KR101571974B1 - Green led package comprisng a rare earth metal oxide particles - Google Patents

Abstract

The present invention relates to a green LED package including rare earth metal oxide particles. More specifically, the green LED package includes: a green LED chip; and a polymer resin including a compound which can be expressed as the chemical formula 1: [Ma(OH)b(CO_3)cOd]. In the formula, M is Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn, Mn, Bi, or Ac. a is one or two while b is zero to two. c is zero to three while d is zero to three. However, b, c, and d cannot be zero at the same time while b and c are zero at the same time or not zero at the same time.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a green LED package including rare earth metal oxide particles,

The present invention relates to a green LED package comprising rare earth metal oxide particles.

 2. Description of the Related Art A light emitting diode (LED), which is a type of semiconductor used to transmit and receive a signal by converting electricity into infrared rays or light by using characteristics of a compound semiconductor, is a high efficiency, (LED) has been widely used for backlighting and illumination of display devices because it has advantages of long life, miniaturization, light weight and low power consumption. .

Typically, the LED package consists of an LED chip, an adhesive, an encapsulant, a phosphor, and a heat dissipation component. Among them, the LED encapsulant surrounds the LED chip and protects the LED chip from external impact and environment.

However, since LED light must pass through the LED encapsulant in order to emerge from the LED package, the LED encapsulant must have a high optical transparency, that is, a high light transmittance, and a high refractive index Is required.

Epoxy resins with high refractive index and low cost have been widely used as LED encapsulants. However, since epoxy resins have low heat resistance, they have a problem that they are deteriorated by heat in high power LEDs. In the case of white light LEDs, Resulting in a problem of lowering the luminance.

As an alternative to this, a silicone resin having excellent light resistance in a low wavelength region is used (the bonding energy of the siloxane bond (Si-O-Si) of the silicone resin is 106 kcal / mol, 20 kcal / mol or more, which is superior in heat resistance and light resistance), and the silicone resin has a problem that the light extraction efficiency is lowered and the adhesiveness is weak due to a low refractive index.

Conventional techniques for sealing materials can be understood with reference to the following Patent Documents 1 and 2. [ As a result, the entire contents of the following Patent Documents 1 and 2 are incorporated in this specification as a prior art.

Patent Document 1 discloses a polyimide film comprising a polysiloxane prepolymer having a TiO ₂ domain having an average domain size of less than 5 nm and comprising 20 to 60 mol% of TiO ₂ (Total solids basis), having a refractive index of > 1.61 to 1.7, and a liquid at room temperature and atmospheric pressure, for curing the liquid polysiloxane / TiO ₂ composite for use as a light emitting diode encapsulant.

Patent Document 2 discloses a composition for an encapsulant of an optoelectronic device, which comprises an epoxy resin and a polysilazane which is cured with the epoxy resin, a sealing material formed from the composition, and a sealing material .

KR Published 10-2012-0129788 A (November 28, 2012) KR public 10-2012-0117548 A (October 24, 2012)

There are two methods for increasing the light efficiency of the LED,

The first is a method of increasing the total amount of light generated in the chip,

The second method is to increase the light extraction efficiency by extracting the generated light amount as much as possible out of the LED.

However, as described above, usually, in the LED package, the encapsulation material encapsulates the LED chip, and only about 15% of the chip-generated light energy is outputted as light and the remainder is absorbed in the encapsulant or the like.

Accordingly, a part where attention is focused on the light efficiency of the LED is to improve the light extraction efficiency so that light generated in the light emitting layer of the LED is effectively lost to the outside without being lost by total internal reflection of the LED chip.

Currently, several technologies are being studied to increase the light extraction efficiency so as to extract the light amount as much as possible out of the LED. However, there is still a need for improvement.

Accordingly, it is an object of the present invention to provide an encapsulant composition that dramatically improves the light extraction efficiency.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the conventional art,

Green LED chip; And

There is provided a green LED package having an LED encapsulant containing a compound represented by the following formula (1) in a polymer resin.

[Chemical Formula 1]

M _a (OH) _b (CO ₃ ) _c O _d

Wherein M is at least one element selected from Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn,

a is 1 or 2, b is 0 to 2, c is 0 to 3, and d is 0 to 3.

B, c and d are not simultaneously 0, and b and c are both 0 or 0 at the same time.

In the present invention, the green LED package is characterized in that the compound of the formula is Y (OH) CO ₃ .

In the present invention, the green LED package is characterized in that the compound of Formula 1 is Y ₂ O ₃ .

In the present invention, the green LED package is characterized in that the compound of Formula 1 is contained in an amount of 30 wt% or less based on the total composition.

Also, the present invention provides a green LED package, wherein the Y (OH) CO ₃ is contained in an amount of 1 to 20 wt% based on the total composition.

Also, the present invention provides a green LED package, wherein the Y ₂ O _{3 content} is 20 wt% or less based on the total composition.

In the present invention, the green LED package is characterized in that the compound of Formula 1 is a spherical particle having a sphericity of 0.5 to 1.

Also, the present invention provides a green LED package, wherein the spherical particles have a particle diameter within a range of 100 nm to 2 mu m.

Further, in the present invention, the spherical particles are monodispersed.

In the present invention, the green LED package is characterized in that the compound of Formula 1 has a refractive index within a range of 1.6 to 2.3.

In the present invention, it is preferable that the polymer resin is at least one selected from a silicone resin, a phenol resin, an acrylic resin, a polystyrene, a polyurethane, a benzoguanamine resin, and an epoxy resin. Package.

The present invention also provides a green LED package, which further comprises phosphor particles.

Further, in the present invention, the emission wavelength of the green LED chip is preferably 500 to 590 Of the green LED package.

In the present invention, the green LED package is characterized in that the compound of Formula 1 is uniformly distributed in the encapsulating material.

The green LED package of the present invention has an effect of extracting light trapped in the interior between the LED package chip and the sealing material to externally extract, thereby exhibiting high luminous efficiency.

1 shows an embodiment of a green LED package according to the present invention.
2 shows another embodiment of the green LED package of the present invention.
FIGS. 3 to 7 show calibration curves showing changes in luminance according to the content, particle size, and sphericity of Y (OH) CO ₃ particles and Y ₂ O ₃ particles, respectively.

Hereinafter, the present invention will be described in detail.

According to the present invention,

Green LED chip; And

And a green LED package having an LED encapsulant containing a compound represented by the following formula (1) in a polymer resin.

[Chemical Formula 1]

M _a (OH) _b (CO ₃ ) _c O _d

Wherein M is at least one element selected from Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn,

a is 1 or 2, b is 0 to 2, c is 0 to 3, and d is 0 to 3.

B, c and d are not simultaneously 0, and b and c are both 0 or 0 at the same time.

The compound of Formula 1 is preferably Y (OH) CO ₃ or Y ₂ O ₃ , and Y (OH) CO ₃ is more preferable in light extraction efficiency. A more detailed description thereof will be understood with reference to the following Examples and Experimental Examples.

When the compound of Formula 1 is contained in the polymer resin, it is preferable that the content of the compound is within 30% by weight of the total composition. If too small amounts are included, it may be insufficient to improve the light extraction efficiency, and conversely, if too much is included, the light extraction efficiency may be rather lowered. That is, although there is a slight difference depending on the wavelength of light or the kind of compound, there is an optimum range of content for maximizing the light extraction efficiency. If the content is over 30% by weight regardless of the wavelength of light or the kind of compound, This is because the extraction efficiency is not good. A more detailed description thereof will be understood with reference to the following Examples and Experimental Examples.

When the compound of formula (1) is Y (OH) CO ₃ , it is preferably contained in an amount of 1 to 20% by weight relative to the total composition, and in the case of Y ₂ O ₃ , If the content is out of the above range and the content is small or large, it is difficult to optimize the luminance. A more detailed description thereof will be understood with reference to the following Examples and Experimental Examples.

The compound of Formula 1 is preferably a spherical particle having a sphericity of 0.5 to 1, and more preferably a sphericity of 1 or less. The sphericity is a value obtained by dividing the maximum diameter of the particles by the minimum diameter, and can be defined by the following equation (1). The closer to 1, the closer to a complete sphere.

[Equation 1]

The spherical particles preferably have a particle diameter within a range of 100 nm to 2 mu m. This may be slightly different depending on the type of the compound of the spherical particles, but if the particle size is less than 100 nm or more than 2 탆, the light extraction efficiency may be lowered. In addition, although there is some difference depending on the kind of the particles, the range of the particle size can be a very important structure in terms of the light extraction efficiency because there is an optimum range of the light extraction efficiency according to the particle size. A more detailed description thereof will be understood with reference to the following Examples and Experimental Examples.

The spherical particles are preferably monodisperse, and in the case of monodisperse, a constant refractive index can be imparted, which is preferable from the viewpoint of improving light extraction efficiency.

The compound of Formula 1 preferably has a refractive index within a range of 1.6 to 2.3. If it is less than 1.6 and exceeds 2.3, the light extraction efficiency may not be increased. This is because the refractive index of the conventional silicon encapsulant is about 1.5 and the refractive index of the GaN chip is about 2.4.

The total reflection problem in the light emitting device package chip is caused by the total reflection at the boundary between the device and the outside air and the silicon as the external sealing material. Snell? According to law, the critical angle ( θcrit ) that light or wave can pass through between two isotropic media with different refractive index is as follows.

Critical angle, which due to the air (n _air = 1), silicon (n _silicon = 1.5) than that of the GaN refractive index of smoking a large difference as about 2.5 is the light produced in the light emitting device package can escape to the outside are each θ _{GaN / air} = 23 [deg.] and [theta] _{GaN / Silicon} = 37 [deg.]. As a result, the light extraction efficiency is only about 15%.

The polymer resin may be a polymer resin widely used in the related art and is not particularly limited. For example, at least one selected from a silicone resin, a phenol resin, an acrylic resin, a polystyrene, a polyurethane, a benzoguanamine resin, and an epoxy resin may be used. The silicone resin may be polysilane, poly Siloxane, and combinations thereof. The phenolic resin may be at least one phenol resin selected from a bisphenol-type phenol resin, a resol-type phenol resin, and a resol-type naphthol resin. The epoxy- The resin may be at least one epoxy resin selected from bisphenol F type epoxy, bisphenol A type epoxy, phenol novolak type epoxy, and cresol novolak type epoxy.

Fig. 1 shows an embodiment of the green LED package of the present invention. 1, an LED package 100 according to an embodiment of the present invention includes a substrate 110, a lead frame 120 mounted on the substrate 110, A bonding wire 140 for electrically connecting the LED chip 130 to the lead frame 120 and a reflector 150 for reflecting the light emitted from the LED chip 130, And an encapsulant 200 filled in the reflector 150 to seal the LED chip 130 and the bonding wire 140.

2 shows another embodiment of the green LED package of the present invention. As shown in FIG. 2, the LED package 100 'according to the present invention may further include the phosphor particles 230 to be used for a purpose of realizing a desired color.

Hereinafter, the present invention will be described in more detail by way of examples. It is to be understood that the following embodiments are for the purpose of illustration only and are not intended to limit the scope of the present invention.

Example

Example  One

Preparation of Y (OH) CO ₃ particles is based on 100 mL of distilled water. 4 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 ml of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5-6 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO ₃ particles were dried in an oven at 70 ° C for 3 hours to prepare particles having a size of 300 nm or less. All spherical particles were monodispersed with uniform size.

After addition to, the Y (OH) CO ₃ particles 98% by weight of a silicone-based resin, Y (OH) CO ₃ 2% by weight ratio to (Mix 2 ratio OE 6631 A and OE 6631 B 1) a silicone resin , And the mixture was homogenized by homogenizer to prepare an encapsulant composition.

Example  2

A silicone-based resin, the Y (OH) CO ₃ particles, silicone-based resin of 98% by weight, Y (OH) CO ₃ 2, except that the addition to the weight% ratio, all the same manner as in Example 1 encapsulant composition and .

Example  3

A silicone-based resin, the Y (OH) CO ₃ particle, a silicone resin, 97% by weight, Y (OH) CO _{3 3,} except that the addition to the weight% ratio, for both the first embodiment the same encapsulant composition and .

Example  4

Except that the silicone resin was added with the Y (OH) CO ₃ particles in a proportion of 93% by weight of the silicone resin and 7% by weight of Y (OH) CO _{3 in the} silicone resin, .

Example  5

A silicone-based resin, the Y (OH) CO ₃ particles, 90% by weight of a silicone-based resin, Y (OH) CO ₃ 10, except that the addition to the weight% ratio, for both the first embodiment the same encapsulant composition and .

Example  6

Y ₂ O ₃ particles were produced by firing after preparation of Y (OH) CO ₃ . First, Y (OH) CO ₃ is based on 100 mL of distilled water. 4 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 ml of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5-6 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO ₃ particles were dried in a 70 ° C oven for 3 hours. The dried Y (OH) CO ₃ particles were calcined at 900 ° C for 3 hours in an oxidizing atmosphere to obtain Y ₂ O ₃ particles of 300 nm or less in size.

FIG. 2 shows SEM photographs of the produced particles.

Y ₂ O ₃ particles (silicon-based resin 99 wt%, Y ₂ O ₃ 1 wt%) were added to a silicone resin (OE 6631 A and OE 6631 B mixed at a ratio of 1: 2) And homogenized to prepare a sealant composition.

Example  7

An encapsulant composition was prepared in the same manner as in Example 6, except that the Y ₂ O ₃ particles were added to the silicone resin in a ratio of 98% by weight of the silicone resin and ₂ % by weight of Y ₂ O ₃ .

Example  8

An encapsulant composition was prepared in the same manner as in Example 6 except that the Y ₂ O ₃ particles were added to the silicone resin in a ratio of 97% by weight of the silicone resin and 3% by weight of Y ₂ O ₃ .

Example  9

An encapsulant composition was prepared in the same manner as in Example 6, except that the Y ₂ O ₃ particles were added to the silicone resin at a ratio of 93% by weight of the silicone resin and 7% by weight of Y ₂ O ₃ .

Example  10

A sealant composition was prepared in the same manner as in Example 6, except that the Y ₂ O ₃ particles were added to the silicone resin at a ratio of 90% by weight of the silicone resin and 10% by weight of Y ₂ O ₃ .

Example  11

Preparation of Y (OH) CO ₃ particles is based on 100 mL of distilled water. 2 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 mL of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5.7 to 5.8 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO ₃ particles were dried in an oven at 70 ° C for 3 hours to prepare particles having a size of 100 nm or less.

After adding the Y (OH) CO ₃ particles (97% by weight of a silicone resin and 3% by weight of Y (OH) CO ₃ ) to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) , And the mixture was homogenized by homogenizer to prepare an encapsulant composition.

Example  12

Preparation of Y (OH) CO ₃ particles is based on 100 mL of distilled water. 2 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 mL of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5.5 to 5.6 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO 3 particles were dried in an oven at 70 ° C for 3 hours to prepare particles having a size of 500 nm or less.

After adding the Y (OH) CO ₃ particles (97% by weight of a silicone resin and 3% by weight of Y (OH) CO ₃ ) to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) , And the mixture was homogenized by homogenizer to prepare an encapsulant composition.

Example  13

Preparation of Y (OH) CO ₃ particles is based on 100 mL of distilled water. 2 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 mL of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5.4 to 5.5 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO 3 particles were dried in an oven at 70 ° C for 3 hours to prepare particles having a size of 1 μm or less.

After adding the Y (OH) CO ₃ particles (97% by weight of a silicone resin and 3% by weight of Y (OH) CO ₃ ) to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) , And the mixture was homogenized by homogenizer to prepare an encapsulant composition.

Example  14

Preparation of Y (OH) CO ₃ particles is based on 100 mL of distilled water. 2 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 mL of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5.2 to 5.3 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO 3 particles were dried in an oven at 70 ° C for 3 hours to prepare particles having a size of 2 μm or less.

After adding the Y (OH) CO ₃ particles (97% by weight of a silicone resin and 3% by weight of Y (OH) CO ₃ ) to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) , And the mixture was homogenized by homogenizer to prepare an encapsulant composition.

Example  15

Y ₂ O ₃ particles were produced by firing after preparation of Y (OH) CO ₃ . First, Y (OH) CO ₃ is based on 100 mL of distilled water. 2 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 mL of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5.7 to 5.8 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO 3 particles were dried in a 70 ° C oven for 3 hours. The dried Y (OH) CO 3 particles were fired at 900 ° C for 3 hours in an oxidizing atmosphere to obtain Y ₂ O ₃ particles of 100 nm or less in size.

Y ₂ O ₃ particles (silicon-based resin 97% by weight and Y ₂ O ₃ 3% by weight) were added to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) And homogenized to prepare a sealant composition.

Example  16

Y ₂ O ₃ particles were produced by firing after preparation of Y (OH) CO ₃ . First, Y (OH) CO ₃ is based on 100 mL of distilled water. 2 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 mL of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5.5 to 5.6 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO ₃ particles were dried in a 70 ° C oven for 3 hours. The dried Y (OH) CO ₃ particles were calcined at 900 ° C for 3 hours in an oxidizing atmosphere to obtain Y ₂ O ₃ particles having a size of 500 nm or less.

Y ₂ O ₃ particles (silicon-based resin 97% by weight and Y ₂ O ₃ 3% by weight) were added to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) And homogenized to prepare a sealant composition.

Example  17

Y ₂ O ₃ particles were produced by firing after preparation of Y (OH) CO ₃ . First, Y (OH) CO ₃ is based on 100 mL of distilled water. 2 g of yttrium nitrate hydrate and 40 g of urea were dissolved in 100 mL of distilled water, and the mixture was thoroughly stirred for 30 minutes. After stirring, the pH was adjusted to 5.4 to 5.5 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO ₃ particles were dried in a 70 ° C oven for 3 hours. The dried Y (OH) CO ₃ particles were fired in an oxidizing atmosphere at 900 ° C for 3 hours to obtain Y ₂ O ₃ particles having a size of 1 μm or less. Fig. 6 shows SEM photographs of Y ₂ O ₃ particles having a size of 1 μm or less.

Y ₂ O ₃ particles (silicon-based resin 97% by weight and Y ₂ O ₃ 3% by weight) were added to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) And homogenized to prepare a sealant composition.

Example  18

Y ₂ O ₃ particles were produced by firing after preparation of Y (OH) CO ₃ . First, Y (OH) CO ₃ is dissolved and mixed with a yttrium nitrate hydrate 2g, 40g of urea in distilled water 100mL, 30 bungan sufficiently stirred. After stirring, the pH was adjusted to 5.2 to 5.3 via a base of nitric acid and ammonium hydroxide. The mixed solution was heated at 90 DEG C and stirred for 1 hour, followed by filtration and washing with distilled water three times. The washed Y (OH) CO 3 particles were dried in a 70 ° C oven for 3 hours. The dried Y (OH) CO 3 particles were fired in an oxidizing atmosphere at 900 ° C. for 3 hours to obtain Y ₂ O ₃ particles of ₂ μm or less in size

Y ₂ O ₃ particles (silicon-based resin 97% by weight and Y ₂ O ₃ 3% by weight) were added to a silicone resin (OE 6631 A and OE 6631 B mixed in a ratio of 1: 2) And homogenized to prepare a sealant composition.

Example  19 - spherical shape less than 0.5

Y ₂ O ₃ particles were produced by firing after preparation of Y (OH) CO ₃ . First, the preparation of Y (OH) CO ₃ particles is based on 100 mL of distilled water. After dissolving 0.5 g of yttrium nitrate hydrochloride and 40 g of urea in 100 mL of distilled water, the pH of the mixture was adjusted to 5 to 6 with nitric acid and mixed with sufficient stirring for 30 minutes. The mixed solution is heated to 60 DEG C and sufficiently stirred for 30 minutes. After adjusting the pH to 8 to 9 with ammonium hydroxide, the mixture is stirred for 1 hour. This was filtered and washed three times with distilled water. The washed Y (OH) CO ₃ particles were dried in an oven at 70 ° C for 3 hours and then calcined at 900 ° C for 6 hours in an oxidizing atmosphere. After firing, this was milled to reduce the particle size to 300 nm.

The particles were not spherical, and the sphericity was less than 0.5.

Y ₂ O ₃ particles (silicon-based resin 99 wt%, Y ₂ O ₃ 1 wt%) were added to a silicone resin (OE 6631 A and OE 6631 B mixed at a ratio of 1: 2) And homogenized to prepare a sealant composition.

Example  20 - spherical shape less than 0.5

An encapsulant composition was prepared in the same manner as in Example 19, except that the Y ₂ O ₃ particles were added to the silicone resin in a ratio of 98% by weight of the silicone resin and ₂ % by weight of Y ₂ O ₃ .

Example  21 - spherical shape less than 0.5

An encapsulant composition was prepared in the same manner as in Example 19, except that the Y ₂ O ₃ particles were added to the silicone resin in a ratio of 98% by weight of the silicone resin and 3% by weight of Y ₂ O ₃ .

Example  22 - spherical shape less than 0.5

An encapsulant composition was prepared in the same manner as in Example 19, except that the Y ₂ O ₃ particles were added to the silicone resin in a ratio of 98% by weight of the silicone resin and 7% by weight of Y ₂ O ₃ .

Example  23 - spherical shape less than 0.5

An encapsulant composition was prepared in the same manner as in Example 19, except that the Y ₂ O ₃ particles were added to the silicone resin in a ratio of 98% by weight of the silicone resin and 10% by weight of Y ₂ O ₃ .

Example  24

A silicone-based resin, the Y (OH) CO ₃ particles, 90% by weight of a silicone-based resin, Y (OH) CO ₃ 13, except that the addition to the weight% ratio, for both the first embodiment the same encapsulant composition and .

Example  25

An encapsulant composition was prepared in the same manner as in Example 6, except that the Y ₂ O ₃ particles were added to the silicone resin at a ratio of 90% by weight of the silicone resin and 13% by weight of Y ₂ O ₃ .

Comparative Example

The silicone resin OE 6631 A and OE 6631 B were mixed in a 1: 2 ratio to prepare a 100 wt% encapsulant composition.

Experimental Example  - Luminance measurement experiment

The encapsulant compositions of Examples 1 to 25 and Comparative Examples were mounted in an LED package having a green LED (wavelength 520 nm) chip, and the luminance increase rate was measured. The light emitting device package used is a chip which is connected to the lead frame by die bonding. A metal wire bonding is performed so that the light emitting element and the lead frame are electrically connected to each other, and then the sealing resin is molded with an encapsulant in which the transparent resin encapsulating material and the inorganic nanoparticles are dispersed. The luminance increase rate is a percentage of the increase in luminance based on Comparative Example 100. The luminance was measured by a DARSA Pro 5200 PL System machine manufactured by Professional Scientific Instrument, Korea.

The results are shown in Table 1 below.

Comparative Example Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Brightness increase rate (%) 100 102.3 102.6 104.7 108.6 113.2 104.7 103.5 104.1 100.4 94.6

Comparative Example Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Brightness increase rate (%) 100 103.2 113.2 107.6 102.1 102.1 105.2 106.3 99.7

Comparative Example Example 19 Example 20 Example 21 Example 22 Example 23 Example 24 Example 25 Brightness increase rate (%) 100 100.8 100.5 99.3 94.1 92.4 105.3 92.2

As can be seen from Tables 1 to 3, when the sealing material composition contains the rare earth metal inorganic oxide particles, the brightness was remarkably increased. However, Y ₂ O ₃ particles, Y (OH) compared to the CO ₃ particles, low content has been shown high luminance increase rate, and contents in a rather showed a low luminance increase rate, the brightness increase peak also Y (OH) CO ₃ particles Respectively.

FIGS. 3 to 7 show calibration curves showing changes in luminance according to the content, particle size, and sphericity of Y (OH) CO ₃ particles and Y ₂ O ₃ particles, respectively. The curve shows the particle content, particle size, and sphericity range, which indicate the maximum value of luminance increase.

100, 100 'LED package 110: substrate
120: lead frame 130: LED chip
140: bonding wire 150: reflector
210: encapsulant 220: rare earth metal oxide particle
230: phosphor particles

Claims (14)

Green LED chip; And
A green LED package having an LED encapsulant containing a compound represented by the following formula (1) in a polymer resin and having spherical particles having a particle diameter within a range of 100 nm to 2 占 퐉:
[Chemical Formula 1]
M _a (OH) _b (CO ₃ ) _c O _d
Wherein M is at least one element selected from Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn,
a is 1 or 2, b is 0 to 2, c is 0 to 3, and d is 0 to 3.
B, c and d are not simultaneously 0, and b and c are both 0 or 0 at the same time. The green LED package according to claim 1, wherein the compound of Formula 1 is Y (OH) CO ₃ . The green LED package according to claim 1, wherein the compound of Formula 1 is Y ₂ O ₃ . The green LED package according to claim 1, wherein the compound of Formula 1 is contained in an amount of 30 wt% or less based on the total composition. The green LED package according to claim 2, wherein the Y (OH) CO ₃ is contained in an amount of 1 to 20 wt% based on the total composition. The green LED package according to claim 3, wherein the Y ₂ O ₃ is contained in an amount of 20 wt% or less based on the total composition. The green LED package according to claim 1, wherein the compound of Formula 1 is a spherical particle having a sphericity of 0.5 to 1. delete The green LED package according to claim 1, wherein the spherical particles are monodispersed. The green LED package according to claim 1, wherein the compound of Formula 1 has a refractive index within a range of 1.6 to 2.3. The green LED package according to claim 1, wherein the polymer resin is at least one selected from a silicone resin, a phenol resin, an acrylic resin, a polystyrene, a polyurethane, a benzoguanamine resin, and an epoxy resin . The green LED package according to claim 1, further comprising phosphor particles. The LED of claim 1, wherein the emission wavelength of the green LED chip is 500 to 590 Lt; RTI ID = 0.0 > nm. ≪ / RTI > The green LED package according to claim 1, wherein the compound of Formula 1 is uniformly distributed in an encapsulating material.

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