KR101570360B1 - Method of setting reference region and method of eliminating noise for the same - Google Patents
Method of setting reference region and method of eliminating noise for the same Download PDFInfo
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Abstract
According to another aspect of the present invention, there is provided a method of setting a reference region, comprising: irradiating a substrate with light; receiving light reflected by the substrate to acquire image data; segmenting the region in the inspection region of the image data; Removing the noise region in the segmented region, and setting at least one of the segmented regions in which the noise region is removed as a reference region. Therefore, even when the reference region is relatively narrowed due to the noise region existing in the inspection region, a more accurate reference region can be set.
Description
The present invention relates to a reference area setting method and a noise removing method for the same, and more particularly, to a method of setting a reference area in a three-dimensional shape measurement using a phase shift method using a moire pattern and a noise removing method therefor.
Electronic equipment has undergone remarkable development, and weight reduction and miniaturization have progressed gradually. Accordingly, there is a growing possibility that an error occurs in the manufacturing process of these electronic equipments, and equipment for detecting this is also being improved in accordance with this.
In recent years, 3D shape measurement technology is not limited to engineering field, but extends its application field to various ranges. In the past, there has been a contact type measurement method using a three-dimensional coordinate measuring device (CMM). However, active research on non-contact three-dimensional shape measuring technology based on optical theory has progressed .
A three-dimensional shape measurement method using a moire phenomenon, which is one of representative non-contact measurement methods, measures a three-dimensional shape by detecting a height at each point on the xy plane by irradiating a grid pattern shifted in phase.
More specifically, a grid pattern is irradiated to a measurement region (FOV), an inspection region (ROI) where a measurement object such as solder is formed for mounting an external electronic component is irradiated, the volume of the solder or the like is measured, An error such as non-payment is detected.
On the other hand, since the three-dimensional shape using the grid pattern measures only the contour of the three-dimensional shape without distinguishing the bottom region and the region where the solder is formed, the bottom region and the solder region are separated, It is possible to judge whether or not the solder is in good condition, overpayment, or non-payment. Therefore, the distinction between the reference area and the object area in which the solder is formed is important, and a method for distinguishing such a bottom area has been continuously studied.
Particularly, when a silk pattern, a hole, or the like is present in the inspection region ROI, the bottom region is relatively narrow, so that the accuracy of inspection is low and the number of data is small.
In addition, in the conventional measurement method, since the reference phase is set using the histogram without dividing the area, there is a problem that the accuracy of the inspection is decreased due to an increase in the bottom area and the noise area of the inspection area.
A problem to be solved by the present invention is to provide a method of setting a reference area capable of improving accuracy.
Another problem to be solved by the present invention is to provide a noise removing method for setting the reference area.
According to an exemplary embodiment of the present invention, there is provided a method of setting a reference area, comprising: irradiating a substrate with light; receiving light reflected by the substrate to acquire image data; The method of claim 1, further comprising: segmenting an area in the inspection area of the image data; removing a noise area in the segmented area; and setting at least one of the segmented areas from which the noise area is removed as a reference area .
For example, in the step of segmenting the regions in the inspection region of the image data, the predetermined inspection region may be extended to segment the regions in the extended inspection region.
In addition, the segmented region may include at least one of a silk screen pattern region, an OCR region, a hole region, a bright solder resist region, a dark solder resist region, and a pad region.
The step of segmenting the regions in the inspection region of the image data may include segmenting the regions based on at least one of a color, a gray scale, a modulation, a phase, a signal-to-noise ratio, a height and a visibility value Segments can be segmented separately.
In addition, the noise region may include at least one of a silk screen pattern region, an OCR region, and a hole region.
Meanwhile, in the step of setting at least one of the segmented regions in which the noise region has been removed as a reference region, the segmented regions in which the measurement object is formed among the segmented regions may be set as the reference region.
Alternatively, in the step of setting at least one of the segmented regions in which the noise region is removed as a reference region, a segmented region adjacent to the measured object among the segmented regions may be set as a reference region.
Alternatively, at least one of the segmented regions in which the noise region has been removed may be set as a reference region, and the largest region among the segmented regions may be set as a reference region.
In still another embodiment of the present invention, the step of setting at least one of the segmented regions in which the noise region is removed as a reference region may include determining a ratio of the segmented region and the inspecting region in the segmented region from which the noise region is removed Calculating a ratio of the largest area to the largest area among the segmented areas from which the noise area is removed if the area ratio of the widest area is greater than or equal to the preset threshold value, If the area area ratio of the area is less than the predetermined threshold value, at least two segment areas including the widest area among the segmented areas in which the noise area is removed may be set as the reference area.
According to another exemplary embodiment of the present invention, a method of setting a reference area includes irradiating a substrate with light before receiving solder on the substrate, receiving light reflected by the substrate to acquire first image data Selecting a segment region to be used as a reference region among the segmented regions of the first image data; and selecting a segment region to be used as the reference region, The method comprising the steps of: obtaining a characteristic value of a region; irradiating light onto the substrate after attaching solder to the substrate; receiving light reflected by the substrate to obtain second image data; Acquiring a characteristic value from data; and comparing the characteristic value obtained in the second image data with a characteristic value of the segment region to be used as the reference region And setting an area matching the characteristic value as a reference area.
In this case, setting the characteristic value obtained from the second image data and the characteristic value of the segment region to be used as the reference region as the reference region may be performed by classifying the region in the inspection region of the second image data The method comprising the steps of: segmenting the second image data into a plurality of segmented regions of the second image data; obtaining characteristic values of the segmented regions of the second image data; As a reference area.
In addition, the characteristic value may be obtained based on at least one of a color, a gray scale, a modulation, a phase, a signal-to-noise ratio, a height, and a visibility value.
On the other hand, in the foregoing embodiments, the light may be one of at least one of color light, white light, and lattice pattern light.
An exemplary noise cancellation method of the present invention includes the steps of illuminating a substrate with one of at least one of color light, white light, and lattice pattern light, acquiring image data, and removing noise from the image data At least one of a silk screen pattern region, an OCR region, and a hole region is formed using at least one of color, gray scale, modulation, phase, signal to noise ratio, height, and visibility in the step of removing noise. As a noise.
According to another exemplary embodiment of the present invention, there is provided a method of setting a reference area, comprising: irradiating a substrate with grating pattern light by a predetermined number of times to receive light reflected by the substrate; Acquiring pattern image data; acquiring average image data of the at least two pattern image data; discriminating a hole area in the average image data; Area.
Wherein the step of distinguishing the hole regions comprises the steps of synthesizing at least two of the average image data of the grating pattern lights illuminated in at least two directions spaced apart by a predetermined angle to obtain composite image data, And separating the hole region from the data.
The step of dividing the hole area in the merged image data may distinguish the hole area in the merged image data based on the shade.
According to the present invention, noise data existing in the inspection area can be removed to set a more accurate reference area.
Further, even when the reference region is relatively narrowed due to the noise region existing in the inspection region, a more accurate reference region can be set.
In addition, it is possible to increase the number of data by extending the inspection area (ROI) to improve the repeatability
In addition, when the inspection area is extended, a more reliable reference area can be set by increasing the number of reliable data by removing the noise pattern included in the inspection area with the reference area through the inspection area expansion.
In addition, the area area ratio is determined in the divided area, and the highly reliable area is secured as the reference area, and the repeatability can be improved.
In addition, the measurement time can be shortened by averaging the phase of the image data of the grid pattern image by separating the noise region from the image data in which the grid pattern is removed.
In addition, it is possible to more accurately distinguish the hole pattern by dividing the noise region by synthesizing the grid pattern image data irradiated in a plurality of directions.
1 is a flowchart illustrating a reference area setting method according to an embodiment of the present invention.
2 is a flowchart showing a reference area setting method according to another embodiment of the present invention.
3 is a flowchart illustrating a reference area setting method according to another embodiment of the present invention.
4 is a plan view showing an inspection region of the substrate.
FIG. 5 is a cross-sectional view taken along the cutting line II 'of FIG. 4 before the solder is attached.
FIG. 6 is a cross-sectional view showing a section cut along the cutting line II 'of FIG. 4 after the solder is attached.
7 is a schematic view showing an average image of holes generated by the irradiated pattern light when irradiating the grating pattern light from the left side to the right side.
8 is a schematic view showing an average image of holes generated by irradiated pattern light when irradiating the grating pattern light from the right side to the left side.
FIG. 9 is a schematic view showing an average image of holes finally obtained by synthesizing the average image of holes in FIG. 7 and the average image of holes in FIG.
The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.
Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.
Hereinafter, in order to understand the present invention, a method of measuring a three-dimensional shape by a phase shift method using a moire pattern will be briefly described.
In the phase shift method using a moiré pattern, a grid image is irradiated on a measurement object, and a three-dimensional shape is measured by observing a grid image reflected from the measurement object.
At this time, assuming that each position of the surface of the substrate is an xy plane, an intensity value of light corresponding to each x, y coordinate value can be expressed by the following equation (1).
In this equation, I is the intensity of the measurement light, A is the average value (average), and B is the modulation. For example, for the 4-bucket algorithm, the subscripts can have 1, 2, 3, and 4, respectively, when changed 90 degrees, 180 degrees, 270 degrees when the phase is not changed.
From Equation (1), Equation (2) representing the phase value? Can be obtained.
On the other hand, the phase? And the height h are proportional to each other as shown in the following equation (3).
Λ is the moire equivalent wavelength.
By using the above-described equations, a lattice pattern is irradiated on an object to obtain a phase value (?) Corresponding to each x, y coordinate value, and the height corresponding to the x, y coordinate value (h), it is possible to distinguish the outline of the substrate surface to which the measurement object such as solder is attached.
On the other hand, the reference area and the object area where the solder is formed are distinguished from the surface of the substrate, and the shape and the volume of the solder are calculated to detect defects such as pre-solder, over-lead, and not-solder.
Hereinafter, a method for setting a reference area outside the object area where the measurement object is located will be described in detail with reference to the drawings.
1 is a flowchart illustrating a reference area setting method according to an embodiment of the present invention. 4 is a plan view showing an inspection region of the substrate. FIG. 5 is a cross-sectional view taken along the cutting line II 'of FIG. 4 before the solder is attached. FIG. 6 is a cross-sectional view showing a section cut along the cutting line II 'of FIG. 4 after the solder is attached.
Referring to FIGS. 1, 4, and 6, according to an exemplary embodiment of the present invention, light is first applied to a substrate and image data is obtained (step S101). At this time, any one of at least one of color light, white light, or lattice pattern light may be used as the light to be irradiated. The reference area is a reference area for measuring the height of a measurement object in a floor area where the measurement object is formed. For example, the reference area may be the entire bottom area, or alternatively it may be part of the bottom area.
Next, the region is segmented in the inspection region of the image data (Step S102). At this time, the step of segmenting the regions in the inspection area of the image data may be performed based on at least one value among color, gray scale, modulation, phase, signal to noise ratio, height and visibility value Segments can be segmented separately.
It is also possible to set a floor area in which an area in which the measurement object is formed in the inspection area is removed before segmenting the inspection area and to segment each area in this floor area. Alternatively, height information may be measured on the substrate before the measurement object is formed, and measurement may be performed using the height information of the measurement object, that is, at least one pre-measured segment area formed with the solder among the segmented areas after the measurement object is formed It can be utilized as a standard.
For example, the segmented regions may include pad regions in which a silk screen pattern region, an
The silk screen pattern area and the
The
A
In the case of using white light or color light in the process of segmenting such areas, the silk screen pattern area and the
When the grating pattern light for three-dimensional shape measurement is used for segmenting the regions, the grating pattern light is irradiated to the substrate by a predetermined number of times, and the light reflected by the substrate is received Thereby acquiring at least two or more pattern image data. Hereinafter, each of the areas to be classified in the pattern image data has unique characteristic values such as color, gray scale, signal-to-noise ratio, modulation, phase, height and visibility, Can be segmented.
Meanwhile, the average image data or 180 degree phase difference images of the at least two pattern image data are added or subtracted to obtain image data from which the lattice pattern is removed.
Thereafter, unique characteristic values of each region are obtained from the image data from which the grid pattern has been removed, and the regions are segmented based on the obtained characteristic values.
On the other hand, in the case of a hole, since light is not reflected according to the irradiation angle, there is a region in which the intensity is very low, that is, a dark region is displayed. In order to distinguish the hole area, at least two of the grid pattern image data of the grid pattern light beams irradiated in at least two directions separated by a predetermined angle or an image in which the grid pattern is removed are synthesized to obtain composite image data The hall area can be distinguished from the composite image data. In this case, in order to distinguish the hole area from the composite image data, the hole area is distinguished from the composite image data based on the shade.
When the pattern light is irradiated from left to right as shown in FIG. 7, the left end of the hole H is formed with the arm portion DR so that the boundary of the hole can be clearly recognized, but the light is partially reflected from the inner wall at the right end A list BR may be formed and the boundaries of the holes may be displayed unclear. Conversely, when the pattern light is irradiated from the right side to the left side as shown in FIG. 8, the arm portion DR is formed at the right end of the hole H so that the boundary of the hole can be clearly seen. However, So that a list portion BR is formed and the boundaries of the holes can be displayed unclearly. The images in these two directions are combined to clearly recognize the boundaries of the holes as shown in FIG.
Also, a visibility (?, Visibility) having the average brightness as a parameter can be used.
Meanwhile, at this time, the inspection area can be enlarged so as to have a larger area than the inspection area set for inspection of the measurement object, thereby increasing the number of data in the bottom area.
Next, the noise area is removed from the segmented area (step S103). Of the segmented areas, the silk screen pattern area, the
Next, at least one of the segmented regions from which the noise region has been removed is set as a reference region (step S104).
At this time, it is possible to set the segmented region in which the measurement object is formed, as the reference region, among the segmented regions. The segmented area where the measurement object is formed means, for example, when a solder, which is a measurement object, is formed on a part of the pad, the pad area can be formed without a solder, except for the region where the solder is formed.
The measurement object and the adjacent region may be set as the reference region among the differently segmented regions. The measurement object and the adjacent region can be adjacent portions of the pad, for example, when all the portions of the pad are all covered by the solder.
Alternatively, the largest area among the segmented areas may be set as the reference area. Alternatively, among the segmented areas in which the noise area is removed, the area area ratio, which is the ratio of the segmented area to the inspection area, Wherein when the area ratio of the largest area is greater than or equal to the predetermined threshold value, the largest area among the segmented areas from which the noise area is removed is set as a reference area, If the area ratio is less than the preset threshold value, at least two segmented areas including the widest one of the segmented areas in which the noise area is removed may be set as the reference area.
According to the present embodiment, noise data existing in the inspection area can be removed to set a more accurate reference area.
Further, even when the reference region is relatively narrowed due to the noise region existing in the inspection region, a more accurate reference region can be set.
In addition, it is possible to increase the number of data by extending the inspection area (ROI) to improve the repeatability
In addition, when the inspection area is extended, a more reliable reference area can be set by increasing the number of reliable data by removing the noise pattern included in the inspection area with the reference area through the inspection area expansion.
2 is a flowchart showing a reference area setting method according to another embodiment of the present invention.
Referring to FIG. 2, according to another exemplary embodiment of the present invention, before a solder is attached to a substrate, light is irradiated onto the substrate, light reflected by the substrate is received And acquires the first image data (step S201). As in the previous embodiment, the light to be irradiated may be at least one of color light, white light, or lattice pattern light.
Next, the region is segmented in the inspection region of the obtained first image data and segmented (Step S202). At this time, the regions can be segmented based on at least one of color, gray scale, modulation, phase, signal-to-noise ratio, height, and visibility values. The segmented regions also include pad regions formed with a silk screen pattern region, an
Next, a segment region to be used as a reference region among the segmented regions of the first image data is selected (Step S203). At this time, as in the previous embodiment, the noise region is removed in advance. Also, among the segmented regions, the region where the measurement object is formed can be selected as the reference region, and the measurement object and the adjacent region can be selected as the reference region from among the segmented regions.
Alternatively, the largest area among the segmented areas may be selected as the reference area. Alternatively, after calculating the area area ratio of the segmented areas from which the noise area has been removed, the area of the largest area Selecting a largest region among the segmented regions from which the noise region is removed if the ratio is greater than or equal to the preset threshold value and if the area ratio of the largest region is less than the preset threshold value, At least two or more segmented regions including the widest one of the segmented regions from which the noise region has been removed may be selected as the reference region. In this case, the area area ratio may be at least one of a ratio of the segmented area to the inspection area, a ratio of the segmented area to the object area, and a ratio of the segmented area to a predetermined area.
Next, a characteristic value of the segment area to be used as the reference area is obtained (step S204). The characteristic value at this time can be obtained based on at least one value of color, gray scale, modulation, phase, signal-to-noise ratio, height, and visibility value.
Next, after attaching the solder to the substrate, light is irradiated onto the substrate, and light reflected by the substrate is received to acquire second image data (step S205). As with the first image data acquisition, the light to be irradiated may be one of at least one of color light, white light, or lattice pattern light.
An area matching the characteristic value obtained from the second image data and the characteristic value of the segment area used as the reference area is set as a reference area (step S206).
In this case, a characteristic value of the segmented regions of the second image data is obtained, and an area corresponding to the characteristic value of the segment region to be used as the reference region and the characteristic value obtained in the segmented regions of the second image data Can be set as the reference area. Meanwhile, in the first image data, at least one value among color, gray scale, modulation, phase, signal-to-noise ratio, height, and visibility values is used as a characteristic value. However, The value of the value uses the same characteristic value as that used in the first image data.
According to the present embodiment, the reliability can be further improved by utilizing the two data before and after the solder is attached to the substrate, as compared with the foregoing embodiment.
Further, it is possible to shorten the inspection time after the solder is attached to the substrate by setting the reference region in advance before attaching the solder to the substrate.
Further, reliability can be further improved by preliminarily setting the reference region before attaching the solder to the substrate and obtaining the height value for the reference region.
Meanwhile, according to the noise removing method of the exemplary embodiment of the present invention, the substrate is irradiated with one of light of at least one of color light, white light, and lattice pattern light, acquires image data, Noise is removed from the data. At least one of the silk screen pattern region, the OCR region, and the hole region is converted into noise using at least one of color, gray scale, modulation, phase, signal-to-noise ratio, height, and visibility, Can be removed.
3 is a flowchart showing a noise removing method according to another embodiment of the present invention.
Referring to FIG. 3, according to another embodiment of the present invention, a grating pattern is irradiated to a substrate by a predetermined number of grating patterns, and light reflected by the substrate is received At least two or more pattern image data are obtained (step S301). The grating pattern light may be irradiated by a predetermined number of gratings in two or more directions different from each other to obtain at least two or more pattern image data in each direction.
Next, average image data of at least two or more pattern image data is obtained (step S302).
Next, the hole area is divided in the average image data (step S303). To do this, we synthesize the average image data in two directions and divide the hole area based on this. Dividing the hole area in the image of the average image data in the two directions has been described with reference to Figs. 7 to 9 described above, so that the overlapping description will be omitted.
Next, the thus determined hole area is removed to the noise area (step S304)
According to this embodiment, the phase of the grid pattern image data used for the three-dimensional shape measurement can be averaged without using a separate light source, so that the measurement time can be shortened by separating the noise region from the image data in which the grid pattern is removed .
Further, it is possible to more accurately distinguish the hole patterns by dividing the regions by combining the grid pattern image data irradiated in a plurality of directions.
As described above, according to the present invention, error can be largely reduced by eliminating holes, silk screen pattern regions, and OCR regions with a large error or low reliability at the time of setting a reference region with noise, Even when the area of the segmented area set as the reference area is relatively narrow, the accuracy and repeatability of the inspection can be improved by extending the area or using other segmented areas together.
In addition, it is possible to increase the number of data of the floor area in which the noise is removed by expanding the inspection area, thereby improving the repeatability.
While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, the foregoing description and drawings are to be regarded in an illustrative rather than a restrictive sense of the invention.
100: inspection area of substrate 110: bright solder resist area
120: dark solder resist region 130: hole region
140: silk screen pattern area, OCR area
150: HASL region 210: substrate
220: pad 230: solder
240: pattern 250: solder resist
Claims (17)
Segmenting an area in the inspection area of the image data;
Removing a noise region in the segmented region; And
Setting at least one of the segmented regions from which the noise region has been removed as a reference region,
The step of segmenting the regions in the inspection region of the image data may include segmenting the regions based on at least one of a color, a gray scale, a modulation, a phase, a signal-to-noise ratio, a height, and a visibility value And segmenting the reference area into segments.
Wherein the predetermined inspection region is extended and the region is segmented in the extended inspection region.
A silicon solder resist region, a dark solder resist region, and a pad region, wherein the at least one solder resist pattern region includes at least one of a silk screen pattern region, an OCR region, a hole region, a bright solder resist region, a dark solder resist region and a pad region.
Wherein the segmented regions in which the measurement object is formed among the segmented regions are set as reference regions.
And a segmented region adjacent to the measurement object among the segmented regions is set as a reference region.
And setting the largest region among the segmented regions as a reference region.
Calculating a ratio of the area area of the segmented area in which the noise area is removed; And
If the largest area area ratio of the largest area is greater than or equal to a preset threshold value, the largest area of the segmented area from which the noise area is removed is set as the reference area, and if the area area ratio of the largest area is less than the predetermined threshold value , And setting at least two segmented areas including the widest one of the segmented areas in which the noise area is removed as a reference area
Segmenting an area in the inspection area of the first image data;
Selecting a segment region to be used as a reference region among the segmented regions of the first image data;
Obtaining a characteristic value of a segment region to be used as the reference region;
Attaching a solder to a substrate, irradiating the substrate with light, and receiving light reflected by the substrate to obtain second image data;
Obtaining a characteristic value from the second image data; And
And setting an area corresponding to the characteristic value obtained in the second image data and the characteristic value of the segment area to be used as the reference area as a reference area.
Segmenting an area in the inspection area of the second image data;
Obtaining a property value of the segmented regions of the second image data; And
And setting an area corresponding to the characteristic value obtained in the segmented areas of the second image data and the characteristic value of the segment area to be used as the reference area as a reference area.
Wherein the reference area is obtained based on at least one of a color, a gray scale, a modulation, a phase, a signal-to-noise ratio, a height, and a visibility value.
Removing noise from the image data,
In the noise removing step, at least one of a silk screen pattern area, an OCR area, and a hole area is used as noise by using at least one of color, gray scale, modulation, phase, signal to noise ratio, height, And removing the noise.
Obtaining average image data of the at least two pattern image data;
Identifying a hole region in the average image data; And
And removing the separated hole area with noise.
Synthesizing at least two average image data of the grating pattern light beams irradiated in at least two directions spaced apart by a predetermined angle to obtain composite image data; And
And separating the hole region from the composite image data.
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| JP2006250609A (en) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | Visual inspection method of circuit mounting board |
| JP2010027964A (en) | 2008-07-23 | 2010-02-04 | Omron Corp | Forming method of region setting data for inspection region and substrate appearance inspection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006250609A (en) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | Visual inspection method of circuit mounting board |
| JP2010027964A (en) | 2008-07-23 | 2010-02-04 | Omron Corp | Forming method of region setting data for inspection region and substrate appearance inspection device |
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