KR101577439B1 - Semiconductor package and method for manufactuing the same - Google Patents

Semiconductor package and method for manufactuing the same Download PDF

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Publication number
KR101577439B1
KR101577439B1 KR1020080117427A KR20080117427A KR101577439B1 KR 101577439 B1 KR101577439 B1 KR 101577439B1 KR 1020080117427 A KR1020080117427 A KR 1020080117427A KR 20080117427 A KR20080117427 A KR 20080117427A KR 101577439 B1 KR101577439 B1 KR 101577439B1
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KR
South Korea
Prior art keywords
semiconductor package
substrate
touch
spacer
mobile terminal
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KR1020080117427A
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Korean (ko)
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KR20100058862A (en
Inventor
김신우
김태현
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엘지전자 주식회사
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Priority to KR1020080117427A priority Critical patent/KR101577439B1/en
Publication of KR20100058862A publication Critical patent/KR20100058862A/en
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Publication of KR101577439B1 publication Critical patent/KR101577439B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

The present invention provides a semiconductor package and a method of manufacturing the same, which can prevent the substrate from being warped when mounted on a motherboard of an electronic device such as a mobile terminal, provided with a spacer.

The semiconductor package of the present invention can prevent the substrate from being warped by bonding the spacers formed on the lower part of the substrate to the mother board so that the short or open (solder) of the solder bonding the land of the substrate and the electrode pad of the mother board Open) defects can be prevented.

Mobile terminal, semiconductor, package, spacer, warp, solder, adhesive

Description

[0001] Semiconductor package and method for manufacturing same [0002]

The present invention relates to a semiconductor package capable of preventing warpage of a substrate and a manufacturing method thereof.

2. Description of the Related Art Generally, a mobile terminal is a portable device that is portable and has one or more functions of voice and video communication, information input / output, and data storage.

As the functions of the mobile terminal are diversified, for example, the mobile terminal has complicated functions such as photographing and photographing of a moving picture, reproduction of music or moving picture data, reception of a game and broadcasting, and the like in the form of a multimedia player .

Various new attempts have been made in terms of hardware or software to implement complex functions in such multimedia devices. For example, a user interface environment is provided for users to search for and select functions easily and conveniently.

In addition, mobile terminals are regarded as personal items to express their individuality, and various designs are required.

Meanwhile, in recent mobile terminals, a user can easily reproduce various pictures, videos, music, and the like.

However, in the conventional mobile terminal, when the user stops the reproduction of the image data, the information about the stopped image data is stored. After the saving, the user can view the list of the stopped image data only if the user selects a separate view list menu. Therefore, unless the user selects a separate menu, the user can not determine whether there is video data to be viewed again, and there is no automatic notification function that enables easy viewing of the video data at a desired time, position, There was a problem of inconvenience. In addition, in the conventional mobile terminal, there is a problem that the user can not view the image before the user is stopped, which is very inconvenient.

The present invention provides a semiconductor package and a method of manufacturing the same, in which the substrate of the semiconductor package is bent to prevent short or open failure of the solder.

According to an aspect of the present invention, there is provided a semiconductor package comprising: a substrate on which at least one chip is mounted and a plurality of lands are formed at a lower portion thereof; And a spacer formed under the substrate.

Such a spacer can prevent the substrate from being warped by bonding the substrate of the semiconductor package to the mother board, and by mounting the semiconductor package on the mother board.

And, the semiconductor package of the present invention includes a spacer layer formed with openings through which the lands of the substrate of the semiconductor package are exposed.

Therefore, since the substrate can be widely bonded to the mother board, there is an advantage that the warp of the substrate can be prevented remarkably.

According to the present invention configured as described above, spacers are provided on the substrate of the semiconductor package to prevent warpage of the substrate, thereby preventing short or open of the solder.

The present invention also provides a method of forming a spacer on the periphery of each of a plurality of lands on a lower portion of a substrate of a semiconductor package to widen the distribution of spacers located on the lower surface of the substrate of the semiconductor package, So that the solder defect can be further reduced.

In the description of the present invention, 'follow-up' means that image data interrupted during reproduction is reproduced after the interruption.

In the description of the present invention, an 'interface unit' means an interface capable of performing wireless Internet communication, Bluetooth communication, infrared communication, UWB communication, and the like.

The mobile terminal described in this specification includes a mobile phone, a smart phone, a notebook computer, a digital broadcast terminal, a PDA (Personal Digital Assistants), a PMP (Portable Multimedia Player), and navigation.

1 is a block diagram of a mobile terminal according to an embodiment of the present invention.

The mobile terminal 100 includes a wireless communication unit 110, an audio / video input unit 120, a user input unit 130, a sensing unit 140, an output unit 150, a memory 160, A controller 170, a controller 180, a power supply 190, and the like. The components shown in FIG. 1 are not essential, and a mobile terminal having more or fewer components may be implemented.

Hereinafter, the components will be described in order.

The wireless communication unit 110 may include one or more modules for enabling wireless communication between the mobile terminal 100 and the wireless communication system or between the mobile terminal 100 and the network in which the mobile terminal 100 is located. For example, the wireless communication unit 110 may include a broadcast receiving module 111, a mobile communication module 112, a wireless Internet module 113, a short distance communication module 114, a location information module 115, have.

The broadcast receiving module 111 receives broadcast signals and / or broadcast-related information from an external broadcast management server through a broadcast channel.

The broadcast channel may include a satellite channel and a terrestrial channel. The broadcast management server may refer to a server for generating and transmitting broadcast signals and / or broadcast related information, or a server for receiving broadcast signals and / or broadcast related information generated by the broadcast management server and transmitting the generated broadcast signals and / or broadcast related information. The broadcast signal may include a TV broadcast signal, a radio broadcast signal, a data broadcast signal, and a broadcast signal in which a data broadcast signal is combined with a TV broadcast signal or a radio broadcast signal.

The broadcast-related information may refer to a broadcast channel, a broadcast program, or information related to a broadcast service provider. The broadcast-related information may also be provided through a mobile communication network. In this case, it may be received by the mobile communication module 112.

The broadcast-related information may exist in various forms. For example, an EPG (Electronic Program Guide) of DMB (Digital Multimedia Broadcasting) or an ESG (Electronic Service Guide) of Digital Video Broadcast-Handheld (DVB-H).

For example, the broadcast receiving module 111 may be a Digital Multimedia Broadcasting-Terrestrial (DMB-T), a Digital Multimedia Broadcasting-Satellite (DMB-S), a Media Forward Link Only (DVF-H) And a Digital Broadcasting System (ISDB-T) (Integrated Services Digital Broadcast-Terrestrial). Of course, the broadcast receiving module 111 may be adapted to other broadcasting systems as well as the digital broadcasting system described above.

The broadcast signal and / or broadcast related information received through the broadcast receiving module 111 may be stored in the memory 160.

The mobile communication module 112 transmits and receives radio signals to at least one of a base station, an external terminal, and a server on a mobile communication network. The wireless signal may include various types of data depending on a voice call signal, a video call signal or a text / multimedia message transmission / reception.

The wireless Internet module 113 is a module for wireless Internet access, and may be built in or externally attached to the mobile terminal 100. WLAN (Wi-Fi), Wibro (Wireless broadband), Wimax (World Interoperability for Microwave Access), HSDPA (High Speed Downlink Packet Access) and the like can be used as wireless Internet technologies.

The short-range communication module 114 refers to a module for short-range communication. Bluetooth, Radio Frequency Identification (RFID), infrared data association (IrDA), Ultra Wideband (UWB), ZigBee, and the like can be used as a short range communication technology.

The position information module 115 is a module for obtaining the position of the mobile terminal, and a representative example thereof is a Global Position System (GPS) module.

Referring to FIG. 1, an A / V (Audio / Video) input unit 120 is for inputting an audio signal or a video signal, and may include a camera 121 and a microphone 122. The camera 121 processes image frames such as still images or moving images obtained by the image sensor in the video communication mode or the photographing mode. The processed image frame can be displayed on the output unit 151. [

The image frame processed by the camera 121 may be stored in the memory 160 or transmitted to the outside through the wireless communication unit 110. [ Two or more cameras 121 may be provided depending on the use environment.

The microphone 122 receives an external sound signal through a microphone in a communication mode, a recording mode, a voice recognition mode, or the like, and processes it as electrical voice data. The processed voice data can be converted into a form that can be transmitted to the mobile communication base station through the mobile communication module 112 when the voice data is in the call mode, and output. Various noise reduction algorithms may be implemented in the microphone 122 to remove noise generated in receiving an external sound signal.

The user input unit 130 generates input data for a user to control the operation of the terminal. The user input unit 130 may include a key pad dome switch, a touch pad (static / static), a jog wheel, a jog switch, and the like.

The sensing unit 140 senses the current state of the mobile terminal 100 such as the open / close state of the mobile terminal 100, the position of the mobile terminal 100, the presence of the user, the orientation of the mobile terminal, And generates a sensing signal for controlling the operation of the mobile terminal 100. For example, when the mobile terminal 100 is in the form of a slide phone, it is possible to sense whether the slide phone is opened or closed. It is also possible to sense whether the power supply unit 190 is powered on, whether the interface unit 170 is connected to an external device, and the like. Meanwhile, the sensing unit 140 may include a proximity sensor 141.

The output unit 150 includes an output unit 151, an audio output module 152, an alarm unit 153, and a haptic module 154, for example, for generating output related to visual, auditory, .

The output unit 151 displays (outputs) information processed by the mobile terminal 100. For example, when the mobile terminal is in the call mode, a UI (User Interface) or a GUI (Graphic User Interface) associated with a call is displayed. When the mobile terminal 100 is in the video communication mode or the photographing mode, the photographed and / or received video or UI and GUI are displayed.

The output unit 151 may be a liquid crystal display (LCD), a thin film transistor-liquid crystal display (TFT LCD), an organic light-emitting diode (OLED), a flexible display display, and a 3D display.

Some of these displays may be transparent or light transmissive so that they can be seen through. This can be referred to as a transparent display, and a typical example of the transparent display is TOLED (Transparent OLED) and the like. The rear structure of the output section 151 may also be of a light transmission type structure. With this structure, the user can see an object located behind the terminal body through the area occupied by the output unit 151 of the terminal body.

There may be two or more output units 151 depending on the implementation of the mobile terminal 100. [ For example, in the mobile terminal 100, a plurality of outputs may be spaced apart or arranged integrally on one surface, and may be disposed on different surfaces, respectively.

(Hereinafter, referred to as a 'touch screen') in which the output unit 151 and a sensor (hereinafter, referred to as 'touch sensor') that detects the touch operation form a mutual layer structure, It can also be used as an input device. The touch sensor may have the form of, for example, a touch film, a touch sheet, a touch pad, or the like.

The touch sensor may be configured to convert a change in a pressure applied to a specific part of the output part 151 or a capacitance generated in a specific part of the output part 151 into an electrical input signal. The touch sensor can be configured to detect not only the position and area to be touched but also the pressure at the time of touch.

If there is a touch input to the touch sensor, the corresponding signal (s) is sent to the touch controller. The touch controller processes the signal (s) and transmits the corresponding data to the controller 180. Thus, the control unit 180 can know which area of the output unit 151 is touched or the like.

Referring to FIG. 1, a proximity sensor 141 may be disposed in an inner area of a mobile terminal or in the vicinity of the touch screen, which is surrounded by the touch screen. The proximity sensor refers to a sensor that detects the presence or absence of an object approaching a predetermined detection surface or a nearby object without mechanical contact using the force of an electromagnetic field or infrared rays. The proximity sensor has a longer life span than the contact sensor and its utilization is also high.

Examples of the proximity sensor include a transmission type photoelectric sensor, a direct reflection type photoelectric sensor, a mirror reflection type photoelectric sensor, a high frequency oscillation type proximity sensor, a capacitive proximity sensor, a magnetic proximity sensor, and an infrared proximity sensor. And to detect the proximity of the pointer by the change of the electric field along the proximity of the pointer when the touch screen is electrostatic. In this case, the touch screen (touch sensor) may be classified as a proximity sensor.

Hereinafter, for convenience of explanation, the act of recognizing that the pointer is positioned on the touch screen while the pointer is not in contact with the touch screen is referred to as "proximity touch & The act of actually touching the pointer on the screen is called "contact touch. &Quot; The position where the pointer is proximately touched on the touch screen means a position where the pointer is vertically corresponding to the touch screen when the pointer is touched.

The proximity sensor detects a proximity touch and a proximity touch pattern (e.g., a proximity touch distance, a proximity touch direction, a proximity touch speed, a proximity touch time, a proximity touch position, a proximity touch movement state, and the like). Information corresponding to the detected proximity touch operation and the proximity touch pattern may be output on the touch screen.

The sound output module 152 may receive audio data stored in the memory 160 or received from the wireless communication unit 110 in a call signal reception mode, a call mode or a recording mode, a voice recognition mode, a broadcast reception mode, The sound output module 152 also outputs sound signals related to functions (e.g., call signal reception sound, message reception sound, etc.) performed in the mobile terminal 100. [ The audio output module 152 may include a receiver, a speaker, a buzzer, and the like.

The alarm unit 153 outputs a signal for notifying the occurrence of an event of the mobile terminal 100. Examples of events that occur in the mobile terminal include call signal reception, message reception, key signal input, touch input, and the like. The alarm unit 153 may output a signal for notifying the occurrence of an event in a form other than the video signal or the audio signal, for example, vibration. The video signal or the audio signal may be output through the output unit 151 or the audio output module 152 so that they may be classified as a part of the alarm unit 153.

The haptic module 154 generates various tactile effects that the user can feel. A typical example of the haptic effect generated by the haptic module 154 is vibration. The intensity and pattern of the vibration generated by the hit module 154 can be controlled. For example, different vibrations may be synthesized and output or sequentially output.

In addition to the vibration, the haptic module 154 may include a pin arrangement vertically moving with respect to the contact skin surface, a spraying force or a suction force of the air through the injection port or the suction port, a touch on the skin surface, contact with an electrode, And various tactile effects such as an effect of reproducing a cold sensation using an endothermic or exothermic element can be generated.

The haptic module 154 can be implemented not only to transmit the tactile effect through the direct contact but also to allow the user to feel the tactile effect through the muscular sensation of the finger or arm. At least two haptic modules 154 may be provided according to the configuration of the mobile terminal 100.

The memory 160 may store a program for the operation of the controller 180 and temporarily store input / output data (e.g., a phone book, a message, a still image, a moving picture, etc.). The memory 160 may store data on vibration and sound of various patterns outputted when a touch is input on the touch screen.

The memory 160 may be a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (for example, SD or XD memory), a RAM (Random Access Memory), SRAM (Static Random Access Memory), ROM (Read Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), PROM A disk, and / or an optical disk. The mobile terminal 100 may operate in association with a web storage that performs a storage function of the memory 160 on the Internet.

The interface unit 170 serves as a path for communication with all external devices connected to the mobile terminal 100. The interface unit 170 receives data from an external device or supplies power to each component in the mobile terminal 100 or transmits data to the external device. For example, a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device having an identification module, an audio I / O port, A video input / output (I / O) port, an earphone port, and the like may be included in the interface unit 170.

The identification module is a chip for storing various information for authenticating the use right of the mobile terminal 100 and includes a user identification module (UIM), a subscriber identity module (SIM), a general user authentication module A Universal Subscriber Identity Module (USIM), and the like. Devices with identification modules (hereinafter referred to as "identification devices") can be manufactured in a smart card format. Accordingly, the identification device can be connected to the terminal 100 through the port.

When the mobile terminal 100 is connected to an external cradle, the interface unit may be a path through which power from the cradle is supplied to the mobile terminal 100, or various command signals input by the user to the cradle may be transmitted It can be a passage to be transmitted to the terminal. The various command signals or the power source input from the cradle may be operated as a signal for recognizing that the mobile terminal is correctly mounted on the cradle.

The controller 180 typically controls the overall operation of the mobile terminal. For example, voice communication, data communication, video communication, and the like. The control unit 180 may include a multimedia module 181 for multimedia playback. The multimedia module 181 may be implemented in the control unit 180 or may be implemented separately from the control unit 180. [

The controller 180 may perform a pattern recognition process for recognizing handwriting input or drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 190 receives external power and internal power under the control of the controller 180 and supplies power necessary for operation of the respective components.

The various embodiments described herein may be embodied in a recording medium readable by a computer or similar device using, for example, software, hardware, or a combination thereof.

According to a hardware implementation, the embodiments described herein may be implemented as application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays May be implemented using at least one of a processor, controllers, micro-controllers, microprocessors, and other electronic units for performing other functions. In some cases, The embodiments described may be implemented by the control unit 180 itself.

According to a software implementation, embodiments such as the procedures and functions described herein may be implemented with separate software modules. Each of the software modules may perform one or more of the functions and operations described herein. Software code can be implemented in a software application written in a suitable programming language. The software code is stored in the memory 160 and can be executed by the control unit 180. [

2A is a perspective view of an example of a mobile terminal or a mobile terminal according to the present invention.

The disclosed mobile terminal 100 includes a bar-shaped terminal body. However, the present invention is not limited thereto, and can be applied to various structures such as a slide type, a folder type, a swing type, and a swivel type in which two or more bodies are relatively movably coupled.

The body includes a case (a casing, a housing, a cover, and the like) which forms an appearance. In this embodiment, the case may be divided into a front case 101 and a rear case 102. [ A variety of electronic components are embedded in the space formed between the front case 101 and the rear case 102. At least one intermediate case may be additionally disposed between the front case 101 and the rear case 102. [

The cases may be formed by injection molding a synthetic resin or may be formed to have a metal material such as stainless steel (STS) or titanium (Ti) or the like.

An output unit 151, an audio output unit 152, a camera 121, user input units 130/131 and 132, a microphone 122, an interface 170, and the like may be disposed in the front body 101 have.

The output unit 151 occupies most of the main surface of the front case 101. The audio output unit 151 and the camera 121 are disposed in an area adjacent to one end of the output unit 151 and the user input unit 131 and the microphone 122 are disposed in an area adjacent to the other end. The user input unit 132 and the interface 170 may be disposed on the side surfaces of the front case 101 and the rear case 102. [

The user input unit 130 is operated to receive a command for controlling the operation of the mobile terminal 100 and may include a plurality of operation units 131 and 132. The operation units 131 and 132 may be collectively referred to as a manipulating portion and may be employed in any manner as long as the user operates in a tactile manner.

The contents inputted by the first or second operation unit 131 or 132 may be variously set. For example, the first operation unit 131 receives a command such as start, end, scroll, and the like, and the second operation unit 132 receives a command to adjust the size or output of the sound output from the sound output unit 152 To the touch recognition mode of the touch screen.

2B is a rear perspective view of the mobile terminal shown in FIG. 2A.

Referring to FIG. 2B, a camera 121 'may be further mounted on the rear surface of the terminal body, that is, the rear case 102. The camera 121 'may have a photographing direction substantially opposite to the camera 121 (see FIG. 2A), and may be a camera having different pixels from the camera 121.

For example, the camera 121 may have a low pixel so that the face of the user can be photographed and transmitted to the other party in case of a video call or the like, and the camera 121 ' It is preferable to have a large number of pixels. The cameras 121 and 121 'may be installed in the terminal body so as to be rotatable or pop-upable.

A flash 123 and a mirror 124 are additionally disposed adjacent to the camera 121 '. The flash 123 illuminates the subject when the subject is photographed by the camera 121 '. The mirror 124 allows the user to illuminate the user's own face or the like when the user intends to shoot himself / herself (self-photographing) using the camera 121 '.

An acoustic output 152 'may be additionally disposed on the rear surface of the terminal body. The sound output unit 152 'may implement the stereo function together with the sound output unit 152 (see FIG. 2A), and may be used for the implementation of the speakerphone mode during a call.

In addition to the antenna for a call or the like, a broadcast signal reception antenna 124 may be additionally disposed on the side of the terminal body. The antenna 124 constituting a part of the broadcast receiving module 111 (see FIG. 1) may be installed to be able to be drawn out from the terminal body.

A power supply unit 190 for supplying power to the mobile terminal 100 is mounted on the terminal body. The power supply unit 190 may be built in the terminal body or may be detachable from the outside of the terminal body.

The rear case 102 may further include a touch pad 135 for sensing a touch. The touch pad 135 may also be of a light transmission type like the output unit 151. In this case, if the output unit 151 is configured to output time information on both sides, the time information can be recognized through the touch pad 135 as well. The information output on both sides may be all controlled by the touch pad 135. [ Alternatively, a display may be additionally mounted on the touch pad 135, and a touch screen may be disposed on the rear case 102 as well.

The touch pad 135 operates in correlation with the output portion 151 of the front case 101. The touch pad 135 may be disposed parallel to the rear of the output unit 151. The touch pad 135 may have a size equal to or smaller than that of the output unit 151.

Hereinafter, a related operation of the output unit 151 and the touch pad 135 will be described with reference to FIGS. 3A and 3B.

3A and 3B are front views of a mobile terminal for explaining one operation state of the mobile terminal according to the present invention.

Various kinds of time information can be displayed on the output unit 151. These pieces of information can be displayed in the form of letters, numbers, symbols, graphics, or icons.

At least one of the letters, numbers, symbols, graphics, or icons may be displayed in a predetermined arrangement for inputting such information, thereby being implemented as a keypad. Such a keypad may be called a so-called " soft key ".

FIG. 3A shows a touch input to a soft key through a front surface of a terminal body.

The output unit 151 may operate as an entire area or may be divided into a plurality of areas and operated. In the latter case, the plurality of areas can be configured to operate in association with each other.

For example, an output window 151a and an input window 151b are displayed at the top and bottom of the output unit 151, respectively. The output window 151a and the input window 151b are areas allocated for outputting or inputting information, respectively. In the input window 151b, a soft key 151c in which a number for inputting a telephone number or the like is displayed is output. When the soft key 151c is touched, a number corresponding to the touched soft key is displayed on the output window 151a. When the first operation unit 131 is operated, call connection to the telephone number displayed on the output window 151a is attempted.

FIG. 3B shows the input of a touch applied to the soft key through the rear surface of the terminal body. FIG. 3A shows a case where the terminal body is vertically arranged, and FIG. 3B shows a case where the terminal body is arranged horizontally. The output unit 151 may be configured to convert the output screen according to the arrangement direction of the terminal body.

3B shows that the text input mode is activated in the mobile terminal. The output unit 151 displays an output window 151a 'and an input window 151b'. In the input window 151b ', a plurality of soft keys 151c' displayed with at least one of letters, symbols, and numbers may be arranged. The soft keys 151c 'may be arranged in the form of a QWERTY key.

When the soft keys 151c 'are touched through the touch pad 135 (see FIG. 2B), characters, numbers, symbols corresponding to the touched soft keys are displayed on the output window 151a'. As described above, the touch input via the touch pad 135 is advantageous in that the soft key 151c 'can not be blocked by the finger when touching the touch input via the output unit 151. [ In the case where the output unit 151 and the touch pad 135 are formed transparently, the fingers located on the rear side of the terminal body can be visually confirmed, thereby enabling a more accurate touch input.

The output unit 151 or the touch pad 135 may be configured to receive a touch input by scrolling, as well as the input method described in the above embodiments. The user can move a cursor or a pointer located on an object displayed on the output unit 151, for example, an icon or the like, by scrolling the output unit 151 or the touch pad 135. [ Further, when the finger is moved on the output unit 151 or the touch pad 135, the path through which the finger moves may be visually displayed on the output unit 151. [ This will be useful for editing the image displayed on the output unit 151. [

One function of the terminal may be executed in response to the touch of the output unit 151 (touch screen) and the touch pad 135 within a predetermined time range. In the case of being touched together, there may be a case where the user clamps the terminal body using the thumb and index finger. The one function may be activation or deactivation of the output unit 151 or the touch pad 135, for example.

The proximity sensor 141 described with reference to Fig. 1 will be described in more detail with reference to Fig.

4 is a conceptual diagram for explaining the proximity depth of the proximity sensor.

As shown in FIG. 4, when a pointer such as a user's finger, a pen, or the like approaches the touch screen, the proximity sensor 141 disposed in or near the touch screen senses the proximity sensor and outputs a proximity signal.

The proximity sensor 141 may be configured to output different proximity signals according to the distance between the proximity-touched pointer and the touch screen (hereinafter referred to as "proximity depth").

In FIG. 4, for example, a cross-section of a touch screen having proximity sensors capable of sensing three proximity depths is illustrated. Of course, proximity sensors that detect less than three or more than four proximity depths are also possible.

Specifically, when the pointer is completely in contact with the touch screen (d 0 ), it is recognized as a contact touch. If the pointer is located on the touch screen at a distance less than the distance d 1 , it is recognized as a proximity touch of the first proximity depth. If the pointer is located on the touch screen at a distance of d 1 or more and less than distance d 2 , it is recognized as a proximity touch of the second proximity depth. If the pointer is located on the touch screen at a distance of d 2 or more and less than d 3 distance, it is recognized as a proximity touch of the third proximity depth. If the pointer is positioned apart from the touch screen by a distance d 3 or more, it is recognized that the proximity touch is released.

Accordingly, the controller 180 can recognize the proximity touch as various input signals according to the proximity depth and proximity position of the pointer, and perform various operation control according to the various input signals.

5 is a conceptual diagram for explaining a control method for a touch operation in a form in which a pair of output units 155 and 156 are overlapped.

The terminal shown in this figure is a folder type terminal connected to a main body so that a folder portion is foldable. The first output unit 155 mounted on the folder unit may be of a light transmitting type or a transparent type such as TOLED or the second output unit 156 mounted on the main body may be a form that does not transmit light like an LCD. The first and second output units 155 and 156 may be configured as a touch screen capable of touch input, respectively.

For example, when a touch (a contact touch or a proximity-touch) to the first output unit or the TOLED 155 is detected, the control unit 180 determines whether the touch At least one of the images displayed in the TOLED 155 may be selected or run.

Hereinafter, with respect to the manner in which the information displayed on the other output unit or the LCD 156 is controlled when touching the TOLED 155 exposed to the outside in an overlapped form, a touch, a long touch, a long touch and drag ), And so on.

In the overlapped state (the mobile terminal is in a closed state), the TOLED 155 is arranged to overlap the lower side of the LCD 156. In this state, if a touch such as a long touch (for example, a touch that lasts for 2 seconds to 3 seconds) is detected in a manner different from the touch for controlling the image displayed on the TOLED 155 in advance, ) Causes at least one image of the image list displayed on the LCD 156 to be selected according to the sensed touch input. The result according to the execution of the selected image is displayed on the TOLED 155.

The long touch may also be used to selectively move a desired one of the entities displayed on the LCD 156 to the TOLED 155 (without performing any action thereto). That is, when a user selects one area of the TOLED 155 corresponding to a specific entity of the LCD 156 In the case of a long touch, the control unit 180 moves the corresponding object to the TOLED 155 to be displayed. The entity displayed on the TOLED 155 may also be displayed on the LCD 156 by a predetermined touch input to the TOLED 155, for example, flicking, swirling, and the like. In this figure, the menu No. 2 displayed on the LCD 156 is displayed on the TOLED 155.

If another input, for example, a drag, is detected in addition to the long touch, the control unit 180 is a function related to the image selected by the long touch. For example, a preview screen for the image is displayed on the TOLED 155, As shown in FIG. In this drawing, a case where a preview (male photograph) is performed on the menu No. 2 (image file) is illustrated.

The control unit 180 displays a selection cursor (or a selection bar) of the LCD 156 in the state that the preview screen is being output, while dragging toward another image is further performed on the TOLED 155 while maintaining the long touch And displays the image selected by the selection cursor on a preview screen (female photograph). Thereafter, when the touch (long touch and drag) ends, the controller 180 displays the first image selected by the long touch.

When the slide (the operation of the proximity touch corresponding to the drag) is detected together with the long proximity touch (the proximity touch continuing for at least 2 seconds to 3 seconds) to the TOLED 155 .

When a touch operation other than those described above is detected, the controller 180 can operate in the same manner as a general touch control method.

The control method for the touch operation in the overlapped form can be applied to a terminal having a single display. In addition, the present invention can be applied to a terminal different from a folder type having a dual display.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

6 is a schematic cross-sectional view of a semiconductor package according to the first embodiment of the present invention. The electrode pads 210 are formed on the upper part of the semiconductor package, and a plurality of lands connected to the electrode pads 210 230) is formed on a lower portion of the substrate (200); At least one chip (220) mounted on the substrate (200) and electrically connected to the electrode pads (210); And at least one spacer 240 formed under the substrate 200.

In the semiconductor package according to the first embodiment of the present invention, the spacer 240 is formed under the substrate 200, so that the substrate can be prevented from being warped when the semiconductor package is mounted on the mother board.

Therefore, the first embodiment of the present invention can prevent the substrate from being warped, and it is possible to prevent solder open or short defects, which bond the lands 230 of the substrate 200 and the electrode pads of the mother board, Can be prevented.

Here, the spacer 240 is also preferably adhered to the motherboard.

The semiconductor package according to the first embodiment of the present invention is a semiconductor package of an LGA (Land Grid Array) structure in which lands are formed under the substrate.

In addition, the semiconductor package of the present invention may further include an adhesive formed under the spacer 240.

In addition, the chip 220 is preferably bonded to the electrode pads 210 and the wire 250, and the chip 220 and the wire 250 are molded with the molding resin 260.

FIG. 7 is a schematic cross-sectional view showing a state in which a semiconductor package according to the first embodiment of the present invention is mounted on a mother board. The semiconductor package is mounted on a mother board of an electronic device and utilized.

7, a plurality of electrode pads 320 are formed on the motherboard 300 corresponding to the lands of the semiconductor package. On the electrode pads 320, solder 330 are welded together.

An adhesive 310 is formed on the motherboard 300 corresponding to the spacer 240 of the semiconductor package.

The adhesive 310 is preferably formed of a thermoplastic resin.

The lands of the semiconductor package are electrically connected to the plurality of electrode pads 320 while being bonded to the solder 330 of the motherboard 300 and the spacers 240 are electrically connected to the plurality of electrode pads 320, And adhered to the adhesive 310.

As a result, in the semiconductor package of the present invention, the spacer of the substrate is bonded to the mother board, thereby preventing the substrate from being warped.

Here, the mother board is preferably a mother board mounted on the mobile terminal.

8 is a schematic cross-sectional view of a semiconductor package according to a second embodiment of the present invention. In the semiconductor package of the second embodiment, solder balls 350 are fused to a plurality of lands 230 of a substrate 200 .

That is, the semiconductor package is a ball grid array (BGA) package.

Therefore, as shown in FIG. 9, it is not necessary that the solder is fused to the upper portions of the plurality of electrode pads 320 of the mother board 300.

When the semiconductor package is mounted on the mother board, solder balls 350 of the semiconductor package may be used.

In the second embodiment of the present invention, the adhesive 310 is formed on the motherboard 300 corresponding to the spacer 240 of the semiconductor package.

10A to 10C are schematic sectional views for explaining the structure of the spacer of the semiconductor package according to the present invention. As described above, the spacer which can prevent the substrate of the semiconductor package from being warped is formed into a point shape or a line shape .

First, as shown in FIG. 10A, a plurality of point-shaped spacers 241a, 241b, 241c, 241d, and 241e are formed under the substrate 200 of the semiconductor package.

As an example of the line-shaped spacer, as shown in Fig. 10B, a square ring-shaped spacer 242 and a cross-line-shaped slider 243 as shown in Fig.

11A and 11B are schematic views showing a state in which a defect is generated when a semiconductor package according to a comparative example of the present invention is mounted on a mother board. In the semiconductor package according to the present invention, There is a defect in the solder for bonding the semiconductor package and the mother board.

That is, if the substrate 910 is warped when the semiconductor package is mounted on the motherboard, the solder ball 911 at the outermost portion of the substrate 910 is opened as shown in FIG. 11A.

11B, the solder ball 912 located at the center of the substrate 910 undergoes ball bridging such as a short.

FIG. 12 is a schematic view showing a state in which no defect is generated when the semiconductor package according to the present invention is mounted on a motherboard, wherein a spacer 240 formed under the substrate 200 of the semiconductor package is mounted on the motherboard 300 (Not shown).

Therefore, since the substrate 200 of the semiconductor package is bonded to the motherboard 300 with the spacer 240 having the predetermined height, the occurrence of warping can be reduced.

The solder 330 for electrically connecting the lands 230 of the semiconductor package and the electrode pads 320 of the motherboard 300 may be opened or bent, It is possible to remarkably prevent occurrence of defects such as bridging.

13 is a schematic cross-sectional view for explaining another structure of the spacer of the semiconductor package according to the present invention. The spacer of the semiconductor package is formed on the outer periphery of each of the plurality of lands 230 on the lower part of the substrate 200 of the semiconductor package A spacer 245 is formed.

Therefore, the distribution of the spacers 245 located on the lower surface of the substrate 200 of the semiconductor package becomes larger, so that the semiconductor package is more firmly adhered to the mother board.

Therefore, it is possible to further prevent the substrate from warping when the semiconductor package is mounted on the mother board, thereby further preventing defective solder.

13 is a bottom view showing an example of the substrate of the semiconductor package having the spacer structure of Fig. 13, in which a spacer is formed on the outer periphery of each of the plurality of lands 230 on the lower side of the substrate 200 of the semiconductor package 14, a spacer layer 246 is formed under the substrate 200 of the semiconductor package, and a plurality of openings 247 are formed in the spacer layer 246.

At this time, the plurality of openings 247 expose each of the plurality of lands 230 located under the substrate 200 of the semiconductor package.

Therefore, even though the spacer layer 246 is formed at the bottom of the semiconductor package, since each of the plurality of lands 230 is exposed to the plurality of openings 247, There is no obstacle.

15 is a partial cross-sectional view for explaining a state in which the semiconductor package having the spacer structure of FIG. 14 is mounted on the mother board. The spacer layer 246 formed under the substrate 200 of the semiconductor package is widely spread on the mother board 300 And the solder 330 is positioned inside the opening 247 of the spacer layer 246.

The solder 330 is stably interposed between the lands 230 of the substrate 200 of the semiconductor package and the electrode pads 320 of the motherboard 300.

This semiconductor package is thus advantageous in that the solder 330 is constrained within the opening 274 of the spacer layer 246 to prevent shorting of the solder 330, i.e., ball bridging.

In addition, since the semiconductor package has a spacer layer formed under the substrate and the substrate is widely bonded to the mother board, it is possible to prevent the substrate from being warped.

14 is a partial cross-sectional view for explaining a state in which the heat releasing passage is formed in the opening of the spacer structure of Fig. 14, in which a spacer layer 246 formed on the lower part of the substrate 200 of the semiconductor package is bonded to the mother board 300 The inside of the opening 274 of the spacer layer 246 is sealed from the outside.

Here, the solder 330 electrically connecting the semiconductor package and the motherboard 300 is located inside the closed opening 274.

At this time, if there is an electrical current flowing from the motherboard 300 to the semiconductor package, heat is generated in the solder 330.

Also, when a chip mounted on the semiconductor package is driven, generated heat is transferred to the mother board 300 through the solder 330.

The heat transferred to the solder 330 expands the air remaining in the opening 247 to cause a crack in the semiconductor package or peel off the interface between the semiconductor package and the motherboard.

Accordingly, the present invention is characterized in that the heat generated in each of the openings 247, if formed in the spacer layer 246, is formed in the spacer layer 246, And can be discharged to the outside through the passage 248 thereof.

FIG. 17 is a schematic flowchart of a method of manufacturing a semiconductor package according to the present invention. First, electrode pads are formed on an upper portion, a plurality of lands connected to the electrode pads are formed on a lower portion, A substrate is prepared which is electrically connected to the electrode pads and has at least one or more mobile terminal chips mounted thereon (S100)

Subsequently, a curable resin is applied to the bottom of the substrate (step S110)

Subsequently, the coated curable resin is cured to form a spacer (step S120)

Here, the curing is cured by heat or ultraviolet rays.

18 is a view for explaining an example in which the semiconductor package according to the present invention is applied to components of a mobile terminal. The semiconductor package includes a broadcast receiving module 510, a mobile communication module 520, The local communication module 540, the location information module 550, the multimedia module 610, the sound output module 710, and the memory 720, as shown in FIG.

Here, the wireless communication unit 500 of the mobile terminal includes the broadcasting receiving module 510, the mobile communication module 520, the wireless Internet module 530, the short distance communication module 540, and the location information module 550 And the control unit 600 includes the multimedia module 610. [

That is, the semiconductor package of the present invention can be used as a structure for packaging driving chips that can be applied to a mobile terminal.

Of course, the semiconductor package of the present invention can be used in an electronic device other than a mobile terminal.

In addition, the semiconductor package of the present invention can be manufactured by mounting a plurality of chips and forming a module such as an MCM (Multi Chip Module).

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1 is a block diagram of a mobile terminal according to an embodiment of the present invention;

2A is a front perspective view of a mobile terminal according to an embodiment of the present invention.

2B is a rear perspective view of a mobile terminal according to an embodiment of the present invention.

FIGS. 3A and 3B are front views of a mobile terminal for explaining an operation state of the mobile terminal according to the present invention;

4 is a conceptual diagram for explaining the proximity depth of the proximity sensor

5 is a conceptual diagram for explaining a control method for a touch operation in a form in which a pair of output units are overlapped.

6 is a schematic cross-sectional view of a semiconductor package according to the first embodiment of the present invention

7 is a schematic cross-sectional view showing a state in which the semiconductor package according to the first embodiment of the present invention is mounted on a mother board

8 is a schematic cross-sectional view of a semiconductor package according to a second embodiment of the present invention

9 is a schematic cross-sectional view showing a state in which the semiconductor package according to the second embodiment of the present invention is mounted on a mother board

10A to 10C are schematic cross-sectional views for explaining the structure of a spacer of a semiconductor package according to the present invention

11A and 11B are schematic views showing a state in which a defect occurs when a semiconductor package according to a comparative example of the present invention is mounted on a mother board

12 is a schematic view showing a state in which no defect occurs when the semiconductor package according to the present invention is mounted on the mother board

13 is a schematic cross-sectional view for explaining another structure of the spacer of the semiconductor package according to the present invention

14 is a bottom view showing an example of the substrate of the semiconductor package having the spacer structure of Fig. 13

15 is a partial cross-sectional view for explaining a state in which the semiconductor package having the spacer structure of Fig. 14 is mounted on the mother board

Fig. 16 is a partial cross-sectional view for explaining a state in which a heat releasing passage is formed in the opening of the spacer structure of Fig. 14

17 is a schematic flow chart of a method of manufacturing a semiconductor package according to the present invention.

18 is a view for explaining an example in which the semiconductor package according to the present invention is applied to the components of the mobile terminal

Claims (10)

A substrate on which electrode pads are formed, and on which a plurality of lands connected to the electrode pads are formed; At least one chip mounted on the substrate and electrically connected to the electrode pads; And at least one spacer formed under the substrate, The spacer And when the board is mounted on the mother board, the board is adhered to the mother board and has a point shape or a line shape. The method according to claim 1, And solder balls are fused to the plurality of lands. The method according to claim 1, Further comprising an adhesive formed under the spacer. The method according to claim 1, The lands of the semiconductor package, And electrically connected to a plurality of electrode pads formed on the motherboard by solder. The method of claim 4, The motherboard includes: Wherein the semiconductor package is mounted on a mobile terminal. delete The method according to claim 1 or 2, And a spacer is formed on an outer periphery of each of the plurality of lands. The method according to claim 1 or 2, The spacer And a spacer layer formed under the substrate of the semiconductor package and having a plurality of openings through which each of the plurality of lands is exposed. The method of claim 8, And a passageway through which air can be introduced from outside into each of the openings is formed in the spacer layer. And a plurality of lands connected to the electrode pads are formed on a lower surface of the substrate and electrically connected to the electrode pads and having at least one mobile terminal chip mounted thereon, ; Applying a curable resin to the bottom of the substrate; Subsequently, curing the applied curable resin to form a spacer, The spacer Wherein when the substrate is mounted on the mother board, the substrate is adhered to the mother board and has a point shape or a line shape.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060094159A1 (en) * 2004-07-29 2006-05-04 Lee Teck K Methods of manufacturing interposers with flexible solder pad elements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060094159A1 (en) * 2004-07-29 2006-05-04 Lee Teck K Methods of manufacturing interposers with flexible solder pad elements

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