KR101626209B1 - Semiconductive tape for high voltage cable, method of manufacturing the same and high voltage cable having the same - Google Patents

Abstract

The semi-conductive tape for a high-voltage electric wire includes a lower half-conductor layer and an upper half-conductor layer of a composite semiconducting material. The composite semiconductive material is composed of longitudinal fibers extending in the machine direction and containing a material having high tensile strength, And an inner semiconductive layer formed by filling the inner space formed by the longitudinal fibers and the transverse fibers and drying the liquid emulsion resin composition. The inner semiconductive layer is formed by combining the longitudinal semi- The upper semiconductive layer is adhered on the lower surface of the whole composite semipermeable sheet and is formed integrally with the entire composite semipermeable sheet and is dried by drying the liquid emulsion resin composition. And is formed by drying the liquid emulsion resin composition.

Description

TECHNICAL FIELD [0001] The present invention relates to a semi-conductive tape for a high-voltage electric wire, a method of manufacturing the same, and a high-voltage electric wire including the same. BACKGROUND OF THE INVENTION [0002]

TECHNICAL FIELD The present invention relates to a semi-conductive tape for high-voltage electric wires, a method for manufacturing the same, and more particularly to a semi-conductive tape for a high-voltage electric wire which is environmentally friendly and can prevent fire danger, a method for manufacturing the same, and a wire will be.

In the case of high-voltage wires, various problems arise which are not generated in a normal wire because the voltage to be transmitted is very high. Due to the high energy transferred, insulation breakdown may occur in the wire sheath, high temperature may occur, and electromagnetic interactions with adjacent wires may occur.

In order to solve these problems, a technique of forming a semiconductive layer surrounding a conductor in a high voltage wire is widely used. The semiconductive layer relaxes the difference in permittivity between the conductor, the insulating layer and the covering layer, thereby relieving the deterioration of the insulator due to the electrical energy generated in the conductor.

However, since the materials used to produce the semiconductive layer contain many toxic organic solvents, they are exposed to environmental pollution, fire and explosion.

In the case of conventional high-voltage electric wires, a three-step extrusion method such as a semiconductive layer extrusion, an insulation layer extrusion, a surface protective layer extrusion and a coating layer extrusion is widely used. In the case of three-stage extrusion, there is an advantage that the method is simple and the cost is saved. However, due to the weight of the extrudate (in particular, before being hardened in the molten state of the semiconductive resin), the gravitational pulling downwardly acts to cause eccentricity. When the copper wire penetrates into the lower part of the semiconductive layer, eccentricity is generated in the completed high-voltage electric wire. If there is an eccentricity in the high-voltage electric wire, electric energy is concentrated in one direction, which causes power loss due to corona discharge or the like, as well as destruction due to energy imbalance of the insulating layer, which reduces the life and increases the accident rate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semi-conductive tape for a high-voltage electric wire which is environmentally friendly and can prevent a fire hazard.

Another object of the present invention is to provide a method of manufacturing the semiconductive tape for high-voltage electric wires.

Another object of the present invention is to provide a wire including the semi-conductive tape for the high-voltage electric wire.

In order to achieve the above-mentioned object of the present invention, a semiconductive tape for a high voltage electric wire includes a composite semiconducting element, a lower semiconductive layer and an upper semiconductive layer. Wherein the composite semiman- tle includes longitudinal fibers extending in a longitudinal direction and containing a material having a strong tensile force, transverse fibers extending in a width direction perpendicular to the longitudinal direction and joined to the longitudinal fibers to form a fabric, And an inner semiconductive layer formed by filling the inner space formed by the transverse fibers and drying the one-pack type emulsion resin composition. The lower semiconductive layer is adhered on the lower surface of the whole composite semipermeable sheet and is formed integrally with the composite semipermeable sheet, and is formed by drying the one-pack type emulsion resin composition. The upper semiconductive layer is attached to the upper surface of the whole composite semipermeable sheet and formed integrally with the composite semipermeable sheet, and is formed by drying the one-pack type emulsion resin composition. Wherein the one-pack type emulsion resin composition is a condensation reaction product of at least one compound selected from the group consisting of a reactive unsaturated silane compound, an alkyltrialkoxysilane compound, an alkoxysilane compound and an alkyl silicate compound and a silica sol; An organic polymer, which is bonded on the condensation reaction product and comprises a copolymer of at least one compound selected from the group consisting of a monomer containing at least one functional group and a reactive unsaturated silane compound and a vinyl or a (meth) acrylic monomer; And an organic solution of an organic / inorganic nanocomposite comprising a metal compound bonded onto the organic polymer, wherein the monomer containing at least one functional group is at least one selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group and an epoxy group And the metal compound includes an oxide, a hydroxide or an alkoxide of 1 to 10 carbon atoms of one metal selected from the group consisting of magnesium, zinc, aluminum, zirconium, iron and titanium.

In one embodiment, the transverse fibers may comprise microfiber fibers.

In one embodiment, the longitudinal fibers include nylon, a centrosome fiber that increases the tensile force in the longitudinal direction; And adsorbent fibers disposed between the adjacent centermost fibers and comprising microfine fibers.

In one embodiment, the longitudinal fibers and the transverse fibers may comprise a hydrophilic material.

In order to accomplish the above-mentioned object of the present invention, there is provided a method for producing a semi-conductive tape for high-voltage electric wire, comprising the steps of: firstly, longitudinally extending fibers extending in the machine direction and having a high tensile strength; The transverse fibers that are extended are woven to produce the fabric. Next, the one-pack type emulsion resin composition is coated on the upper and lower surfaces of the fabric. Thereafter, the thickness of the coated one-pack type emulsion resin composition is adjusted, and the one-pack type emulsion resin composition is intensified so as to penetrate into the fabric. Then, the coated single-pack type emulsion resin composition is dried to form an inner semiconductive layer which fills the inner space formed by the transverse fibers, the longitudinal fibers, and the longitudinal fibers and the transverse fibers, A lower semiconductive layer formed integrally with the entirety of the composite semiconductors on the lower surface of the entire composite semiconductors and an upper semiconductive layer integrally formed on the upper surface of the composite semiconductors. Wherein the one-pack type emulsion resin composition is a condensation reaction product of at least one compound selected from the group consisting of a reactive unsaturated silane compound, an alkyltrialkoxysilane compound, an alkoxysilane compound and an alkyl silicate compound and a silica sol; An organic polymer, which is bonded on the condensation reaction product and comprises a copolymer of at least one compound selected from the group consisting of a monomer containing at least one functional group and a reactive unsaturated silane compound and a vinyl or a (meth) acrylic monomer; And an organic solution of an organic / inorganic nanocomposite comprising a metal compound bonded onto the organic polymer, wherein the monomer containing at least one functional group is at least one selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group and an epoxy group And the metal compound includes an oxide, a hydroxide or an alkoxide of 1 to 10 carbon atoms of one metal selected from the group consisting of magnesium, zinc, aluminum, zirconium, iron and titanium.

In order to achieve the above-mentioned object of the present invention, the high voltage electric wire includes a conductive layer, a semi-conductive tape, a semi-conductive extruded resin, an insulating layer and a sheath. The conductive layer has a structure in which a plurality of interlocking lines are densely compressed. The semi-conductive tape is repeatedly wound on the outside of the conductive layer. The insulating layer surrounds the outer periphery of the semi-conductive tape and insulates the conductive layer and the semi-conductive tape from the outside. The sheath surrounds the outer periphery of the insulating layer to physically protect the sheath from external impact. The semi-conductive tape includes the entirety of the composite semiconductors, the entire lower semiconductive body, and the entire upper semiconductive body. Wherein the composite semiman- tle includes longitudinal fibers extending in a longitudinal direction and containing a material having a strong tensile force, transverse fibers extending in a width direction perpendicular to the longitudinal direction and joined to the longitudinal fibers to form a fabric, And an inner semiconductive layer formed by filling the inner space formed by the transverse fibers and drying the one-pack type emulsion resin composition. The lower semiconductive layer is adhered on the lower surface of the whole composite semipermeable sheet and is formed integrally with the composite semipermeable sheet, and is formed by drying the one-pack type emulsion resin composition. The upper semiconductive layer includes an upper semiconductive layer formed on the entire upper surface of the composite semispherical body and integrally formed with the composite semiconducting layer and formed by drying the one-pack type emulsion resin composition. Wherein the one-pack type emulsion resin composition is a condensation reaction product of at least one compound selected from the group consisting of a reactive unsaturated silane compound, an alkyltrialkoxysilane compound, an alkoxysilane compound and an alkyl silicate compound and a silica sol; An organic polymer, which is bonded on the condensation reaction product and comprises a copolymer of at least one compound selected from the group consisting of a monomer containing at least one functional group and a reactive unsaturated silane compound and a vinyl or a (meth) acrylic monomer; And an organic solution of an organic / inorganic nanocomposite comprising a metal compound bonded onto the organic polymer, wherein the monomer containing at least one functional group is at least one selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group and an epoxy group And the metal compound includes an oxide, a hydroxide or an alkoxide of 1 to 10 carbon atoms of one metal selected from the group consisting of magnesium, zinc, aluminum, zirconium, iron and titanium.

The one-pack type emulsion resin composition may be a one-pack type conductive emulsion resin composition.

According to the present invention, the inner semipermeable layer, the lower semiconductive layer and the upper semiconductive layer are formed using a one-pack type emulsion resin composition which is water-soluble, and no organic solvent is produced during the manufacturing process. Further, the semi-conductive tape for high-voltage electric wires is not toxic, and has high water resistance, alkali resistance, and solvent resistance. Furthermore, the inner semiconductive layer strongly bonds with the longitudinal fibers and the transverse fibers, so that the stability is high. Further, the water-soluble one-pack type emulsion resin composition has high heat resistance and thus reduces the risk of fire.

In addition, by blending the water-soluble semiconductive material coated with the blade into the inside, the received semiconductive material can be densely bonded with the longitudinal fibers and the transverse fibers inside the fabric.

Furthermore, the bonding strength between the inner semiconductive layer and the fabric is improved, including the microfine structure having hydrophilic and hydrophobic fibers.

Further, the longitudinal fibers and the transverse fibers include a hydrophilic coating layer or contain hydrophilic fibers, so that the water-soluble semiconductive material can easily penetrate into the fabric. Therefore, a composite semimajor structure having a dense structure can be formed.

Furthermore, the high-voltage wire includes the semi-conductive tape formed by using the one-pack type emulsion resin composition, so that a fire-resistant, environmentally friendly high-voltage electric wire can be manufactured.

Further, a semi-conductive tape is disposed between the semi-conductive coating layer and the conductive layer to improve the adhesion between the semi-conductive coating layer and the semi-conductive tape. Therefore, the semi-conductive coating layer is prevented from flowing down due to its own weight, and eccentricity is prevented. Further, the thickness of the semi-conductive tape can be reduced, so that the manufacturing cost is reduced.

1 is a partially cutaway perspective view showing a semi-conductive tape for a high voltage electric wire according to an embodiment of the present invention.
2 is a cross-sectional view taken along line A-A 'of FIG.
3 is a flow chart showing a method of manufacturing the semiconductive tape for high-voltage electric wire shown in Fig.
4 is a cross-sectional view showing a method of manufacturing the semiconductive tape for high-voltage electric wires shown in Fig.
5 is a partially cutaway perspective view showing a semi-conductive tape for a high voltage electric wire according to an embodiment of the present invention.
6 is a cross-sectional view taken along line B-B 'of FIG.
7 is an enlarged perspective view showing a fabric applied to a semiconductive tape for a high voltage electric wire according to an embodiment of the present invention.
8 is a cross-sectional view of a semi-conductive tape for a high-voltage wire according to an embodiment of the present invention.
9 is a flowchart showing a step of generating a fabric in a method of manufacturing a semi-conductive tape for a high-voltage electric wire according to an embodiment of the present invention.
10 is a flowchart showing a step of generating a fabric in a method of manufacturing a semi-conductive tape for high-voltage electric wire according to an embodiment of the present invention.
11 is a partially cutaway perspective view showing a high voltage electric wire according to an embodiment of the present invention.
12 is a partially cutaway perspective view showing a high-voltage electric wire according to an embodiment of the present invention.

For the embodiments of the invention disclosed herein, specific structural and functional descriptions are set forth for the purpose of describing an embodiment of the invention only, and it is to be understood that the embodiments of the invention may be practiced in various forms, The present invention should not be construed as limited to the embodiments described in Figs.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and are herein described in detail. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Similar reference numerals have been used for the components in describing each drawing.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having", etc., are intended to specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, But do not preclude the presence or addition of other features, numbers, steps, operations, elements, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings and redundant explanations for the same constituent elements are omitted.

1 is a partially cutaway perspective view showing a semi-conductive tape for a high-voltage electric wire according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A-A 'in FIG.

Referring to FIGS. 1 and 2, a semiconductive tape for a high-voltage wire includes a composite semiconductive body 110, a lower semiconductive layer 120, and an upper semiconductive layer 130.

The composite semipermeable material 110 includes longitudinal fibers 112, transverse fibers 114, and an inner semiconductive layer 115.

The longitudinal fibers 112 extend in the longitudinal direction of the semi-conductive tape for the high-voltage electric wire to increase the tensile force in the longitudinal direction. In this embodiment, the longitudinal fibers 112 include synthetic resin fibers, carbon fibers, glass fibers, natural fibers and the like having high tensile strength. For example, the longitudinal fibers 112 may comprise nylon 66. [ Semi-conductive tape for high-voltage electric wire is used in the pulled state in the longitudinal direction. Therefore, it is possible to prevent the semi-conductive tape for the high-voltage electric wire from being broken by the longitudinal fibers 112 against the tensile force applied to the semi-conductive tape for the high-voltage electric wire.

The transverse fibers 114 extend in the width direction of the semi-conductive tape for the high-voltage electric wire and are combined with the longitudinal fibers 112 so that the semi-conductive tape for the high-voltage electric wire has a stable shape. The longitudinal fibers 112 and the lateral fibers 114 are joined by various methods such as weaving, nonwoven fabrication, fusion, or the like. In this embodiment, longitudinal fibers 112 and transverse fibers 114 are joined by weaving. For example, the longitudinal fibers 112 and the lateral fibers 114 may be joined by various methods such as knitting, twilling, and the like.

In this embodiment, the transverse fibers 114 comprise the same material as the longitudinal fibers 112. [ In another embodiment, the transverse fibers 114 may comprise a different material than the longitudinal fibers 112.

The longitudinal fibers 112 and the transverse fibers 114 constitute the basic skeleton of the composite conductive body 110 and are firmly coupled to the semiconductive layer 115. In this embodiment, the thickness of the composite sheet 110 can be determined by adjusting the thicknesses of the longitudinal fibers 112 and the transverse fibers 114. For example, the diameter of the longitudinal fibers 112 and the lateral fibers 114 is 0.01T to 0.10T, the thickness of the fabric woven using the longitudinal fibers 112 and the lateral fibers 114 is 0.02T To 0.20T.

The inner semiconductive layer 115 fills the space between the longitudinal fibers 112 and the lateral fibers 114 and is firmly engaged with the longitudinal fibers 112 and the transverse fibers 114.

The inner semiconductive layer 115 is formed by drying the one-pack type emulsion resin composition. In the present embodiment, the one-pack type emulsion resin composition comprises a condensation reaction product between a silicon (si) based compound and a silica sol; An organic polymer layer bonded on the condensation reaction product; And an organic / inorganic nanocomposite comprising a metal compound layer bonded on the organic polymer layer, and an aqueous solution. For example, the one-pack type emulsion resin composition may include the composition disclosed in Patent No. 10-1209851 (" one-pack type oil / inorganic emulsion resin composition and a method for producing the same "). The one-pack type emulsion resin composition was developed around 2012. However, the one-pack type emulsion resin composition is not applicable to the semi-conductive tape as in the present invention. This is because, when the one-pack type emulsion resin composition is applied to a fabric woven using a synthetic resin, it is difficult to penetrate the inside of the fabric and a cavity is formed in the middle. However, in the present invention, the one-pack type emulsion resin composition can be penetrated deeply into the fabric by using a microfiber fiber, a hydrophilic coating, a hydrophilic fiber or the like to be described later. In addition, in the method for producing the semiconductive tape for high-voltage electric wire, the step of adjusting the thickness of the semiconducting material coated (step S120 in FIG. 3) by using the blade (50 in FIG. 4) So that the composition can be densely bonded to the fabric.

Since the one-pack type emulsion resin composition is water-soluble, no organic solvent is generated in the drying step.

For example, the one-pack type emulsion resin composition may include a condensation reaction product of a silica sol and at least one compound selected from the group consisting of a reactive unsaturated silane compound, an alkyltrialkoxysilane compound, an alkoxysilane compound and an alkyl silicate compound; An organic polymer, which is bonded on the condensation reaction product and comprises a copolymer of at least one compound selected from the group consisting of a monomer containing at least one functional group and a reactive unsaturated silane compound and a vinyl or a (meth) acrylic monomer; And an organic solution of an organic / inorganic nanocomposite comprising a metal compound bonded onto the organic polymer, wherein the monomer containing at least one functional group is at least one selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group and an epoxy group Functional group, and the metal compound may include an oxide, hydroxide, or alkoxide of 1 to 10 carbon atoms of one metal selected from the group consisting of magnesium, zinc, aluminum, zirconium, iron and titanium.

For example, the silica sol may comprise silica having an average particle size of 5 to 100 nm.

For example, the alkyltrialkoxysilane compound includes a compound represented by the following formula (1), and the reactive unsaturated silane compound includes a (meth) acyloxyalkyltrialkoxysilane compound or a vinyltrialkoxysilane compound represented by the following formula , The alkoxysilane compound includes a compound represented by the following formula (3), and the alkylsilicate compound may include a compound represented by the following formula (4).

[Chemical Formula 1]

R ₁ Si (OR ₂ ) ₃

Wherein R1 is an alkyl group having 1 to 5 carbon atoms, R2 is an alkyl group having 1 to 3 carbon atoms,

(2)

R ₃ -R ₄ -Si (OR ₅ ) ₃

Wherein R ₃ is a (meth) acryloxy group, R ₄ is an alkyl group having 1 to 5 carbon atoms, R ₅ is an alkyl group having 1 to 3 carbon atoms,

(3)

Si (OR < ₆ >) ₄

In Formula 3, R ₆ is an alkyl group having 1 to 3 carbon atoms,

[Chemical Formula 4]

In Formula 4, R ₇ is an alkyl group having 1 to 3 carbon atoms, and n may be an integer of 1 to 10.

For example, the monomer containing at least one functional group may be selected from the group consisting of acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, maleic anhydride, fumaric acid, phthalic acid, phthalic anhydride, (meth) acrylamide, (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl , 3-hydroxybutyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate.

For example, in the copolymer contained in the organic polymer, the reactive unsaturated silane compound may include a (meth) acryloxyalkyltrialkoxysilane compound or a vinyltrialkoxysilane compound represented by the following formula (5).

[Chemical Formula 5]

R ₈ -R ₉ -Si (OR ₁₀ ) ₃

In Formula 5, R ₈ is a (meth) acryloxy group, R ₉ is an alkyl group having 1 to 5 carbon atoms, and R ₁₀ is an alkyl group having 1 to 3 carbon atoms.

For example, the glass transition temperature of the organic polymer may be -100 ° C to 100 ° C.

For example, the average particle size of the organic / inorganic nanocomposite may be 10 nm to 200 nm.

For example, the one-pack type emulsion resin composition may have a viscosity of 50 cps to 50,000 cps at room temperature.

For example, the concentration of solid content of the one-pack type emulsion resin composition may be 20 wt% to 80 wt%.

For example, the organic / inorganic nanocomposite may include 8 to 90% by weight of the condensation reaction product, 8 to 90% by weight of the organic polymer, and 1 to 30% by weight of the metal compound.

The lower semiconductive layer 120 is adhered on the lower surface of the composite semiconductive body 110 and is formed integrally with the composite semiconductive body 110.

The lower semiconductive layer 120 is formed by drying the one-pack type emulsion resin composition. In this embodiment, the lower semiconductive layer 120 is formed from the same material as the inner semiconductive layer 115 of the composite semiconductive body 110.

The thickness of the lower semiconductive layer 120 is thinner than that of the composite semiconductive body 110. In this embodiment, the thickness of the lower semiconductive layer 120 may be 5% to 20% of the thickness of the composite semiconductive body 110. For example, the thickness of the lower semiconductive layer 120 may be 0.005T (mm) to 0.03T. For example, the thickness of the lower semiconductive layer 120 may be 0.01T to 0.02T.

The upper semiconductive layer 130 is adhered on the upper surface of the composite semiconductive body 110 and is formed integrally with the composite semiconductive body 110.

The upper semiconductive layer 130 is formed by drying the one-pack type emulsion resin composition. In this embodiment, the upper semiconductive layer 130 is formed from the same material as the inner semiconductive layer 115 of the composite semiconductive body 110.

The thickness of the upper semiconductive layer 130 is thinner than that of the composite semiconductive body 110. In this embodiment, the thickness of the upper semiconductive layer 130 may be 5% to 20% of the thickness of the composite semiconductive body 110. For example, the thickness of the upper semiconductive layer 130 may be 0.005T (mm) to 0.03T. For example, the thickness of the upper semiconductive layer 130 may be 0.01T to 0.02T.

In this embodiment, the thickness of the upper semiconductive layer 130 is the same as the thickness of the lower semiconductive layer 120. In another embodiment, the upper semiconductive layer 130 and the lower semiconductive layer 120 may have different thicknesses.

In this embodiment, the thickness of the semi-conductive tape for high-voltage electric wire may be 0.01T to 0.10T (mm) and the width may be 50mm to 1cm.

3 is a flow chart showing a method of manufacturing the semiconductive tape for high-voltage electric wire shown in Fig.

Referring to FIGS. 1 to 3, in order to produce a semi-conductive tape for a high-voltage electric wire, first a fabric is woven to produce a fabric (step S100). In this embodiment, the longitudinal fibers 112 in the longitudinal direction and the transverse fibers 114 in the transverse direction are woven to produce the fabric. For example, the width of the fabric may be 48 inches, and the width of the semi-conducting tape for the high voltage wire to be completed may be 50 mm.

Next, the fabric is coated with a water-soluble semiconductive material (step S110). The water-soluble semiconductive material includes a one-pack type emulsion resin composition. In this embodiment, the water-soluble semiconductive material is evenly coated on the upper and lower surfaces of the fabric and penetrates into the fabric.

4 is a cross-sectional view showing a method of manufacturing the semiconductive tape for high-voltage electric wires shown in Fig.

Referring to FIGS. 3 and 4, the thickness of the water-soluble semi-conductive material coated on the fabric is adjusted, and the coated water-soluble semi-conductive material is infiltrated into the fabric (step S120). Since the coated water-soluble semi-conductive material is not uniform in thickness, the outer portion of the coated water-soluble semi-conductive material is scraped off so that the thickness becomes constant. In this embodiment, the blades 50 are provided so as to be in close contact with the upper and lower surfaces of the fabric coated with the water-soluble semiconductive material. The blade 50 scrapes the water-soluble semi-conductive material disposed on the outer surface of the water-soluble semi-conductive material coated on the upper and lower surfaces of the fabric to maintain a constant thickness of the water-soluble semi-conductive material coated on the fabric.

In addition, by blending the water-soluble semi-conductive material coated with the blade 50 inward, the received semi-conductive material can be densely bonded with the longitudinal fibers 112 and the transverse fibers 114 inside the fabric.

Subsequently, the water-soluble semiconductive material coated on the fabric is dried to form the inner semiconductive layer 115, the lower semiconductive layer 120, and the upper semiconductive layer 130 (step S130). In this embodiment, the water-soluble, one-pack type emulsion resin composition does not contain any organic solvent, and only the water vapor is generated without organic solvent being generated in the drying process. For example, the water-soluble semiconducting material coated on the ground can be dried for 5 minutes at a temperature of 100 degrees Celsius.

Next, the inner semiconductive layer 115, the lower semiconductive layer 120, and the upper semiconductive layer 130 are cut to form a semi-conductive tape for a high-voltage wire (step S140). In another embodiment, the width of the fabric may be narrowed and a separate cutting step (step S140) may be omitted.

According to this embodiment, the inner semiconductive layer 115, the lower semiconductive layer 120, and the upper semiconductive layer 130 are formed using a water-soluble one-pack type emulsion resin composition, Do not. Further, the semi-conductive tape for high-voltage electric wires is not toxic, and has high water resistance, alkali resistance, and solvent resistance. Moreover, the inner semiconductive layer 115 strongly bonds with the longitudinal fibers 112 and the transverse fibers 114, so that the stability is high. Further, the water-soluble one-pack type emulsion resin composition has high heat resistance and thus reduces the risk of fire.

In addition, by blending the water-soluble, semi-conductive material coated with the blade 50 inward, the received semiconductive material can be densely bonded to the longitudinal fibers 112 and the transverse fibers 114 inside the fabric.

In other embodiments, longitudinal fibers 112 and transverse fibers 114 do not have a smooth surface and may have a corrugated surface. For example, each of the longitudinal fibers 112 and the lateral fibers 114 may have a corrugated shape having a diameter varying along the fiber axis direction. In other words, the fiber surface is increased by repeating the increase and decrease along the fiber axis. When the surface area of the fiber is increased, a semi-conductive material such as the one-pack type emulsion resin composition can be densely bonded to the inside of the fabric.

FIG. 5 is a partially cutaway perspective view showing a semi-conductive tape for a high-voltage wire according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along line B-B 'of FIG. In the present embodiment, the remaining components except for the fabric are the same as the embodiments shown in Figs. 1 to 4, so duplicate descriptions of the same components will be omitted.

5 and 6, a semiconductive tape for a high voltage electric wire includes a composite semiconductive body 210, a lower semiconductive layer 120, and an upper semiconductive layer 130.

The composite semipermeable material 210 includes the center fiber material 211, the adsorbing material fibers 212, the transverse fibers 114, and the inner semiconductive layer 215.

The center-speckle fibers 211 extend in the longitudinal direction of the semi-conductive tape for the high-voltage electric wire to increase the tensile force in the longitudinal direction. In this embodiment, the central longitudinal fibers 211 include synthetic resin fibers having high tensile strength, carbon fibers, glass fibers, natural fibers and the like. For example, the centrosome fibers 211 may comprise nylon 66. Semi-conductive tape for high-voltage electric wire is used in the pulled state in the longitudinal direction. Therefore, the semi-conductive tape for the high-voltage electric wire can be prevented from being broken by the tensile force applied to the semi-conductive tape for the high-voltage electric wire by the center-

In this embodiment, the thickness of the composite filament 210 can be determined by adjusting the thickness of the center fiber 211. In this embodiment, the thickness of the center-speckle fiber 211 may be about 50% of the thickness of the semi-conductive tape for high-voltage electric wire. For example, the diameter of the center-of-grained fibers 211 is 0.01T (mm) to 0.10T, and the thickness of the fabric woven by the center-of-grained fibers 211, the adsorptive fibers 212 and the transverse fibers 214 is 0.015 T to 0.15T, and the thickness of the semi-conductive tape for high-voltage electric wire may be 0.02T to 0.20T.

The adsorption seed fibers 212 extend in the longitudinal direction of the semi-conductive tape for high-voltage electric wire and have a hydrophilic surface structure such as a microfibre structure to increase the bonding force between the fabric and the inner semiconductive layer 215. The adsorptive fibers 212 are disposed one by one or more between the adjacent central filament fibers 211. When the number of the adsorbent fibers 212 disposed between the adjacent central filament fibers 211 increases, the binding force between the inner semiconductive layer 215 and the fabric is enhanced, but the tensile force in the longitudinal direction decreases. Thus, it is desirable to arrange a suitable number of adsorbent fibers 212 between adjacent centric fibers 211. For example, two adsorptive fibers 212 may be disposed between adjacent pairs of central longitudinal fibers 211.

In this embodiment, the adsorptive fibers 212 may comprise microfiber synthetic resin fibers including fine pores. The diameter of the adsorption seed fibers 212 is smaller than that of the center seed fibers 211. For example, the diameter of the adsorbent fibers 212 may be 0.002T to 0.03T.

The transverse fibers 214 extend in the width direction of the semi-conductive tape for high-voltage electric wire and are combined with the center-of-grained fibers 211 and the adsorption-oriented fibers 212 so that the semi-conductive tape for high-voltage electric wires has a stable shape. In this embodiment, the transverse fibers 214 include the same microfiber synthetic resin fibers as the adsorbent fibers 212 to improve the bonding force between the fabric and the inner semiconductive layer 215. The diameter of the transverse fibers 214 is smaller than that of the central longitudinal fibers 211. For example, the diameter of the transverse fibers 214 may be between 0.002T and 0.03T.

The inner semiconductive layer 215 fills a space between the center fiber yarns 211 and the adsorption seed fibers 212 and the transverse fibers 214 and forms the center fiber yarns 211, the adsorption seed fibers 212, 214, respectively.

In this embodiment, the inner semiconductive layer 215 is formed by drying the one-pack type emulsion resin composition. The one-pack type emulsion resin composition comprises a condensation reaction product between a silicon (si) based compound and a silica sol; An organic polymer layer bonded on the condensation reaction product; And an organic / inorganic nanocomposite comprising a metal compound layer bonded on the organic polymer layer, and an aqueous solution. For example, the one-pack type emulsion resin composition may include the composition disclosed in Patent No. 10-1209851 (" one-pack type oil / inorganic emulsion resin composition and a method for producing the same ").

The manufacturing method of the semi-conductive tape for high-voltage electric wire is the same as that of the embodiment shown in FIGS. 3 and 4, so that a duplicate description of the same components will be omitted.

According to the present embodiment as described above, the adsorbent spunbond fibers 212 and the transverse fibers 214 have a microfine structure having hydrophilicity, so that the bonding strength between the inner semiconductive layer 115 and the fabric is improved.

7 is an enlarged perspective view showing a fabric applied to a semiconductive tape for a high voltage electric wire according to an embodiment of the present invention. In the present embodiment, the remaining components except for the fabric are the same as the embodiments shown in Figs. 1 to 6, so duplicate descriptions of the same components will be omitted.

1 and 7, the semiconductive tape for a high-voltage wire includes the entirety of the composite semiconductors (110 in FIG. 1), the lower semiconductive layer 120, and the upper semiconductive layer 130.

The composite semipermeable (110 in FIG. 1) includes longitudinal fibers 312, transverse fibers 314 and an inner semiconductive layer (115 in FIG. 1).

The longitudinal fibers 312 extend in the longitudinal direction of the semi-conductive tape for the high-voltage electric wire to increase the tensile force in the longitudinal direction. In this embodiment, the longitudinal fibers 312 have a hydrophilic surface structure such as a microfiber structure and increase the bonding force between the fabric and the inner semiconductive layer (115 in FIG. 1).

The transverse fibers 314 extend in the width direction of the semi-conductive tape for high-voltage electric wire and are joined with the center-of-grained fibers 312 to form a raw material, so that the semi-conductive tape for high-voltage electric wire has a stable shape. In this embodiment, the transverse fibers 314 include the same microfiber synthetic fibers as the adsorbent fibers 312 to improve the bonding force between the fabric and the inner semiconductive layer (115 in FIG. 1).

In this embodiment, the diameter of the transverse fibers 314 is smaller than that of the longitudinal fibers 312. For example, the diameters of the longitudinal fibers 312 and the transverse fibers 314 may be 0.002T to 0.03T.

In this embodiment, the longitudinal fibers 312 and the lateral fibers 314 are joined by a weaving method such as knitting, twilling, and the like. In another embodiment, longitudinal fibers 312 and transverse fibers 314 may be randomly joined to form a nonwoven fabric.

The inner semiconductive layer 115 of FIG. 1 fills the space between the longitudinal fibers 312 and the transverse fibers 314 and is firmly engaged with the longitudinal fibers 312 and the transverse fibers 314.

In this embodiment, the inner semiconductive layer (115 in FIG. 1), the lower semiconductive layer 120 and the upper semiconductive layer 130 are formed by drying the one-pack type emulsion resin composition. The one-pack type emulsion resin composition comprises a condensation reaction product between a silicon (si) based compound and a silica sol; An organic polymer layer bonded on the condensation reaction product; And an organic / inorganic nanocomposite comprising a metal compound layer bonded on the organic polymer layer, and an aqueous solution. For example, the one-pack type emulsion resin composition may include the composition disclosed in Patent No. 10-1209851 (" one-pack type oil / inorganic emulsion resin composition and a method for producing the same ").

The manufacturing method of the semi-conductive tape for high-voltage electric wire is the same as that of the embodiment shown in FIGS. 3 and 4, so that a duplicate description of the same components will be omitted.

According to the present embodiment as described above, the longitudinal fibers 312 and the transverse fibers 314 have a microfiber structure having hydrophilicity, so that the bonding force between the inner semiconductive layer (115 in Fig. 1) and the fabric is improved.

8 is a cross-sectional view of a semi-conductive tape for a high-voltage wire according to an embodiment of the present invention. In the present embodiment, the remaining components except for the fabric are the same as those shown in Figs. 1 to 4, so duplicate descriptions of the same components are omitted.

1 and 8, a semiconductive tape for a high voltage electric wire includes a composite semiconductive body 410, a lower semiconductive layer 120, and an upper semiconductive layer 130.

The composite semipermeable material 410 includes longitudinal fibers 412, transverse fibers (not shown), and an inner semiconductive layer 415.

The longitudinal fibers 412 extend in the longitudinal direction of the semi-conductive tape for the high-voltage electric wire to increase the tensile force in the longitudinal direction.

The longitudinal fibers 412 include a longitudinal fiber core 412a and a hydrophilic coating layer 412b.

In this embodiment, the bell-type fiber core 412a includes synthetic resin fibers, carbon fibers, glass fibers, natural fibers and the like having high tensile strength. For example, the bell fiber core 412a may comprise nylon 66. [ Semi-conductive tape for high-voltage electric wire is used in the pulled state in the longitudinal direction. Therefore, the bimetallic fiber core 412a can prevent the semi-conductive tape for the high-voltage electric wire from being cut off against the tensile force applied to the semi-conductive tape for the high-voltage electric wire.

The hydrophilic coating layer 412b is coated along the outer peripheral surface of the bell-formed fiber core 412a. In this embodiment, the hydrophilic coating layer 412b may include an inorganic material such as titanium oxide (TiO2), aluminum, silicon oxide (SiO2) or the like, or a synthetic resin such as fluororesin, GPS resin (Glycidoxypropyl trimethoxysilane) In another embodiment, the longitudinal fiber core 412a may be plasma treated to form the hydrophilic coating layer 412b. In another embodiment, the hydrophilic coating layer 412b may comprise a one-pack type emulsion resin composition used for forming the inner semiconductive layer 415. [

In this embodiment, the transverse fibers (not shown) include a hydrophilic coating layer (not shown) as well as the longitudinal fibers 412. For example, the structure of the transverse fibers (not shown) is the same as that of the longitudinal fibers 412, so duplicate descriptions are omitted.

The inner semiconductive layer 415 fills the space between longitudinal fibers 412 and transverse fibers (not shown) and is firmly engaged with longitudinal fibers 412 and transverse fibers (not shown).

The inner semiconductive layer 415 is formed by drying the one-pack type emulsion resin composition. In the present embodiment, the one-pack type emulsion resin composition comprises a condensation reaction product between a silicon (si) based compound and a silica sol; An organic polymer layer bonded on the condensation reaction product; And an organic / inorganic nanocomposite comprising a metal compound layer bonded on the organic polymer layer, and an aqueous solution. For example, the one-pack type emulsion resin composition may include the composition disclosed in Patent No. 10-1209851 (" one-pack type oil / inorganic emulsion resin composition and a method for producing the same ").

9 is a flowchart showing a step of generating a fabric in a method of manufacturing a semi-conductive tape for a high-voltage electric wire according to an embodiment of the present invention.

1, 3, 8 and 9, in order to produce a semi-conductive tape for a high-voltage wire, raw fibers are first prepared (step S102). In this embodiment, the raw fibers comprise a bell fiber core 412a and a transverse fiber core (not shown).

Subsequently, a hydrophilic coating is applied to the longitudinal fiber core 412a and the transverse fiber core (not shown) (step S104). The hydrophilic coating layer 412b is formed on the bell core 412a to form the bell fibers 412. A hydrophilic coating layer (not shown) is also formed on the transverse fiber core (not shown) to form the transverse fibers (114 in Fig. 1).

Thereafter, the longitudinal fibers 412 in the longitudinal direction and the transverse fibers in the lateral direction (114 in FIG. 1) are woven to produce a fabric (step S100).

Next, the fabric is coated with a water-soluble semiconductive material (step S110). The water-soluble semiconductive material includes a one-pack type emulsion resin composition. In this embodiment, the longitudinal fibers 412 and the transverse fibers (not shown) of the fabric include the hydrophilic coating layer 412b so that the water-soluble semiconductive material can easily penetrate into the fabric.

Thereafter, the thickness of the water-soluble semiconductive material coated on the fabric is adjusted (step S120).

Subsequently, the water-soluble semiconductive material coated on the fabric is dried to form an inner semiconductive layer 415, a lower semiconductive layer 120 and an upper semiconductive layer 130 (step S130).

Next, the inner semiconductive layer 415, the lower semiconductive layer 120 and the upper semiconductive layer 130 are cut to form a semi-conductive tape for a high-voltage wire (step S140).

According to this embodiment as described above, the longitudinal fibers 412 and the transverse fibers (not shown) include the hydrophilic coating layer 412a so that the water-soluble semiconductive material can easily penetrate into the fabric. Therefore, the composite semimajor body 410 having a dense structure can be formed.

10 is a flowchart showing a step of generating a fabric in a method of manufacturing a semi-conductive tape for high-voltage electric wire according to an embodiment of the present invention. In this embodiment, the same as the embodiment shown in Figs. 1 to 9 except for the use of the hydrophilic fiber, so that a duplicate description of the same components will be omitted.

Referring to FIGS. 1, 3 and 10, in order to produce a semi-conductive tape for a high-voltage electric wire, a hydrophilic fiber is first prepared (step S106). In this embodiment, the hydrophilic fibers may include synthetic resins such as polyvinyl alcohol (PVA), natural fibers such as cotton, Tencel and the like.

Subsequently, the hydrophilic fibers are woven to form a fabric (step S108).

Thereafter, the fabric is coated with a water-soluble semiconductive material (step S110). The water-soluble semiconductive material includes a one-pack type emulsion resin composition.

Subsequently, the thickness of the water-soluble semiconductive material coated on the fabric is adjusted (step S120).

The water-soluble semiconductive material coated on the fabric is then dried (step S130).

Thereafter, the fabric is cut to form a semi-conductive tape for high-voltage electric wire (step S140).

According to the present embodiment as described above, the fabric includes hydrophilic fibers so that the water-soluble semiconductive material can easily penetrate into the fabric. Therefore, a composite semimajor structure having a dense structure can be formed.

11 is a partially cutaway perspective view showing a high voltage electric wire according to an embodiment of the present invention.

11, the high-voltage electric wire includes a conductive layer 10, a semi-conductive tape 100, a first insulating layer 20, a second insulating layer 30, and a sheath 40.

The conductive layer 10 includes a metal having a high electrical conductivity. In this embodiment, the conductive layer 10 may include interlocking lines. For example, the conductive layer 10 may have a structure in which a plurality of interlocking lines are densely compressed in a circular shape.

The semi-conductive tape (100) surrounds the outside of the conductive layer (10). The semi-conductive tape 100 may be repeatedly wound around the conductive layer 10 to adhere the semi-conductive tape 100 to the outer surface of the conductive layer 10 in this embodiment. By using the semi-conductive tape 100 as in the present embodiment, the thickness can be uniform and the center axis can be precisely aligned as compared with the semiconductive layer (not shown) produced by the extrusion method. Therefore, it is possible to prevent dielectric breakdown due to eccentricity, so that a plurality of semi-conductive layers (not shown) commonly used in the extrusion method can be omitted. In other words, stable high-voltage transmission is possible even if the semi-conductive tape 100 is not additionally provided.

The semi-conductive tape 100 is formed by drying the one-pack type emulsion resin composition. In the present embodiment, the one-pack type emulsion resin composition comprises a condensation reaction product between a silicon (si) based compound and a silica sol; An organic polymer layer bonded on the condensation reaction product; And an organic / inorganic nanocomposite comprising a metal compound layer bonded on the organic polymer layer, and an aqueous solution. For example, the one-pack type emulsion resin composition may include the composition disclosed in Patent No. 10-1209851 (" one-pack type oil / inorganic emulsion resin composition and a method for producing the same ").

The first insulating layer 20 surrounds the outer periphery of the semi-conductive tape 100 and primarily insulates the conductive layer 10 and the semi-conductive tape 100 from the outside. In this embodiment, the first insulating layer 20 includes a material having a high insulation factor such as polyethylene.

The second insulation layer 30 surrounds the outer periphery of the first insulation layer 20 and secondarily insulates the conductive layer 10 and the semi-conductive tape 100 from the outside. In this embodiment, the second insulating layer 30 may include a synthetic resin such as ethylene-propylene rubber (EPR) or the like. For example, the second insulating layer 30 has high strength and is not easily scratched, so that the first insulating layer 20 can be protected from external impacts.

The sheath 40 surrounds the outer periphery of the second insulating layer 30 and physically protects the high voltage electric wire from the outside. For example, the sheath 40 may include a synthetic resin such as polyvinyl chloride (PVC), a low toxic flame retardant polyolefin, and the like.

In another embodiment, a semi-conductive coating layer (not shown) may further be provided between the semi-conductive tape 100 and the first insulating layer 20. For example, a semi-conductive coating layer (not shown) may be formed by extrusion molding a one-pack type emulsion resin composition, rubber or the like on the semi- conductive tape 100.

According to the present embodiment as described above, the high voltage electric wire includes the semi-conductive tape 100 formed using the one-pack type emulsion resin composition. Therefore, it is possible to manufacture a high-voltage electric wire which is resistant to fire and is eco-friendly.

12 is a partially cutaway perspective view showing a high-voltage electric wire according to an embodiment of the present invention.

12, the high-voltage electric wire includes a conductive layer 10, a semi-conductive tape 100, a semi-conductive coating layer 60, a first insulating layer 20, a second insulating layer 30 and a sheath 40 .

The semi-conductive coating layer 60 surrounds the outer periphery of the semi-conductive tape 100 and includes a one-pack type emulsion resin composition, rubber and the like. In this embodiment, the one-pack type emulsion resin composition is extrusion-molded on the conductive layer 10 on which the semi-conductive tape 100 is wound to form a semi-conductive coating layer 60.

The first insulating layer 20 surrounds the outer surface of the semi-conductive coating layer 60 and primarily insulates the conductive layer 10 and the semi-conductive tape 100 from the outside.

According to the present embodiment as described above, the semi-conductive tape 100 is disposed between the semi-conductive coating layer 60 and the conductive layer 10 so that the adhesion between the semi-conductive coating layer 60 and the semi-conductive tape 100 . Thus, the semiconducting coating layer 60 is prevented from flowing down by its own weight, and eccentricity is prevented. Also, the thickness of the semi-conductive tape 100 can be reduced, thereby reducing manufacturing costs.

According to the present invention, the inner semipermeable layer, the lower semiconductive layer and the upper semiconductive layer are formed using a one-pack type emulsion resin composition which is water-soluble, and no organic solvent is produced during the manufacturing process. Further, the semi-conductive tape for high-voltage electric wires is not toxic, and has high water resistance, alkali resistance, and solvent resistance. Furthermore, the inner semiconductive layer strongly bonds with the longitudinal fibers and the transverse fibers, so that the stability is high. Further, the water-soluble one-pack type emulsion resin composition has high heat resistance and thus reduces the risk of fire.

In addition, by blending the water-soluble semiconductive material coated with the blade into the inside, the received semiconductive material can be densely bonded with the longitudinal fibers and the transverse fibers inside the fabric.

Furthermore, the bonding strength between the inner semiconductive layer and the fabric is improved, including the microfine structure having hydrophilic and hydrophobic fibers.

Further, the longitudinal fibers and the transverse fibers include a hydrophilic coating layer or contain hydrophilic fibers, so that the water-soluble semiconductive material can easily penetrate into the fabric. Therefore, a composite semimajor structure having a dense structure can be formed.

Furthermore, the high-voltage wire includes the semi-conductive tape formed by using the one-pack type emulsion resin composition, so that a fire-resistant, environmentally friendly high-voltage electric wire can be manufactured.

Further, a semi-conductive tape is disposed between the semi-conductive coating layer and the conductive layer to improve the adhesion between the semi-conductive coating layer and the semi-conductive tape. Therefore, the semi-conductive coating layer is prevented from flowing down due to its own weight, and eccentricity is prevented. Further, the thickness of the semi-conductive tape can be reduced, so that the manufacturing cost is reduced.

Industrial Applicability The present invention has industrial applicability in that it can be used in a variety of high power applications such as semi-conducting tapes, such as semi-conducting tapes inside the high voltage wires, and semi-conducting tapes used in devices using high voltage power such as transformers.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. It will be understood that the invention may be modified and varied without departing from the scope of the invention.

10: conductive layer 20: first insulating layer
30: second insulation layer 40: sheath
50: roller 60: anti-conducting coating layer
100: Semi-conductive tape
101: semi-conductive material 110: composite semiconductive layer
112, 211, 212, 312, 412: longitudinal fibers 114, 214, 312, 412:
115, 215, 415: inner semiconductive layer 120: lower semiconductive layer
130: upper semiconductive layer

Claims (7)

Longitudinal fibers extending in a longitudinal direction and containing a material having a strong tensile force, transverse fibers extending in a width direction perpendicular to the longitudinal direction and joined to the longitudinal fibers to form a fabric, and longitudinal fibers A composite semipermeable material including an inner semiconductive layer formed by filling the formed inner space and drying the one-pack type emulsion resin composition;
A lower semiconductive layer formed on the lower surface of the composite semipermeable sheet and formed integrally with the composite semipermeable sheet and formed by drying the one-pack type emulsion resin composition; And
And an upper semiconductive layer formed on the entire upper surface of the composite semispherical body and integrally formed with the composite semiconductive body and formed by drying the one-pack type emulsion resin composition,
In the one-pack type emulsion resin composition,
A condensation reaction product of silica sol with at least one compound selected from the group consisting of a reactive unsaturated silane compound, an alkyltrialkoxysilane compound, an alkoxysilane compound and an alkyl silicate compound;
An organic polymer, which is bonded on the condensation reaction product and comprises a copolymer of at least one compound selected from the group consisting of a monomer containing at least one functional group and a reactive unsaturated silane compound and a vinyl or a (meth) acrylic monomer; And
And a metal compound bonded on the organic polymer, wherein the monomer containing at least one functional group comprises at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group and an epoxy group, Wherein the metal compound comprises an oxide, a hydroxide or an alkoxide of 1 to 10 carbon atoms of one metal selected from the group consisting of magnesium, zinc, aluminum, zirconium, iron and titanium. Semi conductive tape for electric wire. The semi-conductive tape for a high-voltage electric wire according to claim 1, wherein the transverse fibers comprise microfine fibers. [3] The method according to claim 2,
A centrosome fiber that increases tensile strength in the longitudinal direction, including nylon; And
Characterized in that it comprises adsorbent fibers disposed between adjacent centermost fibers and comprising microfine fibers. The semiconductive tape according to claim 1, wherein the longitudinal fibers and the transverse fibers comprise a hydrophilic material. The method comprising the steps of: fabricating longitudinal fibers and longitudinal fibers comprising a material having a high tensile strength; and transverse fibers extending in a transverse direction perpendicular to the longitudinal direction to produce a fabric;
Coating a one-pack type emulsion resin composition on the upper and lower surfaces of the fabric;
Adjusting the thickness of the coated one-pack type emulsion resin composition and making the one-pack type emulsion resin composition penetrate into the fabric; And
And an inner semiconductive layer which is formed by drying the coated one-pack type emulsion resin composition to fill an inner space formed by the transverse fibers, the longitudinal fibers, the longitudinal fibers, and the transverse fibers, A lower semiconductive layer formed integrally with the entirety of the lower half of the composite semiconductors on the entire lower surface of the composite semiconductors; and an upper semiconductive layer integrally formed on the upper surface of the entirety of the composite semiconductors,
In the one-pack type emulsion resin composition,
A condensation reaction product of silica sol with at least one compound selected from the group consisting of a reactive unsaturated silane compound, an alkyltrialkoxysilane compound, an alkoxysilane compound and an alkyl silicate compound;
An organic polymer, which is bonded on the condensation reaction product and comprises a copolymer of at least one compound selected from the group consisting of a monomer containing at least one functional group and a reactive unsaturated silane compound and a vinyl or a (meth) acrylic monomer; And
And a metal compound bonded on the organic polymer, wherein the monomer containing at least one functional group comprises at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group and an epoxy group, Wherein the metal compound comprises an oxide, a hydroxide or an alkoxide of 1 to 10 carbon atoms of one metal selected from the group consisting of magnesium, zinc, aluminum, zirconium, iron and titanium. Method for manufacturing semi-conductive tape for wire. 6. The method of claim 5, wherein producing the fabric further comprises hydrophilically coating the bell fibers and the transverse fiber core to produce the bell fibers and the transverse fibers. / RTI > A conductive layer having a structure in which a plurality of interlocking lines are densely compressed;
A semi-conductive tape repeatedly wound on the outside of the conductive layer;
An insulating layer surrounding the outer periphery of the semi-conductive tape and insulating the conductive layer and the semi-conductive tape from the outside; And
And a sheath surrounding the outer periphery of the insulating layer to physically protect the outer layer from external impact,
The semi-
Longitudinal fibers extending in a longitudinal direction and containing a material having a strong tensile force, transverse fibers extending in a width direction perpendicular to the longitudinal direction and joined to the longitudinal fibers to form a fabric, and longitudinal fibers A composite semipermeable material including an inner semiconductive layer formed by filling the formed inner space and drying the one-pack type emulsion resin composition;
A lower semiconductive layer formed on the lower surface of the composite semipermeable sheet and formed integrally with the composite semipermeable sheet and formed by drying the one-pack type emulsion resin composition; And
And an upper semiconductive layer formed on the entire upper surface of the composite semispherical body and integrally formed with the composite semiconductive body and formed by drying the one-pack type emulsion resin composition,
In the one-pack type emulsion resin composition,
A condensation reaction product of silica sol with at least one compound selected from the group consisting of a reactive unsaturated silane compound, an alkyltrialkoxysilane compound, an alkoxysilane compound and an alkyl silicate compound;
An organic polymer, which is bonded on the condensation reaction product and comprises a copolymer of at least one compound selected from the group consisting of a monomer containing at least one functional group and a reactive unsaturated silane compound and a vinyl or a (meth) acrylic monomer; And
And a metal compound bonded on the organic polymer, wherein the monomer containing at least one functional group comprises at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group and an epoxy group, Wherein the metal compound comprises an oxide, a hydroxide or an alkoxide of 1 to 10 carbon atoms of one metal selected from the group consisting of magnesium, zinc, aluminum, zirconium, iron and titanium. wire.

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