KR101599305B1 - Epoxy resin compositions based on bisphenol f typed epoxy resin for high pressure resin transfer molding - Google Patents

Epoxy resin compositions based on bisphenol f typed epoxy resin for high pressure resin transfer molding Download PDF

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KR101599305B1
KR101599305B1 KR1020150121156A KR20150121156A KR101599305B1 KR 101599305 B1 KR101599305 B1 KR 101599305B1 KR 1020150121156 A KR1020150121156 A KR 1020150121156A KR 20150121156 A KR20150121156 A KR 20150121156A KR 101599305 B1 KR101599305 B1 KR 101599305B1
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epoxy resin
resin composition
bisphenol
curing agent
weight
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최호경
최종하
임성식
박준성
박경준
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주식회사 신아티앤씨
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

Modified epoxy resin; A first bisphenol F type epoxy resin composition comprising, as a first bisphenol F epoxy resin composition, 80 to 90 parts by weight of a compound represented by the general formula (4) based on the total weight of the first bisphenol F type epoxy resin composition; A second bisphenol F type epoxy resin composition which is distilled to have a higher purity than the first bisphenol F type epoxy resin composition; And curing agents; Based epoxy resin composition for a high-pressure resin transfer molding (HP-RTM).
[Chemical Formula 4]

Figure 112015083426777-pat00015

Description

TECHNICAL FIELD [0001] The present invention relates to an epoxy resin composition for high-pressure resin transfer molding based on bisphenol F type epoxy resin. BACKGROUND OF THE INVENTION [0001]

The present invention relates to an epoxy resin composition for high pressure-resin transfer molding (HP-RTM) based on bisphenol F type epoxy resin. More particularly, it relates to an epoxy resin composition for HP-RTM based on bisphenol F type epoxy resin having excellent viscosity, gel time, and the like.

Epoxy resin, which is mainly used in the production of carbon fiber composites, is excellent in physical properties and chemical resistance, especially heat resistance, but it has been an obstacle to mass production because it requires additional time for curing reaction. Recently, a high pressure-resin transfer molding (HP-RTM) process has been used as a method for drastically reducing this. The HP-RTM process can improve productivity by mixing the base and curing agent uniformly at high pressure, shortening the mixing time and reducing the curing reaction time. These products should be developed not only with the process but also with the polymer materials, but the research on the materials used in the HP-RTM process is insufficient.

US 6399199 B1 JP 2003-128746 A

Embodiments of the present invention provide an epoxy resin composition for HP-RTM having excellent viscosity, gel time and the like.

According to one embodiment of the present invention, a modified epoxy resin represented by the following general formula (1) or (2); A first bisphenol F epoxy resin composition comprising 80 to 90 parts by weight of a compound represented by the following formula (4) based on the total weight of the first bisphenol F epoxy resin composition, the composition comprising a compound having a structure represented by the following formula A first bisphenol F type epoxy resin composition; A second bisphenol F type epoxy resin composition comprising a compound having a structure represented by the following formula (3) and having a higher purity than the first bisphenol F type epoxy resin composition; And curing agents; A high-pressure resin transfer molding (HP-RTM) epoxy resin composition is provided.

[Chemical Formula 1]

Figure 112015083426777-pat00001

(2)

Figure 112015083426777-pat00002

(3)

Figure 112015083426777-pat00003

 [Chemical Formula 4]

Figure 112015083426777-pat00004

In the general formulas (1) and (2), R 1 to R 4 are each independently selected from the group consisting of an alkyl group, an alkenyl group and an alkynyl group having 1 to 10 carbon atoms. In the general formula (3), n is an integer of 0 to 5 .

In an exemplary embodiment, the first bisphenol F epoxy resin composition may have a molecular weight within the range of 300 to 1,500.

In an exemplary embodiment, the second bisphenol F epoxy resin composition may include 95 to 99.9 parts by weight of the compound represented by Formula 3 based on the total weight of the second bisphenol F epoxy resin composition.

In an exemplary embodiment, the first bisphenol F epoxy resin composition has a viscosity of from 2,000 cps to 5,000 cps at 25 DEG C,

The second bisphenol F type epoxy resin composition may have a viscosity of 1,000 cps to 3,000 cps.

In an exemplary embodiment, the curing agent may include a first curing agent that is an ethyleneamine based curing agent and a second curing agent that is a polyether amine based curing agent.

In an exemplary embodiment, the first curing agent is selected from the group consisting of ethylene diamine, diethylene triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, , Aminoethylene piperazine, and aminoethylethanolamine. ≪ / RTI >

In an exemplary embodiment, the second curing agent is a polyether monoamine curing agent having a molecular weight in the range of 600 to 2,000, a chain or branched polyether diamine curing agent having a molecular weight in the range of 140 to 4,000, A chain type polyether triamine type curing agent having a molecular weight and a branched polyether triamine type curing agent having a molecular weight within a range of 400 to 5,000.

In an exemplary embodiment, the epoxy resin composition for HP-RTM comprises, based on 100 parts by weight of the first bisphenol F type epoxy resin, 5 to 100 parts by weight of the second bisphenol F type epoxy resin; 10 to 50 parts by weight of the modified epoxy resin; 10 to 40 parts by weight of the first curing agent and 5 to 20 parts by weight of the second curing agent; . ≪ / RTI >

In an exemplary embodiment, the epoxy resin composition for HP-RTM may have a viscosity of 850 cps to 2000 cps at 25 占 폚.

In an exemplary embodiment, the epoxy resin composition for HP-RTM may have a gel time of 10 seconds to 110 seconds at 120 < 0 > C.

In an exemplary embodiment, the epoxy resin composition for HP-RTM may have a glass transition temperature of from 70 캜 to 110 캜.

In an exemplary embodiment, the epoxy resin composition for HP-RTM has a viscosity of 850 cps to 2000 cps at 25 占 폚; A gel time of from 10 seconds to 110 seconds at 120 DEG C; And a glass transition temperature of from 70 캜 to 110 캜; Lt; / RTI >

The epoxy resin composition for HP-RTM according to an embodiment of the present invention may have a viscosity, a gel time and a high glass transition temperature value within a certain range. Accordingly, it can be usefully used in the HP-RTM process, thereby reducing the reaction time of the process and improving the productivity of the final product.

Hereinafter, embodiments of the present invention will be described in detail. Although embodiments of the present invention have been described, it is to be understood that the same is by way of illustration only and is not to be construed as limiting the technical spirit and scope of the invention.

In the present specification, "high purity" means that in the second bisphenol F type epoxy resin composition, the content of the compound represented by the following general formula (4) is increased through distillation.

Epoxy resin composition for high pressure resin transfer molding

The present invention relates to a modified epoxy resin represented by the following general formula (1) or (2); A first bisphenol F epoxy resin composition comprising 80 to 90 parts by weight of a compound represented by the following formula (4) based on the total weight of the first bisphenol F epoxy resin composition, the composition comprising a compound having a structure represented by the following formula A first bisphenol F type epoxy resin composition; A second bisphenol F type epoxy resin composition comprising a compound having a structure represented by the following formula (3) and having a higher purity than the first bisphenol F type epoxy resin composition; And curing agents; Resin transfer molding (HP-RTM) epoxy resin composition.

 [Chemical Formula 1]

Figure 112015083426777-pat00005

(2)

Figure 112015083426777-pat00006

(3)

Figure 112015083426777-pat00007

Meanwhile, when n is 0, the compound having the structure represented by the formula (3) may be represented by the following formula (4).

[Chemical Formula 4]

Figure 112015083426777-pat00008

In the general formulas (1) and (2), R 1 , R 2 and R 3 are each independently selected from the group consisting of an alkyl group, an alkenyl group and an alkynyl group having 1 to 10 carbon atoms. In the general formula (3), n may be an integer of 0 to 5 inclusive.

The bisphenol F type epoxy resin composition of the present invention may be composed of a first bisphenol F type epoxy resin composition and a second bisphenol F type epoxy resin composition.

The first bisphenol F epoxy resin composition may include the compounds represented by Formula 3, and the first bisphenol F epoxy resin composition may include 80 to 90 parts by weight of the compound represented by Formula 4 can do.

In an exemplary embodiment, the first bisphenol F epoxy resin composition may have a molecular weight (Mw) of 300 to 1,500 and a viscosity of 2,000 cps to 5,000 cps. Preferably, the first bisphenol F epoxy resin composition may have a viscosity of from 2,500 cps to 4,500 cps.

In the epoxy resin composition for HP-RTM of the present invention, the second bisphenol F epoxy resin composition may be composed of the materials represented by the above-mentioned formula (3), and may be distilled to have a higher purity than the first bisphenol F epoxy resin composition . Specifically, the second bisphenol F epoxy resin composition may be prepared to have a higher purity than the first bisphenol F epoxy resin composition through a distillation process, and the second bisphenol F epoxy resin composition may further include And 95 to 99.9 parts by weight of the compound.

Preferably, the second bisphenol F epoxy resin composition comprises 98 to 99 parts by weight of the compound represented by the general formula (4) based on the total weight of the second bisphenol F epoxy resin composition.

Through the distillation process, the content of the compound represented by the general formula (4) in the second bisphenol F type epoxy resin composition can be increased. Accordingly, the second bisphenol F epoxy resin composition has a higher purity than the first bisphenol F epoxy resin composition, and can have a high glass transition temperature and a low mixture viscosity.

In an exemplary embodiment, the second bisphenol F epoxy resin composition may have a viscosity of 500 cps to 3,000 cps. Preferably, the viscosity of the second bisphenol F epoxy resin composition may be 800 cps to 2,500 cps, more preferably 1,000 to 2,000 cps.

In the epoxy resin composition for HP-RTM of the present invention, the modified epoxy resin may be represented by the following formula (1) or (2).

 [Chemical Formula 1]

Figure 112015083426777-pat00009

(2)

Figure 112015083426777-pat00010

In the general formulas (1) and (2), R 1 , R 2 and R 3 are each independently selected from the group consisting of an alkyl group, an alkenyl group and an alkynyl group having 1 to 10 carbon atoms.

In an exemplary embodiment, the modified epoxy resin may have a molecular weight ranging from 300 to 700 and may have a viscosity of from 1,000 to 3,000 cps.

The epoxy resin composition for HP-RTM according to an embodiment of the present invention may include a curing agent, and the curing agent may include a first curing agent which is an ethyleneamine type curing agent and a second curing agent which is a polyether amine type curing agent.

In an exemplary embodiment, the first curing agent is selected from the group consisting of diethylene triamine, ethylene diamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, , Aminoethylene piperazine, aminoethylethanolamine, and the like.

Meanwhile, the second curing agent may be a polyether amine-based curing agent having a molecular weight ranging from 140 to 5,000. The polyetheramine-based curing agent may be mono-, di-, or triamine, and the polyetheramine-based curing agent may be terminated with one or more amine groups.

Specifically, the second curing agent is a polyether monoamine curing agent having a molecular weight in the range of 600 to 2,000, a chain or branched polyether diamine curing agent having a molecular weight in the range of 140 to 4,000, a curing agent having a molecular weight in the range of 400 to 5,000 A chain type polyether triamine type curing agent and a branched polyether triamine type curing agent having a molecular weight within the range of 400 to 5,000.

For example, the polyether amine-based curing agent may be a curing agent having a trade name JEFFAMINE® available from Huntsman Corporation, specifically D-230, D-400, D-2000, D T-3000, T-3000, ED-900, ED-2003, ED-148, T-403, T-3000, M-600, M-1000, M-2005, .

In an exemplary embodiment, the epoxy resin composition for HP-RTM comprises, based on 100 parts by weight of the first bisphenol F type epoxy resin composition, 5 to 100 parts by weight of the second bisphenol F type epoxy resin composition; 10 to 50 parts by weight of the modified epoxy resin; 10 to 40 parts by weight of the first curing agent and 5 to 20 parts by weight of the second curing agent.

Specifically, when the epoxy resin composition for HP-RTM of the present invention is less than 5 parts by weight based on 100 parts by weight of the first bisphenol F epoxy resin composition, the epoxy resin for HP-RTM The mixed viscosity of the composition increases and the glass transition temperature of the epoxy resin composition for HP-RTM can be reduced. On the other hand, when the second bisphenol F type epoxy resin composition is mixed with 100 parts by weight of the first bisphenol F type epoxy resin composition , The gel time of the epoxy resin composition for HP-RTM may be increased and crystallized.

On the other hand, when the modified epoxy is less than 10 parts by weight based on 100 parts by weight of the first bisphenol F epoxy resin composition, the mixed viscosity of the epoxy resin composition for HP-RTM may increase. When the modified epoxy is more than 50 parts by weight based on 100 parts by weight of the first bisphenol F type epoxy resin composition, the mixed viscosity and gel time of the epoxy resin composition for HP-RTM are increased and the glass transition temperature is decreased .

In addition, when the first curing agent is less than 4 parts by weight or more than 40 parts by weight based on 100 parts by weight of the first bisphenol F epoxy resin composition, the curing density of the epoxy resin composition for HP-RTM is very low, May not exhibit excellent physical properties. On the other hand, when the second curing agent is less than 2 parts by weight or more than 20 parts by weight based on 100 parts by weight of the first bisphenol F epoxy resin composition, the epoxy resin composition for HP-RTM is not cured, The glass transition temperature and other physical properties may not be excellent.

The epoxy resin composition for HP-RTM according to one embodiment of the present invention may have a viscosity of 500 cps to 5000 cps at 25 ° C, and preferably a viscosity of 850 cps to 3,500 cps.

In addition, the epoxy resin composition for HP-RTM may have a gel time of 10 seconds to 110 seconds, preferably a gel time of 30 seconds to 60 seconds.

In addition, the epoxy resin composition for HP-RTM may exhibit a glass transition temperature of 70 ° C to 110 ° C, and preferably a glass transition temperature of 90 ° C to 110 ° C.

The epoxy resin composition for HP-RTM according to an embodiment of the present invention may have a viscosity of 850 cps to 3500 cps at 25 ° C, a composition having a gel time of 10 seconds to 180 seconds, a glass transition temperature of 70 ° C to 110 ° C Lt; / RTI > The above conditions will have optimum conditions in the HP-RTM process, and thus the HP-RTM process time can be shortened without deteriorating the physical properties of the epoxy resin composition. Thus, the final product manufactured by the HP-RTM process The productivity of the product can be improved.

The embodiments of the present invention described above should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of protection of the present invention as long as it is obvious to those skilled in the art.

Example

Hereinafter, the present invention will be described in more detail with reference to Examples. It is to be understood by those skilled in the art that these embodiments are only for illustrating the present invention and that the scope of the present invention is not construed as being limited by these embodiments.

Example  Preparation of 1 to 9

As the first bisphenol F epoxy resin composition, an SEF-170 epoxy resin composition of Shin-Etsu Chemical Co., Ltd. was used, and as a second bisphenol F epoxy resin composition, SEF-170P epoxy resin composition of Shin- As the modified epoxy resin, SED-3300 epoxy resin of Shin-Etsu Chemical Co., Ltd. was used.

Also, diethylene triamine was used as the first curing agent, and D-230 (Jeffamine) of Huntsman was used as the second curing agent.

The above materials were mixed together as shown in Table 1 below to form epoxy resin compositions according to Examples 1 to 9.

division The first bisphenol F type epoxy resin composition Second Bisphenol F Type Epoxy Resin Composition denaturalization
Epoxy resin The first curing agent The second curing agent SEF-170 SEF-170P SED-3300 DETA D-230 Weight portion 100 5-100 10 to 50 10 to 40 5-20 Example 1 100 5 10 10.9 2.7 Example 2 100 20 10 11.0 2.8 Example 3 100 50 10 11.2 2.8 Example 4 100 80 10 11.3 2.8 Example 5 100 100 10 11.4 2.9 Example 6 100 50 30 10.8 2.7 Example 7 100 50 50 10.5 2.6 Example 8 100 50 30 8.7 8.7 Example 9 100 50 30 4.9 19.8

Example  Preparation of 10-12

The above materials were mixed together as shown in Table 2 below to form an epoxy resin composition according to Examples 10 to 12.

division The first bisphenol F type epoxy resin composition Second Bisphenol F Type Epoxy Resin Composition denaturalization
Epoxy resin The first curing agent The second curing agent SEF-170 SEF-170P SED-3300 DETA D-230 Example 10 100 0 30 9.3 2.3 Example 11 100 150 30 10.8 2.7 Example 12 100 200 30 10.9 2.7

Example  Preparation of 13-15

The above materials were mixed together as shown in Table 3 below to form an epoxy resin composition according to Examples 13 to 15.

division The first bisphenol F type epoxy resin The second bisphenol F type epoxy resin denaturalization
Epoxy resin The first curing agent The second curing agent SEF-170 SEF-170P SED-3300 DETA D-230 Example 13 100 50 0 11.5 2.9 Example 14 100 50 70 8.7 2.2 Example 15 100 50 100 8.0 2.0

Comparative Example  Preparation of 1 and 2

The above materials were mixed together in the amounts shown in Table 4 below to form epoxy resin compositions according to Comparative Examples 1 and 2, respectively.

division The first bisphenol F type epoxy resin composition Second Bisphenol F Type Epoxy Resin Composition denaturalization
Epoxy resin The first curing agent The second curing agent SEF-170 SEF-170P SED-3300 DETA D-230 Comparative Example 1 100 50 30 10.9 - Comparative Example 2 100 50 30 - 31.7

Experimental Example : Mixed viscosity of epoxy resin composition, Gel time  And glass transition temperature experiment

The mixed viscosity, gel time and glass transition temperature of the epoxy resin composition for HP-RTM according to Examples 1 to 15 and the epoxy resin composition according to Comparative Examples 1 and 2 were measured and are shown in Table 5.

At this time, the mixed viscosity was measured by a brookfield viscometer, the gel time was measured under a hot plate condition at a surface temperature of 120 ° C, and the glass transition temperature was measured by DSC under a temperature increasing rate of 20 ° C / min.

division Mixed viscosity (25 ° C, cps) Gel time (120 ° C, sec) Tg (占 폚) Example 1 3,125 42 101.9 Example 2 2,094 43 103.1 Example 3 1,545 45 104.4 Example 4 1,310 47 105.4 Example 5 1,149 49 105.9 Example 6 1,432 48 104.2 Example 7 1,319 51 101.1 Example 8 1,237 81 97.8 Example 9 872 166 91.5 Example 10 3,980 45 101.5 Example 11 961 55 106.4 Example 12 724 59 107.1 Example 13 1,722 41 104.7 Example 14 1,487 59 103.5 Example 15 2,294 76 103.3 Comparative Example 1 1,653 45 108.3 Comparative Example 2 523 420 87.4

First, an epoxy resin composition for HP-RTM according to Examples 10 to 12, in which the epoxy resin composition according to Example 6 and the high purity second bisphenol F type epoxy resin composition are less than 5 parts by weight or more than 100 parts by weight, And the physical properties were compared.

As shown in Table 5, when the amount of the second bisphenol F epoxy resin composition was less than 5 parts by weight, it was confirmed that the mixed viscosity of Example 10 was slightly increased to 3,980 cps and the gel time and glass transition temperature were slightly decreased. On the other hand, in the case of the epoxy resin composition for HT-RTM prepared according to Examples 11 and 12 in which the second bisphenol F type epoxy resin composition is more than 100 parts by weight, the mixed viscosity decreases and the gel time and the glass transition temperature increase I could confirm.

Then, comparing the physical properties of the epoxy composition for HP-RTM according to Examples 13 to 15 when the epoxy composition for HP-RTM prepared according to Example 6 and the modified epoxy resin were less than 10 parts by weight or more than 50 parts by weight Respectively.

Comparing the epoxy composition for HP-RTM prepared according to Example 6 with the epoxy composition for HP-RTM prepared according to Example 13 in which the modified epoxy resin was less than 10 parts by weight, the HP It was confirmed that the epoxy composition for HP-RTM prepared according to Example 13 has an increased mixed viscosity, a reduced gel time and an increased glass transition temperature compared to the epoxy composition for RTM.

 Further, when comparing the epoxy composition for HP-RTM prepared according to Example 6 with the epoxy composition for HP-RTM according to Examples 14 and 15 which is an embodiment exceeding 50 parts by weight of modified epoxy resin, Examples 14 and 15 Showed that the epoxy composition for HP-RTM exhibited increased mixing viscosity and gel time as compared to the epoxy composition for HP-RTM prepared according to Example 6, and that the glass transition temperature was reduced.

Next, the epoxy resin composition for HP-RTM according to Example 6, Comparative Example 1 containing only the first curing agent, and Comparative Example 2 containing only the second curing agent were respectively compared.

It was confirmed that the epoxy composition according to Comparative Example 1 containing only the first curing agent showed a decrease in gel time and an increase in glass transition temperature but an increase in the mixed viscosity as compared with the epoxy composition for HP-RTM according to Example 6. [ On the other hand, the epoxy composition according to Comparative Example 2 containing only the second curing agent showed a decrease in the mixed viscosity as compared with the epoxy composition for HP-RTM according to Example 6, but the gel time was increased and the glass transition temperature was decreased .

Claims (12)

A modified epoxy resin represented by the following formula (1) or (2);
A first bisphenol F epoxy resin composition comprising 80 to 90 parts by weight of a compound represented by the following formula (4) based on the total weight of the first bisphenol F epoxy resin composition, the composition comprising a compound having a structure represented by the following formula A first bisphenol F type epoxy resin composition;
A second bisphenol F type epoxy resin composition comprising a compound having a structure represented by the following formula (3) and having a higher purity than the first bisphenol F type epoxy resin composition; And
Curing agent; / RTI >
The first bisphenol F epoxy resin composition has a viscosity of from 2,000 cps to 5,000 cps at 25 ° C,
Wherein the second bisphenol F epoxy resin composition has a viscosity of 1,000 cps to 3,000 cps. The epoxy resin composition for high pressure-resin transfer molding (HP-RTM)
[Chemical Formula 1]
Figure 112016000201813-pat00011

(2)
Figure 112016000201813-pat00012

(3)
Figure 112016000201813-pat00013

[Chemical Formula 4]
Figure 112016000201813-pat00014

Wherein R 1 to R 4 are each independently selected from the group consisting of an alkyl group, an alkenyl group and an alkynyl group having 1 to 10 carbon atoms, and in the formula (3), n is an integer of 0 to 5 / RTI > The method according to claim 1,
Wherein the first bisphenol F epoxy resin composition has a molecular weight of 300 to 1,500 or less. The method according to claim 1,
Wherein the second bisphenol F epoxy resin composition comprises 95 to 99.9 parts by weight of the compound represented by Formula 3 based on the total weight of the second bisphenol F epoxy resin composition. delete The method according to claim 1,
Wherein the curing agent comprises a first curing agent which is an ethyleneamine type curing agent and a second curing agent which is a polyether amine type curing agent. 6. The method of claim 5,
The first curing agent may be at least one selected from the group consisting of ethylene diamine, diethylene triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, aminoethylene piperazine) and aminoethylethanolamine. The epoxy resin composition for HP-RTM is at least one selected from the group consisting of aminoethylene piperazine and aminoethylethanolamine. 6. The method of claim 5,
Wherein the second curing agent is selected from the group consisting of a polyether monoamine curing agent having a molecular weight in the range of 600 to 2,000, a chain or branched polyether diamine curing agent having a molecular weight in the range of 140 to 4,000, An ether triamine-based curing agent and a branched polyether triamine-based curing agent having a molecular weight within the range of 400 to 5,000. 6. The method of claim 5,
5 to 100 parts by weight of the second bisphenol F type epoxy resin relative to 100 parts by weight of the first bisphenol F type epoxy resin; 10 to 50 parts by weight of the modified epoxy resin; 10 to 40 parts by weight of the first curing agent and 5 to 20 parts by weight of the second curing agent; ≪ RTI ID = 0.0 > HP-RTM. ≪ / RTI > The method according to claim 1,
An epoxy resin composition for HP-RTM having a viscosity of 850 cps to 2000 cps at 25 占 폚. The method according to claim 1,
An epoxy resin composition for HP-RTM having a gel time of 10 seconds to 110 seconds at 120 占 폚. The method according to claim 1,
An epoxy resin composition for HP-RTM having a glass transition temperature of 70 캜 to 110 캜. The method according to claim 1,
A viscosity of 850 cps to 2000 cps at 25 占 폚;
A gel time of from 10 seconds to 110 seconds at 120 DEG C; And
A glass transition temperature of 70 ° C to 110 ° C; Lt; RTI ID = 0.0 > HP-RTM. ≪ / RTI >
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109825230A (en) * 2019-02-01 2019-05-31 上海牛元工贸有限公司 A kind of double-component aqueous epoxy color sand gap filler and preparation method thereof
CN112029237A (en) * 2020-09-10 2020-12-04 惠柏新材料科技（上海）股份有限公司 Two-component epoxy resin composition and preparation method and application thereof
CN115433344A (en) * 2022-09-02 2022-12-06 深圳市飞荣达科技股份有限公司 Fast curing agent for HP-RTM (high pressure-resin transfer molding) and preparation method and application thereof

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