KR101625043B1 - Method for forming electrode for touch screen panel, method for manufacturing touch screen panel, touch screen panel, display panel and display device - Google Patents

Abstract

The present invention relates to a touch screen panel comprising a conductive paste, forming a mesh pattern on a substrate, heat treating the mesh pattern formed on the substrate, and pressing the heat-treated mesh pattern. A method of manufacturing the touch screen panel, a touch screen panel, a display panel, and a display device.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of forming an electrode for a touch screen panel, a method of manufacturing a touch screen panel, a touch screen panel, a display panel and a display device }

The present invention relates to a method of forming an electrode for a touch screen panel, a method of manufacturing a touch screen panel, a touch screen panel, a display panel, and a display device.

2. Description of the Related Art Electronic apparatuses having a small-sized display apparatus such as a smart phone and a tablet computer have been widely used in recent years. In particular, electronic apparatuses having input means such as a touch screen panel are widely used.

The touch screen panel is a device for controlling an electronic device using a hand or a touch pen. The touch screen panel allows the user to control the electronic device by directly pressing the displayed screen. Such a touch screen panel can be classified into a resistance film type, a capacitive type, an infrared type, and an ultrasonic type according to the principle and operation method of the touch screen panel. Among these, capacitive touch screen panels have excellent touch sensitivity, and multi-touch inputting signals with two or more fingers is being actively studied.

Generally, the touch screen panel is composed of a window substrate, a black matrix layer, a transparent electrode layer, a metal electrode layer, a primer layer, and the like. Among them, indium tin oxide (ITO) is mainly used as a material of the transparent electrode layer.

These indium tin oxides are excellent in permeability and electrical properties, but are inexpensive because they use indium (In), which is a rare earth metal. In addition, since indium tin oxide is a brittle material as a ceramic material, there is a problem that a flexible touch screen panel can not be manufactured. In order to fabricate the thin film of indium tin oxide, a vacuum apparatus is required because a vacuum process is required. In order to form a pattern, an etching process is necessary. Since these devices are expensive, there is a problem that the production cost of the indium tin oxide thin film and the cost of the display panel increase. Therefore, various materials and various methods for replacing indium tin oxide have been studied. In particular, studies on metal meshes formed using conductive pastes are actively under way.

Korean Patent Publication No. 10-2014-0072289 Korean Patent Publication No. 10-1422270

One aspect of the present invention discloses a method of forming an electrode for a touch screen panel, a method of manufacturing the touch screen panel, a touch screen panel, a display panel, and a display device capable of improving the electrical characteristics of the electrode.

Another aspect of the present invention discloses a method of forming an electrode for a touch screen panel, a method of manufacturing the touch screen panel, a touch screen panel, a display panel, and a display device capable of maintaining or improving the electrical characteristics of the electrode even when the heat treatment temperature is lowered.

According to an aspect of the present invention, there is provided a method of forming an electrode for a touch screen panel, the method including forming a mesh pattern on a substrate using a conductive paste, heat treating the mesh pattern formed on the substrate, Lt; / RTI >

Pressing the heat-treated mesh pattern may be to pressurize the heat-treated mesh pattern for greater than 0 seconds and less than 10 seconds.

The step of pressurizing the heat-treated mesh pattern may be to pressurize the heat-treated mesh pattern at a pressure of 0.1 MPa or more and 20 MPa or less.

The step of pressing the heat-treated mesh pattern may be to press the mesh pattern along an axis perpendicular to the top surface of the substrate.

In the step of heat-treating the mesh pattern, the heat treatment temperature may be 50 ° C or higher and 250 ° C or lower.

The conductive paste may include at least one of silver (Ag) and copper (Cu).

The conductive paste may include powdered silver (Ag) and a powdery metal alloy. The metal alloy may have a melting point of 50 ° C or higher and 250 ° C or lower.

The metal alloy may be one or more selected from the group consisting of Bi, Sn, Zn, Pb, In, Ga, and Cd. have.

The metal alloy may be a bismuth (Bi) alloy and a tin (Sn) alloy.

The metal alloy may include 58 wt% of bismuth (Bi) and 42 wt% of tin (Sn).

The metal alloy may be contained in an amount of 0 to 50 parts by weight based on 100 parts by weight of the conductive paste.

A method of manufacturing a touch screen panel according to an aspect of the present invention includes forming a mesh pattern on a substrate using a conductive paste, heat treating the mesh pattern formed on the substrate, And pressurizing.

Pressing the heat-treated mesh pattern may be to pressurize the heat-treated mesh pattern for greater than 0 seconds and less than 10 seconds.

The step of pressurizing the heat-treated mesh pattern may be to pressurize the heat-treated mesh pattern at a pressure of 0.1 MPa or more and 20 MPa or less.

In the step of heat-treating the mesh pattern, the heat treatment temperature may be 50 ° C or higher and 250 ° C or lower.

The conductive paste may include at least one of silver (Ag) and copper (Cu).

A touch screen panel according to an aspect of the present invention can be manufactured according to a method of manufacturing a touch screen panel according to an aspect of the present invention.

A display device according to an aspect of the present invention may include a touch screen panel and a display panel coupled to the touch screen panel.

A display panel according to an aspect of the present invention may include a touch screen panel.

According to one aspect of the present invention, the electrical characteristics of the electrode can be increased by increasing the packing density and connectivity of the conductive paste by pressing the mesh pattern.

According to another aspect of the present invention, as the mesh pattern is pressed, the surface roughness of the upper surface of the electrode may be reduced to prevent a short circuit, thereby stabilizing the electrical characteristics.

Figs. 1 and 2 are photographs showing the microstructure of the mesh pattern before pressurizing the mesh pattern. Fig.
FIGS. 3 and 4 are photographs showing the microstructure of the mesh pattern after pressurizing the mesh pattern. FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below are merely intended to be illustrative of the present invention in sufficient detail to enable those skilled in the art to practice the present invention and thus the scope of protection of the present invention is limited Do not. That is, the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. In addition, the position or arrangement of the individual components of each disclosed embodiment may be varied without departing from the spirit and scope of the invention. In describing various embodiments of the present invention, elements having the same technical characteristics are denoted by the same reference numerals even though they are shown in different drawings. It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. Respectively.

Hereinafter, various embodiments of a method of forming an electrode for a touch screen panel according to the present invention will be described in detail.

A method of forming an electrode for a touch screen panel according to an exemplary embodiment of the present invention may first form a mesh pattern on a substrate using a conductive paste.

As the substrate, a hard substrate or a flexible substrate can be used. Examples of the substrate include glass, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, polyethylene naphthalate, acrylic resin, May be composed of any one material selected from among vinyl acetate resin (EVA), butyl rubber resin, polyarylate, polyimide, silicone, ferrite, ceramic and FR-4. Preferably, it can be selected from glass, polyimide, polycarbonate, polymethyl methacrylate, polyethylene terephthalate, heat-resistant epoxy, FR-4.

The substrate may be formed in the form of a transparent film. An electrode is formed on this transparent substrate.

The conductive paste may include at least one of silver (Ag) and copper (Cu). However, it is more preferable to include silver (Ag) in consideration of the electrical characteristics of the electrode formed through the conductive paste. The silver (Ag) or copper (Cu) contained in the conductive paste may be in powder form.

The conductive paste may further include at least one of a polymer binder, a solvent, a dispersant, a curing agent and a defoaming agent in addition to a metal such as silver (Ag) or copper (Cu). For example, the conductive paste may contain 50 wt% of silver (Ag) powder, 6.1 wt% of binder, 42.4 wt% of solvent, and 1.5 wt% of dispersant.

The conductive paste may further include a metal alloy mixed with a metal such as silver (Ag) or copper (Cu). The metal alloy may have a melting point of 50 ° C or more and 250 ° C or less. The metal alloy may be a low temperature melting point metal alloy. The metal alloy may be in powder form.

When the mesh pattern formed by using the conductive paste is heat-treated, an electrode is formed.

During the heat treatment of the mesh pattern, the metal alloy melts and acts as a binder for silver (Ag) or copper (Cu) particles. The metal alloy melts in the heat treatment process and functions to connect silver (Ag) or copper (Cu) particles. The metal alloy melts during the heat treatment process and seeps between the silver (Ag) or copper (Cu) particles due to capillary action. Such a metal alloy permeable between silver (Ag) or copper (Cu) particles improves the connectivity between silver (Ag) or copper (Cu) particles. As a result, the metal alloy can be melted in the heat treatment process to improve the electrical characteristics of the electrode.

Therefore, when the electrode is formed using the conductive paste containing the metal alloy, the electrical characteristics of the electrode can be further improved even if the heat treatment of the mesh pattern is performed at the same temperature as the conventional one.

Generally, since the heat treatment temperature of the mesh pattern is high, the electrical characteristics of the electrode formed after the heat treatment may be high. Particularly, in the case of a mesh pattern formed using a conductive face containing silver (Ag), the sintering of silver (Ag) proceeds when the heat treatment temperature is 300 ° C or higher, and the electrical characteristics (electrical conductivity) of the electrode are high. However, when the electrode is formed using the conductive paste containing the metal alloy, the electrode can exhibit sufficient electrical characteristics even if the heat treatment temperature is lower than this. However, the heat treatment temperature should be the same as or higher than the melting point of the metal alloy.

As a result, when the conductive paste containing the metal alloy is used, the electrical characteristics of the electrode can be improved or similar to that of the heat treatment at a temperature of 300 ° C or higher even if the heat treatment temperature is equal to or higher than the melting point of the metal alloy, . That is, the heat treatment temperature of the mesh pattern is lowered, and the time and cost for the heat treatment can be reduced.

The metal alloy may be one or more selected metal alloys selected from the group consisting of bismuth (Bi), tin (Sn), zinc (Zn), lead (Pb) and cadmium (Cd). For example, the metal alloy is composed of 92 wt% of tin (Sn), 8 wt% of zinc, 91 wt% of tin and 9 wt% of zinc, 63 wt% of tin and 37 wt% of zinc ), 62.2 wt% tin (Sn), and 37.7 wt% zinc (Zn). Alternatively, the metal alloy may be composed of 56.5 wt% of bismuth (Bi), 43.5 wt% of lead (Pb), 50.0 wt% of bismuth (Bi), 28.0 wt% of lead (Pb) and 22.0 wt% of tin Lt; / RTI > The above metal alloys are illustrative and metallic alloys having a low melting point (50 DEG C or more and 250 DEG C or less) can all be included in the embodiments of the present invention.

The metal alloy may be composed of bismuth (Sn) and bismuth (Bi). These metal alloys are safe because they do not contain heavy metals such as lead (Pb) or cadmium (Cd).

In particular, the metal alloy may be composed of 58 wt% of bismuth (Bi) and 42 wt% of tin (Sn). That is, the metal alloy may be a Bi58-Sn42 alloy.

The formation of a mesh pattern on a substrate using a conductive paste may be performed by various printing methods such as gravure off set, reverse off set, screen printing, and gravure printing And the like.

Gravure offset printing is a method in which a conductive paste is filled in a patterned engraved plate, primary transfer is performed with a silicone rubber called a blanket, and the blanket and the substrate are brought into close contact with each other to perform secondary transfer.

The reverse offset printing is a method in which a conductive paste is applied to a roll-type blanket and then adhered to a cliche having irregularities to form a desired pattern on the blanket, and then the pattern formed on the blanket is transferred to the substrate.

Screen printing is a method in which a conductive paste is placed on a screen having a pattern, and then a conductive paste is directly printed on a substrate through a screen in which a space is empty while pushing a squeegee.

Gravure printing is a method in which a blanket in which a pattern is formed is wound on a roll, the conductive paste is filled in the pattern, and then transferred onto the substrate on which the conductive film is formed.

However, the formation of the mesh pattern on the substrate using the conductive paste is not limited to the above method, but may be performed by a sputtering deposition method or a plasma deposition method.

A method of forming an electrode for a touch screen panel according to an embodiment of the present invention may include forming a mesh pattern on a substrate, heat treating the mesh pattern formed on the substrate, and pressing the heat-treated mesh pattern .

Heat treatment of the mesh pattern is for curing the mesh pattern.

Pressing the heat treated mesh pattern is intended to improve the electrical properties of the electrode by reducing pores formed in the mesh pattern. In the process of heat-treating the mesh pattern, pores may be formed as the solvent, the binder, and the dispersing agent contained in the conductive paste are volatilized. These pores cause the electrical properties of the electrode to deteriorate. The method of forming an electrode for a touch screen panel according to an embodiment of the present invention presses a mesh pattern to remove pores formed in a heat treatment process and increases packing density between particles. Accordingly, the electrode according to the method of forming an electrode for a touch screen panel according to an embodiment of the present invention can greatly improve its electrical characteristics (electric conductivity). In addition, by pressing the mesh pattern, the surface roughness of the upper portion of the mesh pattern can be reduced. Thus, the electrical characteristics of the electrode can be stabilized by preventing a short circuit with the upper electrode.

Generally, the higher the annealing temperature, the better the electrical properties of the electrode formed on the substrate. Therefore, the heat treatment of the mesh pattern formed on the substrate is performed at a high temperature of 300 DEG C or higher. However, if the heat treatment temperature is increased, it takes a lot of time to heat it, and a lot of cost is required to raise the temperature. On the other hand, if the heat treatment temperature is lowered, the time and cost consumed in the heat treatment can be reduced, but the electrical characteristics of the electrode are deteriorated.

According to the method of forming an electrode for a touch screen panel according to an embodiment of the present invention, the step of pressing the mesh pattern formed on the substrate may improve the electrical characteristics of the electrode. Accordingly, even if the heat treatment temperature is lowered, the electrical characteristics of the electrode can be improved or even improved compared to when the heat treatment temperature is set at a high temperature.

As a result, according to the method for forming an electrode for a touch screen panel according to an embodiment of the present invention, a mesh pattern formed on a substrate can be heat-treated at a temperature of 50 ° C or more and 250 ° C or less. Even if the heat treatment is performed at such a low temperature, if the mesh pattern is pressed, the electrical characteristics of the electrode can be maintained or improved.

Pressing the heat-treated mesh pattern is intended to reduce the pores formed in the mesh pattern and increase the packing density of the mesh pattern, that is, the packing density of the electrode.

1 and 2 are photographs showing the microstructure of the mesh pattern before pressurizing the mesh pattern. 3 and 4 are photographs showing the microstructure of the mesh pattern after pressing the mesh pattern.

Referring to FIGS. 1 and 2, it can be seen that pores are formed between the particles of the mesh pattern. On the other hand, referring to FIG. 3 and FIG. 4, it can be seen that the pores between the particles of the mesh pattern are reduced or eliminated, and the mesh pattern has a dense structure. It can be confirmed that the packing density of the mesh pattern is improved.

When the mesh pattern is pressed, it can be pressed along an axis perpendicular to the upper surface of the substrate. That is, the mesh pattern formed to protrude from the substrate can be pressed toward the surface of the substrate. This is because the pores of the mesh pattern can be reduced or removed only by pressurizing the mesh pattern. In addition, the surface roughness of the upper portion of the electrode can be reduced by such pressing.

When pressurizing the mesh pattern, it is possible to pressurize for more than 0 seconds and less than 10 seconds. When the mesh pattern is pressed for more than 10 seconds, since the pores of the mesh pattern have already been sufficiently reduced 10 seconds ago, there is no more pores to be reduced or eliminated. That is, even when the pressure is longer than 10 seconds, the electrical characteristics of the electrode are not significantly different from those in the case where the mesh pattern is pressed for 10 seconds. As a result, when the mesh pattern is pressed for more than 10 seconds, the efficiency is lowered considering the cost and time consumed for pressing. If the mesh pattern is pressed longer than 10 seconds, cracks may be formed on the mesh pattern formed on the substrate, and the mesh pattern may be damaged.

The heat-treated mesh pattern can be pressurized to a pressure of 0.1 MPa or more and 20 MPa or less. When the mesh pattern is pressurized to less than 0.1 MPa, the pores of the mesh pattern can not be sufficiently reduced or removed. In addition, the packing density of the mesh pattern may not be sufficiently increased. As a result, the electrical characteristics of the electrode formed on the substrate may not be sufficiently improved.

On the other hand, when the mesh pattern is pressurized with a pressure higher than 20 MPa, a crack is formed in the mesh pattern due to an excessively large pressure, and the mesh pattern may be damaged. Further, when the pressure is about 20 MPa, the pores of the mesh pattern are sufficiently reduced or removed. Therefore, even when the pressure is higher than 20 MPa, there is no pore to be removed. As a result, pressurizing at pressures greater than 20 MPa results in reduced efficiency when considering the cost and time consumed in pressurizing.

Hereinafter, various embodiments of a manufacturing method of a touch screen panel according to the present invention will be described in detail.

First, a mesh pattern can be formed on a substrate using a conductive paste.

The conductive paste may include at least one of silver (Ag) and copper (Cu). The silver (Ag) or copper (Cu) contained in the conductive paste may be in powder form.

The conductive paste may further include at least one of a polymer binder, a solvent, a dispersant, a curing agent and a defoaming agent in addition to a metal such as silver (Ag) or copper (Cu).

The conductive paste may further include a metal alloy mixed with a metal such as silver (Ag) or copper (Cu). The metal alloy may have a melting point of 50 ° C or more and 250 ° C or less. The metal alloy may be a low temperature melting point metal alloy. The electrical characteristics of the mesh pattern and the electrode formed by the conductive paste containing the metal such as silver (Ag) or copper (Cu) and the metal alloy are improved. The metal alloy may be in powder form.

The metal alloy may be one or more selected metal alloys selected from the group consisting of bismuth (Bi), tin (Sn), zinc (Zn), lead (Pb) and cadmium (Cd). In particular, the metal alloy may be composed of bismuth (Bi) and tin (Sn). Specifically, the metal alloy may be composed of 58 wt% of bismuth (Bi) and 42 wt% of tin (Sn). That is, the metal alloy may be a Bi58-Sn42 alloy.

The formation of a mesh pattern on a substrate using a conductive paste may be performed by various printing methods such as gravure off set, reverse off set, screen printing, and gravure printing And the like.

A mesh pattern may be formed on the substrate, and then the mesh pattern formed on the substrate may be heat-treated. Heat treatment of the mesh pattern is for curing the mesh pattern. The mesh pattern formed on the substrate can be heat-treated at a temperature of 50 ° C to 250 ° C.

After the heat treatment of the mesh pattern, the heat treated mesh pattern can be pressed. Pressing the heat-treated mesh pattern is intended to improve the electrical properties of the electrode by reducing pores formed in the mesh pattern during the heat treatment process. By pressurizing the mesh pattern, the pores can be removed, and the inter-particle packing density can be increased to increase the inter-particle connectivity. As the inter-particle connectivity increases, the electrical properties (electrical conductivity) of the electrodes increase. In addition, by pressing the mesh pattern, the surface roughness of the upper portion of the mesh pattern can be reduced, and the electrical characteristics of the electrode can be stabilized.

When pressurizing the mesh pattern, it is possible to pressurize for more than 0 seconds and less than 10 seconds. Further, the heat-treated mesh pattern can be pressurized to a pressure of 0.1 MPa or more and 20 MPa or less.

Hereinafter, various embodiments of the touch screen panel according to the present invention will be described in detail.

A touch screen panel according to an embodiment of the present invention may include a substrate and electrodes formed on the substrate.

The substrate may be a hard substrate or a flexible substrate. Examples of the substrate include glass, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyetherimide, polyethylene naphthalate, acrylic resin, epoxy resin, May be composed of any one material selected from among vinyl acetate resin (EVA), butyl rubber resin, polyarylate, polyimide, silicone, ferrite, ceramic and FR-4. Preferably, it can be selected from glass, polyimide, polycarbonate, polymethyl methacrylate, polyethylene terephthalate, heat-resistant epoxy, FR-4.

The substrate may be formed in the form of a transparent film. An electrode is formed on this transparent substrate.

The electrode can be manufactured by the method for forming an electrode for a touch screen panel according to an embodiment of the present invention described above. The description of the electrode is replaced with an explanation of the electrode forming method for a touch screen panel according to an embodiment of the present invention.

The touch screen panel according to an embodiment of the present invention can be manufactured according to the method of manufacturing a touch screen according to the embodiment of the present invention described above. Therefore, the description of the touch screen panel according to an embodiment of the present invention is replaced with the above description.

Hereinafter, various embodiments of the display panel according to the present invention will be described in detail.

The display panel according to an exemplary embodiment of the present invention may include a lower substrate and an upper substrate that are bonded to the lower substrate. The display panel according to an embodiment of the present invention may further include a touch screen panel.

Such a display panel including a touch screen panel is referred to as an embedded type.

According to the display panel according to an embodiment of the present invention, the touch screen panel can be coupled to the upper substrate.

Although the touch screen panel is built in the display panel, the one attached to the outside of the upper and lower substrates is called an on-cell type.

A display panel according to another embodiment of the present invention may include a lower substrate and an upper substrate which are adhered to the lower substrate. The display panel according to an embodiment of the present invention may further include a touch screen panel. The touch screen panel may be positioned between the upper substrate and the lower substrate.

At this time, the touch screen panel may be formed integrally with a cell layer such as a liquid crystal layer located between the upper substrate and the lower substrate.

In this manner, the touch screen panel is built in the display panel, and the one located between the upper substrate and the lower substrate is called an in-cell type.

The touch screen panel or cell layer may be manufactured according to the method of manufacturing a touch screen panel according to an embodiment of the present invention.

Hereinafter, various embodiments of the display device according to the present invention will be described in detail.

A display device according to an embodiment of the present invention may include a display panel. The display panel may be a display panel according to one embodiment of the present invention as described above and a display panel according to another embodiment of the present invention. That is, the display panel may be an on-cell type or an in-cell type.

A display device according to another embodiment of the present invention may include a touch screen panel and a display panel coupled to the touch screen panel. According to a display device according to another embodiment of the present invention, it is attached to the exterior of a display panel of a touch screen panel.

The touch screen panel attached to the outside of the display panel is called an add-on type.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the appended claims. It will be understood that the present invention can be changed.

Claims (20)

A method of forming an electrode for a touch screen panel,
Forming a mesh pattern on the substrate using a conductive paste;
Heat treating the mesh pattern formed on the substrate; And
Pressing the heat-treated mesh pattern,
In the conductive paste,
(Ag) in powder form and a metal alloy in powder form,
The metal alloy has a melting point of not less than 50 ° C. and not more than 250 ° C. and is made of bismuth (Bi), tin (Sn), zinc (Zn), lead (Pb), indium (In), gallium Wherein at least one of the electrodes is selected from the group consisting of the electrodes. The method according to claim 1,
The step of pressurizing the heat-treated mesh pattern comprises:
Wherein the heat-treated mesh pattern is pressurized for a period of time greater than 0 seconds and less than 10 seconds. The method according to claim 1,
The step of pressurizing the heat-treated mesh pattern comprises:
Wherein the heat-treated mesh pattern is pressed at a pressure of 0.1 MPa or more and 20 MPa or less. The method according to claim 1,
The step of pressurizing the heat-treated mesh pattern comprises:
And pressing the mesh pattern along an axis perpendicular to the upper surface of the substrate. The method according to claim 1,
The step of heat-treating the mesh pattern may include:
And the heat treatment temperature is not less than 50 ° C and not more than 250 ° C. The method according to claim 1,
Wherein the conductive paste comprises at least one of silver (Ag) and copper (Cu). delete delete The method according to claim 1,
Wherein the metal alloy is a bismuth (Bi) alloy and a tin (Sn) alloy. The method according to claim 1,
Wherein the metal alloy comprises 58 wt% of bismuth (Bi) and 42 wt% of tin (Sn). 11. The method of claim 10,
Wherein the metal alloy is contained in an amount of 0 to 50 parts by weight based on 100 parts by weight of the conductive paste. Forming a mesh pattern on the substrate using a conductive paste;
Heat treating the mesh pattern formed on the substrate; And
Pressing the heat-treated mesh pattern,
In the conductive paste,
(Ag) in powder form and a metal alloy in powder form,
The metal alloy has a melting point of not less than 50 ° C. and not more than 250 ° C. and is made of bismuth (Bi), tin (Sn), zinc (Zn), lead (Pb), indium (In), gallium One or more selected from the group consisting of: 13. The method of claim 12,
The step of pressurizing the heat-treated mesh pattern comprises:
Wherein the heat-treated mesh pattern is pressurized for a period of time greater than 0 seconds and less than 10 seconds. 13. The method of claim 12,
The step of pressurizing the heat-treated mesh pattern comprises:
Wherein the heat-treated mesh pattern is pressed at a pressure of 0.1 MPa or more and 20 MPa or less. 13. The method of claim 12,
The step of heat-treating the mesh pattern may include:
Wherein the heat treatment temperature is not less than 50 ° C and not more than 250 ° C. 13. The method of claim 12,
Wherein the conductive paste comprises at least one of silver (Ag) and copper (Cu). A touch screen panel manufactured according to any one of claims 12 to 16. A touch screen panel according to claim 17;
And a display panel coupled to the touch screen panel. A display panel comprising a touch screen panel manufactured according to the method of any one of claims 12 to 16. A display device comprising a display panel according to claim 19.

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