KR101650827B1 - Conductive complex composite having piezoresistivity and piezoresistive device using the same - Google Patents

Conductive complex composite having piezoresistivity and piezoresistive device using the same Download PDF

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KR101650827B1
KR101650827B1 KR1020150053597A KR20150053597A KR101650827B1 KR 101650827 B1 KR101650827 B1 KR 101650827B1 KR 1020150053597 A KR1020150053597 A KR 1020150053597A KR 20150053597 A KR20150053597 A KR 20150053597A KR 101650827 B1 KR101650827 B1 KR 101650827B1
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weight
parts
conductive
conductive composite
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이영진
유시원
이정배
최성재
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한국세라믹기술원
주식회사 디메텍
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    • H01L41/18
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • H01L41/0471
    • H01L41/08

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  • Compositions Of Macromolecular Compounds (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

It can be used as a tactile sensor that can measure the external pressure or detect the area under pressure. It can also be used for various applications such as electronic and electric products, parts, automobiles and machines. And a piezoresistive element using the conductive composite composition.
The conductive composite composition having a piezoresistive characteristic according to the present invention is characterized by comprising 0.05 to 95 parts by weight of a conductive filler, 50 to 1000 parts by weight of a solvent, 0.01 to 5 parts by weight of a plasticizer and 0.01 to 5 parts by weight of a dispersant 0.01 To 5 parts by weight.

Description

TECHNICAL FIELD [0001] The present invention relates to a conductive composite composition having a piezoresistive property and a piezoresistive element using the same. BACKGROUND OF THE INVENTION < RTI ID =

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive composite composition and a piezoresistive element using the conductive composite composition. More particularly, the present invention relates to a conductive composite composition having a conductive filler added thereto at an optimal composition ratio, A conductive composite composition having a piezoresistive characteristic that can be utilized as a tactile sensor by measuring the external pressure intensity by measuring the strength of the external pressure through the piezoresistance characteristic in which the volume and the electric resistance value are reversibly changed, Device.

Piezoresistive effect refers to a change in the electrical resistance of a material due to external pressure or force. The piezoresistive effect can be classified into positive piezoresistivity and negative piezoresistivity. The positive voltage resistance characteristic indicates that the resistance value increases as the external stress increases , And the negative pressure resistance characteristic means that the resistance value decreases as the external stress increases. Further, the piezoresistance effect is distinguished from the piezoelectric effect which causes a change in the electrical potential because it causes only a change in the electric resistance value.

The piezoresistive sensor is a micro-electro-magnetometer (MEMS) sensor that detects pressure, vibration, and acceleration. The piezoresistive sensor detects pressure, Mechanical-System (MEMS) sensors.

Pressure measurement, which had previously been dependent on mechanical displacement, has begun to be developed as a small and high performance electronic sensor by utilizing the piezoresistive effects of metals, semiconductors, and conductive polymers, The change of the resistance is large, and the position control and the shape of the sensor are simple.

In particular, in the bent surfaces of various industrial equipments such as automobile engines and electric appliances, existing rigid pressure sensors are difficult to perform their functions properly, and in order to detect physical changes such as mutual contact action between operating systems, Development is required.

It is expected that a conductive composite using a rubber or polymer material having a high flexibility and excellent elastic restoration property as a composite substrate will be a good alternative to solve the above problems, and is soft and light in weight It can be applied to various fields.

The related literature is Korean Patent Laid-Open Publication No. 10-2011-0110388 (published on October 10, 2011), which discloses a method for manufacturing a pressure-sensitive device, a pressure-sensitive device manufactured by the method, and a pressure- A method of measuring the pressure by the pressure is described.

An object of the present invention is to provide a conductive composite composition in which a conductive filler is added at an optimal composition ratio to form a conductive composite layer by using a printing method, thereby having a piezoelectric resistance characteristic in which the volume and electric resistance value are reversibly changed according to an external pressure Therefore, it is an object of the present invention to provide a conductive composite composition having a piezoresistive characteristic that can be used as a tactile sensor that measures the external pressure or senses an area where a pressure is applied, and a piezoresistive element using the same.

In order to accomplish the above object, the conductive composite composition according to an embodiment of the present invention comprises 0.05 to 95 parts by weight of a conductive filler, 50 to 1000 parts by weight of a solvent, 0.01 to 5 parts by weight of a plasticizer, And 0.01 to 5 parts by weight of a dispersing agent.

According to an aspect of the present invention, there is provided a piezoresistive element comprising: a conductive composite layer produced by a printing method; A first electrode disposed on a lower surface of the conductive complex layer and patterned in a slit shape along a first direction; And a second electrode disposed on an upper surface of the conductive complex layer and patterned in a slit shape along a second direction intersecting the first direction.

The conductive composite composition having the piezoresistive characteristic and the piezoresistive element using the same according to the present invention are formed so that the filling amount of the conductive filler particles in the polymer composite layer is close to the percolation threshold value, By varying the type of the substrate and the conductive filler particles, the dispersibility of the conductive filler particles, the orientation direction, the shape and size of the conductive filler particles, and the thickness of the conductive composite layer, It is suitable for use as a tactile sensor.

Therefore, the conductive composite composition having the piezoresistive characteristic according to the present invention and the piezoresistive element using the same have a piezoresistive characteristic in which the volume and the electric resistance value are reversibly changed according to the external pressure. Therefore, Not only can it be used as a tactile sensor capable of sensing the area under pressure, but also can be applied to various applications such as electronic and electrical products, parts, automobiles, and machines.

1 is a perspective view illustrating a piezoresistive element having a piezoresistive characteristic according to an embodiment of the present invention.
2 and 3 are cross-sectional views taken along line II-II 'in FIG.
4 is a perspective view illustrating a tactile sensor according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a conductive composite composition having a piezoresistive characteristic according to a preferred embodiment of the present invention and a piezoresistive element using the same will be described in detail with reference to the accompanying drawings.

The conductive composite composition having a piezoresistive property according to an embodiment of the present invention may include 0.05 to 95 parts by weight of a conductive filler, 50 to 1000 parts by weight of a solvent, 0.01 to 5 parts by weight of a plasticizer, 0.01 to 5 parts by weight of a dispersing agent.

The polymer substrate is nonconductive as the main material of the conductive composite composition. Such polymeric substrates may be selected from the group consisting of polyethylene, high density polyethylene, low density polyethylene, bakelite, neoprene, nylon, polystyrene, polyacrylonitrile, ultra high molecular weight polyethylene, ethylene vinyl acetate, polypropylene, polysulfurethylene, polyacrylates, At least one selected from the group consisting of vinyl butyral, polyvinyl chloride, ethylene propylene rubber (EPDM), polydimethylsiloxane (PDMS), alkyl glycidyl ether, polyfunctional acrylic resin, acryl-urethane copolymer, carboxyl binder and amide binder . ≪ / RTI >

The conductive filler is added to the polymer base material and serves to selectively impart conductivity to the conductive composite layer by the electric tunneling effect. The conductive filler is preferably added in an amount of 0.05 to 95 parts by weight based on 100 parts by weight of the polymer resin. More preferably in an amount of about 10 parts by weight based on the penetration threshold value concentration so as to be a concentration near the penetration threshold value.

When the amount of the conductive filler to be added is less than 0.05 part by weight based on 100 parts by weight of the polymer resin, the addition amount of the conductive filler is insignificant, so that it may be difficult to exhibit the electric tunneling effect properly. Conversely, when the amount of the conductive filler added is more than 95 parts by weight based on 100 parts by weight of the polymer resin, it is not economical since it can act as a factor for raising the manufacturing cost without any additional effect.

Such a conductive filler may be a semiconductor material containing a metal material including Ag, Au, Al, Cu, Pt, Ni and Fe, vanadium oxide and titanium oxide, carbon black, acetylene black, Carbon materials including carbon nanotubes and multi-wall carbon nanotubes.

At this time, the conductive filler preferably has an average particle size of 10 nm to 100 μm. When the average particle size of the conductive filler is less than 10 nm, the dispersion stability may be deteriorated. On the contrary, when the average particle size of the conductive filler exceeds 100 탆, problems such as nozzle clogging may occur during the printing process.

The solvent is selected from the group consisting of polyalcohol, dimethylsulfoxide, N, N-dimethylformamide, ethylene glycol, polyethylene glycol, meso-erythritol, aniline, acetone, methyl ethyl ketone, isopropyl alcohol, butyl alcohol, ethyl alcohol, The solvent is preferably selected from amides, hexanes, toluene, chloroform, cyclohexanone, distilled water, pyridine, methylnaphthalene, octamethylamine, tetraacetamide, hexane, toluene, chloroform, cyclohexanone, distilled water, pyridine, methylnaphthalene, octamethylamine, Furan, dichlorobenzene, dimethylbenzene, trimethylbenzene, nitromethane, and acrylonitrile may be used.

Plasticizers are added for the purpose of lowering the modulus of elasticity. Such plasticizers may include at least one selected from phthalic acid esters, fatty acid esters, polyarylene glycol dielectrics, waxes and glycerin.

Such a plasticizer is preferably added in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the polymer base material. When the amount of the plasticizer to be added is less than 0.01 part by weight based on 100 parts by weight of the polymer base material, the elastic modulus is so high that the change in capacitance is induced to decrease the contact sensitivity. On the contrary, when the amount of the plasticizer to be added is more than 5 parts by weight based on 100 parts by weight of the polymer base material, there arises a problem of matrix hardening or a problem of resilience due to elasticity, which may easily break or deform.

The dispersant is added for the purpose of improving the flow characteristics of the paste. Such dispersing agents may include at least one selected from the group consisting of acrylic acid type, fatty acid type, sulfonic acid type, phosphoric acid ester type, sulfuric acid ester type, polyarylene glycol type and amine type dispersing agent.

Such a dispersant is preferably added in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the polymer base material. When the addition amount of the dispersing agent is less than 0.01 part by weight based on 100 parts by weight of the polymer base material, there is a possibility that the effect of the addition is not properly exhibited. On the other hand, if the addition amount of the dispersing agent is more than 5 parts by weight based on 100 parts by weight of the polymer base material, it can not be economical because it can only increase the manufacturing cost without increasing the effect.

When the conductive composite composition having the above composition is formed by using the printing method, since the volume resistivity and the electric resistance value are reversibly changed according to the external pressure, the strength of the external pressure can be measured, It can be used as a tactile sensor that can sense the area under pressure.

In this case, the material having the piezoresistive characteristic includes a metal, a semiconductor, a conductive polymer, and a conductive composite, and a conductive composite made of a rubber or a polymer as a substrate has high flexibility and excellent elastic recovery It has the advantage that it can be applied to curved surfaces and it can be used repeatedly in dynamic products.

The conductive composite layer composed of the conductive particles and the polymer resin of the non-conductive substrate functions as an important parameter for the resistance of the conductive filler particles and the current flow path between the first and second electrodes, , The resistance across one particle, and the number of particles that generate the current flow path determine the total resistance value of the conductive composite layer.

When stress is applied to the conductive composite layer, the difference in compressibility between the conductive filler particles and the polymer substrate causes a change in distance between the conductive filler particles, resulting in a change in resistance. In particular, because the conductive filler particles have a much lower compressive modulus than the polymeric substrate of the nonconductive substrate, the deformation of the polymeric substrate shortens the distance between the conductive filler particles, and the tunneling current flows through the particle spacing Resulting in a change in the electrical resistance value of the conductive composite layer.

In particular, one of the important factors in the conductive composite layer is the percolation threshold, which is the concentration at which the polymeric substrate of the nonconductive substrate becomes conductive. When the conductive filler particles are three-dimensionally uniformly dispersed in the conductive composite layer, a current flow path connecting the first and second electrodes with respect to the filling amount of the specific conductive filler particles is generated, The electrical conductivity of the conductive filler particles is changed from the insulating region to the conductive region, and the electrical resistance value changes suddenly. The filling amount of the conductive filler particles is referred to as the penetration threshold value.

In the conductive composite layer, the penetration threshold value is significantly changed depending on the kind of the polymer substrate and the conductive filler particles, and the dispersion property of the conductive filler particles filled in the conductive composite layer, the orientation direction, the particle shape and size, And the like.

In order to be used as a tactile sensor having a piezoresistive characteristic, such as a measuring device for measuring stress or load, a piezoresistive characteristic with a very high change rate of an electrical resistance value according to a pressure change is required. In order to fabricate a tactile sensor having a resistance characteristic that is sensitive to such a stress change, a characteristic that the electric conductivity of the conductive complex layer transitions from the insulating region to the conductive region should be used in proportion to the magnitude of the stress applied to the material.

Therefore, it is preferable to form the polymer composite layer so that the amount of the conductive particles filled in the polymer composite layer is close to the percolation threshold, and the kind of the polymer resin and the conductive filler particles, the dispersibility of the conductive filler particles, And the thickness of the conductive composite layer are the main factors determining the penetration threshold value. Therefore, it is important to form a conductive composite layer considering the correlation therebetween.

Hereinafter, a piezoresistive element having a piezoresistive characteristic according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a piezoresistive element having a piezoresistive characteristic according to an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views taken along the line II-II 'in FIG.

1 to 3, a piezoresistor 100 having a piezoresistive characteristic according to an embodiment of the present invention includes a conductive complex layer 120, a first electrode 140, and a second electrode 160 do.

The conductive complex layer 120 can be produced in the form of a film or a thin film by a printing method in the form of a paste or a slurry conductive composite composition. In this case, the conductive composite composition is preferably composed of 0.05 to 95 parts by weight of a conductive filler, 50 to 1000 parts by weight of a solvent, 0.01 to 5 parts by weight of a plasticizer, and 0.01 to 5 parts by weight of a dispersant, based on 100 parts by weight of the polymer base material Is preferably used.

The conductive composite layer 120 may include a nonconductive elastomeric substrate 122 and a conductive filler 124 dispersed and disposed within the nonconductive elastomeric substrate 122. The polymeric substrate, which is the main raw material for the nonconductive elastic substrate 122, is selected from the group consisting of polyethylene, high density polyethylene, low density polyethylene, bakelite, neoprene, nylon, polystyrene, polyacrylonitrile, ultra high molecular weight polyethylene, ethylene vinyl acetate, polypropylene, (Meth) acrylates, such as ethylene, polyacrylate, polyurethane, polyvinyl butylal, polyvinyl chloride, ethylene propylene rubber (EPDM), polydimethylsiloxane (PDMS), alkyl glycidyl ether, polyfunctional acrylic resin, A binder and an amide-based binder.

The conductive filler 124 is dispersed three-dimensionally uniformly in the interior of the nonconductive elastic substrate 122 to selectively impart conductivity to the conductive composite layer 120 by an electrical tunneling effect. The conductive filler 124 may be made of a metal material including Ag, Au, Al, Cu, Pt, Ni and Fe, a semiconductor material containing vanadium oxide and titanium oxide, carbon black, acetylene black, , Single-wall carbon nanotubes, and multi-wall carbon nanotubes. At this time, it is preferable that the conductive filler 124 has an average particle size of 10 nm to 100 μm.

It is preferable that the conductive complex layer 120 has a thickness of 0.1 占 퐉 to 5 mm. When the thickness of the conductive composite layer 120 is less than 0.1 탆, it is difficult to uniformly disperse the conductive filler particles 124 in the conductive composite layer 120 three-dimensionally, and when the thickness of the conductive composite layer 120 is insufficient It may be difficult to measure the resistance value when a large external force is applied to the local surface. Conversely, if the thickness of the conductive composite layer 120 exceeds 5 mm, it may not be possible to realize flexible characteristics due to excessive thickness design.

The first electrode 140 is disposed on the lower surface of the conductive complex layer 120 and is patterned in a slit shape along the first direction and the second electrode 160 is disposed on the upper surface of the conductive complex layer 120, And is patterned in a slit shape along a second direction intersecting with one direction.

Each of the first and second electrodes 140 and 160 is formed of a polymer including PEDOT, polyaniline, polythiophene, polypyrrole, polyphenylenevinylene, and polystyrene sulfonate, and Ag, Pt, Pd, Ni, and Ag- It is preferable to include at least one selected from the metals. At this time, each of the first and second electrodes 140 and 160 preferably has a thickness of 0.1 탆 to 1 mm. At this time, each of the first and second electrodes 140 and 160 may have a slit interval (sw) of 0.1 to 10 mm, but is not limited thereto.

A pressure can be applied to the first electrode or the second electrode of the piezoresistive element having the above-described configuration. Fig. 2 shows a state in which no pressure is applied to the piezoresistive element. Respectively.

3, when the pressure 200 is applied to the second electrode 160, the second electrode 160 and the conductive complex layer 120 are squeezed by the pressure 200, and the second electrode 160 The spacing between the conductive filler particles dispersed in the region between the squeezed point of the second electrode 160 and the first electrode 140 is reduced and as a result, The particles of the conductive filler 124 disposed between the electrode 140 and the second electrode 160 physically come into contact with each other.

That is, when the pressure 200 is applied to the first electrode 140 or the second electrode 160, the conductive complex layer 120 is compressed in a direction in which the pressure 200 is applied, An electric tunneling effect is generated between the first and second electrodes 124 and 140 so that a current is applied between the first and second electrodes 140 and 160. When driving voltages of 1 mV to 100 V are applied to the first electrode 140 and the second electrode 160, the first and second electrodes 140 and 160 are electrically connected to each other by electrical tunneling effect between the conductive particles 124, 140, and 160, respectively.

As the intensity of the pressure 200 increases, the area between the first electrode 140 and the second electrode 160 at the squeezed point is reduced, so that the electric tunneling effect with the electric field in this area increases, And the resistance decreases. In contrast, when the force for compressing the second electrode 160 is reduced or eliminated, the gap between the point where the second electrode 160 is compressed and the first electrode 140 due to the restoring force of the conductive complex layer 120, The electric field effect existing in this region and the density of the conductive filler 124 particles are both decreased, and the electric tunneling effect is reduced again. As the electrical tunneling effect decreases, the amount of current decreases and the resistance increases inversely with the amount of current.

In particular, the piezoresistive device 100 having the piezoresistive characteristic according to the present invention patterns the first and second electrodes 140 and 160 for measuring voltage and current, and measures an area where the pressure 200 is applied , It becomes possible to fabricate a single element having a large area size.

Accordingly, the changing current or resistance is measured through the first electrode 140 and the second electrode 160, and the data such as the modulus of elasticity of the conductive complex layer 120 is combined to obtain the intensity of the pressure with respect to the large area It can be calculated accurately.

4 is a perspective view illustrating a tactile sensor according to an embodiment of the present invention.

Referring to FIG. 4, a conductive composite layer 320 in which conductive fillers regularly arranged therein are inserted, a first electrode 340 patterned in a slit shape along a first direction on a lower surface of the conductive composite layer 320, And a second electrode 360 patterned in a slit shape along a second direction intersecting the first direction on the upper surface of the conductive composite layer 320. The piezoresistive element may be formed of a single large- As shown in FIG.

When a predetermined pressure 380 is applied to the first electrode 340 of the tactile sensor 300, the current or resistance of the piezoresistive element changes accordingly, Is monitored in the measurement device 370 through two connection wires 354 and the monitored results are combined to measure the intensity of the pressure 380. [

As described above, the conductive composite composition having the piezoresistive characteristic and the piezoresistive element using the same according to the embodiment of the present invention have a composition ratio such that the filling amount of the conductive filler particles in the polymer composite layer is close to the percolation threshold In addition, by changing the type of the polymer substrate and the conductive filler particles of the polymer composite layer, the dispersibility of the conductive filler particles, the orientation direction, the shape and size, and the thickness of the conductive composite layer, Is very suitable for use as a tactile sensor.

Therefore, the conductive composite composition having the piezoresistive characteristic according to the present invention and the piezoresistive element using the same have a piezoresistive characteristic in which the volume and the electric resistance value are reversibly changed according to the external pressure. Therefore, Not only can it be used as a tactile sensor capable of sensing the area under pressure, but also can be applied to various applications such as electronic and electrical products, parts, automobiles, and machines.

Example

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

The contents not described here are sufficiently technically inferior to those skilled in the art, and a description thereof will be omitted.

1. Manufacture of piezoresistive element

Example 1

A conductive composite composition consisting of 30 parts by weight of a conductive filler, 700 parts by weight of a solvent, 3 parts by weight of a plasticizer and 2 parts by weight of a dispersant was coated on a PET film to a thickness of 3 mm with respect to 100 parts by weight of a polymer substrate, Lt; 0 > C for 1 hour to prepare a conductive composite layer.

Next, a first metal layer was formed on the lower surface of the conductive composite layer to a thickness of 0.3 mm, and then the first metal layer was patterned by wet etching to form a first electrode having a slit shape along the first direction.

Next, after removing the PET film, a second metal layer is formed on the upper surface of the conductive complex layer to a thickness of 0.3 mm, and then the second metal layer is patterned by wet etching to form a slit shape along the second direction intersecting the first direction A second electrode having a thickness of 100 nm was formed to produce a piezoresistive element.

Example 2

Resistive elements were prepared in the same manner as in Example 1, except that conductive composite compositions consisting of 60 parts by weight of a conductive filler, 600 parts by weight of a solvent, 3 parts by weight of a plasticizer and 2 parts by weight of a dispersing agent were used for 100 parts by weight of a polymer substrate .

Example 3

Resistive elements were prepared in the same manner as in Example 1 except that conductive composite compositions consisting of 80 parts by weight of a conductive filler, 900 parts by weight of a solvent, 3 parts by weight of a plasticizer and 2 parts by weight of a dispersant were used for 100 parts by weight of a polymer substrate .

2. Property evaluation

Table 1 shows the results of physical properties evaluation of the piezoresistive devices according to Examples 1 to 3.

[Table 1]

Figure 112015036968563-pat00001

As shown in Table 1, the resistivity of the piezoresistive device according to Examples 1 to 3 was measured. As the pressure increased, the electric tunneling effect was increased. As a result, the amount of current increased and the resistivity decreased .

The conductive filler was added in an amount of 30 parts by weight based on 100 parts by weight of the polymer base material and the conductive filler was added in an amount of 60 parts by weight and 80 parts by weight based on 100 parts by weight of the polymer base material, 3 shows that the resistivity is remarkably decreased.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

100: Resistive element
120: conductive composite layer
122: nonconductive elastic substrate
124: Conductive filler
140: first electrode
160: Second electrode

Claims (16)

With respect to 100 parts by weight of the polymer substrate,
Conductive filler: 0.05 to 95 parts by weight,
Solvent: 50 to 1000 parts by weight,
0.01 to 5 parts by weight of a plasticizer, and
0.01 to 5 parts by weight of a dispersing agent,
Wherein the plasticizer comprises at least one selected from phthalic acid ester, fatty acid ester, polyarylene glycol dielectric, wax and glycerin,
Wherein the dispersant comprises at least one selected from the group consisting of acrylic acid type, fatty acid type, sulfonic acid type, phosphoric acid ester type, sulfuric acid ester type, polyarylene glycol type and amine type dispersant.
The method according to claim 1,
The polymer substrate
A polyolefin such as polyethylene, high density polyethylene, low density polyethylene, bakelite, neoprene, nylon, polystyrene, polyacrylonitrile, ultra high molecular weight polyethylene, ethylene vinyl acetate, polypropylene, polysulfurethylene ethylene, polyacrylate, polyurethane, Those containing at least one selected from polyvinyl chloride, ethylene propylene rubber (EPDM), polydimethylsiloxane (PDMS), alkyl glycidyl ether, polyfunctional acrylic resin, acryl-urethane copolymer, carboxyl-based binder and amide-based binder Wherein the conductive composite composition has a piezoresistive property.
The method according to claim 1,
The conductive filler
A semiconductor material comprising a metal material including Ag, Au, Al, Cu, Pt, Ni and Fe, vanadium oxide and titanium oxide, carbon black, acetylene black, Wherein the carbon nanotubes contain at least one selected from the group consisting of carbon materials including carbon nanotubes and multi-wall carbon nanotubes.
The method according to claim 1,
The conductive filler
And having an average particle size of 10 nm to 100 탆.
The method according to claim 1,
The solvent
But are not limited to, alcohols such as methanol, ethanol, isopropyl alcohol, isopropyl alcohol, isopropyl alcohol, butyl alcohol, isopropyl alcohol, The organic solvent is selected from the group consisting of hexane, toluene, chloroform, cyclohexanone, distilled water, pyridine, methylnaphthalene, octamethylamine, tetraacetamide, hexane, toluene, chloroform, cyclohexanone, distilled water, pyridine, methylnaphthalene, octamethylamine, Wherein the conductive composite composition comprises at least one selected from the group consisting of dichlorobenzene, dimethylbenzene, trimethylbenzene, nitromethane, and acrylonitrile.
delete delete A conductive composite material according to any one of claims 1 to 5, which is produced by a printing method;
A first electrode disposed on a lower surface of the conductive complex layer and patterned in a slit shape along a first direction; And
And a second electrode disposed on the upper surface of the conductive complex layer and patterned in a slit shape along a second direction crossing the first direction,
The conductive composite composition is composed of 0.05 to 95 parts by weight of a conductive filler, 50 to 1000 parts by weight of a solvent, 0.01 to 5 parts by weight of a plasticizer, and 0.01 to 5 parts by weight of a dispersant, based on 100 parts by weight of a polymeric base material,
Wherein the plasticizer comprises at least one selected from phthalic acid ester, fatty acid ester, polyarylene glycol dielectric, wax and glycerin,
Wherein the dispersing agent comprises at least one selected from the group consisting of an acrylic acid type, a fatty acid type, a sulfonic acid type, a phosphoric acid ester type, a sulfuric acid ester type, a polyarylene glycol type and an amine type dispersant.
9. The method of claim 8,
The conductive composite layer
And has a thickness of 0.1 占 퐉 to 5 mm.
9. The method of claim 8,
Each of the first and second electrodes
And has a thickness of 0.1 占 퐉 to 1 mm.
9. The method of claim 8,
Each of the first and second electrodes
PEDOT, polyaniline, polythiophene, polypyrrole, polyphenylene vinylene and polystyrene sulfonate, and a metal including Ag, Pt, Pd, Ni and Ag-Pb alloy Lt; / RTI >
delete 9. The method of claim 8,
When an external force is applied to the first electrode or the second electrode,
Wherein the conductive composite layer is compressed in a direction in which the external force is applied and an electric tunneling effect is generated between the conductive filler particles in the compressed region to apply a current between the first and second electrodes. device.
14. The method of claim 13,
Due to the electrical tunneling effect,
And a current of 1mA to 100A is supplied between the first and second electrodes.
A tactile sensor manufactured using the piezoresistive element according to claim 8.
16. The method of claim 15,
Wherein the tactile sensor is provided with the piezoresistive element alone to measure an area where the pressure is applied.
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CN109443609A (en) * 2018-10-29 2019-03-08 陕西科技大学 A kind of high-precision piezoresistance sensor material and preparation method thereof based on collagen
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KR20190069078A (en) * 2017-12-11 2019-06-19 울산과학기술원 Pressure sensor component using piezoresistivity and assembly thereof
KR20190142964A (en) * 2018-06-19 2019-12-30 한국과학기술원 Piezoresistive Sensor Module of Self-generating Function
KR20200106745A (en) * 2019-03-05 2020-09-15 김병곤 Pressure Resistive Pressure Sensor with Easy Pressure Distribution Confirmation Structure
CN111830086A (en) * 2020-05-07 2020-10-27 西安电子科技大学 Preparation method of gas sensor based on polyaniline film surface modification
CN111982362A (en) * 2020-08-25 2020-11-24 工科思维技术(深圳)有限公司 Method for preparing high-sensitivity flexible piezoresistive sensor based on fracture microstructure
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CN114502936A (en) * 2019-10-15 2022-05-13 松下知识产权经营株式会社 Load sensor
KR20230102850A (en) 2021-12-30 2023-07-07 현대자동차주식회사 Preparing method for conductive composite, conductive composite and ppiezoresistive device using the same

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KR20190032988A (en) * 2017-09-20 2019-03-28 숭실대학교산학협력단 Pressure sensor for sensing vertical pressure and Method for manufacturing the same
KR102010175B1 (en) * 2017-09-20 2019-08-13 숭실대학교산학협력단 Pressure sensor for sensing vertical pressure and Method for manufacturing the same
KR20190069078A (en) * 2017-12-11 2019-06-19 울산과학기술원 Pressure sensor component using piezoresistivity and assembly thereof
KR102070873B1 (en) * 2017-12-11 2020-01-29 울산과학기술원 Pressure sensor component using piezoresistivity and assembly thereof
KR20190142964A (en) * 2018-06-19 2019-12-30 한국과학기술원 Piezoresistive Sensor Module of Self-generating Function
KR102085295B1 (en) * 2018-06-19 2020-03-05 한국과학기술원 Piezoresistive Sensor Module of Self-generating Function
CN109443609A (en) * 2018-10-29 2019-03-08 陕西科技大学 A kind of high-precision piezoresistance sensor material and preparation method thereof based on collagen
KR102180901B1 (en) * 2019-03-05 2020-11-19 김병곤 Pressure Resistive Pressure Sensor with Easy Pressure Distribution Confirmation Structure
KR20200106745A (en) * 2019-03-05 2020-09-15 김병곤 Pressure Resistive Pressure Sensor with Easy Pressure Distribution Confirmation Structure
CN114502936A (en) * 2019-10-15 2022-05-13 松下知识产权经营株式会社 Load sensor
CN114502936B (en) * 2019-10-15 2024-04-26 松下知识产权经营株式会社 Load sensor
CN111830086A (en) * 2020-05-07 2020-10-27 西安电子科技大学 Preparation method of gas sensor based on polyaniline film surface modification
CN111982362A (en) * 2020-08-25 2020-11-24 工科思维技术(深圳)有限公司 Method for preparing high-sensitivity flexible piezoresistive sensor based on fracture microstructure
CN111982362B (en) * 2020-08-25 2022-12-20 工科思维技术(深圳)有限公司 Method for preparing high-sensitivity flexible piezoresistive sensor based on fracture microstructure
CN112374490A (en) * 2020-10-31 2021-02-19 华南理工大学 Three-dimensional porous graphene/polyurethane flexible stress-strain sensor and preparation method thereof
CN112374490B (en) * 2020-10-31 2022-08-16 华南理工大学 Three-dimensional porous graphene/polyurethane flexible stress-strain sensor and preparation method thereof
KR20230102850A (en) 2021-12-30 2023-07-07 현대자동차주식회사 Preparing method for conductive composite, conductive composite and ppiezoresistive device using the same

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