KR101616769B1 - The surface treatment method of Shape-Controllable Diamond and the Diamond thereby - Google Patents

The surface treatment method of Shape-Controllable Diamond and the Diamond thereby Download PDF

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Publication number
KR101616769B1
KR101616769B1 KR1020150047455A KR20150047455A KR101616769B1 KR 101616769 B1 KR101616769 B1 KR 101616769B1 KR 1020150047455 A KR1020150047455 A KR 1020150047455A KR 20150047455 A KR20150047455 A KR 20150047455A KR 101616769 B1 KR101616769 B1 KR 101616769B1
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South Korea
Prior art keywords
diamond
polymer
diamond particles
surface treatment
treatment method
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KR1020150047455A
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Korean (ko)
Inventor
허지인
이현우
이종민
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일진다이아몬드(주)
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

The present invention relates to a diamond surface treatment method capable of controlling a shape of a diamond and a diamond thereby. Particularly, the diamond surface treatment method according to the present invention includes: a masking step of masking a polymer on a diamond particle surface; a coating step of coating the masked diamond particle surface with ceramics; a polymer removal step of removing the polymer from the diamond particle surface; a mixing step of mixing metal powder with the diamond particle wherein the polymer is removed; a heat treatment step of performing heat treatment of the mixed diamond particle and the mixed metal powder; and a ceramic removal step of removing a ceramic coating layer from the diamond particle surface. According to the present invention, it is possible to form regular etching, and thus the diamond surface treatment method can obtain the effect of forming an edge of the diamond particle continuously by artificial and partial fracturing the diamond, wherein the diamond is fractured along the etching plane without being cut, even against impact. In addition, the diamond surface treatment method enables a diamond to provide constant processing performance and to have an increased service life.

Description

[0001] The present invention relates to a surface treatment method of a diamond capable of controlling a shape,

TECHNICAL FIELD The present invention relates to a method for surface treatment of diamond capable of shape control and diamond by the method.

Diamond has attracted attention as a material having superior properties over almost all industrial fields including the electronic industry and the chemical industry. Diamond has advantages such as high hardness, wide range of light transmittance, chemical stability, high thermal conductivity, low thermal expansion, and electrical insulation. In recent years, diamond powder and surface treatment methods have been developed to effectively apply the properties of diamond with the rapid development of nanotechnology. Surface treatment of diamond powder is generally used to increase the roughness of diamond powder particles, thereby increasing the surface area and increasing the efficiency.

However, in order to increase the applicability of diamond powder in the future, it is necessary not only to increase the roughness but also to treat the surface shape of the diamond powder according to each purpose and application.

For example, when a tool is manufactured and used with diamond, a machining impact (processing load) is generated, and diamond shattering occurs due to the machining impact.

In the case of diamond particles which have not undergone surface treatment, irregular and large cracks are invented in the grinding process, resulting in simple crushing and no new edge. For this reason, a new edge is continuously generated in the grinding process through the surface treatment. However, it is difficult to uniformly grind the diamond particles 10a surface-treated by such a general surface treatment method due to irregular and various sizes of edges There has been a problem that it is difficult to ensure uniform workability and service life of a grinding tool and the like manufactured using the same.

The edge of the particle is directly related to the working efficiency as a part directly related to the processing of the object to be processed. Therefore, when the particles are simply crushed without the occurrence of a new edge at the time of crushing, the efficiency of the work is lowered, and the replacement cycle of the diamond particles is advanced.

The present invention provides a method for surface treatment of diamond capable of being etched according to a regular or arbitrary pattern, and to thereby provide a diamond.

The present invention also provides a method for surface treatment of a diamond in which a new edge is uniformly and continuously generated even at the time of fracturing, thereby maintaining the processing performance and improving the life span, and a diamond by the method.

A diamond surface treatment method according to the present invention comprises a masking step of masking a polymer on a surface of diamond particles; A coating step of coating the surface of the masked diamond particles with a ceramic; A polymer removing step of removing the polymer from the diamond particle surface; Mixing the diamond particles and the metal powder from which the polymer has been removed; A heat treatment step of heat-treating the mixed diamond particles and the metal powder; And a ceramic removing step of removing the ceramic coating layer from the surface of the diamond particles.

The polymer may also be a heat-resistant polymer.

In addition, the ceramic in the coating step may be an alumina, TiN, TiC, at least one of TiO 2.

Also, in the polymer removing step, the polymer may be removed by any one of thermal and chemical methods.

Further, the chemical polymer removing method may be performed by dissolving with an organic solvent or an aqueous solution of an organic solvent.

The organic solvent may also include alcohols, ether alcohols and ketones.

And may be performed at 600 to 1000 degrees centigrade in the heat treatment step.

The metal powder may be at least one selected from the group consisting of Ni, Ti, Ni / P, Cr, Tantalum, Fe, Co, Or at least one of them.

The ceramic removing step may be performed by acid treatment.

On the other hand, the diamond powder according to the present invention is produced by one of the above-mentioned diamond particle surface treatment methods.

According to the present invention, it is possible to form a regular etch, and thereby, even when a machining impact occurs, a partial fracture in which a diamond is broken along an etched surface is artificially generated, The effect to be formed can be obtained.

Further, according to the present invention, it is possible to continuously form the edge of the diamond particles by inducing chipping formation of a uniform size, thereby enabling continuous maintenance of the machining performance and thereby improving the service life.

1 is a schematic view showing a grinding wheel as a general grinding tool.
2 is a schematic view showing diamond particles exposed on the surface of the grinding wheel of Fig.
FIG. 3A is a schematic view schematically showing an ideal wear state of diamond as work progresses. FIG.
FIG. 3B is a schematic view showing wear and shattering states of diamond particles having an irregular surface through general surface treatment. FIG.
FIG. 3C is a schematic view showing the wear and tear state of diamond particles having a regular or constant patterned surface according to an embodiment. FIG.
FIGS. 4 and 5 are schematic views showing a state in which diamond particles having a regular or constant pattern-formed surface as shown in FIG.
6 is a flowchart showing a diamond surface treatment method according to an embodiment.
FIGS. 7 to 13 are schematic views sequentially showing a diamond surface treatment method according to one embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the absence of special definitions or references, the terms used in this description are based on the conditions indicated in the drawings. The same reference numerals denote the same members throughout the embodiments. For the sake of convenience, the thicknesses and dimensions of the structures shown in the drawings may be exaggerated, and they do not mean that the dimensions and the proportions of the structures should be actually set.

The surface treated diamond according to one embodiment of the present invention and characteristics thereof will be described with reference to FIGS. 1 to 5. FIG.

Fig. 1 is a schematic view showing a grinding wheel as a general grinding tool, and Fig. 2 is a schematic view showing diamond particles exposed on the surface of the grinding wheel of Fig. FIG. 3B is a schematic view showing wear and crushing states of diamond particles having an irregular surface through general surface treatment, and FIG. 3C is a schematic view showing the wear Fig. 3 is a schematic view showing wear and shattering states of diamond particles having a regular or constant patterned surface according to an example; Fig. Figs. 4 and 5 are schematic views showing a state in which a machining impact is generated in the diamond particles of Fig. 3 to be partially crushed.

As shown in FIG. 1, a plurality of diamond particles 10 are attached to a grinding portion of a grinding wheel 110 by a bonding portion 120 such as a polymer bond. The diamond particles 10 and the adhering portion 120 are gradually worn from the surface in the process of rotating the grinding wheel 110 to cut the object or the like.

Specifically, as shown in FIG. 2, the diamond particles 10 are exposed to the outer surface of the bonding portion 120 and function to cut an object to be processed. In the case of ideal diamond particles, the diamond particles 10 are uniformly worn from the outside as shown in FIG. 3A, and the diamond particles 10 are separated from the bonding portion 120 as the work progresses. After the diamond particles 10 on the outer surface are detached, the adhered portion 120 is further worn, and new diamond particles inside the adhered portion 120 are exposed to the outside to newly cut the object.

On the other hand, in the case of the diamond particles 10 surface-treated by a general surface treatment method, cracks generated due to an irregular surface are also irregularly formed, so that when the external impact F1 is generated by cutting, The cutting tools including such diamond particles make it difficult to maintain uniform machining performance.

3C, in the case of the diamond particles 10c according to an embodiment of the present invention, a crack (Cr) generated at the time of impact F1 due to the uniformly etched surface is the same as that of FIG. 3B It occurs regularly in comparison with the cracks generated in the case of diamond particles having an irregular surface. For this reason, even when the cutting operation is continuously performed, chipping of a relatively uniform size occurs, and the grinding wheel including the grinding wheel can maintain uniform cutting performance and grinding performance.

That is, when the irregular etching portion is formed, the diamond particles are cut off, resulting in a problem that the machining performance is deteriorated. However, in the diamond particles surface-treated by the diamond surface treatment method according to the present invention, when a machining impact occurs, as shown in FIG. 4, cracks are generated between the etching portions E1 and partial fracture occurs. In addition, when partial fracturing occurs, as shown in FIG. 5, in addition to the original edge of the diamond particles, edges (R1 and R2) due to partial fracture are additionally generated.

That is, the conventional diamond does not generate additional edge due to cutting, and the processing efficiency is lowered. In the case of a diamond having an irregular surface that has been surface-treated according to the conventional surface treatment method, uniform operation stability and life stability are guaranteed In contrast, in the case of the diamond particles surface-treated by the surface treatment method according to the present embodiment, as the partial fracture progresses, new edges R1 and R2 are generated, thereby continuously maintaining the machining performance and increasing the service life Effect can be obtained.

A diamond surface treatment method according to one embodiment will be described with reference to FIGS. 6 to 13. FIG. FIG. 6 is a flowchart showing a diamond surface treatment method according to an embodiment, and FIGS. 7 to 13 are schematic views sequentially showing a diamond surface treatment method according to an embodiment.

As shown in FIG. 6, the surface treatment method according to an embodiment of the present invention includes a masking step (S100) of masking a polymer on the surface of diamond particles, a coating step (S200) of coating the surface of the masked diamond particles with a ceramic, (S400) for mixing the diamond particles and the metal powder (S400), a heat treatment step (S500) for heat-treating the mixed diamond particles, and an acid treatment step for removing the ceramic coating layer S600). In addition, if necessary, it may further include a washing step or a drying step. Each step will be described in detail below.

First, diamond particles 10 are provided as shown in FIG. The diamond particles 10 to be subjected to the surface treatment according to the present embodiment will be described taking diamond particles having a diameter of about 1 mm as an example. However, the surface treatment method according to the present embodiment can be applied to any diamond particles having a size capable of being masked by a mechanical method or a manual operation.

Next, in the masking step S100, the polymer is masked (M1) on the surface of the diamond particles 10 as shown in FIG. At this time, it is preferable to use a heat-resistant polymer as the polymer.

Also, the masking using the polymer is finally performed in the region where the etching is to be performed. The polymer should be masked in all of the areas where the etch part is to be formed as the first step in the double masking operation. In this case, the masking operation can be performed by hand or printing equipment.

Next, in the coating step S200, the coating layer M2 is formed on the surface of the diamond particles 10 masked with M1 as shown in Fig. Ceramics and polymers are not friendly to each other and do not react. When the ceramic is coated on the surface of the masked diamond particles, the ceramic coating layer M2 is formed on a portion other than the region where the masking is performed.

The formation of the ceramic coating layer is formed in the portion corresponding to the second step of the double masking operation in which the etching portion should not be formed.

On the other hand, alumina, TiN, TiC, TiO 2 and the like, which are oxides of aluminum, may be used as the ceramics used in the coating step.

Next, in the polymer removing step (S300), the polymer is removed from the ceramic coated diamond particles 10 as shown in FIG. The polymer removal step (S300) may be performed by a thermal or chemical method. For example, the chemical polymer removal method can be carried out by dissolving with either an organic solvent or an aqueous solution of an organic solvent.

The organic solvent may be an alcohol such as butanol, an ether alcohol such as butoxy-ethanol, or a ketone such as acetone.

Next, in the mixing step (S400), the diamond particles and the metal powder from which the polymer is removed are mixed as shown in FIG. The metal powder may be at least one selected from the group consisting of Ni, Ti, Ni / P, Cr, Tantalum, Fe, Co, Can be used.

In the next heat treatment step (S500), the mixed diamond particles and the metal powder are heat-treated to etch the surface of the diamond particles as shown in FIG. At this time, the heat treatment can be performed at 600 to 1000 degrees centigrade. In the case of ceramics, it reacts with heat at a temperature of about 1100 degrees Celsius or more, so that it is stably maintained at the above-mentioned heat treatment temperature.

In the next ceramic removing step S600, the ceramic coating layer is removed from the surface of the diamond particles 10 as shown in Fig. At this time, the removal of the ceramic coating layer can be performed by an acid treatment. The acid treatment can be carried out using sulfuric acid or nitric acid at a temperature of 50 to 200 캜. If the pickling temperature is lower than 50 캜, the surface may not be cleaned cleanly. If the pickling temperature exceeds 200 캜, excess pickling may occur and the diamond surface quality may deteriorate. Such an acid treatment step is preferably carried out in a range of about 0.5 to 5 hours. If it is less than 0.5 hour, the surface is not cleaned cleanly. If it exceeds 5 hours, the surface quality deteriorates due to excessive pickling.

Then, the diamond powder subjected to the acid treatment as described above is dried through the drying step or the like to obtain diamond particles which are regularly etched or etched according to a pattern according to the intention of the processor, as shown in FIG.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. have.

Claims (11)

A masking step of masking the polymer on the diamond particle surface;
A coating step of coating the surface of the masked diamond particles with a ceramic;
A polymer removing step of removing the polymer from the diamond particle surface;
Mixing the diamond particles and the metal powder from which the polymer has been removed; And
A heat treatment step of heat-treating the mixed diamond particles and the metal powder; ≪ / RTI > The method according to claim 1,
And a ceramic removing step of removing the ceramic coating layer from the surface of the diamond particles after the heat treatment step. The method according to claim 1,
Wherein the polymer is a heat-resistant polymer. The method according to claim 1,
Ceramics are alumina, TiN, TiC, TiO 2, at least any one of the surface treatment method of the diamond in the coating step. The method according to claim 1,
In the polymer removing step, the polymer is removed by any one of thermal and chemical methods. 6. The method of claim 5,
Wherein the chemical polymer removing method is performed by dissolving with an organic solvent or an aqueous solution of an organic solvent. The method according to claim 6,
Wherein the organic solvent comprises an alcohol, an ether alcohol, and a ketone. The method according to claim 1,
Wherein the annealing step is performed at 600 to 1000 degrees centigrade. The method according to claim 1,
The metal powder may be at least one of Ni, Ti, Ni / P, Cr, Ta, Fe, A method for treating a diamond surface. 3. The method of claim 2,
Wherein the ceramic removing step is performed by an acid treatment. A diamond powder surface-treated by the method according to any one of claims 1 to 10.
KR1020150047455A 2015-04-03 2015-04-03 The surface treatment method of Shape-Controllable Diamond and the Diamond thereby KR101616769B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101926449B1 (en) * 2017-08-02 2018-12-07 새솔다이아몬드공업 주식회사 Polishing pad dresser with pores on the surface of diamond and the manufacuring method thereof
CN109016197A (en) * 2018-07-18 2018-12-18 郑州磨料磨具磨削研究所有限公司 A kind of novel electroplating diamond fretsaw

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094335A (en) 1998-09-28 2000-04-04 Hilti Ag Abrasive having diamond grain and manufacture of it
JP2005524100A (en) 2002-04-24 2005-08-11 シピックス・イメージング・インコーポレーテッド Method for forming a patterned thin film conductor on a substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094335A (en) 1998-09-28 2000-04-04 Hilti Ag Abrasive having diamond grain and manufacture of it
JP2005524100A (en) 2002-04-24 2005-08-11 シピックス・イメージング・インコーポレーテッド Method for forming a patterned thin film conductor on a substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101926449B1 (en) * 2017-08-02 2018-12-07 새솔다이아몬드공업 주식회사 Polishing pad dresser with pores on the surface of diamond and the manufacuring method thereof
WO2019027076A1 (en) * 2017-08-02 2019-02-07 새솔다이아몬드공업 주식회사 Polishing pad dresser having surface pores and method for manufacturing diamond
CN109016197A (en) * 2018-07-18 2018-12-18 郑州磨料磨具磨削研究所有限公司 A kind of novel electroplating diamond fretsaw

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