KR101607447B1 - Method for producing a grinding tool - Google Patents

Method for producing a grinding tool Download PDF

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KR101607447B1
KR101607447B1 KR1020157030731A KR20157030731A KR101607447B1 KR 101607447 B1 KR101607447 B1 KR 101607447B1 KR 1020157030731 A KR1020157030731 A KR 1020157030731A KR 20157030731 A KR20157030731 A KR 20157030731A KR 101607447 B1 KR101607447 B1 KR 101607447B1
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diamond particles
powder layer
powder
particles
diamond
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KR1020157030731A
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Korean (ko)
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KR20150126719A (en
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프란츠 에거
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티로리트 슈라이프미텔베르케 스바로프스키 콤만디트게젤샤프트
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Priority claimed from AT14642008A external-priority patent/AT506578B1/en
Application filed by 티로리트 슈라이프미텔베르케 스바로프스키 콤만디트게젤샤프트 filed Critical 티로리트 슈라이프미텔베르케 스바로프스키 콤만디트게젤샤프트
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

Abstract

본 발명은 서로 일정한 간격을 두고 다이아몬드입자가 배치된 연마공구의 제조방법으로서, 다이아몬드가 구비된 매트릭스가 가압되어 최종적으로 소결되기 전에 분말형태의 소결성 매트릭스의 표면에 요구가 형성되고 요구의 안에 각각의 다이아몬드입자가 배치되는 연마공구의 제조방법에 관한 것이다.The present invention relates to a method of manufacturing an abrasive tool in which diamond particles are arranged at regular intervals from each other, wherein a demand is formed on the surface of the sintering matrix in powder form before the diamond matrix is pressed and finally sintered, To a method of manufacturing an abrasive tool in which diamond particles are disposed.

Description

연마공구의 제조방법 {METHOD FOR PRODUCING A GRINDING TOOL}METHOD FOR PRODUCING A GRINDING TOOL [0002]

본 발명은, 서로 일정한 간격을 두고 다이아몬드입자(diamond particles)가 배치된 연마공구의 제조방법으로서, 다이아몬드(diamonds)가 구비된 매트릭스가 가압되어 최종적으로 소결되기 전에 분말형태의 소결성 매트릭스의 표면에 요구(recesses)가 형성되고 요구의 안에 각각의 다이아몬드입자가 배치되는 연마공구의 제조방법에 관한 것이다.The present invention relates to a method of manufacturing an abrasive tool in which diamond particles are arranged at regular intervals from each other, characterized in that a diamond-coated matrix is pressed onto the surface of the sinterable matrix in powder form to a method of manufacturing an abrasive tool in which recesses are formed and each diamond particle is placed within a demand.

종래의 기술(특허문헌 US No 4 925 457 참조)에 있어서 다이아몬드입자가 배치되는 요구는 격자구조물의 개방부이다. 그러나, 이러한 보조 격자구조물은 공구에 그대로 남아 있기 때문에 제품의 품질에 영향을 준다. 따라서, 각 다이아몬드입자가 분리되게 하는 이러한 격자구조물을 다이아몬드입자가 가압된 후에 제거하는 것이 제안된 바 있다(특허문헌 US No 6 286 498 참조). 이러한 경우에 있어서는 다이아몬드입자의 방향과 크기가 다를 수 있어 각 다이아몬드입자를 분리하고 격자구조물을 제거하는 것이 어렵도록 하는 경우가 있다.The requirement for the diamond particles to be placed in the conventional technique (see Patent Document US 4 925 457) is the opening of the lattice structure. However, these auxiliary grating structures remain in the tool and therefore affect the quality of the product. Therefore, it has been proposed to remove such a lattice structure that causes each diamond particle to separate after the diamond particles are pressed (see Patent Document US 6 286 498). In such a case, the direction and size of the diamond particles may be different, so that it may be difficult to separate each diamond particle and remove the lattice structure.

본 발명은 분말형태의 매트릭스 표면에 매트릭스 자체의 물질로부터 격자구조가 형성될 수 있도록 하는 것에 기초한다. 따라서, 본 발명에 따르면 요구는 분말형태인 매트릭스의 패턴압축(pattern compression)에 의하여 형성된다.The invention is based on allowing a lattice structure to be formed from the material of the matrix itself on the matrix surface in the form of a powder. Thus, according to the present invention, the requirement is formed by pattern compression of the matrix in powder form.

만약 이들 요구가 절두원추형 또는 절두피라밋형인 경우 다이아몬드입자는 정확히 고정되고 분말을 가압할 때와 특히 분말을 추가하고 성층하여 가압할 때 위치가 그대로 유지될 수 있도록 함으로써 여러 층에서 입자의 독특한 결합관계가 보장된다.If these requirements are a truncated cone or truncated pyramid shape, the diamond particles are precisely pinned, allowing the powder to remain in position during pressurization, especially when powder is added and stratified and pressed, .

본 발명을 첨부도면에 의거하여 더욱 상세히 설명하면 다음과 같다.The present invention will be described in more detail with reference to the accompanying drawings.

도 1은 준비과정에서 다이아몬드입자를 각각 분리하여 배치하기 위한 장치를 보인 단면도,
도 2는 도 1의 부분확대도,
도 3과 도 4는 도 1의 장치를 이용하여 다이아몬드입자를 배치하는 과정을 보인 단면도, 및
도 5와 도 6은 도 3과 도 4에서 분말형태의 기판(2)을 보인 평면도와 단면도이다.1 is a sectional view showing an apparatus for separating and arranging diamond particles in preparation,
Fig. 2 is a partially enlarged view of Fig. 1,
FIGS. 3 and 4 are cross-sectional views showing a process of disposing diamond particles using the apparatus of FIG. 1, and FIGS.
5 and 6 are a plan view and a cross-sectional view showing the substrate 2 in powder form in FIGS. 3 and 4. FIG.

본 발명의 주요단계는 연마디스크의 몸체 내에 매입되어야 하는 다이아몬드입자를 개별적으로 각각 분리하는 것에 있다. 이를 위하여 입자(4)가 도 1에서 보인 천공판(1)의 상측면에 산포(scattered)된다. 천공판(1)에는 통공(6)이 형성되어 있고 이를 통하여 램 플레이트(ram plate)(7)의 핀(3)이 삽입된다. 천공판의 내부공간(9)에는 감압(減壓)이 유지된다. 이러한 감압은 통공(6)의 구부를 통하여 전달됨으로써 이에 각 입자(4)가 신속히 흡착고정된다. 어떠한 통공(6)에도 흡착고정되지 않은 입자(4)는 천공판으로부터 제거된다.The main step of the present invention consists in separately separating the diamond particles, which are to be embedded in the body of the polishing disk, respectively. For this purpose, the particles 4 are scattered on the upper side of the apertured plate 1 shown in FIG. A through hole 6 is formed in the apertured plate 1 and the pin 3 of the ram plate 7 is inserted through the through hole 6. A reduced pressure is maintained in the inner space 9 of the apertured plate. The reduced pressure is transmitted through the bore of the through hole 6, so that the respective particles 4 are quickly adsorbed and fixed. The particles 4 not adsorbed and fixed to any through holes 6 are removed from the apertured plate.

전형적으로 다이아몬드입자는 350 ~ 700 ㎛ 의 범위의 크기로부터 선택된다. 천공판(1)의 통공(6)은 직경이 다이아몬드입자의 평균입도 보다 커서(약 0.6 mm) 다이아몬드입자가 이에 안착될 수 있도록 한다. 통공(6)의 전형적인 간격은 1.25 mm 이다.Typically, the diamond particles are selected from sizes ranging from 350 to 700 mu m. The through-holes 6 of the apertured plate 1 have diameters larger than the average grain size of the diamond grains (about 0.6 mm) so that the diamond grains can be seated thereon. The typical spacing of the through holes 6 is 1.25 mm.

도1 및 도 2에서 보인 바와 같이, 핀(3)의 제1기능은 통공(6)이 작은 입자에 의하여 폐색(obstructed)되는 것을 방지하는 것이다. 그러나 이들의 주요목적은 도 3 및 도 4로부터 명백하게 알 수 있게 된다.1 and 2, the first function of the pin 3 is to prevent the through hole 6 from being obstructed by small particles. However, the main purpose of these is evident from Figs. 3 and 4.

도 1에서 보인 바와 같이 흡착된 입자(4)를 금속분말의 기판(2)상에 배치하기 위하여 천공판(1)이 180°회전되고 기판(2)으로부터 분말이 흡인되지 않는 범위까지 기판(2)측으로 근접하여 이동된다. 만약 이와 같은 과정을 통하여 확보된 높이에서 입자(4)가 단순히 낙하하도록 한다면 다이아몬드입자가 균일하게 배열될 수는 없을 것이다. 입자(4)가 적당한 가이드(8)를 통한 램 플레이트(7)의 이동으로 핀(3)에 의하여 방출될 때 입자의 균일한 배열이 용이하게 이루어질 것이다.The substrate 2 is rotated to the extent that the apertured plate 1 is rotated 180 degrees and the powder is not drawn from the substrate 2 in order to place the adsorbed particles 4 on the substrate 2 of metal powder as shown in Fig. As shown in Fig. If the particles 4 simply fall from the height ensured through such a process, the diamond particles will not be uniformly arranged. The uniform arrangement of the particles will be facilitated when the particles 4 are discharged by the fins 3 by the movement of the ram plate 7 through suitable guides 8. [

실질적인 개선은 평판형의 기판(2)을 이용하는 것에 비하여 기판(2)의 금속분말에 형성된 요구(5)의 배열구조에 의하여 달성될 수 있다. 이로써 평판형 기판의 경우에서 필요로 하였던 것처럼 핀(3)에 의하여 입자(4)를 깊숙히 박아 넣을 필요가 없어 입자를 둘러싸는 금속층이 흐트러지거나 변형되는 것을 피할 수 있다.A substantial improvement can be achieved by the arrangement structure of requirements 5 formed on the metal powder of the substrate 2 compared with the use of the plate-like substrate 2. This eliminates the need for the particles (4) to be embedded deeply by the pin (3) as required in the case of a planar substrate, and thus the metal layer surrounding the particles can be prevented from being disturbed or deformed.

기판(2)을 제작함에 있어서 먼저 금속분말이 예를 들어 2.5 mm ~ 3 mm 의 높이로 몰드에 주입되고 이 몰드에서 성형된다. 그리고 분말층이 돌출형의 절두피라밋으로 구성된 허니컴 패턴을 갖는 램에 의하여 약 1.8 ~ 2.2 mm 의 높이로 25% 정도 압축된다. 따라서, 간격이 예를 들어 1.25 mm 인 랜드부분(lands)(10) 사이에서, 압축된 분말은 절두피라밋형의 요구(5)를 가지며 그 저면부분은 절두피라밋에 대하여 높이가 0.4 mm 인 사방 0.3 mm 의 크기를 갖는다.In manufacturing the substrate 2, first, the metal powder is injected into the mold at a height of, for example, 2.5 mm to 3 mm, and is molded in the mold. And the powder layer is compressed by about 25% to a height of about 1.8-2.2 mm by a ram having a honeycomb pattern of protruding truncated pyramids. Thus, between lands 10 having a spacing of, for example, 1.25 mm, the compacted powder has a truncated pyramid-like requirement 5, whose bottom portion is 0.4 mm in height with respect to the truncated pyramid mm.

요구가 원통형의 형상으로 이루어진 것으로 수행된 예비시험에서는 원통형 부분 사이에 있는 금속분말이 문제가 있는 변형을 보이는 결과를 가져왔다. 아울러, 원통형 램을 제거할 때, 최상측 분말층의 상부가장자리에서 분말층이 벗기어졌다. 이들 문제점은 절두원추형 또는 절두피라밋형의 패턴을 이용함으로써 해결될 수 있다.In a preliminary test conducted with the requirement of a cylindrical shape, the metal powder between the cylindrical portions resulted in a problematic deformation. In addition, when removing the cylindrical ram, the powder layer was peeled from the upper edge of the uppermost powder layer. These problems can be solved by using a truncated cone or truncated pyramidal pattern.

기판(2)을 구성하는 물질은 종래기술의 물질과 같다. 예를 들어 이는 56%의 Cu-Co-Fe 합금, 26%의 청동(90%의 Cu 와 10%의 Sn)과, 18%의 구리로 구성된다.The materials constituting the substrate 2 are the same as those of the prior art. For example, it consists of 56% Cu-Co-Fe alloy, 26% bronze (90% Cu and 10% Sn) and 18% copper.

각 다이아몬드의 입자(4)는 랜드부분(10) 사이에 형성된 각 요구(5)내에 배치되고, 이 경우에 있어서 이들 입자의 각 분리 및 배치의 과정은 상기 언급된 바와 같이 이루어질 수 있다. 그리고 이들 다이아몬드는 금속 램(허니컴 패턴 없이)에 의하여 분말층 내로 가압된다. 이러한 가압과정에서 분말층은 10% 정도 더 압축된다. 이와 같이 초기의 주입단계로부터 시작하여 분말은 35% 압축된다. 이로써 분말층은 그 높이가 약 1.6 mm ~ 1.9 mm 가 된다.The particles 4 of each diamond are arranged in respective demands 5 formed between the land portions 10, and in this case the respective separation and arrangement of these particles can be made as mentioned above. These diamonds are then pressed into the powder layer by metal rams (without honeycomb pattern). During this pressing process, the powder layer is further compressed by about 10%. Thus starting from the initial injection stage, the powder is compressed by 35%. Whereby the powder layer has a height of about 1.6 mm to 1.9 mm.

이러한 과정 이후에 상기 언급된 과정은 연마디스크의 몸체가 요구된 두께에 이를 때까지 반복된다.After this process, the above-mentioned process is repeated until the body of the polishing disk reaches the required thickness.

모든 분말층이 결합될 수 있도록 다시 한번 가압된다. 이러한 가압작업은 초기의 주입높이(전체 주입높이)에서 47% 압축될 수 있도록 한다. 이와 같이 하여 얻은 연마디스크의 블랭크는 완성된 연마디스크의 몸체를 얻기 위하여 소결된다.All of the powder layers are pressed once more so that they can be combined. This pressurizing operation allows for 47% compression at the initial injection height (total injection height). The thus obtained blank of the polishing disk is sintered to obtain the body of the finished polishing disk.

1: 천공판, 2: 기판, 3: 핀, 4: 입자, 5: 요구, 6: 통공, 7: 램 플레이트, 8: 가이드, 9: 내부공간, 10: 랜드부분.1: perforated plate, 2: substrate, 3: pin, 4: particle, 5: required, 6: through hole, 7: ram plate, 8: guide, 9: inner space, 10: land portion.

Claims (4)

서로 일정한 간격을 두고 다이아몬드입자(diamond particles)가 배치된 연마공구의 제조방법으로서,
(a) 금속분말을 몰드에 주입하거나 또는 몰드에서 성형하여 분말층을 형성하는 단계;
(b) 분말층의 표면에 패턴을 가압하여 요구(recesses)를 형성하는 단계;
(c) 요구의 안에 다이아몬드입자가 배치되도록 하는 단계; 및
(d) 다이아몬드입자가 분말층 내로 가압되도록 분말층을 가압하는 단계;를 포함하며,
상기 분말층을 최종적으로 소결하기 전에 연마디스크의 몸체가 요구되는 두께에 이를 때까지 상기 (a), (b), (c), 및 (d) 단계가 반복되는 것을 특징으로 하는 연마공구의 제조방법.A method of manufacturing an abrasive tool having diamond particles arranged at regular intervals from each other,
(a) injecting or molding the metal powder into a mold to form a powder layer;
(b) pressing the pattern on the surface of the powder layer to form recesses;
(c) placing the diamond particles within the need; And
(d) pressing the powder layer so that the diamond particles are pressed into the powder layer,
(A), (b), (c), and (d) are repeated until the body of the polishing disk has reached the required thickness prior to the final sintering of the powder layer. Way. 제1항에 있어서, 요구가 절두원추형(shape of truncated cones) 또는 절두피라밋형(shape of truncated pyramids)으로 되어 있음을 특징으로 하는 연마공구의 제조방법.The method of claim 1, wherein the requirement is a shape of truncated cones or a shape of truncated pyramids. 제1항 또는 제2항에 있어서, 다이아몬드입자가 각각의 핀에 의하여 천공판으로부터 방출(ejected)되어 요구 내로 가압됨을 특징으로 하는 연마공구의 제조방법.The method of claim 1 or 2, wherein the diamond particles are ejected from the apertured plates by respective fins and pressed into the needles. 삭제delete
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