diagram showing an example of applying an embedded filter structure as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.
14 is a view showing an example of forming connection grooves as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may properly define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents It should be understood that water and variations may be present.

Before describing the present invention with reference to the accompanying drawings, it should be noted that the present invention is not described or specifically described with respect to a known configuration that can be easily added by a person skilled in the art, Let the sound be revealed.

3 is a view illustrating an example of a transmission line structure according to the first embodiment of the present invention. 3 shows an air strip transmission line structure in which an internal signal conductor 102 is implemented using a thin dielectric film 101b. In order to keep the thin dielectric film 101b constant inside the outer conductor, the outer conductor is separated into the lower outer conductor 100a and the upper outer conductor 100b, a thin dielectric film 101b is inserted therebetween And is supported by the lower outer conductor 100a and the upper outer conductor 100b.

The characteristic impedance value of the transmission line is determined by adjusting the line width W of the internal signal conductor 102 and the distance variables B ₁ , B ₂ , W _s1 and W _s2 from the inner wall of the external conductor. When a very thin dielectric film is used in comparison with the wavelength, most of the medium of the transmission line can be regarded as air, so that the insertion loss of the transmission line is minimized.

That is, when the thickness of the dielectric film used in Fig. 3 is very small compared to the wavelength, the upper and lower conductors can be regarded as being approximately electrically shorted to each other.

Preferably, the thickness of the dielectric film is formed to be 0.2 mm or less so that electrical shorting is possible.

However, when the frequency is high, if the upper and lower conductors are not connected, the electrical characteristics such as the characteristic impedance of the transmission line may be affected.

Accordingly, as a second embodiment of the present invention, an upper and lower outer conductor shorting method as shown in FIG. 4 is proposed. The direct contact approach of Figure 4 (a) allows a thin dielectric film to be completely inserted between the upper and lower conductors, followed by direct contact of the two conductors.

Here, the method of fastening the lower outer conductor 100a and the upper outer conductor 100b of FIG. 3 or 4 may be a screw in a general manner, but in this patent, (110a) on one side and a convex structure (male, 110b) on the other side to the upper and lower conductors without using the upper and lower conductor structures.

In this case, the male and female structures can be firmly fastened using an adhesive agent.

Such a fastening method can reduce the production cost by increasing the production efficiency in mass production of the high-frequency circuit, the component, and the planar array antenna product using the low-loss or high-efficiency transmission line structure proposed in the present patent.

Depending on the design conditions, the heights B ₁ and B ₂ between the stripline and the upper and lower structures can be designed to be the same or different from each other so that the characteristic impedance can be adjusted.

In addition, although the structure in which the upper and lower structures form a rectangular cross-section is illustrated in FIG. 3, the characteristic impedance can be adjusted by changing the upper and lower structures so as to have various cross-sectional shapes such as hexagonal, H-shaped and cruciform.

In addition, two strip lines may be formed on one line and may be designed to be coupled. In this case, the structure of the lines may be formed along each strip line. For example, the height between one strip line and the upper and lower structures may be larger than the height of the other strip line. In addition, a line section may be formed to surround each strip line.

It is also possible to fill the line with air only to enable air stripping, but it is also possible to fill the line with foams having a dielectric constant similar to air in order to maintain the shape of the film firmly.

FIG. 6 is a diagram comparing insertion loss simulation results for each transmission line structure.

In order to confirm the low-loss effect of the air-strip transmission line structure proposed in FIG. 3, the insertion loss characteristics are compared with respect to the same transmission length (1 λ _o ) as that of the conventional microstrip and strip transmission line structure. Electrical and physical characteristics of the dielectric film and Teflon type dielectric material used in the simulation are shown in Table 1 and the insertion loss characteristics obtained through simulation are shown in FIG.

Electrical and physical properties of dielectric materials used in simulation Transmission line structure Dielectric substrate Electrical / Air strip line
Dielectric film Permittivity, e _r = 3.0
Film thickness, H = 25 um
Tangent loss, tand = 0.008 @ 12 GHz
Copper foil thickness, T = 18 um Microstrip line,

Strip line
Taconic
Teflon substrate
(RF 35) Permittivity, e _r = 3.5
Dielectric thickness, H = 0.508 mm
Tangent loss, tand = 0.0025 @ 12 GHz
Copper foil thickness, T = 18 um

In addition, the results of insertion loss comparison are summarized in Table 2 when applied to each array size of the planar array antenna using the insertion loss characteristics for the transmission length of one wavelength (1? _O ) in FIG. We assumed the array comparison condition with center frequency of 12 GHz, transmission line with 50 Ω characteristic impedance, and array element spacing of 0.88 λ _o .

Comparison of Insertion Loss Characteristics by Antenna Array Size Reflecting Insertion Loss Characteristics of Each Transmission Line Structure Item The air strip transmission line structure Conventional strip transmission line structure Conventional microstrip transmission line structure Insertion loss / λ _o -0.009 dB / lambda _o -0.11 dB / lambda _o -0.173 dB / lambda _o Feeding loss of 2x2 array 2 d _x = 1.76? _O
-0.016 dB 2 d _x = 1.76? _O
-0.19 dB 2 d _x = 1.76? _O
-0.30 dB Feeding loss of 4x4 array 2 d _x = 1.76? _O
-0.03 dB 2 d _x = 1.76? _O
-0.38 dB 2 d _x = 1.76? _O
-0.61 dB Feeding loss of 8x8 array 8 d _x = 7.04 lambda _o
-0.06 dB 8 d _x = 7.04 lambda _o
-0.75 dB 8 d _x = 7.04 lambda _o
-1.22 dB Feeding loss of 16x16 array 16 d _x = 14.08 lambda _o
-0.13 dB 16 d _x = 14.08 lambda _o
-1.51 dB 16 d _x = 14.08 lambda _o
-2.44 dB Feeding loss of 32x32 array 32 d _x = 28.16 lambda _o
-0.25 dB 32 d _x = 28.16 lambda _o
-3.01 dB 32 d _x = 28.16 lambda _o
-4.87 dB

The comparison result of each transmission line shown in Table 2 can be used for the development of a high efficiency array antenna and the development of a low loss high frequency circuit and components because the feeding loss can be greatly reduced when the air strip transmission line structure proposed in this patent is used.

In addition, although the air strip transmission line structure proposed in this patent shows an electrical performance similar to that of a waveguide transmission line structure, the air strip transmission line structure is capable of developing a low-profile high-frequency circuit and components with constant line cross- On the other hand, the waveguide transmission line structure has a disadvantage in that the total volume and weight of the waveguide transmission line structure increases as the frequency becomes lower, so that it is impossible to develop a small and light high frequency circuit and parts.

FIG. 7 is a diagram illustrating an example of a 90-degree hybrid coupler as an example of an application part to which a transmission line structure according to an embodiment of the present invention is applied.

This paper shows the PCB layout, top and bottom conductor device development shapes, and S-parameter simulation results of the 90 ^o hybrid combiner circuit designed in the 12 GHz band by applying this patented technology.

The interior of the upper and lower conductor structures 200a and 200b is appropriately designed for the characteristic impedance implementation of each transmission line constituting the 90 ^o hybrid combiner circuit.

From the S-parameter simulation result of Fig. 7 (b), it can be seen that the insertion loss is about 3 dB in the 11-13 GHz operating band, so there is almost no dielectric loss other than the distribution loss. Therefore, the use of this patented technology makes it possible to design low-loss high-frequency circuits and parts. In addition, if the PCB circuit in the dielectric film is modified, it can be reused without replacing the upper and lower conductor devices, so that it is possible to correct the circuit and to make a complementary design.

When the low-loss air-strip transmission line structure proposed in this patent is applied to a planar array antenna, highly efficient directivity characteristics such as a reflector antenna can be obtained. FIG. 8 illustrates an embodiment of a high-efficiency planar array antenna operating in the 10.7 to 12.75 GHz band by applying the present patented technology.

FIG. 8 shows a unit antenna element having a slot-taper opening surface having the air strip feeding line proposed in the patent. 8A shows a structure of both surfaces (front surface and back surface) of the upper conductor structure 300b constituting the unit antenna element and has a slot 303-taper 304 opening spherical structure in order to obtain broadband characteristics.

Here, the slot 303-tapered 304 opening structure helps to mitigate the mutual coupling characteristics between adjacent slot array elements upon array element extension for increased antenna directivity.

8 (b) shows a thin dielectric film 301 on which an inner conductor 302 for feeding air strips of unit antenna elements is implemented.

8 (c) shows the structure of the lower conductor body 300a constituting the unit antenna element. The inside of the upper and lower conductor structures 300a and 300b constituting the unit antenna element has a cavity structure 305a and 306b in a square shape closely related to the operating frequency band.

8 (d) and 8 (e) show the assembling process of the unit antenna element and the shape after assembly.

Although a slot-taper opening surface is exemplified in Fig. 8, it may be designed using a slot-opening surface that is not subjected to tapering depending on design conditions.

In one embodiment, FIG. 9 shows a 2x2 planar array configuration in which unit antenna elements are arrayed in a two-dimensional manner. For feeding the 2x2 array, a feeder network using the air strip transmission line structure proposed in this patent was used. To this end, a feeder network 402 (PCB layout pattern of the inner conductor) is implemented on the thin dielectric film 401, and the inside of the lower conductor structure 400a and the upper conductor structure 400b is divided into four squares In addition to the cavity structures 405a and 405b, passageway or channel structures 406a and 406b for the transmission line of the feeder network are provided.

In one embodiment, FIG. 10 shows a 16x16 planar array configuration extending a 16x16 array to achieve high efficiency and high antenna gain characteristics. The total feed length of a 16 × 16 planar array antenna with a constant spacing of 0.88 λ _{o in} the x and y directions is about 28 λ _o . When using the air strip transmission line proposed in this patent, an insertion loss of about 1.0 dB or less can be obtained.

Depending on the design conditions, various arrangements such as 16x32 and 16x48 arrays can be designed.

11 shows the simulated electrical characteristics (input return loss characteristics and radiation characteristics) of a 16x16 planar array antenna using a commercial EM simulator. 11 (a) shows the input return loss characteristics matched in the 10.7 to 12.75 GHz band, and Figs. 11 (b) and 11 (c) show the azimuth angle of the 16x16 planar array antenna simulated at 10.7 GHz, 11.7 GHz, and 12.75 GHz, And the radiation pattern characteristics in the elevation angle direction. The simulation radiation pattern shows very similar results to the theoretical radiation pattern characteristics. This is because the lower conductor body 500a and the upper conductor body 500b are connected to the power supply network 502
This is because there is no leakage electromagnetic wave from the power supply network because it is completely shielded.

Table 3 summarizes the simulated radiation characteristics of 16x16 planar array antennas. From the simulation results summarized in Table 3, a planar array antenna with high efficiency and high gain characteristics can be developed.

Summary of Simulated Radiation Characteristics of 16x16 Planar Array Antennas Item / Frequency 10.7 GHz 11.75 GHz 12.75 GHz Antenna gain 31.9 dBi 32.8 dBi 33.0 dBi Antenna efficiency 83.9% 84.7% 84.3% 3dB beam width 4.0 ^o @ azimuth &
elevation 3.6 ^o @ azimuth &
elevation 3.4 ^o @ azimuth &
elevation Side Lobe Level 12.7 dBc or higher 12.7 dBc or higher 13.2 dBc or higher Antenna size 352 x 352 x 18 mm
(12.55x12.55x0.64 lambda _o ) 352 x 352 x 18 mm
(13.73 x 13.73 x 0.70 lambda _o ) 352 x 352 x 18 mm
(14.96 x 14.96 x 0.77 lambda _o )

Another advantage of the planar array antenna technology applying the low-loss air-strip transmission line structure proposed in the present patent is that the lower and upper conductor structures manufactured as described above are used as they are and only a thin dielectric film ), It is possible to develop an array antenna having various functions (arbitrary beam patterning, low SLL characteristics, etc.) and radiation characteristics.

That is, by changing the width of the stripline, it is possible to change the characteristic impedance. Therefore, it is possible to develop an antenna having various radiation characteristics without using the upper and lower conductor structures.

Also, in order to add a strip filter function in addition to the antenna function without changing the size and volume of the entire antenna, a double spur line filter structure implemented on the input feed line of the planar array antenna can be inserted. FIG. 12 shows a simulation characteristic of an embodiment designed using a 1-stage double spur line filter structure 600 and a 2-stage dual spur line filter structure 700. Fig. 12 (c) shows S-parameter simulation characteristics. 10 to 12.5 GHz (left band) is the pass band, and 13.5 to 15.0 GHz (right band) is the suppress band.

13 illustrates an embedded filter structure inserted into an input feed network of a planar array antenna according to an embodiment of the present invention. Since the antenna is implemented on the feed transmission line, the filter function can be implemented without increasing the size and volume of the array antenna.

According to the design conditions, the antenna employing the transmission line according to the present invention can be constituted so as to be respectively constituted by a transmitter and a receiver.

In addition, it is possible to increase the gain by connecting the antennas with strip lines. By forming cross-shaped connecting grooves between the lines at the bottom of the lower conductor body, it is possible to maintain the gap without damaging the shape of the line, have.

In this case, the connection grooves are used for the connection between the antennas or as connection grooves for the waveguide function (refer to FIG. 14 (a) lower conductor structure and (b) upper conductor structure).

1 to 14 are merely the main points of the present invention, and various designs can be made within the technical scope thereof, so that the present invention is not limited to the configurations and functions of Figs. 1 to 14 It is self-evident that it is not limited.

100a: lower outer conductor 100b: upper outer conductor
101a: air medium 101b: dielectric film
102: signal conductor 110a: concave structure
110b: convex structure 200a: lower conductor structure
200b: upper conductor body 300a: lower conductor body
300b: upper conductor body 301: dielectric film
302: inner conductor 303: slot
304: taper 305a, 305b: hollow structure
400a: Lower conductor body 400b: Upper conductor body
401: dielectric film 402: feeder network
405a, 405b: public structures 406a, 406b: channel or channel structure
500a: lower conductor body 500b: upper conductor body
502: feeder network 600: 1-stage double sputter line filter structure
700: 2-stage double sputter line filter structure

Claims (10)

For low loss transmission lines,
A dielectric film or substrate, an upper conductor body and a lower conductor body,
The strips embodied in the dielectric film or substrate serve as internal conductors,
The upper conductor body and the lower conductor body are designed to be electrically short-circuited, and the upper conductor body and the lower conductor body are designed on the basis of an air-strip transmission line for coupling while holding the dielectric film or the substrate,
An upper conductor structure with a function to provide a noncontact space for the feedthrough slot of the array antenna, an upper cavity structure, an upper ground plane for the array feed network and a feed signal transmission channel,
A high-frequency power distribution or a high-frequency power distribution network having a reflective ground plane of the array antenna, a lower cavity structure, a lower ground plane for the array feed network and a lower conductor structure for providing a noncontact space for the feed signal transmission channel, A high frequency planar array antenna comprising a dielectric film or substrate on which a coupling circuit is implemented.
The method according to claim 1,
In order to adjust the characteristic impedance value of the transmission line,
The line width W of the strip formed on the dielectric film or the substrate and the distance variables B ₁ , B ₂ , W _s1 and W _s2 from the inner walls of the upper and lower conductor structures are controlled to adjust the characteristic impedance value of the transmission line Wherein the antenna is a flat antenna.
The method according to claim 1,
Characterized in that a dielectric or foam material similar to the air is inserted between the upper and lower conductor structures and the dielectric film or substrate to keep the dielectric film or substrate constant.
The method according to claim 1,
For an electrical short between the upper conductor body and the lower conductor body,
The dielectric film or the substrate is formed to be 0.2 mm or less so that the upper and lower conductor structures come into contact with each other,
Wherein the dielectric film or substrate is positioned at a portion of the area where the upper and lower conductor structures abut and the upper and lower conductor structures direct electrical shorting in the area without the dielectric film or substrate.
The method of claim 4,
In order to directly short-circuit the upper conductor body and the lower conductor body,
Characterized in that a convex structure is implemented in one of the upper and lower conductor structures and a concave structure is formed in the other of the upper and lower conductor structures to fasten the upper and lower conductor structures.
The method according to claim 1,
The shape of the cross section formed by the upper conductor body and the lower conductor body may be a rectangle, an H-shape or a cross shape,
Wherein the strips can be two or more.
delete delete The method according to claim 1,
A high - frequency planar array antenna with an air - strip transmission line structure low - loss filter structure embedded in a feed line of a dielectric feed - through network.
The method according to claim 1,
Wherein a cross-shaped pore is formed between the feed signal transmission channels so that the antennas can be connected to each other.

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