KR101571063B1 - Electrolytic copper foil, electric component and battery comprising the foil and preparation method thereof - Google Patents

Abstract

Tensile strength of 60 kgf / mm ² To 80 kgf / mm < ^{2 &} gt ;, and an edge curling angle of 15 to 25 degrees.
The electrolytic copper foil according to the present invention has a low light intensity and a high strength and is suppressed from curling edges to be used as a semiconductor packaging packaging substrate for TAB (Tape Automated Bonding) used in current collectors of medium and large lithium ion secondary batteries and TCP (Tape Carrier Package) And the like.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic copper foil, an electric component and a battery, and an electrolytic copper foil,

The present invention relates to an electrolytic copper foil, an electrolytic copper foil having an electrolytic copper foil, a battery, and a method of manufacturing an electrolytic copper foil. More particularly, the present invention relates to an electrolytic copper foil having excellent heat resistance characteristics and high tensile strength and low lightness even in the case of ultra thin foil.

A copper foil is generally used as the current collector of the secondary battery. Although the rolled copper foil by rolling is mainly used for the copper foil, it is difficult to manufacture a copper foil having a high manufacturing cost and a wide width. Further, since the rolled copper foil is required to use lubricating oil during rolling, the adhesion of the rolled copper foil to the active material is lowered due to contamination of the lubricating oil, so that the charge-discharge cycle characteristics of the battery may be deteriorated.

The secondary battery is accompanied by heat generation due to volume change and overcharge at the time of charge and discharge. In addition, in order to improve the adhesion with the electrode active material and to prevent the occurrence of wrinkles and fractures in the copper foil as a current collector due to the influence of the expansion and contraction of the active material layer in the charging and discharging cycles, The illuminance should be low. Therefore, there is a demand for a high-elongation, high-strength, and low-illuminance copper foil which can withstand the volume change and heat generation phenomenon of the secondary battery and is excellent in adhesion with the active material.

Particularly, as the thickness of the copper foil used as the negative electrode current collector of the secondary battery increases, the amount of the active material that can be included increases, so that the capacity of the secondary battery increases. However, if the thickness of the copper foil is small, the strength is low and the handling is not easy. For example, there is a high possibility that the electrolytic drum tears when released. Therefore, in the case of ultra thin, the tensile strength characteristic becomes more important.

In addition, there is an increasing demand for miniaturization of a semiconductor mounting substrate or a main board substrate in order to increase the degree of integration of a circuit within a small area due to high performance, miniaturization, and lightness due to the requirement for light and small size of electronic devices. If a thick copper foil is used in the production of a printed wiring board having such a fine pattern, the etching time for forming the wiring circuit becomes long and the verticality of the side wall of the wiring pattern is lowered. Particularly, when the wiring line width of the wiring pattern formed by etching is narrow, the wiring can be broken. Therefore, in order to obtain a fine pitch circuit, a thin copper foil is required. However, since the thickness of the copper foil is limited by the thin copper foil, the mechanical strength is weak, and the occurrence frequency of defects such as wrinkling or bending is increased at the time of manufacturing the printed wiring board.

An inner lead disposed in a device hall located at a central portion of a product in a semiconductor packaging substrate for TAB (Tape Automated Bonding) used in a TCP (Tape Carrier Package) And a plurality of terminals of the semiconductor device are directly bonded. At this time, a current is instantaneously applied using a bonding device to heat and apply a constant pressure. Therefore, the inner lead formed by the etching of the electrolytic copper foil is stretched by the bonding pressure.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide an electrolytic copper foil having excellent heat resistance and high tensile strength and low light intensity even in the case of a cathode foil, an electric component and a battery including such electrolytic copper foil, And a method for manufacturing the same.

According to an aspect of the present invention, there is provided an electrolytic copper foil having a tensile strength of 60 kgf / mm < ^{2 >} To 80 kgf / mm < ^{2 &} gt ;, and a corner curling angle is 15 to 25 deg.

The electrolytic copper foil may have an elongation of 3.0% to 4.0%, and the surface roughness Rz may be 1.5 탆 or less.

The tensile strength after heat treatment at 200 ° C for 1 hour may be 60 kgf / mm ² to 75 kgf / mm ² , and the elongation percentage may be 3.0% to 4.0%.

The electrolytic copper foil may have a thickness of 2 탆 to 12 탆.

According to another aspect of the present invention, there is provided a battery including such an electrolytic copper foil.

According to another aspect of the present invention, there is provided an insulating substrate comprising: an insulating substrate; And an electrolytic copper foil attached to one surface of the insulating substrate.

According to still another aspect of the present invention, there is provided a method for producing a semiconductor device comprising the steps of: electrolyzing a copper electrolytic solution containing additive A, additive B and saccharin, wherein the additive A is a thiourea compound, Sulfonic acid or its metal salt is provided. The copper electrolytic solution may further contain chlorine at a concentration of 1 to 30 ppm.

Here, the content of the additive A may be 1 to 10 ppm, and the content of the additive B may be 40 to 200 ppm. Also, the content of saccharin may be 1 to 100 ppm.

The thiourea compound is preferably selected from the group consisting of diethylthiourea, ethylenethiourea, acetylenethiourea, dipropylthiourea, dibutylthiourea, N-trifluoroacetylthiourea, N-ethylthiourea, N-cyanoacetylthiourea, N-allylthiourea, o-tolylthiourea, N, N'-butylenethiourea (N, N ' -butylene thiourea, thiazolidinethiol, 4-thiazolinethiol, 4-methyl-2-pyrimidinethiol and 2-thiouracil (2- thiouracil). < / RTI >

The sulfonic acid or its metal salt of the compound containing a sulfur atom is preferably selected from the group consisting of bis- (3-sulfopropyl) -disulfide disodium salt, 3-mercapto-1-propanesulfonic acid, 3- (N, N-dimethylthiocarbamoyl) Sulfonate sodium salt, 3 - [(amino-iminomethyl) thio] -1-propanesulfonate sodium salt, o-ethyldithiocarbonate-S- (3-sulfopropyl) Ethylthio-bis-benzothiazolyl-2-mercapto) -propyl-sulfonic acid sodium salt, ethylenedithiodipropylsulfonic acid sodium salt, thioglycolic acid, thiophosphoric acid- (ω-sulfopropyl) ester disodium salt and thiophosphoric acid-tris- (ω-sulfopropyl) ester tin sodium salt (Thiophosphoric acid- tris- (omega -sulfopropyl) ester trisodium salt).

The electrolytic copper foil according to the present invention exhibits a high strength, and the stress inside the electrolytic copper foil is small, thereby preventing corner curling. Therefore, the electrolytic copper foil according to the present invention is excellent in heat resistance characteristics and has high tensile strength and low light intensity even in the case of superfine foil, so that the process is advantageously performed, the product defect rate is reduced, and the product such as a PCB or a negative electrode collector of a secondary battery If used, product reliability can be improved.

1 is a scanning electron microscopy (SEM) image of the surface of the electrolytic copper foil produced in Example 1. Fig.
2 is an SEM image of the surface of the electrolytic copper foil of Example 2. Fig.
3 is an SEM image of the surface of the electrolytic copper foil of Example 3. Fig.
4 is an SEM image of the surface of the electrolytic copper foil of Example 4. Fig.
5 is an SEM image of the surface of the electrolytic copper foil of Comparative Example 1. Fig.
6 is an SEM image of the surface of the electrolytic copper foil of Comparative Example 2. Fig.
7 is an SEM image of the surface of the electrolytic copper foil of Comparative Example 3. Fig.
8 is an SEM image of the surface of the electrolytic copper foil of Comparative Example 4. Fig.

Hereinafter, an electrolytic copper foil according to the present invention, an electric part including the electrolytic copper foil, a battery, and an electrolytic copper foil manufacturing method will be described in detail.

According to an aspect of the present invention, there is provided an electrolytic copper foil having a tensile strength of 60 kgf / mm < ^{2 >} To 80 kgf / mm < ^{2 &} gt ;, and the corner curling angle is from 0 DEG to 25 DEG.

The electrolytic copper foil according to the present invention has a tensile strength of 60 kgf / mm < ^{2 >} To 80 kgf / mm < ^{2 &} gt ;. The tensile strength of an electrolytic copper foil is the force divided by the area divided by the area. The tensile strength of the electrolytic copper foil is generally increased as the amount of the impurity contained in the electrolytic copper foil increases with the addition of the additive. This is because the size of copper crystals in the copper foil is small because it interferes with the growth of copper crystals of the copper foil in accordance with the presence of impurities. The higher the tensile strength of the electrolytic copper foil, the easier it is for the subsequent process to proceed.

When the strength of the electrolytic copper foil is increased, the internal stress is increased to lower the curl characteristic of the copper foil. The edge curling phenomenon of the electrolytic copper foil is known to occur when the internal energy of the electrolytic copper foil is non-uniform. When corner curling occurs, a large number of defects such as edge tearing may occur in the process of lamination in the PCB process. , Problems such as tearing, folding, or wrinkling of corners may occur during coating of the active material.

The curling phenomenon of the electrolytic copper foil can be measured by the angle at which the electrolytic copper foil edge is curled up. Angle of curvature refers to the angle at which the edge of the electrolytic copper foil, that is, the edge or edge, is bent when the electrolytic copper foil is placed on a flat surface. If the angle of curling of the electrolytic copper foil is large, it is difficult to use the copper foil in a subsequent process, so that the corner curling angle is preferably 0 to 45 degrees. If the cornering angle exceeds 45 °, it is difficult to carry out the subsequent process. In addition, the electrolytic copper foil is spread on a flat surface and is cut into an X-shape, and the height at which the cut portion is raised is referred to as a corner edge height, and the curling of the electrolytic copper foil can be measured by measuring the edge curl height.

In the case of the electrolytic copper foil according to the present invention, it is expected that the electrolytic copper foil will be curled very much due to the addition of the additive for increasing the strength, but the ultra high strength and curl characteristic are excellent due to the addition of saccharin. Therefore, the edge angle of the electrolytic copper foil according to the present invention is 15 to 25 degrees.

The electrolytic copper foil may have an elongation of 3.0% to 4.0%. The elongation percentage of the electrolytic copper foil is the ratio of the elongation before elongation to the initial length. When the elongation is less than 3.0%, winding is difficult and can not be used in the subsequent process.

The surface roughness Rz may be 1.5 탆 or less. If the surface roughness Rz of the precipitate surface in the electrolytic copper foil is more than 1.5 mu m, the contact surface between the surface of the electrolytic copper foil for the negative electrode collector and the active material becomes small, so that the lifetime of the charge / discharge cycle and the electric capacity at the initial stage of charging may become low. If the surface roughness Rz of the precipitated surface exceeds 1.5 탆, it is not easy to form a high-density circuit having a fine pitch in the printed wiring board.

The tensile strength after heat treatment at 200 ° C for 1 hour may be 60 kgf / mm ² to 75 kgf / mm ² , and the elongation percentage may be 3.0% to 4.0%. The heat treatment may be performed at, for example, 150 캜 to 220 캜, and more specifically, at 200 캜. The heat treatment can be carried out for 30 minutes, 1 hour, 2 hours and several hours. The heat treatment is for measuring the tensile strength of the electrolytic copper foil and is a treatment for obtaining tensile strength or elongation which is maintained at a constant value when the electrolytic copper foil is stored or put into a subsequent process. The meaning of the term before the heat treatment, that is, the term "before the heat treatment" in this specification, means the temperature of 25 ° C. to 130 ° C. which is the temperature before the heat treatment in the high temperature state in the present specification.

Since the electrolytic copper foil is generally subjected to a high-temperature subsequent process, it is preferable that the tensile strength is not lowered even after the heat treatment. If the strength is maintained even after the heat treatment, the handling in the following process is easy and the yield is increased. In addition, if the elongation after heat treatment in the electrolytic copper foil is less than 3.0%, cracks may occur in a subsequent process at a high temperature process. For example, when the electrolytic copper foil is used as an anode current collector of a secondary battery, a process for manufacturing an anode current collector is a high-temperature process, and a volume change of the active material layer is accompanied by a change in volume during charging / discharging, Therefore, the predetermined elongation ratio should be maintained after the heat treatment.

The electrolytic copper foil may have a thickness of 2 탆 to 12 탆. In the case of products using electrolytic copper foil, it is required to increase the density of circuits in accordance with the tendency that electronic devices are thinned and shortened, and miniaturized and highly functionalized. High-density circuits require fine pitches, and thinner electrolytic bumps and lower-intensity electrolytic bumps are required for fine pitch. When the electrolytic copper foil is 6 μm or less, it is possible to realize a high-density circuit as an ultra-thin one, but the thickness of the electrolytic copper foil may be too thin to handle in a subsequent process. Therefore, the thinner the thickness of the electrolytic copper foil is, the higher the strength of the electrolytic copper foil is, and it is desirable to suppress the edge curling phenomenon that occurs when the strength is increased. The electrolytic copper foil according to the present invention is an electrolytic copper foil which is especially useful for such ultra-thin copper foil and has a high strength and a curled edge.

A battery according to one embodiment of the present invention includes an electrolytic copper foil as described above. In the battery, electrolytic copper foil can be used as an anode current collector, but it is not limited thereto and can be used as other components used in a battery. The battery is not particularly limited and includes all the primary and secondary batteries, and is a battery using a lithium ion battery, a lithium polymer battery, a lithium air battery, or the like as a current collector. Any battery that can be used in the related art can be used Do.

An electrical component according to an embodiment of the present invention includes an insulating substrate; And an electrolytic copper foil adhered to one surface of the insulating substrate.

The electrical component is not limited to the TAB tape, the printed circuit board (PCB), the flexible printed circuit board (FPC), or the like, and is used by attaching the electrolytic copper foil on the insulating substrate. Anything that can be used in.

According to still another aspect of the present invention, there is provided a method for producing a semiconductor device comprising the steps of: electrolyzing a copper electrolytic solution containing additive A, additive B and saccharin, wherein the additive A is a thiourea compound, Sulfonic acid or its metal salt is provided. The copper electrolytic solution may further contain chlorine at a concentration of 30 ppm or less.

According to the present invention, a copper electrolytic solution containing the additive A, the additive B and saccharin is electrolyzed to produce an electrolytic copper foil, whereby a low-illuminated copper foil having a thin thickness and a high mechanical strength while suppressing curling due to high strength can be manufactured . The content of the additive A may be 1 to 10 ppm, and the content of the additive B may be 40 to 200 ppm.

In the copper electrolytic solution, the additive A can improve the stabilization of the production of the electrolytic copper foil and improve the strength of the electrolytic copper foil. If the content of the additive A is less than 1 ppm, the tensile strength of the electrolytic copper foil may be lowered. If the content of the additive A is more than 10 ppm, the surface roughness of the precipitated surface may increase, and the electrolytic copper foil of low light intensity may be difficult to produce and the tensile strength may be lowered.

In the copper electrolytic solution, the additive B can improve the surface gloss of the electrolytic copper foil. When the content of the additive B is less than 10 ppm, the brightness of the electrolytic copper foil may be lowered. If the content of the additive B is more than 200 ppm, the surface roughness of the precipitated surface is increased, and the electrolytic copper foil of low light intensity is difficult to manufacture, .

Saccharin in copper electrolytes can increase the strength of electrolytic copper foil. In addition, saccharin has a lower internal stress increase than other additives while increasing the strength of the electrolytic copper foil, thereby suppressing the edge curling of the electrolytic copper foil. If the content of saccharin is less than 1 ppm, the effect of increasing the strength of the electrolytic copper foil is small. If the content of saccharin is more than 100 ppm, the strength of the electrolytic copper foil is increased, but the edge curling phenomenon becomes too high, Or handling may be difficult.

The copper electrolytic solution may contain chlorine (chloride ion) at a concentration of 30 ppm or less. When a small amount of chlorine ion is present in the copper electrolyte, the initial nucleation sites are increased during the electrolytic plating, and the crystal grains become fine. The precipitates formed at the grain boundary interface inhibit crystal growth upon heating to high temperature, thereby improving the thermal stability at high temperature have. If the concentration of chlorine ions is less than 1 ppm, the concentration of chlorine ions required in the sulfuric acid-copper sulfate-copper electrolytic solution is insufficient, so that the tensile strength before heat treatment may be lowered and the thermal stability at high temperature may be lowered. If the concentration of chlorine ion is more than 30 ppm, the surface roughness of the precipitated surface is increased, so that it is difficult to produce electrolytic copper foil in low light intensity, the tensile strength before heat treatment is lowered, and the thermal stability at high temperature may be lowered.

The thiourea compound is preferably selected from the group consisting of diethylthiourea, ethylenethiourea, acetylenethiourea, dipropylthiourea, dibutylthiourea, N-trifluoroacetylthiourea, N-ethylthiourea, N-cyanoacetylthiourea, N-allylthiourea, o-tolylthiourea, N, N'-butylenethiourea (N, N ' -butylene thiourea, thiazolidinethiol, 4-thiazolinethiol, 4-methyl-2-pyrimidinethiol and 2-thiouracil (2- thiouracil), but is not limited thereto, and any thiourea compound which can be used as an additive in the art can be used.

The sulfonic acid or its metal salt of the compound containing a sulfur atom is preferably selected from the group consisting of bis- (3-sulfopropyl) -disulfide disodium salt, 3-mercapto-1-propanesulfonic acid, 3- (N, N-dimethylthiocarbamoyl) Sulfonate sodium salt, 3 - [(amino-iminomethyl) thio] -1-propanesulfonate sodium salt, o-ethyldithiocarbonate-S- (3-sulfopropyl) Ethylthio-bis-benzothiazolyl-2-mercapto) -propyl-sulfonic acid sodium salt, ethylenedithiodipropylsulfonic acid sodium salt, thioglycolic acid, thiophosphoric acid- (ω-sulfopropyl) ester disodium salt and thiophosphoric acid-tris- (ω-sulfopropyl) ester tin sodium salt (Thiophosphoric acid- tris- (omega -sulfopropyl) ester trisodium salt). However, Is not possible if all of the sulfonic acid or a metal salt of a compound containing a sulfur atom that can be used as additives in the art.

The temperature of the copper electrolytic solution used in the above production method may be 30 to 60 캜, but is not necessarily limited to this range and can be appropriately adjusted within the range of achieving the object of the present invention. For example, the temperature of the copper electrolytic solution may be 40 to 50 ° C.

The current density used in the above manufacturing method may be 20 to 500 A / dm ² , but is not necessarily limited to this range and can be appropriately adjusted within the range of achieving the object of the present invention. For example, the current density may be between 30 and 40 A / dm < ² >. The copper electrolytic solution may be a sulfuric acid-copper sulfate copper electrolytic solution. In the copper sulfate-copper sulfate copper solution, the concentration of the Cu ^{2 +} ion may be 60 g / L to 180 g / L, but it is not necessarily limited to this range and can be appropriately controlled within the range of achieving the object of the present invention have. For example, the concentration of Cu ^{2 +} may be from 65 g / L to 175 g / L.

The copper electrolytic solution may be prepared by a known method. For example, the concentration of Cu ^{2 +} ions can be obtained by controlling the addition amount of copper ions or copper sulfate, and the concentration of SO ₄ ^{2 +} ions can be obtained by controlling the addition amount of sulfuric acid and copper sulfate.

The concentration of the additive contained in the copper electrolytic solution can be obtained from the amount and molecular weight of the additive supplied to the copper electrolytic solution or by analyzing the additives contained in the copper electrolytic solution by a known method such as column chromatography.

The electrolytic copper foil can be produced by a known method, except that the above-described copper electrolytic solution is used.

For example, in the electrolytic copper foil, the copper electrolytic solution is supplied and electrolyzed between the cathode surface on the curved surface of titanium on the rotating titanium drum and the anode, and electrolytic copper foil is deposited on the surface of the cathode, and the electrolytic copper foil can be manufactured by continuously winding the electrolytic copper foil.

Hereinafter, the present invention will be described in further detail with reference to examples, but the present invention is not limited thereto.

(Manufacture of electrolytic copper foil)

Example 1

A 3L capacity electrolytic cell system capable of circulating at 20L / min was used to produce an electrolytic copper foil by electrolysis, and the temperature of the copper electrolytic solution was kept constant at 45 ° C. The anode was a DSE (Dimensionally Stable Electrode) electrode plate having a thickness of 5 mm and a size of 10 x ¹⁰ cm ² , and the cathode was a titanium electrode plate having the same size and thickness as the anode.

In order to facilitate the movement of Cu ^{2 +} ions, a current density of 35 A / dm ² was plated and a 12 μm thick electrolytic copper foil was produced.

The basic composition of the copper electrolyte is as follows:

CuSO ₄ .5H ₂ O: 70-100 g / L

H ₂ SO ₄ : 80 to 150 g / L

Chlorine ions and additives are added to the copper electrolytic solution, and the compositions of the additives and chlorine ions added are shown in Table 1 below. In Table 1, ppm is the same as mg / L.

A scanning electron microscope photograph of the surface of the electrolytic copper foil precipitation surface (matte surface, M surface) produced is shown in Fig.

Examples 2 to 4 and Comparative Examples 1 to 4

An electrolytic copper foil was prepared in the same manner as in Example 1, except that the composition of the copper electrolytic solution was changed as shown in Table 1 below. Scanning electron microscopic photographs of the surface of the precipitated surface of the electrolytic copper foil produced in Examples 2 to 4 and Comparative Examples 1 to 4 are shown in Figs. 2 to 8, respectively.

Concentration [ppm] Cl- ET SPS ZPS SAC PEG DDAC 2M-5S Example 1 30.0 3.0 60.0 40.0 10.0 - - - Example 2 30.0 3.0 60.0 40.0 30.0 - - - Example 3 30.0 3.0 60.0 40.0 50.0 - - - Example 4 30.0 3.0 60.0 40.0 100.0 - - - Comparative Example 1 30.0 3.0 60.0 40.0 - 20.0 - - Comparative Example 2 30.0 3.0 60.0 40.0 - 40.0 - - Comparative Example 3 58.9  - 40.5  -  -  - 60.5 24.2 Comparative Example 4 61.2 - 38.9 - - - 50.1 24.0

Abbreviations in Table 1 mean the following compounds.

ET: Ethylenethiourea

SPS: bis (3-sulfopropyl) -disulfide (bis (3-sulfopropyl)

ZPS: 3- (2-Benzothiazolylthio) -1-propanesulfonate (3- (2-Benzothiazolythio)

SAC: Saccharin

PEG: Polyethylene glycol (PolyEthyleneGlycol) (molecular weight 1,000-20,000)

DDAC: Didecyldimethylammonium chloride < RTI ID = 0.0 >

2M-5S: 2-mercapto-5-benzimidazole sulfonic acid sodium salt dehydrate (2-mercapto-5-benzoimidazole)

Evaluation Example 1: Scanning electron microscope experiment

A scanning electron microscope was measured on the surface of the precipitated surface of the electrolytic copper foil obtained in Examples 1 to 4 and Comparative Examples 1 to 4, and the results are shown in Figs. 1 to 8, respectively.

As shown in Figs. 1 to 8, the electrolytic copper foils of Examples 1 to 4 had lower surface roughness than the electrolytic copper foils of Comparative Examples 1 to 4.

Evaluation Example 2: Measurement of surface roughness (Rz, Ra and Rmax)

The surface roughnesses Rz, Ra and Rmax of the precipitated surfaces of the electrolytic copper foils obtained in Examples 1 to 4 and Comparative Examples 1 to 4 were measured according to the JIS B 0601-1994 standard. The surface roughnesses Rz, Ra and Rmax obtained by the above measurement method are shown in Table 2 below. The lower the value, the lower the roughness.

Evaluation Example 3: Measurement of room temperature tensile strength, room temperature elongation, high temperature tensile strength and high temperature elongation

The tensile test specimens were taken from the electrolytic copper foils obtained in Examples 1 to 4 and Comparative Examples 1 to 4 at a width of 12.7 mm and a gauge length of 50 mm. The tensile test was carried out at a crosshead speed of 50.8 mm / min using the IPC-TM-650 2.4.18B standard , The maximum load of the tensile strength measured at room temperature is referred to as room temperature tensile strength and the elongation at break is referred to as room temperature elongation. The room temperature is 25 ° C.

The same electrolytic copper foil as that used for measuring the tensile strength and elongation at room temperature was taken out after heat treatment at 200 ° C for 1 hour, and the tensile strength and elongation were measured in the same manner as above, and were referred to as high temperature tensile strength and high temperature elongation.

The room temperature tensile strength, room temperature elongation, high temperature tensile strength and high temperature elongation obtained by the above measurement method are shown in Table 2 below.

Evaluation Example 4: Measurement of curl degree

The electrolytic copper foils obtained in Examples 1 to 4 and Comparative Examples 1 to 4 were sampled at a width of 10 cm and a length of 10 cm and then placed on a flat surface. Angles of curvature of the corners were measured and the results are shown in Table 2 below .

Ra
[Mu m] Rz
[Mu m] Rmax
[Mu m] Room temperature tensile strength
[kgf / mm ² ] High temperature tensile strength
[kgf / mm ² ] Room temperature elongation
[%] High temperature elongation
[%] Curling angle [°] Example 1 0.25 1.28 2.52 68.23 64.85 3.13 3.25 15 Example 2 0.21 1.17 2.64 76.12 65.60 3.48 3.04 20 Example 3 0.17 0.94 1.36 74.75 65.90 3.21 3.89 15 Example 4 0.25 1.17 2.36 83.46 71.58 3.28 3.36 25 Comparative Example 1 0.07 0.28 0.80 46.85 43.73 6.41 7.36 0 Comparative Example 2 0.07 0.25 0.67 47.58 43.44 5.77 5.36 5 Comparative Example 3 0.31 1.81 3.25 81.14 79.07 2.21 3.28 48 Comparative Example 4 0.32 1.91 3.91 64.66 61.63 3.01 3.92 50

As shown in Table 2, the electrolytic copper foils of Examples 1 to 4 had a surface roughness Ra of 0.3 mu m or less, Rz of 1.5 mu m or less, and Rmax of 3 mu m or less. In Examples 1 to 4 had a tensile strength at room temperature is very high as more than 65kgf / mm ^2, even after high temperature heat treatment the tensile strength of the tensile strength lowering rate was low even after the heat treatment to 64kgf / mm ² or more.

In addition, the running angles of Examples 1 to 4 were both 25 degrees or less. When the tensile strength is high, the curling phenomenon tends to increase. In the case of the electrolytic copper foils of Examples 1 to 4 according to the present invention, a low curling angle is exhibited and curl characteristics are excellent. This is presumably because the internal stress reduction effect due to the addition of SAC occurred.

In comparison, the electrolytic copper foils of Comparative Example 1 and Comparative Example 2 to which PEG was added in place of SAC exhibited 0 ° and 5 °, respectively, in terms of the curling angle. It is presumed that the curling property is improved due to the leveling effect of PEG. However, in the case of Comparative Example 1 and Comparative Example 2, the tensile strength at room temperature and the tensile strength at high temperature were as low as 48 kgf / mm ² , which is disadvantageous in terms of tensile strength.

In the case of Comparative Example 3 and Comparative Example 4 which did not include both SAC and PEG, the tensile strengths were all higher than 60 kgf / mm ² and showed high strength characteristics. However, curling due to high- 50 < / RTI > and was found to be difficult to handle in subsequent processes. Accordingly, the electrolytic copper foil according to the present invention exhibits excellent performance because it has high strength and low internal stress, resulting in less curling of edges.

The present invention is not to be limited by the above-described embodiments and the accompanying drawings, but should be construed according to the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (14)

Tensile strength of 60 kgf / mm ² To 80 kgf / mm < ^{2 &} gt ;, and an edge curling angle of 15 [deg.] To 25 [deg.]. The method according to claim 1,
An elongation rate of 3.0% to 4.0%. The method according to claim 1,
And the surface roughness Rz of the matte side is 1.5 占 퐉 or less. The method according to claim 1,
The tensile strength after heat treatment at 200 ° C for 1 hour is 60 kgf / mm ² to 75 kgf / mm ² . The method according to claim 1,
And an elongation rate of 3.0% to 4.0% after heat treatment at 200 占 폚 for 1 hour. The method according to claim 1,
An electrolytic copper foil having a thickness of 2 탆 to 12 탆. A battery comprising an electrolytic copper foil according to any one of claims 1 to 6. Insulating substrate; And
An electric part comprising an electrolytic copper foil according to any one of claims 1 to 6 attached to one surface of the insulating base material. Comprising the step of electrolyzing a copper electrolytic solution comprising additive A, additive B and saccharin,
Wherein the additive A is a thiourea compound,
Wherein the additive B is a sulfonic acid or a metal salt thereof of a compound containing a sulfur atom,
The electrolytic copper foil according to any one of claims 1 to 6, wherein the content of saccharin is 1 to 100 ppm. 10. The method of claim 9,
Wherein the copper electrolytic solution further contains chlorine at a concentration of 1 ppm to 30 ppm. 10. The method of claim 9,
The content of the additive A is 1 to 10 ppm,
Wherein the content of the additive B is 40 to 200 ppm. delete 10. The method of claim 9,
Wherein the thiourea compound is at least one compound selected from the group consisting of diethyl thiourea, ethylenethiourea, acetylenethiourea, dipropylthiourea, dibutylthiourea, N-trifluoroacetylthiourea, Nethylthiourea ), N-cyanoacetylthiourea, N-allylthiourea, o-tolylthiourea, N, N'-butylene thiourea (N, N -butylene thiourea, thiazolidinethiol, 4-thiazolinethiol, 4-methyl-2-pyrimidinethiol and 2-thiouracil (2 -thiouracil). < / RTI > 10. The method of claim 9,
Wherein the sulfonic acid or its metal salt of the compound containing the sulfur atom is at least one selected from the group consisting of bis- (3-sulfopropyl) -disulfide disodium salt, 3-mercapto-1-propanesulfonic acid, 3- (N, N-dimethylthiocarbamoyl) Propylsulfonate sodium salt, 3 - [(amino-iminomethyl) thio] -1-propanesulfonate sodium salt, o-ethyldithiocarbonate-S- (3-sulfopropyl) (Benzothiazolyl-2-mercapto) -propyl-sulfonic acid sodium salt, ethylenedithiodipropylsulfonic acid sodium salt, thioglycolic acid, thiophosphoric acid-o- (ω-sulfopropyl) ester disodium salt and thiophosphoric acid-tris- (ω-sulfopropyl) ester tin sodium salt (Thiophosphoric acid -tris- (omega -sulfopropyl) ester trisodium salt).

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