KR101632291B1 - Multi layered or multi segmented phosphor-in-glass and LED applications comprising the same - Google Patents

Abstract

The present invention relates to a phosphor-glass plate (PiG). More specifically, the present invention relates to a PiG which prevents an energy loss due to reabsorption of a phosphor and improves light emitting efficiency, and an LED application product including the PiG. The PiG includes two or more certain areas formed by only dispersing a homogeneous phosphor inside one medium.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a high-efficiency phosphor plate and an LED application product including the phosphor plate,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phosphor plate (Phosphor-Glass Plate (PiG)), and more particularly, to a phosphor plate for preventing energy loss due to reabsorption of a phosphor and improving luminous efficiency and an LED application product comprising the phosphor plate will be.

A phosphor plate, in particular, PiG (Phosphor-in-Glass, PiG) is a plate type color conversion member manufactured by mixing a low melting point glass frit and a phosphor, It is a packaging method to receive.

The existing white LED product is a color conversion element in which YAG: Ce ³⁺ yellow (- yellow) phosphor is mixed with an organic binder such as epoxy and mounted on a blue LED chip. It is used for long time use and high output, The efficiency of the LED product and the life span of the LED product are reduced due to the deterioration of the phosphor due to the deterioration of the phosphor and the discoloration of the organic binder.

Recently, a variety of approaches have been actively attempted to increase the lifetime and efficiency of LED products. Recently, silicon is being used instead of organic binder, but fundamental problems such as moisture absorption and oxygen permeation are not solved. In order to improve the deterioration of the phosphor, a conventional YAG: Ce ³⁺ phosphor is mixed with a highly thermally stable oxynitride series Research and development is being actively pursued to replace it, but phosphor production is difficult and the unit price is very high, which limits practical application.

In order to solve these problems, it is most important not to use an organic binder such as an organic binder or a silicon material, and to prevent direct contact with a light source. For this purpose, a thermal durable inorganic material- A remote-type structure that does not need to be contacted is emerging as the fundamental solution, and PiG is being studied as a new packaging method satisfying this.

As an example of such a technique, Korean Patent Laid-Open No. 10-2013-0059674 discloses a reflector cup; A blue light emitting diode mounted on the bottom of the reflector cup; And a frit glass plate spaced apart from the blue light emitting diode on the reflector cup, wherein the frit glass plate includes a sulfide phosphor and another phosphor.

As such, white LEDs based on PiG are being put to practical use in automobile headlamps, backlights for LCD-TVs, general lighting, and the demand is expected to expand sharply. Such a white LED including PiG has an advantage of long life because it is an environmentally friendly solid device because mercury is not used. However, as in the above-mentioned patent, the luminous efficiency is increased due to the superposition of the emission-excitation wavelength of the heterogeneous phosphor mixed non- The problem of declining remains a challenge to be solved.

However, since white LED lighting is now replacing incandescent lamps and it is predicted that fluorescent lamps will replace fluorescent lamps in the future, social and economic impacts are very significant if white LED lighting including PiG replace all existing lighting methods .

As a result of a number of studies, the inventors of the present invention paid attention to the fact that the luminous efficiency is increased by blocking the plate gap generated when several plates made of the same kind of phosphor are rearranged to prevent superimposition of the emission-excitation wavelengths of the phosphors included in PiG. Completed.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method and a device for reducing the luminous efficiency of light emitted by overlapping of emission-excitation wavelengths in which fluorescent materials are unevenly mixed in a conventional glass medium, And a method of manufacturing the phosphor plate, and an LED application product comprising the phosphor plate.

Another object of the present invention is to eliminate the overlap of the emission-excitation wavelengths without forming an air layer by the gap between the phosphor plates to prevent the loss of light escaping into the gap when the blue light generated from the LED chip passes through the phosphor plate, A phosphor plate capable of maintaining the color purity of the LED and capable of increasing the luminous efficiency of the whole light, a method of manufacturing the phosphor plate, and an LED application product including the phosphor plate.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above-mentioned object, the present invention provides a phosphor plate including two or more predetermined regions formed by dispersing only a homogeneous phosphor in one medium.

In a preferred embodiment, the one medium is made of at least one of glass or transparent ceramics.

In a preferred embodiment, the two or more constant regions are formed on different planes and their boundary surfaces are in contact with each other to form a multi-layer structure.

In a preferred embodiment, the two or more constant regions are formed on the same plane, and their boundary sides are in mutual contact with each other to form a multi-partition structure.

In a preferred embodiment, the phosphors dispersed in the two or more regions are different from each other.

The present invention also relates to a method for preparing a phosphor comprising the steps of: preparing a reaction mixture in which two or more reaction mixtures in which an inorganic material powder and a phosphor are mixed are prepared; Forming a mold in which at least two partition parts are formed by inserting the two or more reaction mixtures so that the two or more reaction mixtures are separated from each other in a predetermined area; And a plate forming step of pressing the two or more partition sections formed in the mold and then heat-treating the phosphor plate to mold the phosphor plate.

In a preferred embodiment, the method further comprises a polishing step of polishing the surface of the formed phosphor plate.

In a preferred embodiment, the inorganic material powders contained in the two or more reaction mixtures are the same, and the phosphors are different phosphors.

In a preferred embodiment, the inorganic material powder contained in the reaction mixture is at least one of glass frit or transparent ceramic.

In a preferred embodiment, when the two or more partition sections are formed on different planes, the partitioning step may be performed by inserting any one of the two or more reaction mixtures into the mold, applying a predetermined pressure in the inserted state, A lower layer forming step of forming a layer having a flat surface; And an upper layer forming step of inserting another reaction mixture on the surface of the lower layer and applying a certain pressure to form an upper layer having a flat surface.

In a preferred embodiment, when the two or more sections are formed on the same plane, the section forming step includes the steps of: providing a separation membrane so that two or more section spaces are formed in the prepared mold; The same amounts of different reaction mixtures are respectively inserted into two or more compartment spaces formed by the separator, and a certain pressure is applied to the surfaces of the compartment layers formed in the respective compartment spaces, A partition layer forming step; And a separation membrane removing step of removing the separation membrane with the partition layer being held.

In a preferred embodiment, the plate forming step is pressurized to 0.5 to 1.5 tons and then heat-treated at 500 ° C to 700 ° C.

Further, the present invention provides a light-emitting device comprising any one of the above-described phosphor plates or a phosphor plate manufactured by any one of the manufacturing methods.

The present invention also relates to an excitation light source of 300 nm to 470 nm; And a phosphor plate made by any one of the above-described phosphor plates or any one of the manufacturing methods.

In a preferred embodiment, the color coordinates of the 3000K white light formed in the white light emitting device are (0.41, 0.38) or close to this value.

In a preferred embodiment, the white light emitting device includes a light emitting diode, a laser diode, a surface emitting laser diode, an inorganic electroluminescence device, or an organic electroluminescence device.

The present invention has the following excellent effects.

First, according to the present invention, a structure in which two or more layers or compartments are formed in a certain region in which a homogeneous phosphor is dispersed in one medium is used to superimpose the emission-excitation wavelengths in which the phosphors are unevenly mixed in the conventional glass medium It is possible to prevent the reduction of the light emitting efficiency through the light emitting diode.

In addition, according to the present invention, it is possible to prevent the loss of light that escapes into the gap when the blue light generated from the LED chip passes through the phosphor plate while eliminating overlap of the emission-excitation wavelengths, It is possible to maintain the color purity of the LED and increase the luminous efficiency of the whole light.

Although the present invention has been fully described by way of example with reference to the accompanying drawings, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Of course.

FIG. 1A is a photomicrograph of a known phosphor plate including a phosphor non-uniformly in a glass medium, and FIG. 1B is a schematic diagram showing a dispersion state of the phosphor in a known phosphor plate.
FIGS. 2A and 2B are schematic diagrams of a known phosphor plate prepared by rearranging two or four pieces of cut phosphor plates each made of a homogeneous phosphor, FIG. 2C is a schematic view of a known phosphor plate manufactured by rearranging a cut phosphor plate And FIG. 2D is a schematic view of a white light emitting device including the phosphor plate shown in FIG. 2B.
3A is a schematic view of a multi-layered phosphor plate according to an embodiment of the present invention, FIG. 3B is a schematic view of a multi-layered structure phosphor plate according to another embodiment of the present invention, FIG. 3C is a cross- 3B is a cross-sectional view briefly showing a manufacturing process of the multi-zone structure phosphor plate.
4 is a schematic view of a white light emitting device including a 450 nm LED chip, a 450 nm LED chip including the phosphor plate shown in FIGS. 2A and 2B, and a phosphor plate shown in FIGS. 3A and 3B.
Figs. 5A to 5C are cross-sectional views illustrating a light emitting device including the phosphor plate shown in Fig. 1A, a light emitting device including the phosphor plate shown in Fig. 2B, and a phosphor plate shown in Figs. 2A, 2B, 3A, And the EL data of the LED device including the 450 nm LED chip are compared and analyzed.
6 is a color coordinate comparison graph of the light emitting device including the phosphor plate shown in Figs. 2A, 2B, 3A, and 3B.
7A and 7B are SEM-mapping images and analysis graphs showing that the upper and lower divisions are distinguished in the multi-layered phosphor plate shown in FIG. 3A.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. Also, in certain cases, there may be a term selected arbitrarily by the applicant, in which case the meaning thereof will be described in detail in the description of the corresponding invention. Accordingly, the terms used in the present invention should not be construed to be mere terms, but should be interpreted based on the ordinary meanings of the terms and contents described throughout the specification of the present invention. In particular, where the use of the terms " about ", "substantially" or " about " is used, it can be interpreted that the manufacturing and material tolerances inherent in the stated meanings are used in the numerical value or in close proximity to the numerical value .

Hereinafter, the technical structure of the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.

However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Like reference numerals used to describe the present invention throughout the specification denote like elements.

The technical feature of the present invention resides in a phosphor plate having a structure in which two or more layers or sections are formed in a certain region in which a homogeneous phosphor is dispersed in one medium, a method of manufacturing the same, and various LED applications including the same. The present invention will be described.

That is, in order to prevent superimposition of emission-excitation wavelengths, which are caused by non-uniform mixing of the xenon phosphors in a conventional glass medium in a conventional phosphor plate such as PiG, when a plurality of plates made of the same kind of phosphor are prepared and rearranged to manufacture a phosphor plate, The light emission efficiency is reduced due to the gap. The present invention not only prevents overlapping of emission-excitation wavelengths of phosphors through a structure in which two or more layers or compartments are formed in a certain region in which a homogeneous phosphor is dispersed in one medium, This is because the air layer formed by the gap between the phosphor plates is not formed, so that the light emitted from the LED chip can pass through the phosphor plate to prevent the loss of light escaping into the gap, thereby achieving higher luminous efficiency.

Accordingly, the phosphor plate of the present invention is characterized in that two or more predetermined regions formed by dispersing only the homogeneous phosphor in one medium are included.

Here, the medium included in the phosphor plate of the present invention is not limited as long as it is transparent and a material capable of dispersing the phosphor, but may be made of at least one of glass or transparent ceramics as an embodiment.

The two or more predetermined regions included in the phosphor plate of the present invention may be formed on different planes or on the same plane. If two or more predetermined regions are formed on different planes, The multi-layer structure can be formed by interfacing with each other, and when the multi-layer structure is formed on the same plane, the boundary sides thereof are mutually interposed to form a multi-partition structure. At this time, the number of certain regions included in the phosphor plate is not limited as long as it does not affect the luminous efficiency, but it may be 6 or less considering the optical aspect. That is, it is necessary to prevent the optical characteristics of the phosphor plate from being damaged due to overlapping of the luminescence-excitation spectrum of the phosphor.

When two or more predetermined regions are formed on the phosphor plate in a multi-layer structure or a multi-partition structure, the phosphors dispersed in a certain region are included in the same kind of phosphor, but at least one phosphor in which the layer or the partition is dispersed in another region The above may include a different phosphor from the phosphor contained in the other layer or compartment, but may also include a different kind of phosphor which is different or only partially different.

Next, the phosphor plate manufacturing method of the present invention includes a reaction mixture preparing step, a compartment forming step, and a plate forming step. If necessary, it may further comprise a polishing step.

First, the reaction mixture preparing step is a step of preparing two or more reaction mixture in which the inorganic material powder and the fluorescent material are mixed, and it is prepared according to the number of the predetermined regions to be formed in one medium. Here, the inorganic material powders contained in the two or more reaction mixtures may be the same or different from each other, but the phosphors included in each of the two or more reaction mixtures are at least two or more different phosphors. In other words, if the reaction mixture contains 4 phosphors, if the phosphors contained in the two reaction mixtures are A phosphors, the phosphors included in the other two reaction mixtures may be B phosphors, or the four reaction mixtures may be different from each other such that A phosphors, B phosphors, C phosphors The reaction mixture may be prepared to include the phosphor and the D phosphor. The inorganic material powder contained in the reaction mixture may be at least one of glass frit or transparent ceramic.

The step of forming the compartment includes a step of inserting two or more reaction mixtures into a prepared mold such that the two or more reaction mixtures are separated from each other to form a predetermined region, thereby forming two or more divided portions, wherein two or more divided portions are formed on different planes, Or may be carried out through different processes depending on whether they are formed on the substrate.

When two or more partition parts are formed on different planes, the partition forming step is a step of forming a lower layer which is formed by inserting any one of two or more reaction mixtures into a mold and applying a certain pressure in a state of being inserted, step; And an upper layer forming step of inserting another reaction mixture on the surface of the lower layer and applying a certain pressure so as to form an upper layer whose surface is flat. In the case of two or more reaction mixtures, the upper layer forming step is repeatedly performed To form a multi-layer structure.

When two or more partitions are formed on the same plane, the division forming step includes the steps of: installing a separation membrane so that two or more division spaces are formed in the prepared mold; The same amount of different reaction mixtures are respectively inserted into two or more compartment spaces formed by the separator and a certain pressure is applied so that the surface of the compartment is flattened so that the surfaces of the compartment layers formed in the respective compartment spaces are all located on the same plane A layer forming step; And a separation membrane removing step of removing the separation membrane while the partition layer is maintained. Here, the separator may be any material as long as the reaction mixture is well divided in the compartment space, but a polymeric film is used as the separator in the embodiment of the present invention.

Third, the plate forming step may be performed by pressurizing at least two compartments formed in the mold and then heat-treating the phosphor plate to pressurize the phosphor plate at 0.5 to 1.5 tons, followed by heat treatment at 500 to 700 ° C. In this case, the pressing time may be 10 minutes or less, and the heat treatment time may be 10 minutes to 30 minutes or less. The prescribed pressure, temperature and time conditions are experimentally determined optimum values.

Fourthly, the polishing step is a step of polishing the surface of the formed phosphor plate. It is unnecessary if the surface of the phosphor plate obtained after the molding is a mirror surface, but when the surface is not a mirror surface, the surface is polished using known polishing means To be mirror-finished. Also, the thickness of the finished phosphor plate can be adjusted. The thickness of the phosphor plate finally obtained through polishing may be 1 mm or less.

Next, the light emitting device of the present invention includes an excitation light source and the above-described phosphor plate. In particular, in the case of a white light emitting device, an excitation light source of 300 nm to 470 nm may be included depending on the number of the same phosphor regions included in the multi-layer or multi-partition region of the phosphor plate and the phosphor plate. That is, when a blue LED chip (420 nm to 470 nm) is used as an excitation light source as described later, a phosphor plate including a certain region formed of a green phosphor and a certain region formed of a red phosphor is included to form a white light emitting device However, in the case where the phosphor plate has a structure including a certain region formed by a blue phosphor, a certain region formed by a green phosphor, and a certain region formed by a red phosphor, a near UV LED may be used as an excitation light source. As described above, the color coordinates of the 3000 K white light formed in the white light emitting device including the phosphor plate of the present invention are excellent (0.41, 0.38) or close to the value. Here, the proximity means that the error is within 10% of the optimum value.

The phosphor plate of the present invention can be applied to various LED application products including light emitting diodes, laser diodes, surface emission laser diodes, inorganic electroluminescence elements, or organic electroluminescence elements.

Example 1

The phosphor plate 1 having the structure shown in Fig. 3A was prepared in the following manner.

1. Reaction mixture preparation step

The reaction mixture 1 was prepared by mixing 95.85 wt% of glass frit composed of SiO ₂ -B ₂ O ₃ -RO (R = Ba, Zn, Mg) and the remaining weight of a commercial phosphor CaAlSiN ₃ : Eu ²⁺ (CASN) , 95.85% by weight of glass frit composed of SiO ₂ -B ₂ O ₃ -RO (R = Ba, Zn, Mg) component and the remaining weight of a commercial phosphor Lu ₃ Al ₅ O ₁₂ : Ce ³⁺ (LuAG) Mixture 2 was prepared.

2. Block formation step

The reaction mixture 1 was inserted into the prepared mold as shown in the first figure of FIG. 3c (a), and the mixture was pressurized at a pressure of 0.5 to 1.5 ton to form a flat layer having a thickness of 1 mm to form a lower layer. Thereafter, the reaction mixture 2 was placed on the surface of the lower layer, and the mixture was pressurized with a pressure of 0.5 to 1.5 ton to form a flat layer, thereby forming an upper layer with a thickness of 1 mm.

3. Plate forming step

As shown in the second figure of FIG. 3c (a), the entire surface of the upper layer is pressurized to 1 ton by using a tool such as a punch and then heat-treated in a 600 degree atmosphere to obtain a cross-section of the multi- Was formed. Thereafter, both surfaces of the phosphor plate 1 were polished with sandpaper and mirror-polished to have a thickness of 1 mm to obtain a phosphor plate 1 having the structure shown in Fig. 3A.

Example 2

The phosphor plate 2 having the structure shown in FIG. 3B was prepared in the following manner.

1. Reaction mixture preparation step

The reaction mixture 1 and the reaction mixture 2 were prepared in the same manner as in Example 1.

2. Block formation step

A separator made of a polymer film material having a structure capable of dividing the space inside the prepared mold into four parts was inserted. Thereafter, the same amount of the reaction mixture 1 and the reaction mixture 2 were inserted so as to have the same cross-sectional shape as the first figure of FIG. 3 (b) When the reaction mixture 1 and the reaction mixture 2 were inserted into the mold separated by the separator, the mixture was pressurized with a pressure of 0.5 to 1.5 tons to form a flat layer having a thickness of 1.5 mm. Thereafter, the separation membrane is removed, and it can be easily removed by pulling the separation membrane toward the upper side of the mold.

3. Plate forming step

As shown in the second figure of FIG. 3c (b), the entire surface of the same plane is partitioned by a tool such as a punch or the like, and then subjected to heat treatment in an atmosphere of 600 degrees, Thereby forming a phosphor plate 2 having a cross section of a partition structure. Thereafter, both surfaces of the phosphor plate 2 were polished with sandpaper and mirror-polished to have a thickness of 1 mm to obtain a phosphor plate 2 having the structure shown in Fig. 3B.

Example 3

A one-step double layer PiG as shown in the first quadrant of FIG. 4 was prepared so as to include the phosphor plate 1 obtained in Example 1 and the LED chip of 450 nm.

Example 4

A one-step compartmental 4-quadrant PiG as shown in the fourth quadrant of FIG. 4 was prepared to include the phosphor plate 2 obtained in Example 2 and the LED chip of 450 nm.

Comparative Example 1

A glass frit composed of SiO ₂ -B ₂ O ₃ -RO (R = Ba, Zn, Mg) component, 2.75 wt% of Lu ₃ Al ₅ O ₁₂ : Ce ³⁺ (LuAG) and CaAlSiN ₃ : 1.4% by weight of Eu ²⁺ (CASN) phosphor were mixed and then pressurized to 1 ton, followed by heat treatment in an atmosphere of 600 ° C. The surface was polished to obtain a comparative phosphor plate 1 having a thickness of 1 mm.

Comparative Example 2

95.85% by weight of glass frit composed of SiO ₂ -B ₂ O ₃ -RO (R = Ba, Zn, Mg) component and Lu ₃ Al ₅ O ₁₂ : Ce ³⁺ (LuAG) , Followed by pressing in one ton, followed by heat treatment in an atmosphere of 600 degrees, and the surface was polished to obtain a comparative phosphor plate 2-1. Then, 95.85 wt% of glass frit composed of SiO ₂ -B ₂ O ₃ -RO (R = Ba, Zn, Mg) component and the remaining weight of CaAlSiN ₃ : Eu ²⁺ (CASN) And then heat-treated in a 600-degree atmosphere, and the surface was polished to obtain a comparative example phosphor plate 2-2 having a thickness of 1 mm.

Comparative Example 3

The comparative phosphor plate 2-1 and the comparative phosphor plate 2-2 obtained in Comparative Example 2 were cut as shown in Fig. 2C, and two pieces were rearranged to obtain a comparative phosphor plate 3 having the structure shown in Fig. 2A .

Comparative Example 4

The comparative example phosphor plate 2-1 and the comparative example phosphor plate 2-2 obtained in Comparative Example 2 were cut as shown in Fig. 2C, and the four pieces were rearranged to obtain the comparative example phosphor plate 4 having the structure shown in Fig. 2B .

Comparative Example 5

In order to have the structure as shown in the second quadrant of FIG. 4 and to include the phosphor plate prepared in the state in which the comparative plate 2-2 was overlapped on the comparative phosphor plate 2-1 obtained in Comparative Example 2 and the LED chip of 450 nm in the comparative example A light emitting device 1 (double layer PiG) was prepared.

Comparative Example 6

The comparative example phosphor plate 4 obtained in Comparative Example 4 and the comparative example light emitting element 2 [Diced 4-piece PiG; 4 pieces (4-PiG)] were prepared.

Comparative Example 7

A comparative phosphor plate 1 obtained in Comparative Example 1 and a Comparative Example 3 (Reference PiG emission) including a 450 nm LED chip were prepared.

Comparative Example 8

A comparative example phosphor plate 2-1 obtained in Comparative Example 2 and a comparative light emitting element 4 (Green LuAG: Ce ^{3 +} excitation) including an LED chip were prepared.

Comparative Example 9

A comparative example phosphor plate 2-2 obtained in Comparative Example 2 and a comparative light emitting element 5 (Red CASN: Eu ^{2 +} excitation) including an LED chip were prepared.

Comparative Example 10

Comparative Example 3 [2 pieces (2-PiG)] containing the comparative phosphor plate 3 obtained in Comparative Example 3 and an LED chip of 450 nm were prepared.

Experimental Example 1

The comparative phosphor plate 1 obtained in Comparative Example 1 was observed, and a plane photograph thereof was shown in FIG. 1A, and the dispersed state of the phosphor dispersed in the medium was shown in FIG. 1B.

As shown in FIG. 1B, it can be seen that the two types of phosphors included in the comparative phosphor plate 1 are not uniformly dispersed in the homogeneous phosphor but mixed with each other.

Experimental Example 2

The emission-excitation spectrum and optical characteristics of the comparative light-emitting device 3 (Reference PiG emission) obtained in Comparative Examples 7 to 9 were compared with those of the comparative light-emitting device 5 (Red CASN: Eu ²⁺ excitation). The emissive-excitation spectrum and the EL characteristics through the measured rearrangement were compared and analyzed, and the results are shown in FIG. 5A.

From FIG. 5A, it can be seen that the comparative example light emitting element 3 shows white light while the comparative example light emitting element 4 shows green light, and the comparative example light emitting element 5 shows red light.

Experimental Example 3

Light emitting devices 2 [4 pieces (4 PiG)] obtained in Comparative Example 6, Reference PiG emission 3 obtained in Comparative Example 7, and Comparative Example 10 [2 pieces 2-PiG)] were investigated for their emission-excitation spectra and optical properties. The emissive-excitation spectrum and the EL characteristics through the measured rearrangement were compared and analyzed, and the results are shown in FIG. 5B.

From FIG. 5B, it can be seen that the comparative light-emitting element 2 and the comparative light-emitting element 6 show white light having a light emission intensity close to that of the comparative light-emitting element 3.

Experimental Example 4

One-step double layer PiG and one-step compartmental 4-quadrant PiG obtained in Examples 3 and 4 and Comparative Example 5 and Comparative Example 6 obtained in Comparative Example 6 (double layer PiG) and Comparative Example 2 (Diced 4-piece PiG) were investigated. The luminescence-excitation spectrum and EL characteristics through the measured rearrangement were compared and analyzed, and the results are shown in Fig. 5c.

5C, the emission intensity of the white light of the light emitting device 1 (one-step double layer PiG) and the light emitting device 1 of the comparative example (double layer PiG) are compared. It can be seen that the light emitting element 1 of the present invention having no air layer has remarkably excellent light emission intensity.

In addition, the emission intensity of the white light of the one-step compartmental 4-quadrant PiG and the diced 4-piece PiG are compared, It can be seen that the light emission intensity of the light emitting element 2 having no air layer is remarkably superior to that of the light emitting element 2.

Experimental Example 5

One-step double layer PiG and one-step compartmental 4-quadrant PiG obtained in Examples 3 and 4 and Comparative Example 5 and Comparative Example 6 obtained in Comparative Example 6 (double layer PiG) and a comparative example light emitting device 2 (Diced 4-piece PiG).

6, the color coordinates of the 3000K white light produced by combining the phosphor plate PiG and the 450nm blue chip are numerically represented. The results are shown in Table 1, It can be seen that the color coordinate values of the light-emitting elements 1 and 2 are similar to the values (0.41, 0.38) which were the target values.

Experimental Example 6

The structure of the phosphor plate 1 obtained in Example 1 was observed with an SEM, and the results are shown in Figs. 7A and 7B.

From the SEM image of FIG. 7A, it can be seen that the arrangement of the phosphor plate 1 is formed in such a form that the upper and lower sections can be clearly distinguished. The SEM images of the regions of FIG. 7B to FIG. 7A clearly show that the homogeneous phosphor It can be confirmed that a certain region is formed.

Experimental Example 7

One-step double layer PiG and one-step compartmental 4-quadrant PiG obtained in Examples 3 and 4 and Comparative Example 5 and Comparative Example 6 obtained in Comparative Example 6 (double layer PiG) and the comparative example light emitting device 2 (Diced 4-piece PiG), respectively. The results are shown in Tables 1 and 2 below.

Table 1 and Table 2 below. From Table 2, it can be seen that the light emitting device 2 (one-step compartmental 4-quadrant PiG) has the highest luminous efficiency through comparison of luminous efficiency within the similar coordinate range.

The above-described experimental results show that the phosphor plate according to the present invention has better optical characteristics through elimination of the clearance between the phosphor plates through rearrangement while suppressing the efficiency reduction due to the overlapping of the phosphor-excitation spectrum inherent in the phosphor plate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, And falls within the scope of the present invention.

Claims (16)

delete delete delete delete delete A reaction mixture preparation step of preparing two or more reaction mixtures in which an inorganic material powder and a phosphor are mixed; Forming a mold in which at least two partition parts are formed by inserting the two or more reaction mixtures so that the two or more reaction mixtures are separated from each other in a predetermined area; And a plate forming step of pressing the at least two compartments formed in the mold and then performing heat treatment to form the phosphor plate,
When the two or more sections are formed on the same plane, the section forming step includes the steps of: installing a separation membrane so that at least two compartment spaces are formed in the prepared mold; The same amounts of different reaction mixtures are respectively inserted into two or more compartment spaces formed by the separator, and a certain pressure is applied to the surfaces of the compartment layers formed in the respective compartment spaces, A partition layer forming step; And a separation membrane removing step of removing the separation membrane with the partition layer being maintained.
The method according to claim 6,
And a polishing step of polishing the surface of the molded phosphor plate.
The method according to claim 6,
Wherein the inorganic material powders contained in the two or more reaction mixtures are the same and the phosphors are different phosphors.
The method according to claim 6,
Wherein the inorganic material powder contained in the reaction mixture is at least one of glass frit and transparent ceramic.
delete delete The method according to claim 6,
Wherein the plate forming step is performed at a temperature ranging from 0.5 to 1.5 tons, and then a heat treatment is performed at a temperature ranging from 500 to 700 占 폚.
A light emitting device comprising a phosphor plate produced by the method of any one of claims 6 to 9 and 12.
An excitation light source of 300 nm to 470 nm; And
A white light emitting device comprising a phosphor plate produced by the method of any one of claims 6 to 9 and 12.
15. The method of claim 14,
And a color coordinate of the 3000K white light formed in the white light emitting device is (0.41, 0.38).
15. The method of claim 14,
Wherein the white light emitting device comprises a light emitting diode, a laser diode, a surface emitting laser diode, an inorganic electroluminescence device, or an organic electroluminescence device.

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