KR101590907B1 - Directional Coupler by using New Tight coupling Method - Google Patents

Directional Coupler by using New Tight coupling Method Download PDF

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Publication number
KR101590907B1
KR101590907B1 KR1020150111437A KR20150111437A KR101590907B1 KR 101590907 B1 KR101590907 B1 KR 101590907B1 KR 1020150111437 A KR1020150111437 A KR 1020150111437A KR 20150111437 A KR20150111437 A KR 20150111437A KR 101590907 B1 KR101590907 B1 KR 101590907B1
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South Korea
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directional coupler
ground
floating conductor
substrate
coupling line
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KR1020150111437A
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Korean (ko)
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김병철
장익수
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(주)엑소더스커뮤니케이션스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines

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Abstract

The present invention relates to a 3 dB directional coupler using a new strong combining method. The 3 dB directional coupler has a coupling line of a coplanar waveguide structure on the upper surface and the lower surface of the substrate to realize an excellent mode impedance and a radix mode impedance value of the coupled line so that the coupling coefficient C is 0.707 A floating conductor is disposed between the coupling line and the ground, or a floating conductor is disposed at the center of the coupling line.
In the directional coupler according to the present invention, by inserting a floating conductor between the coupling line and ground, or by inserting a floating conductor at the center of the coupling line, Coo is increased to reduce Zoo, Coe is decreased and Zoe is increased, So that it can be adjusted to a desired value.

Description

[0001] The present invention relates to a directional coupler using a new strong coupling method,

The present invention relates to a directional coupler, and more particularly, to a 3-dB directional coupler in which the size of an input signal is 1/2 out of two output ports and one port is isolated.

Components that output half of the input signal from the microwave communication port to both output ports are widely used. There are various types such as a Wilkinson power divider, a branch line hybrid, a ring hybrid, and a coupled line coupler.

In particular, as shown in FIGS. 1 to 4, the directional coupler is mainly a four-port device, and has one input port, two output ports, an isolation port, and the like.

1 shows a typical 3 dB coupler, wherein (a) is a Wilkinson power divider, (b) is a branch line hybrid coupler, and (c) is a ring hybrid coupler. As shown in FIG. 1, the Wilkinson power distributor, the branch line hybrid coupler, and the ring hybrid coupler are DC connected, which is inconvenient when bias is applied.

On the other hand, conventional Coupled Line Coupler is almost impossible to make 3dB coupler. Therefore, in order to make a 3dB coupler with Coupled Line Coupler structure, many PCBs are stacked on PCB, and Lange Coupler is used as a single PCB. FIG. 2 is a view of a conventional modular directional coupler, and FIG. 3 is a view of a conventional Lange coupler.

As shown in FIG. 2, the 3-dB coupler in the form of a module has a complicated structure and is difficult to manufacture. Also, as shown in FIG. 3, there is a problem that the Lange Coupler can be manufactured by using a wire bonding equipment to connect lines and lines.

4A is a front view of a directional coupler of a coupled line structure, and FIG. 4B is a cross-sectional view taken along the line A-A 'of FIG. 4A. Referring to FIG. 4, the directional coupler is composed of a coupling line composed of a first microstrip line 700 and a second microstrip line 710. In order for the coupling coefficient of the directional coupler to be 3 dB, the best mode impedance Zoe at the coupling coefficient C = (Zoe-Zoo) / (Zoe + Zoo) should be larger than 120O and the radix mode impedance Zoo should be smaller than 20O. Here, Zoe = 1 / VpCoe and Zoe = 1 / VpCoo. In the coupled line structure shown in FIG. 4, since Coe can not be made small and Coo can not be made large, 3dB directional couplers can not be formed.

Korean Patent Laid-Open Publication No. 10-2003-0050467 Korean Patent Laid-Open Publication No. 10-2011-0008871

In order to solve the above-described problems, it is an object of the present invention to provide a 3-dB directional coupler of a coupled line structure using a tight coupling through a simple structure change.

According to an aspect of the present invention, there is provided a directional coupler comprising: a substrate made of a dielectric material and having an upper surface and a lower surface opposite to each other; A coupling line composed of first and second microstrip lines respectively formed in the form of a coplanar waveguide on the upper surface and the lower surface of the substrate; And a ground formed at a distance from both sides of the coupling line.

A directional coupler according to a second aspect of the present invention includes: a substrate made of a dielectric and having an upper surface and a lower surface opposite to each other; A coupling line composed of first and second microstrip lines respectively formed in the form of a coplanar waveguide on the upper surface and the lower surface of the substrate; A ground formed at a distance from both sides of the coupling line; And a floating conductor which is disposed between the coupling line and the ground and is spaced apart from the coupling line and the ground by a predetermined distance.

A directional coupler according to a third aspect of the present invention comprises: a substrate made of a dielectric material and having upper and lower surfaces facing each other; A coupling line composed of first and second microstrip lines respectively formed in the form of a coplanar waveguide on the upper surface and the lower surface of the substrate; A ground formed at a distance from both sides of the coupling line; And a floating conductor disposed at a center of the coupling line and spaced apart from the coupling line by a predetermined distance.

In the directional coupler according to the second and third aspects, the floating conductor may include: a first floating conductor formed on an upper surface of the substrate; A second floating conductor formed on a lower surface of the substrate; And a via hole filled with an electrically conductive material to electrically connect the first floating conductor and the second floating conductor.

In the directional coupler according to the first to third aspects, the ground may include: a first ground formed on an upper surface of the substrate; A second ground formed on a lower surface of the substrate; And a via hole filled with an electrically conductive material and electrically connecting the first ground and the second ground.

In the directional coupler according to any one of the first to third aspects, the directional coupler is preferably a 3 dB directional coupler having a coupling coefficient C of 0.707.

In the directional coupler according to the second and third aspects, it is preferable to set the spacing between the coupling line and the floating conductor and the spacing between the floating conductor and the ground so that the coupling coefficient C is 0.707.

In the directional coupler according to the first aspect, it is preferable to set the separation distance between the coupling line and the ground so that the coupling coefficient C is 0.707.

The 3 dB directional coupler using the new strong coupling method according to the present invention is inserted between the respective stages of the multi-stage power amplifier and divided into the same power by 3 dB on both sides to be applied to the next stage, and is composed of several transistors And is used in a power amplifier that outputs a large output by bundling the output of the final stage.

Further, the 3dB directional coupler using the new strong coupling method according to the present invention can be constructed much simpler than the modular directional coupler or the Lange coupler, and is also very easy to implement.

FIG. 1 is a diagram showing a conventional Wilkinson power distributor, a branch line hybrid, and a ring hybrid.
2 is a diagram of a conventional modular directional coupler.
3 is a view of a conventional Lange coupler.
4 is a front view and a cross-sectional view of a directional coupler of a conventional coupled line structure.
5 is a front view and a sectional view of the directional coupler according to the first embodiment of the present invention.
6 is a front view and a sectional view of a directional coupler according to a second embodiment of the present invention.
7 is a front view and a sectional view of a directional coupler according to a third embodiment of the present invention.

The 3dB directional coupler using the new strong coupling method according to the present invention is based on the fact that the value of C is 0.707 in the formula C = (Zoe-Zoo) / (Zoe + Zoo) Is 0.707, and a method for implementing the odd mode impedance and the odd mode impedance value of the coupled line is presented.

Hereinafter, the structure of the 3dB directional coupler according to the present invention having the above-described characteristics will be described in detail.

≪ Embodiment 1 >

The 3dB directional coupler according to the first embodiment of the present invention is characterized in that a coplanar waveguide is formed on the upper surface and the lower surface of the substrate. Hereinafter, the structure of the 3 dB directional coupler according to the first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

5 is a front view and a sectional view of the directional coupler according to the first embodiment of the present invention. Referring to FIG. 5, the directional coupler 10 according to the first embodiment includes a substrate 100, a first microstrip line 110, a second microstrip line 120, and a ground 130.

The substrate 100 is made of a dielectric material and has upper and lower surfaces facing each other. For example, a printed circuit board (PCB) can be used.

Coupled lines are composed of first and second microstrip lines 110 and 120 respectively formed in the form of a coplanar waveguide on the upper and lower surfaces of the substrate. The first microstrip line 110 is formed on the upper surface of the substrate, and the second microstrip line 120 is formed on the lower surface of the substrate. 5, both ends of the first microstrip line 120 are represented by ports of (3) and (4), and the second microstrip line 110 is connected to the ground and the lower portion of the first microstrip line Both ends of which are indicated by ports 1 and 2, respectively.

The ground 130 is formed at a distance from both sides of the coupling line. The ground 130 includes a first ground 132 formed at a position spaced apart from the first microstrip line 110 located on the upper surface of the substrate, A second ground 134 formed at a position spaced apart from the second microstrip line 120 at a lower surface of the first microstrip line 120 and a second ground 134 electrically connected to the first ground and the second ground, (136).

On the other hand, the coupling coefficient C of the directional coupler is obtained by the following equation (1).

Figure 112015076621057-pat00001

In order for the coupling coefficient to be 3dB, the best mode impedance Zoe can be expressed as 1 / VpCoe and must be greater than 120Ω, and the radix mode impedance Zoo can be expressed as 1 / VpCoo and less than 20Ω.

As shown in Fig. 5, the directional coupler according to the present embodiment forms a coupling line in the coplanar waveguide by configuring the coupling line in the form of a coplanar waveguide on the upper and lower surfaces of the substrate. In this case, since Coe is a small value at the edge, Zoe can be raised, and Coo can make a large value by the upper surface and the lower surface, thereby making the Zoo small. As a result, Coe is made smaller and Coo is made larger, so that the modulus of the directional coupler can be adjusted to be 3 dB so as to make a 3 dB directional coupler.

Therefore, it is preferable that the directional coupler according to the present embodiment has a distance between the edge of the ground and the coupling line so that the coupling coefficient is 0.707.

≪ Embodiment 2 >

The 3 dB directional coupler according to the second embodiment of the present invention is characterized in that a coplanar waveguide is formed on the upper surface and the lower surface of the substrate and a floating conductor is disposed between the coupling line and the ground do. Hereinafter, the structure of a 3 dB directional coupler according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

6 is a front view and a sectional view of a directional coupler according to a second embodiment of the present invention. Referring to FIG. 6, the directional coupler 20 according to the second embodiment includes a substrate 200, a first microstrip line 210, a second microstrip line 220, a ground 230, and a floating conductor 240 , 250). The substrate, the first microstrip line, the second microstrip line, and the grounding of the directional coupler 20 according to the present embodiment are the same as those of the first embodiment, and a duplicate description will be omitted.

The floating conductors 240 and 250 are formed between the coupling line and ground and include first floating conductors 242 and 252 formed between the first microstrip line and the ground located on the upper surface of the substrate, Second floating conductors 244 and 254 formed between the second microstrip line and ground, and via holes 246 and 256, which are filled with the electrically conductive material and electrically connect the first and second floating conductors, Respectively.

The directional coupler according to the present embodiment inserts a floating conductor between the first microstrip line and the ground and between the second microstrip line and the ground so that the capacitance formed between the upper and lower surfaces and the capacitance between the floating conductor and the coupling line Coo is greatly increased as the resulting capacity is added. On the other hand, as the capacity between the coupling line and the edge of the floating conductor and the capacitance between the edge of the floating conductor and the edge of the ground are connected in series, Coe becomes a very small value. As described above, the directional coupler according to the present embodiment increases the Coo by inserting the floating conductor to reduce the Zoo and reduce the Coe to increase the Zoe.

As a result, the value of the coupling coefficient C can be made close to 1 in C = (Zoe-Zoo) / (Zoe + Zoo). Therefore, the directional coupler according to the present embodiment can be configured as a 3-D directional coupler by setting the spacing between the coupling line and the floating conductor and the spacing between the floating conductor and the ground so that the coupling coefficient C is 0.707.

≪ Third Embodiment >

The 3dB directional coupler according to the third embodiment of the present invention is characterized in that a coplanar waveguide is formed on the upper surface and the lower surface of the substrate and a floating conductor is disposed in the middle of the coupling line. Hereinafter, the structure of a 3 dB directional coupler according to a third embodiment of the present invention will be described in detail with reference to the accompanying drawings.

7 is a front view and a sectional view of a directional coupler according to a third embodiment of the present invention. Referring to FIG. 7, the directional coupler 30 according to the third embodiment includes a substrate 300, a first microstrip line 310, a second microstrip line 320, a ground 330, and a floating conductor 340 . The substrate 330 and the ground 330 of the directional coupler 30 according to the present embodiment are the same as those of the first embodiment, and a duplicate description will be omitted.

The floating conductor 340 is disposed at the center of the coupling line, and is spaced apart from the coupling line by a predetermined distance. The floating conductor comprises a first floating conductor (342) formed on the upper surface of the substrate, a second floating conductor (344) formed on the lower surface of the substrate, and an electrically conductive material inside the first and second floating conductors (Not shown). Accordingly, the first floating conductor 342 is formed at the center of the first microstrip line located on the upper surface of the substrate, and the second floating conductor 344 is formed at the center of the second microstrip line located on the lower surface of the substrate. .

The coupling line includes first and second microstrip lines. The first floating conductor is located at the center of the first microstrip line. The first floating conductor is disposed at a position spaced apart from each end of the center of the first microstrip line. The second floating conductor is located at the center of the second microstrip line, and the second floating conductor is positioned at a position spaced apart from each end of the center of the second microstrip line.

In the directional coupler according to the present embodiment, Coo is hardly changed, but Coo is greatly increased as the capacitance between the microstrip line and the ground is added to the capacitance between the microstrip line and the floating conductor inside the microstrip line .

As a result, the value of the coupling coefficient C can be made close to 1 in C = (Zoe-Zoo) / (Zoe + Zoo). Therefore, the directional coupler according to the present embodiment can be configured as a 3-D directional coupler by setting the spacing between the coupling line and the floating conductor and the spacing between the floating conductor and the ground so that the coupling coefficient C is 0.707.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various changes and modifications may be made without departing from the spirit and scope of the invention. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

The strong coupling directional coupler according to the present invention can be constructed in a simple structure and is very easy to implement, so that it can be used to fabricate a power amplifier that outputs a large output by bundling outputs of a final stage composed of several TRs.

Also, the 3dB directional coupler using the new strong coupling method according to the present invention can be used to replace most of the modular directional couplers.

10, 20, 30: directional coupler
100, 200, 300: substrate
110, 210 and 310: a first microstrip line
120, 220, 320: a second microstrip line
130, 230, 330: ground
132, 232, 332: first ground
134, 234, 334: second ground
136, 236, 336: ground via hole
240, 250, 340: Floating conductor
242, 252, 343: a first floating conductor
244, 254, 344: a second floating conductor
246, 256, 346: floating conductor via hole

Claims (8)

delete A substrate made of a dielectric and having opposed upper and lower surfaces;
A coupling line composed of first and second microstrip lines respectively formed in the form of a coplanar waveguide on the upper surface and the lower surface of the substrate;
A ground formed at a distance from both sides of the coupling line; And
A floating conductor disposed between the coupling line and the ground, the floating conductor being spaced apart from the coupling line and the ground;
And a directional coupler. A substrate made of a dielectric and having opposed upper and lower surfaces;
A coupling line composed of first and second microstrip lines respectively formed in the form of a coplanar waveguide on the upper surface and the lower surface of the substrate;
A ground formed at a distance from both sides of the coupling line; And
A floating conductor disposed in the middle of the coupling line, the floating conductor being spaced apart from the coupling line by a predetermined distance;
And a directional coupler. The semiconductor device according to any one of claims 2 and 3,
A first floating conductor formed on an upper surface of the substrate;
A second floating conductor formed on a lower surface of the substrate; And
A via hole that is filled with an electrically conductive material and electrically connects the first floating conductor and the second floating conductor;
And a directional coupler. 4. The method according to any one of claims 2 to 3,
A first ground formed on an upper surface of the substrate;
A second ground formed on a lower surface of the substrate; And
A via hole filled with an electrically conductive material to electrically connect the first ground and the second ground;
And a directional coupler. The directional coupler according to any one of claims 2 to 3, wherein the directional coupler is a 3dB directional coupler having a coupling coefficient C of 0.707. The directional coupler according to any one of claims 2 and 3, wherein the directional coupler sets the spacing distance between the coupling line and the floating conductor and the spacing between the floating conductor and the ground so that the coupling coefficient C is 0.707. Coupler. delete
KR1020150111437A 2015-08-07 2015-08-07 Directional Coupler by using New Tight coupling Method KR101590907B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108987874A (en) * 2018-07-20 2018-12-11 西安电子科技大学 The adjustable strip line coupler of the degree of coupling based on graphene nanometer sheet
CN110855334A (en) * 2019-11-15 2020-02-28 Oppo广东移动通信有限公司 Radio frequency circuit and terminal
CN110854533A (en) * 2019-11-15 2020-02-28 Oppo广东移动通信有限公司 Antenna module and terminal

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023309A (en) 2001-07-05 2003-01-24 Toshiba Corp Method for increasing coupling capacitance of directional coupler and microwave circuit board applied with the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023309A (en) 2001-07-05 2003-01-24 Toshiba Corp Method for increasing coupling capacitance of directional coupler and microwave circuit board applied with the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108987874A (en) * 2018-07-20 2018-12-11 西安电子科技大学 The adjustable strip line coupler of the degree of coupling based on graphene nanometer sheet
CN110855334A (en) * 2019-11-15 2020-02-28 Oppo广东移动通信有限公司 Radio frequency circuit and terminal
CN110854533A (en) * 2019-11-15 2020-02-28 Oppo广东移动通信有限公司 Antenna module and terminal
CN110855334B (en) * 2019-11-15 2021-10-29 Oppo广东移动通信有限公司 Radio frequency circuit and terminal
CN110854533B (en) * 2019-11-15 2021-11-02 Oppo广东移动通信有限公司 Antenna module and terminal

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