KR101573756B1 - Optical input device - Google Patents

Abstract

Disclosed is an optical input device. The optical input device of the present invention comprises: a light source coupled to an upper part of a substrate; an optical detecting unit spaced from the light source, and coupled to the upper part of the substrate; an optical device unit for refracting or blocking at least a part of light generated by the light source; a support including a plurality of surfaces of which a first surface is coupled to a lower part of the substrate; and a signal line unit extended from the first surface to a second surface of the support, and transmitting an electric signal.

Description

OPTICAL INPUT DEVICE

The present invention relates to an optical input device, and more particularly to an optical input device capable of detecting movement of an object in various directions.

The optical input device is an input device for generating an electrical signal by sensing the movement of an object to be sensed using light. The optical input device is typically used for a mouse for moving a cursor or an icon displayed on a display device in a personal computer, a laptop computer, a tablet computer, or the like. Also, it is used to detect motion in an electronic device controlled by generating an input signal by a mechanical motion.

A typical optical input device includes a light source and a light sensing unit. In the light source, light including a specific wavelength band is generated, and the generated light is reflected to the object to be sensed. The light sensing unit receives the reflected light and can sense the movement of the sensing object.

The light source and the light sensing portion are mounted on the substrate in various ways. A commonly used light source is irradiated with light in a direction perpendicular to the mounted substrate, and the light sensing unit senses light irradiated in a direction perpendicular to the mounted substrate. And the substrate on which the light source and the light sensing part are mounted is mounted on another electronic device. Therefore, in the conventional optical input device, there is a problem that it is difficult to sense the movement of the object to be sensed in the other direction although the motion of the object in the vertical direction can be sensed.

Particularly, recently, electronic devices capable of performing a complex function while adopting a miniaturized form factor have become popular, and there is a need for an optical input device capable of detecting movement of objects in various directions such as a vertical direction as well as a horizontal direction Is increasing.

An object of the present invention is to provide an optical input device capable of detecting movement of objects in various directions such as a vertical direction as well as a horizontal direction.

Another object to be solved by the present invention is to provide a structure that is simple in structure and low in manufacturing cost in the optical input device.

Another object to be solved by the present invention is to provide a structure having a heat resistance enough to enable an SMT process in the optical input device.

Another object to be solved by the present invention is to provide a structure having improved impact resistance in the optical input device.

According to an aspect of the present invention, there is provided an optical input device comprising: a light source coupled to an upper portion of a substrate; a light sensing portion spaced apart from the light source and coupled to the substrate; at least a portion of light generated by the light source is refracted or shielded And a signal line portion extending from the first surface to the second surface of the support and capable of transmitting an electrical signal.

In an embodiment of the present invention, the signal line portion formed on the second surface may include a terminal that can be surface-mounted on the circuit board.

In one embodiment of the present invention, the signal line portion includes a first terminal electrically connected to a conductive pad formed on a lower surface of the substrate on the first surface, and a second terminal electrically connected to the first terminal, And a second terminal for input and output.

In an embodiment of the present invention, the second terminal may be surface mounted on the circuit board and coupled.

In one embodiment of the present invention, one end of the signal line portion may be located between the lower surface of the substrate and the first surface, and may be electrically connected to a conductive pad formed under the substrate.

In one embodiment of the present invention, at least one of the boundaries between the two surfaces through which the signal line passes may be formed into a gentle curved surface.

In one embodiment of the present invention, the first surface and the second surface may be adjacent to each other.

In an embodiment of the present invention, the first surface and the second surface may be perpendicular to each other.

In one embodiment of the present invention, the light source may irradiate light in a direction perpendicular to the first surface.

In an embodiment of the present invention, the light sensing unit may sense light emitted in a direction perpendicular to the first surface.

In an embodiment of the present invention, the substrate and the support may have coupling portions for coupling the substrate and the support.

In an embodiment of the present invention, the coupling portion may include an insertion hole formed in the substrate and an insertion protrusion protruding from the surface of the support and inserted into the insertion hole.

In one embodiment of the present invention, the signal line portion may be a conductive pattern formed on the flexible film.

In one embodiment of the present invention, the flexible film may be bonded onto the surface of the support.

In one embodiment of the present invention, the flexible film and the support may be bonded through a heat-resistant adhesive.

In one embodiment of the present invention, the flexible film and the support may have coupling portions for coupling the flexible film and the support.

In one embodiment of the present invention, the coupling portion may include an insertion hole formed in the flexible film and an insertion protrusion protruded from the surface of the support and inserted into the insertion hole.

In an embodiment of the present invention, the engaging portion may be formed on the first surface.

In one embodiment of the present invention, the engaging portion may be formed on a surface adjacent to the second surface in a direction opposite to the first surface.

In one embodiment of the present invention, the signal line portion may be a conductive pattern formed on the surface of the support.

In one embodiment of the present invention, the conductive pattern may be a plating layer selectively formed on the surface of the support.

In one embodiment of the present invention, the support is formed of a resin material that is non-conductive but changes in conductivity when irradiated with a laser, and the signal line portion is selectively formed in a region of the surface of the support, Or the like.

In one embodiment of the present invention, the additive may comprise a metal compound having a spinel or similar structure.

In one embodiment of the present invention, the signal line portion may be a metal structure that is inserted and injected into the support so that a part of the signal line portion is exposed to the surface of the support.

In one embodiment of the present invention, the optical element unit may include a lens prism and a light-shielding portion.

The optical input device according to an embodiment of the present invention is capable of detecting movement of objects in various directions such as a vertical direction as well as a horizontal direction.

In addition, the optical input device according to an embodiment of the present invention is simple in structure and low in manufacturing cost.

In addition, the optical input device according to an embodiment of the present invention has heat resistance enough to enable the SMT process.

Further, the optical input device according to an embodiment of the present invention also has improved impact resistance and can be used for various applications.

1 is a perspective view of an optical input device according to an embodiment of the present invention.
2 is an exploded perspective view of the optical input device shown in Fig.
3 is a cross-sectional view of the optical input device shown in FIG. 1 taken along line AA '.
Fig. 4 is an enlarged view of a part of Fig.
5 is a perspective view of an optical input device according to another embodiment of the present invention.
6 is an exploded perspective view of the optical input device shown in Fig.
Fig. 7 is a cross-sectional view of the optical input device shown in Fig. 4 taken along BB '. Fig.
Fig. 8 is an enlarged view of a part of Fig. 7. Fig.
9 is a cross-sectional view of an optical input device according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that it is possible to make the gist of the present invention obscure by adding a detailed description of a technique or configuration already known in the field, it is omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express embodiments of the present invention, which may vary depending on the person or custom in the field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, an optical input device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4 attached hereto.

1 is a perspective view of an optical input device according to an embodiment of the present invention. 2 is an exploded perspective view of the optical input device shown in Fig. 3 is a cross-sectional view of the optical input device shown in FIG. 1 taken along line AA '. Fig. 4 is an enlarged view of a part of Fig.

1 to 4, the optical input device of the present invention includes a light source 130, a light sensing unit 150, an optical element unit 170, a support body 200, and a signal line unit 210 do.

The light source 130 and the light sensing unit 150 are mounted on the substrate 110 and coupled. The substrate 110 may be formed of a printed circuit board (PCB), a flexible PCB, or an arbitrary injection structure printed with a conductive pattern on the surface thereof, but is not limited thereto .

A circuit pattern is formed on the substrate 110 to supply power to the light source 130 and the light sensing unit 150 and to input and output signals. A conductive pad 111 through which a signal can be input and output may be formed on a lower portion of the substrate 110. The conductive pad 111 may be electrically connected to a circuit pattern on the substrate 110.

The light source 130 and the light sensing unit 150 may be combined with the substrate 110 in various ways. For example, a wire bonding method or a ball grid array (BGA) method may be used, but the present invention is not limited thereto.

The light source 130 and the light sensing unit 150 are spaced apart from each other at a predetermined distance on the substrate 110. A light shielding portion to be described later may be disposed between the light source 130 and the light sensing portion 150 to shield light so that the light from the light source 130 is not directly irradiated to the light sensing portion 150.

The light source 130 generates light including a predetermined wavelength band. The light generated by the light source 130 may be, for example, infrared rays having a wavelength band around 850 nm, but is not limited thereto. The light source 130 may be, for example, a light emitting diode (LED), a laser diode (LD), or a ramp type device.

The light source 130 may be to illuminate light in a direction d perpendicular to the combined substrate 110. The fact that the light is irradiated vertically means that it spreads with a predetermined irradiation angle and the central portion of the beam to be irradiated is the same as or almost in the same direction (d) perpendicular to the substrate 110.

The light source 130 may be one that irradiates light in a direction d perpendicular to the mounting scene so that if the light source 130 is tilted and mounted at an oblique angle to the substrate 110, It may be irradiated at an oblique angle instead of the direction (d). However, the conventional light source 130 is generally designed to be mounted horizontally on the substrate 110 as a mounting scene. In this case, the light source 130 irradiates light in a direction (d) perpendicular to the substrate 110.

The light sensing part 150 is a light receiving element for sensing the light generated by the light source 130. Accordingly, the light sensing unit 150 can receive the wavelength band of the light generated by the light source 130. The light sensing unit 150 may include, for example, a photodiode (PD).

The light sensing unit 150 may sense light radiated in a direction (d) perpendicular to the combined substrate 110. The sensing of the vertically illuminated light means that the central portion of the light sensing area having a predetermined field of view (FOV) is the same or nearly the same as the direction d perpendicular to the substrate 110 .

The light sensing unit 150 may sense light irradiated in a direction perpendicular to the mounting scene so that if the light sensing unit 150 is tilted at an oblique angle to the substrate 110, It is possible to detect a case where the light is irradiated at an oblique angle rather than a direction (d) perpendicular to the light source 110. However, it is general that the conventional light sensing unit 150 is designed to be mounted on the substrate 110, which is a mounting scene, horizontally. Therefore, in this case, the light sensing unit 150 senses the light emitted in the direction (d) perpendicular to the substrate 110.

Here, light emitted in the direction (d) perpendicular to the substrate 110 sensed by the light sensing unit 150 may be the light generated by the light source 130 reflected on the surface of the sensing object. The light source 130 and the light sensing unit 150 are designed so as to face in the same direction to illuminate light in the above direction and to sense light emitted in the above direction.

The light sensing unit 150 senses light and converts the light into an electrical signal. In addition, the light sensing unit 150 may convert an electrical signal into a digital signal. In addition, the light sensing unit 150 may process the digital signal to calculate the direction and speed of movement of the sensing object.

The optical element unit 170 is located above the light source 130 and the light sensing unit 150 to refract or shield at least a part of the light generated by the light source 130. The optical element unit 170 may include a lens prism and a light-shielding portion.

The lens prism refracts or scatters at least a part of the light generated by the light source 130 so that light is irradiated toward the object to be sensed. The light is reflected from the surface of the sensing object and irradiated to the light sensing unit 150 side. The reflected light may be condensed toward the light sensing unit 150 through the condensing lens.

The light shielding part is located between the light source 130 and the light sensing part 150 to shield scattered light and the like from being reflected by the light source 130 and not being irradiated. If light from the light source 130 is directly irradiated to the light sensing unit 150, a malfunction may be caused.

In addition, the optical filter 150 may further include an optical filter that selectively shields a wavelength band of the light sensed by the optical sensing unit 150 from the light incident from the outside.

A cover for covering the light source 130, the light sensing unit 150, and the like may be further included. The cover can protect the light source 130 and the light sensing unit 150 by an external impact, and can be formed in various shapes, thereby improving the sense of beauty. The upper surface of the cover may be formed with a contact surface in which the object to be sensed directly contacts.

The support 200 includes a plurality of surfaces. The support 200 may have a hexahedral shape, for example, as shown in the figure, but may be formed in various shapes such as a tetrahedron, an octahedron, or the like depending on its use and purpose.

The support 200 may be formed by injection molding. The support 200 may be formed of a plastic resin material having heat resistance. Therefore, the support 200 can be held even if the optical input device of the present invention is mounted by SMT (Surface Mounting Technology).

The first surface 201 of the plurality of surfaces of the support 200 engages with the lower portion of the substrate 110. The first surface 201 and the lower portion of the substrate 110 may be in direct contact with each other or in a state in which other components are disposed therebetween.

The coupling portion 115 may be provided to couple the substrate 110 and the support 200 together. The substrate 110 and the support 200 can be firmly coupled by the coupling part 115. [ The coupling portion 115 may include an insertion hole 115a formed in the substrate 110 and an insertion protrusion 115b protruding from the surface of the support 200 corresponding to the insertion hole 115a. have. The insertion protrusion 115b may be formed on the first surface 201. [ The insertion protrusion 115b is inserted into the insertion hole 115a so that the substrate 110 and the support 200 can be firmly coupled and the relative position between them can be determined. More than two coupling portions 115 may be formed to determine the relative position and coupling angle of the substrate 110 and the support 200.

The signal line portion 210 is formed on the surface of the support 200 and may be formed of a conductive material to transmit an electrical signal. The signal line portion 210 may be integrally formed with the support 200 at the surface of the support 200 or may be physically coupled to the surface of the support 200.

The signal line portion 210 may extend from the first surface 201 of the plurality of surfaces of the support 200 to the second surface 202 different from the first surface 201 to transmit an electrical signal. The first surface 201 and the second surface 202 may be adjacent to each other or may not be adjacent to each other and the third surface or the like may be located therebetween.

In the accompanying drawings, it is shown that the support 200 is in the form of a hexahedron and the first surface 201 and the second surface 202 are adjacent to each other. Also, in the attached drawings, the first surface 201 and the second surface 202 are shown to be perpendicular to each other. However, the present invention is not limited thereto. The first surface 201 and the second surface 202 may be not adjacent to each other, and the first surface 201 and the second surface 202 may have different angles Or may be parallel.

The signal line unit 210 is electrically connected to the first terminal 211 and the first terminal 211 electrically connected to the conductive pad 111 formed on the lower surface of the substrate 110 on the first surface 201, And a second terminal 212 for inputting and outputting signals on the two sides 202. The first terminal 211 may be located between the lower surface of the substrate 110 and the first surface 201 and may be electrically connected to the conductive pad 111.

Here, the first terminal 211 and the second terminal 212 may be formed at both ends of the signal line unit 210. However, it is also possible that the first terminal 211 and the second terminal 212 are formed in the middle portion of the signal line portion 210 as the case may be.

The second surface 202 may be abutted against the mounting surface 300 to which the optical input device of the present invention is coupled. The second terminal 212 of the signal line unit 210 formed on the second surface 202 is electrically connected to the terminal 301 of the mount 300 to transmit power or input / output a signal. Specifically, by the SMT process, the second terminal 212 of the signal line portion 210 is coupled to the mount 300 to couple the optical input device.

The substrate 110 coupled to the first surface 201 has a predetermined angle? With respect to the mounting scene 300 to which the optical input device is coupled. The direction in which the light source 130 on the substrate 110 irradiates light and the direction in which the light sensing unit 150 receives light also have a predetermined angle? With respect to the mount 110 coupled with the optical input device . Therefore, the optical input device can sense the motion of the object to be detected in a direction other than the vertical direction with reference to the combined mount scene 300. The direction of the object to be sensed can be variously adjusted according to the shape of the support 200 and the angle between the first surface 201 and the second surface 202.

The signal line portion 210 may extend from the first surface 201 to the second surface 202 and may pass through the boundary 205 between the two surfaces. For example, between the first surface 201 and the second surface 202 of the support 200 when extending to the first surface 201 and the second surface 202 adjacent thereto, as shown in the accompanying drawings, And passes through the boundary 205 of FIG. In addition, although not shown in the figure, when the signal line portion 210 extends from the first surface 201 to the third surface opposite to the first surface 201, And the second surface 202 having the same shape. In this case, it passes through the boundary 205 between the first surface 201 and the second surface and the boundary 205 between the second surface 202 and the third surface.

At least one of the boundaries 205 between two surfaces of the support 200 through which the signal line portion 210 passes may be formed into a gentle curved surface. Accordingly, the signal line portion 210 formed on the surface of the boundary 205 between the two surfaces can also be formed on a gentle curved surface rather than a suddenly curved surface. Therefore, it is possible to reduce the possibility that the signal line portion 210 is suddenly bent and broken.

The signal line portion 210 may be a conductive pattern formed on the flexible film 220. Here, the flexible film 220 is bonded onto the surface of the support 200. The surface of the flexible film 220 and the surface of the support 200 may be adhered through the adhesive 217. The adhesive 217 is preferably heat resistant to withstand the high temperature of the SMT process. The flexible film 220 and the signal line portion 210 may be formed of, for example, a flexible circuit board 110.

The flexible film 220 may engage the surface of the support 200 in more areas than the signal line portion 210. As shown in FIGS. 1 to 3, the flexible film 220 may extend to the third surface, not the first to second surfaces 202, and may be coupled to the support 200. The third surface is preferably a surface adjacent to the second surface 202 in a direction opposite to the first surface 201. So that the signal line portions 210 on the second surface 202 can be stably coupled to each other under a tension in the opposite direction to each other.

The flexible film 220 and the support 200 may have an engaging portion 215 for engaging each other. The coupling portion 215 may include an insertion hole 215a formed in the flexible film 220 and an insertion protrusion 215b protruding from the surface of the support 200 and inserted into the insertion hole 215a.

The engaging portion 215 may be formed on the first surface 201. The coupling portion 215 of the flexible film 220 and the support 200 may be formed at the same position as the coupling portion 115 of the substrate 110 and the support 200. More specifically, the insertion protrusions 115b and 215b of the support 200 are formed, and the insertion protrusions 115b and 215b are inserted into the insertion holes 215a of the flexible film 220 and the insertion holes 115a of the substrate 110, As shown in FIG.

Further, the engaging portion 215 may be formed on the second surface 202 or another surface other than the first and second surfaces. As shown in FIGS. 1 to 3, the engaging portions 115 215 may be formed on the third surface, which is a surface adjacent to the second surface 202, in a direction opposite to the first surface 201.

More than two coupling portions 215 may be formed to determine the relative positions and coupling angles of the flexible film 220 and the support 200.

Hereinafter, an optical input device according to another embodiment of the present invention will be described with reference to FIGS. 5 to 8. FIG.

5 is a perspective view of an optical input device according to another embodiment of the present invention. 6 is an exploded perspective view of the optical input device shown in Fig. Fig. 7 is a cross-sectional view of the optical input device shown in Fig. 4 taken along BB '. Fig. Fig. 8 is an enlarged view of a part of Fig. 7. Fig.

For convenience of explanation, the optical input device according to another embodiment of the present invention will be described with reference to FIGS. 5 to 8, focusing on differences from the above-described embodiments with reference to FIGS. 1 to 4 .

In this embodiment, the signal line portion 230 may be a conductive pattern formed on the surface of the support 200. The signal line portion 230 may be formed directly coupled to the surface of the support 200 without passing through another medium such as a flexible film.

Specifically, the signal line portion 230 may be a plating layer formed on the surface of the support 200 by a selective plating technique. The selective plating technique means that a plating layer is selectively formed only on a desired area of a surface of a structure such as the support 200. For example, a method of forming a plating layer on an etched surface by etching only a specific region through an etching method in which a structure is formed of resin materials of different materials and reacts with only one resin material, or a method of irradiating a laser only on a selective surface, A method in which a plating layer is formed only on a portion irradiated with a laser beam, or the like.

Specifically, when the laser is irradiated, the support 200 may be formed of a resin material containing an additive that is non-conductive before the laser is irradiated, but changes its conductivity when the laser is irradiated. The additive may be, for example, a metal compound having a spinel or similar structure. Then, if the support 200 is immersed in the plating solution, a plating layer may be selectively formed only on the surface of the support 200 where the laser is irradiated.

In another embodiment, the signal line portion 230 may be formed as a metal structure so that a part of the signal line portion 230 is exposed to the surface of the support 200. Specifically, the signal line portion 230 may be a metal structure inserted and injected into the support 200. Insertion injection means that the support body 200 is positioned inside the mold when the support body 200 is injected so as to be partially exposed to the surface of the support body 200. After the injection, the signal line portion 230 is fixed inside the support 200.

When the signal line portion 230 is directly coupled to the surface of the support 200, a coupling portion for coupling the signal line portion 230 and the support 200 may not exist separately. This is because the signal line portion 230 is firmly coupled to the surface of the support 200.

Hereinafter, an optical input device according to another embodiment of the present invention will be described with reference to FIG.

9 is a cross-sectional view of an optical input device according to another embodiment of the present invention.

For convenience of explanation, an optical input device according to another embodiment of the present invention will be described with reference to FIG. 9, focusing on differences from the above-described one embodiment with reference to FIGS. 1 to 4. FIG.

In this embodiment, the support 250 may be a stainless steel (SUS) structure including a plurality of surfaces. The support 250 includes a plurality of surfaces formed by bending. Specifically, as shown in FIGS. 6 to 7, the first to third surfaces 251, 252, and 253 may be formed to be bent. Although not shown, it is also possible in some cases to consist of only the first surface and the second surface.

The embodiments of the optical input device of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

110: substrate 111: conductive pad
130: light source 150:
170: optical element unit 200, 250:
210, 230: signal line portion 220: flexible film

Claims (27)

A light source coupled to an upper portion of the substrate;
A light sensing unit spaced apart from the light source and coupled to the substrate;
At least a part of the light generated by the light source is refracted or shielded;
A support including a plurality of surfaces, the first surface of which engages the lower portion of the substrate; And
And a signal line portion extending from the first surface to the second surface of the support to transmit an electrical signal,
Wherein the first surface and the second surface are adjacent to each other.
The method according to claim 1,
Wherein the signal line portion formed on the second surface includes a terminal that can be surface mounted to the circuit board.
The method according to claim 1,
Wherein the signal line portion includes a first terminal electrically connected to a conductive pad formed on a lower surface of the substrate on the first surface and a second terminal electrically connected to the first terminal and configured to input and output a signal on the second surface, Input device.
The method of claim 3,
And the second terminal can be surface mounted and coupled to the circuit board.
The method according to claim 1,
Wherein one end of the signal line portion is located between the lower surface of the substrate and the first surface and is electrically connected to the conductive pad formed under the substrate.
The method according to claim 1,
Wherein at least one of the boundaries between the two surfaces through which the signal line section passes is formed into a gentle curved surface.
delete The method according to claim 1,
Wherein the first surface and the second surface are perpendicular to each other.
The method according to claim 1,
Wherein the light source irradiates light in a direction perpendicular to the first surface.
The method according to claim 1,
Wherein the light sensing unit senses light irradiated in a direction perpendicular to the first surface.
The method according to claim 1,
Wherein the substrate and the support have coupling portions for coupling each other.
12. The method of claim 11,
Wherein the coupling portion includes an insertion hole formed in the substrate and an insertion protrusion protruding from the surface of the support and inserted into the insertion hole.
The method according to claim 1,
Wherein the signal line portion is a conductive pattern formed on the flexible film.
14. The method of claim 13,
Wherein the flexible film is bonded onto the surface of the support.
15. The method of claim 14,
Wherein the flexible film and the support are coupled through a heat-resistant adhesive.
14. The method of claim 13,
Wherein the flexible film and the support have coupling portions for coupling each other.
17. The method of claim 16,
Wherein the coupling portion includes an insertion hole formed in the flexible film and an insertion protrusion protruding from the surface of the support and inserted into the insertion hole.
17. The method of claim 16,
Wherein the coupling portion is formed on the first surface.
17. The method of claim 16,
And the engaging portion is formed on a surface adjacent to the second surface in a direction opposite to the first surface.
The method according to claim 1,
Wherein the signal line portion is a conductive pattern formed on a surface of the support.
21. The method of claim 20,
Wherein the conductive pattern is a plating layer selectively formed on the surface of the support.
21. The method of claim 20,
Wherein the support is formed of a resin material containing an additive that is non-conductive and changes in conductivity when irradiated with a laser,
Wherein the signal line portion is a plating layer formed by selectively plating a laser-irradiated region of the surface of the support.
23. The method of claim 22,
Wherein the additive comprises a metal compound having a spinel or similar structure.
The method according to claim 1,
Wherein the signal line portion is a metal structure that is inserted and injected into the support so that a part of the signal line portion is exposed to the surface of the support.
The method according to claim 1,
Wherein the optical element portion includes a lens prism and a light-shielding portion.
The method according to claim 1,
Wherein the support is a stainless steel structure formed by bending the first surface and the second surface.
27. The method of claim 26,
Wherein the support further comprises a third surface extending from an opposite surface of the first surface at the second surface and being bent with the second surface.

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