KR101617669B1 - Emp rack - Google Patents

Emp rack Download PDF

Info

Publication number
KR101617669B1
KR101617669B1 KR1020150153052A KR20150153052A KR101617669B1 KR 101617669 B1 KR101617669 B1 KR 101617669B1 KR 1020150153052 A KR1020150153052 A KR 1020150153052A KR 20150153052 A KR20150153052 A KR 20150153052A KR 101617669 B1 KR101617669 B1 KR 101617669B1
Authority
KR
South Korea
Prior art keywords
rack
emp
shielding
present
housing
Prior art date
Application number
KR1020150153052A
Other languages
Korean (ko)
Inventor
이붕희
Original Assignee
대한실드엔지니어링(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대한실드엔지니어링(주) filed Critical 대한실드엔지니어링(주)
Priority to KR1020150153052A priority Critical patent/KR101617669B1/en
Application granted granted Critical
Publication of KR101617669B1 publication Critical patent/KR101617669B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38Cooling arrangements using the Peltier effect
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to an EMP shielding rack. The present invention enables a cooling structure of the rack to rapidly reduce heat generated from electric and electronic equipment by combining a thermoelectric element with a housing of a server rack which needs to maintain protection against EMP, and is characterized in that overheat problems such as malfunction, a network failure, etc. resulting from operations of the electric and electronic equipment in emergency as well as in normal times can be solved without a ventilation or duct system such an air supply and exhaust fan.

Description

EMP Protection Rack {EMP RACK}

(Peltier element) is coupled to a housing of a server rack to be protected from the EMP, so that the heat generated from the electromagnetic (electric and electronic equipment) can be quickly cooled by the self cooling structure. The present invention relates to an EMP protection rack characterized in that it is possible to solve an overheating problem (malfunction, communication paralysis, etc.) due to electromagnetic operation during an emergency as well as an emergency without a ventilation or ducting facility (such as an air supply fan).

That is, according to the present invention, it is possible to provide a Peltier device for each rack to have a self-cooling system, to protect the equipment by its own cooling system in an emergency situation, and to prevent the inflow of a high output electromagnetic wave completely without honeycomb- The Peltier device is able to control the temperature appropriately and obtain excellent cooling efficiency. This is because the temperature can be adjusted according to the amount of heat generated by the equipment installed in the rack, thereby ensuring energy saving.

Further, the present invention is characterized in that it can be used in any place without additional air conditioner or air conditioner. (Overcoming installation environment)

Further, the present invention is characterized in that the capacity (size, quantity) of the Peltier element can be adjusted according to the cooling ability.

In modern society, most of the tasks in defense, finance, and control are processed through computerization, electronics, communication, computer equipment, etc., and these systems are destroyed and damaged by external artificial or natural causes. If the damage is serious, it will cause serious consequences beyond imagination. Therefore, various attempts are being actively made to strengthen security and invest in security facilities to prevent such damage.

Particularly, electromagnetic pulse (hereinafter referred to as EMP) refers to electromagnetic energy that is generated naturally by lightning, or artificially generated by an electronic bomb. EMP with such an electronic bomb causes rapid generation of high microwave energy And damage the defense, financial, and industrial infrastructure by damaging and destroying defense computer information system, administrative computer system, financial information system and so on by disabling computerization, electronics, communication and computer equipment.

However, the conventional EMP protection rack implements the purpose of shielding the EMP in various ways for shielding, but it is difficult to prevent the EMP protection due to the heat generated when the equipment installed in the rack, especially the server, As the temperature rises rapidly inside the rack, the stable operation of the computer equipment installed in the rack can not be guaranteed.

That is, when the internal temperature rises due to the internal heat, the server and the computer equipment installed in the EMP protection rack are subjected to a fatal problem such as shutdown or damage.

In other words, the conventional EMP protection rack is cooled by the air conditioner or the air conditioner in the server room, and the heat discharged from the equipment installed inside the rack is forcibly discharged to the cooling fan through the honeycomb. In case of failure of the air conditioner or the air conditioner, The equipment of the rack installed inside is overheated and burnout occurs.

1. Registration No. 10-1547869 (Registered on August 21, 2015)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is a technical object of the present invention to provide a thermoelectric element (Peltier element) to a housing of a server rack, The cooling structure can be quickly cooled. This is because it is possible to solve the problem of overheating (malfunction, communication paralysis, etc.) due to electromagnetic operation in an emergency as well as during a normal period without ventilation or ducting equipment The present invention has been made in view of the above problems.

That is, according to the present invention, it is possible to provide a Peltier device for each rack to have a self-cooling system, to protect the equipment by its own cooling system in an emergency situation, and to prevent the inflow of a high output electromagnetic wave completely without honeycomb- The Peltier device is capable of controlling the temperature appropriately so that excellent cooling efficiency can be obtained. This is because it is possible to control the temperature according to the amount of heat generated by the equipment installed in the rack, thereby saving energy.

Further, the present invention is intended to provide an additional air conditioner or an air conditioner which can be used in any place (overcoming installation environment).

It is another object of the present invention to provide various cooling capacities by controlling the capacity (size, quantity) of Peltier elements according to the cooling capacity.

In order to achieve the above object, the present invention is configured so that one or more thermoelectric elements (100) are combined inside the housing (10) of a server rack to cool the heat generated from the electromagnetic.

At this time, it is preferable that the thermoelectric element 100 is formed as a Peltier element on one side or a combined side of at least one of the top, bottom, and sides of the inside of the housing.

The housing 10 is formed with an opening at one side thereof to be opened and closed by a hinge-type shielding door 20, and a pocket groove 12 in which a pair of thermal shielding fingers 11 are housed is formed on an outer circumferential surface of the opening The shielding door 20 is formed with a pair of heat shielding knives 21 to correspond to the pocket grooves 12 and to be formed to have an indoor / outdoor shielding structure when closed.

As described above, according to the present invention, a thermoelectric element (Peltier element) is coupled to a housing of a server rack, which must be protected from EMP, so that heat generated from electromagnetic (electric and electronic equipment) This has the effect of solving the problem of overheating (malfunction, communication paralysis, etc.) caused by electromagnetic operation in an emergency as well as during a normal period without ventilation or a duct facility (such as an air supply fan).

That is, according to the present invention, it is possible to provide a Peltier device for each rack to have a self-cooling system, to protect the equipment by its own cooling system in an emergency situation, and to prevent the inflow of a high output electromagnetic wave completely without honeycomb- The Peltier device is able to control the temperature appropriately so that excellent cooling efficiency can be obtained. This is because the temperature can be controlled according to the amount of heat generated by the equipment installed in the rack, thereby saving energy.

Further, the present invention has the effect that it can be used in any place without additional air conditioner or air conditioner.

Further, the present invention has an effect of providing various cooling capacities by controlling the capacity (size, quantity) of the Peltier element according to the cooling ability.

1 is an example of an EMPACK according to the present invention,
FIG. 2 is an illustration showing a shielded state when the shielding finger and the shielding knife correspond to each other according to the present invention, FIG.
3 is an example of a conventional EMPRACK.

Hereinafter, the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the present invention is configured to cool one or more thermoelectric elements 100 inside a housing 10 of a server rack to generate heat from electromagnetic waves.

First, the EMP is caused by a nuclear explosion or e-bomb that causes malfunctions and malfunctions of electrical and electronic equipment, resulting in paralysis of the national / defense command and communication network and social network. It is a protective measure against key facilities and equipment.

In other words, it is operated for the protection of electric and electronic equipments in all fields of the EMP situation, not only in national defense and defense fields, but also in finance and traffic, and also in social environment. Also, in case of EMP due to nuclear explosion and terror (e-bomb) To operate or maintain the network.

In consideration of the cost effectiveness caused by manufacturing racks against the cost of constructing commercial facilities that can be operated normally under the EMP situation and the cost of constructing the facilities for EMP protection and considering the mobility according to the specific field of defense, It is imperative that measures are taken to protect them.

In particular, since network equipment is distributed and deployed, it is necessary to develop a protection measure for each rack because it is too wide to protect the facility itself.

This is because it is difficult to guarantee the safety of existing foreign products as the EMP threat continues to evolve, and it is necessary to develop and apply the corresponding technology.

In other words, the expansion of the wideband frequency (from 1 GHz to 18 GHz), the EMP protection technology of the antenna lead-in portion, and the weight reduction technology of the housing are desperately required.

Accordingly, the EMP rack of the present invention is based on a commercially operated rack, and is classified into a server, a communication equipment, and the like depending on the use. The protective enclosure aims at development of a lightweight and easy-to- It is designed for the complete shielding of inner and outer parts and the performance of various power source, signal line and antenna line to protect 100% of internal equipments under EMP condition including excellent shielding effect, weight and heat dissipation effect by MIL-STD-188-125 measurement standard And IEEE-STD-299 measurement standards to meet the requirements.

As shown in the following Table 1, the current requirement is 1 GHz, 80 dB or more. However, the present invention has developed an ultra-wideband rack and a protection enclosure that covers the threat of high output electromagnetic waves due to denuclearization, As shown in FIG.

SE test method of MIL-STD-188-125

Figure 112015106267383-pat00001


Figure 112015106267383-pat00002

The basic concept of thermoelectric technology is the Peltier effect, which was first discovered in the early 19th century. It refers to the phenomenon of endothermic or exothermic phenomena occurring at junctions of two different conductors depending on the direction of current when current flows through two different conductors.

That is, the thermoelectric semiconductor is a material selected to produce the Peltier effect, pumping heat, which not only exerts higher performance than other materials, but also has an advantage of controlling the characteristics of the charge carrier inside the conductor.

Using the properties of these materials, the thermoelectric module can be made by joining the two ends of one semiconductor element with an electrically conductive material (copper electrode).


Figure 112015106267383-pat00003

In the configuration shown above, the components necessary for the Peltier effect are the copper lines that connect to the power supply, and the heat is transferred through the circuit in the direction that the charge carrier moves (ie, the heat transfer material is the charge carrier).

In other words, the N-type material is generally manufactured in the form of pellets, so that the electrons having negative electric charge become the charge carriers to cause the Peltier effect in the N-type material.

When the DC power source is connected as shown in the figure, the electrons protrude from the cathode and are attracted to the anode. By this polarity, electrons flow clockwise as shown in the figure.

Thus, electrons flowing below and above the N-type semiconductor absorb heat at the lower contact and actively move to the upper contact to release heat.

That is, heat is effectively pumped by the charge carrier in the semiconductor device.

The thermoelectric module also incorporates a P-type semiconductor device, and the P-type device is manufactured such that a positive charge called a hole serves as a charge carrier inside.

The holes increase the electric conductivity of the P-type crystal structure because electrons can flow more freely in the material when voltage is applied.

Positive charge carriers protrude from the anode of the DC power source and are drawn to the cathode, resulting in the flow of holes in the direction opposite to the electrons.

This is due to the inherent charge carriers that can transfer heat within the conductor. Using a P-type material as the material that conducts heat through the conductor results in heat being absorbed at the cathode of the power source and emitted at the cathode.

The thermoelectric element 100 is preferably a Peltier element formed at the upper and lower ends of the inside of the housing.

The housing 10 is formed with an opening at one side thereof to be opened and closed by a hinge-type shielding door 20, and a pocket groove 12 in which a pair of thermal shielding fingers 11 are housed is formed on an outer circumferential surface of the opening The shielding door 20 is formed with a pair of heat shielding knives 21 to correspond to the pocket grooves 12 and to be formed to have an indoor / outdoor shielding structure when closed.

Since the present invention develops EMP protection racks and mobile enclosures in Korea, it minimizes the waste of foreign currency due to accumulation of technology and imports of foreign products, and contributes to the development and production of domestic cooperating companies, As shown in FIG.

Further, the present invention is introduced into the C4I system of the military so as to improve the operational performance and to carry out missions without difficulty in any battlefield.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims and their equivalents. Of course, such modifications are within the scope of the claims.

10 ... housing 11 ... shielding finger
12 ... pocket groove 20 ... shielding door
21 ... shielding knife 100 ... thermoelectric element

Claims (3)

An EMP protection rack for cooling one or more thermoelectric elements (100) coupled to an inside of a housing (10) of a server rack to cool heat generated from the electromagnetic device,
The housing 10 is formed with an opening at one side thereof to be opened and closed by a hinge-type shielding door 20, wherein a pocket groove 12 accommodating a pair of thermal shielding fingers 11 is formed on an outer circumferential surface of the opening, The shielding door 20 is formed with a pair of thermal shielding knives 21 to correspond to the pocket grooves 12 and to provide an indoor / outdoor shielding structure when closed. The thermoelectric element 100 is a Peltier element, And the thermoelectric element 100 is installed in each of the racks so as to be able to control an appropriate temperature according to the amount of heat generated by the equipment, thereby ensuring energy saving. Rack for.
delete delete
KR1020150153052A 2015-11-02 2015-11-02 Emp rack KR101617669B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150153052A KR101617669B1 (en) 2015-11-02 2015-11-02 Emp rack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150153052A KR101617669B1 (en) 2015-11-02 2015-11-02 Emp rack

Publications (1)

Publication Number Publication Date
KR101617669B1 true KR101617669B1 (en) 2016-05-03

Family

ID=56022719

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150153052A KR101617669B1 (en) 2015-11-02 2015-11-02 Emp rack

Country Status (1)

Country Link
KR (1) KR101617669B1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101912684B1 (en) 2017-04-12 2018-10-29 대한실드엔지니어링(주) Cooling system for EMP rack
KR101981130B1 (en) 2018-12-14 2019-05-22 김성준 Server rack with variable space
KR102008955B1 (en) 2018-06-07 2019-08-08 한국전자통신연구원 Lightweight and low-cost emp shield rack
KR102176097B1 (en) 2020-05-07 2020-11-10 김태균 Energy storage system with colling apparatus
US10966341B2 (en) 2019-05-28 2021-03-30 Electronics And Telecommunications Research Institute Lightweight and low-cost EMP protection rack
KR20220120185A (en) 2021-02-23 2022-08-30 (주)금녕산업 Ess server rack with variable temperature contorl
US11917800B1 (en) 2023-02-27 2024-02-27 Electronics And Telecommunications Research Institute Multi-layered window or door system for electromagnetic pulse protection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028159A (en) 2006-07-21 2008-02-07 Mie Tsuda Denki Sangyo Kk Electronic equipment, and high frequency oscillator
JP2008091607A (en) * 2006-10-02 2008-04-17 Nitto Electric Works Ltd Cabinet with cooling function
KR101345247B1 (en) * 2010-12-30 2013-12-27 주식회사 쉴드텍 Door for EMP and TEMPEST electromagnetic wave test chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028159A (en) 2006-07-21 2008-02-07 Mie Tsuda Denki Sangyo Kk Electronic equipment, and high frequency oscillator
JP2008091607A (en) * 2006-10-02 2008-04-17 Nitto Electric Works Ltd Cabinet with cooling function
KR101345247B1 (en) * 2010-12-30 2013-12-27 주식회사 쉴드텍 Door for EMP and TEMPEST electromagnetic wave test chamber

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101912684B1 (en) 2017-04-12 2018-10-29 대한실드엔지니어링(주) Cooling system for EMP rack
KR102008955B1 (en) 2018-06-07 2019-08-08 한국전자통신연구원 Lightweight and low-cost emp shield rack
KR101981130B1 (en) 2018-12-14 2019-05-22 김성준 Server rack with variable space
US10966341B2 (en) 2019-05-28 2021-03-30 Electronics And Telecommunications Research Institute Lightweight and low-cost EMP protection rack
KR102176097B1 (en) 2020-05-07 2020-11-10 김태균 Energy storage system with colling apparatus
KR20220120185A (en) 2021-02-23 2022-08-30 (주)금녕산업 Ess server rack with variable temperature contorl
US11917800B1 (en) 2023-02-27 2024-02-27 Electronics And Telecommunications Research Institute Multi-layered window or door system for electromagnetic pulse protection

Similar Documents

Publication Publication Date Title
KR101617669B1 (en) Emp rack
US5934079A (en) Base station heat management system
US7272002B2 (en) Auxiliary cooling methods and systems for electrical device housings
US20140165597A1 (en) Battery cooling
US9635783B2 (en) Electronic component housing with heat sink
US10412860B1 (en) Heat capture system for electrical components providing electromagnetic pulse protection
JP2012244172A (en) Systems for circuit board heat transfer and method of assembling the same
US9843250B2 (en) Electro hydro dynamic cooling for heat sink
US20050247471A1 (en) Electromagnetic shield using meta-material
US20140247559A1 (en) Heat dissipation structure of electronic shield cover
CN206547244U (en) Electronic cabinet
US10383251B1 (en) Heat dissipation structure of electronic device
CN104602484B (en) Portable apparatus and cooling device thereof
CN114222451B (en) Heat dissipation and electromagnetic interference prevention device for network equipment
RU97220U1 (en) CASE OF AN ACTIVE PHASED ANTENNA ARRAY MODULE
Zhang et al. Realisation of DC/DC high power and large current combined power supply for airborne radar
CN113889340A (en) Explosion-proof capacitor
US11026343B1 (en) Thermodynamic heat exchanger
CN207009519U (en) Battery power structure and battery power
CN104283316B (en) A kind of method improving intelligent assembly adaptive capacity to environment
CN209948786U (en) Uninterrupted power supply with heat radiation structure
CN209896481U (en) Electrical cabinet and electrical control device
Sánchez-Soriano et al. Energy recovery from microstrip passive circuits
CN113299482B (en) Electronic component packaging structure, electronic equipment, server and data center system
CN210986794U (en) Heat radiation explosion-proof box

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190429

Year of fee payment: 4