KR101561253B1 - Led lighting fixture having dual-heat-radiating structure - Google Patents

Abstract

The present invention provides a power supply device comprising: a housing including a power terminal capable of electrical connection with an external AC power source; A light emitting diode module installed in the housing and having a light emitting diode portion and a heat sink attached to a rear surface of the light emitting diode portion; A power supply control circuit module installed in the housing and connected to the power supply terminal to supply the external AC power to the light emitting diode module; A supporting structure for supporting the light emitting diode module and the power control circuit module to be fixed to the housing; A thermally conductive solid heat dissipating tube attached to the heat dissipating plate and closely attached to the inner surface of the housing; And a heat dissipating fluid filled in the housing to dissipate heat generated from the light emitting diode module and the power supply control circuit module through a heat flow.

Description

TECHNICAL FIELD [0001] The present invention relates to a LED lighting fixture having a dual heat-

The present invention relates to a light emitting diode lighting device having a dual heat dissipation structure, which is excellent in heat dissipation and economical efficiency.

The incandescent lamp is not helping the human being anymore because the power consumption is increasing remarkably. A light-emitting diode (LED) lighting device capable of emitting a luminous intensity superior to that of an incandescent lamp with less electric power than that of an incandescent lamp is attracting attention. In particular, it is a fact that the power consumption is not only efficient but also the environmental destruction material used in the manufacture of incandescent lamps is not required to be used in the manufacture of LED lighting.

However, there is still a problem in the LED lighting apparatus. Although power efficiency and light efficiency are superior to incandescent lamps, the heat dissipation problem still remains as a problem to be solved. The problem of heat dissipation in the LED lighting apparatus shortens the service life of the LED package itself, shortens the life of the power supply module supplying power to the LEDs, and shortens the life of the LED lighting apparatus. Efforts continued.

In order to solve the heat dissipation problem of the LED, a water-cooled heat dissipation structure has been proposed. However, in this case, the insulating solution chemically reacts with the substrate or the LED to shorten the lifetime of the LED. Finally, the heat generated by the LEDs and the power supply module must be released to the outside world. When the insulating liquid is filled in the low-thermal-conductivity housing, the thermal conductivity of the housing is low, There arises a problem that it is operated in an atmosphere of high temperature.

Recently, LED lighting has been used in various applications in various fields such as home lighting, office lighting, factory lighting, street light, headlight, landscape lighting, leisure lighting, house lighting, fishery lighting and marine exploration lighting. In particular, when a luminaire is installed on a livestock house or a leisure facility, moisture may penetrate into the luminaire, shortening the lifetime of the LED and possibly causing electric failure.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide a light emitting diode illuminating device having a dual heat dissipating structure which maximizes heat dissipation efficiency by using a dual heat dissipating structure, will be.

According to an aspect of the present invention, there is provided a light emitting diode (LED) lighting apparatus having a dual heat dissipation structure, including: a housing including a power terminal capable of being electrically connected to an external AC power source; A light emitting diode module installed in the housing and having a light emitting diode portion and a heat sink attached to a rear surface of the light emitting diode portion; A power supply control circuit module installed in the housing and connected to the power supply terminal to supply the external AC power to the light emitting diode module; A supporting structure for supporting the light emitting diode module and the power control circuit module to be fixed to the housing; A thermally conductive solid heat dissipating tube attached to the heat dissipating plate and closely attached to the inner surface of the housing; And a heat dissipating fluid filled in the housing to dissipate heat generated from the light emitting diode module and the power supply control circuit module through a heat flow.

Here, the heat discharging fluid may be a light-transmitting insulating liquid.

Here, the light-transmitting insulating liquid may include a thermoelectric element including carbon nanotubes and graphene particles.

Here, the thermoelectric element may include at least one of CNT particles, graphene particles, and ceramic particles.

Here, the housing may include: a base module having the power terminal formed therein and having a side surface formed with a thread; A cylinder portion of glass or resin material coupled with the base module; And a molding part for sealing the cylinder part and the base module.

Here, the housing may further include a sealing portion movable by expansion or contraction of the light-transmitting insulating liquid.

Here, the housing may further include a sealing portion having a hollow protrusion that is deformed by expansion or contraction of the light-transmitting insulating liquid.

Here, between the sealing portion and the molding portion, a space can be formed in which the sealing portion can move by expansion or contraction of the light-transmitting insulating liquid.

Here, the power control circuit module may include: an AC-DC converter for converting the AC power into a DC power; A rectifying circuit connected to the AC-DC converter; And a dimming circuit connected to the rectifying circuit and capable of regulating the current of the rectified DC power supply; . ≪ / RTI >

Here, the housing may be a cylindrical cylinder type, and the thermally conductive solid heat pipe may have the same outer diameter as the inner diameter of the cylindrical cylinder.

The housing has a cylindrical cylindrical shape and the thermally conductive solid heat pipe includes a first sub heat dissipation pipe and a second sub heat dissipation pipe, the outer diameter of the first sub heat dissipation pipe is the same as the inner diameter of the housing, The inner diameter is the same as the outer diameter of the second sub heat-radiating tube, and the second sub heat-radiating tube can be attached to the heat-radiating plate.

Here, the thermally conductive solid heat pipe may be made of copper, aluminum, an alloy thereof, or a thermally conductive resin material.

Here, graphene particles or carbon nanotube particles may be scattered on the surface of the thermally conductive solid heat pipe.

Here, the power control circuit module may be vertically erected and attached to the support structure.

Here, the heat discharging fluid may be a liquid material or a vapor material.

Here, the light emitting diode illuminating device having the dual heat dissipating structure may further include a lens installed on an inner surface of the upper portion of the housing to diffuse light emitted from the light emitting diode module.

According to an embodiment of the present invention having the above-described structure, heat generated in the light emitting diode is primarily removed by the thermal flow of the light-transmitting insulating liquid, and secondarily, the thermal conductivity The heat dissipation efficiency can be maximized by being removed by the solid heat radiation pipe.

In addition, according to the present invention, a heavy metal heat dissipation module can be minimized, resulting in weight reduction and manufacturing cost reduction.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a light emitting diode lighting device having a dual heat dissipation structure according to an embodiment of the present invention. FIG.
2 is an exploded perspective view of a light emitting diode lighting device having a dual heat dissipation structure, which is an embodiment of the present invention.
3 is a cross-sectional view of a light emitting diode lighting device having a dual heat dissipation structure, which is an embodiment of the present invention.
FIG. 4 is a block diagram illustrating a power control circuit of a light emitting diode (LED) lighting apparatus having a dual heat dissipation structure according to an embodiment of the present invention. FIG.

Hereinafter, an LED lighting apparatus according to the present invention will be described in detail with reference to the drawings.

1 is a perspective view of a light emitting diode lighting device having a dual heat dissipation structure according to an embodiment of the present invention. As shown in the figure, the LED lighting apparatus 100 having a dual heat dissipation structure according to an embodiment of the present invention includes a base module 11 for receiving external power by being coupled to a power socket, And a cylinder portion 13 made of translucent material made of glass or resin or synthetic resin filled with the translucent insulating liquid 60. The cylinder portion 13 and the base module 11 are watertight A housing 10 provided with a seal ring 19 for fastening the LED module 20 and a cylinder part 13 formed in close contact with the cylinder part 13 to transmit heat generated from the light emitting diode module 20 to the cylinder part 13 through heat conduction A heat dissipating tube 50 made of a thermally conductive solid for finally discharging the heat to the outside, and a light emitting tube 50 formed on one side of the cylinder 13 and being emitted by the electric energy transmitted through the base module 11 It can comprise a light emitting diode module 20.

The light emitting diode lighting device 100 having the above structure is filled with the light transmissive insulating liquid 60. The light emitting diode module 20 and the power control circuit module The heat generated in the LED module 30 is primarily cooled and the heat dissipating tube attached to the heat dissipating plate 23 of the LED module 20 is brought into close contact with the cylinder 13 of the housing 10, 20 is secondarily cooled by heat conduction, it is possible to maximize heat dissipation efficiency.

Hereinafter, a light emitting diode lighting device having a dual heat dissipation structure, which is an embodiment of the present invention, will be described in more detail with reference to FIGS. 2 and 3. FIG.

FIG. 2 is an exploded perspective view of a light emitting diode lighting apparatus having a dual heat dissipation structure according to an embodiment of the present invention, and FIG. 3 is a sectional view of a light emitting diode lighting apparatus having a dual heat dissipation structure according to an embodiment of the present invention.

2 and 3, a light emitting diode (LED) lighting apparatus 100 having a dual heat dissipation structure according to an embodiment of the present invention includes a housing 10, a light emitting diode module 20, a power control circuit module 30 ), A supporting structure 40, a thermally conductive solid heat-dissipating tube 50, and a heat-dissipating fluid (a light-transmitting insulating liquid 60) filled in the housing 10.

The housing 10 includes a base module 11 having the power supply terminal 12 formed thereon and a screw thread formed on the side thereof, a cylinder portion 13 made of glass or resin and coupled to the base module 11, A molding part 15 for sealing the cylinder part 13 and the base module 11 and a sealing part 17 movable by expansion or contraction of the translucent insulating liquid 60. Here, a space is formed between the molding part 15 and the sealing part 17, and the sealing part 17 is movable by expansion or contraction according to the temperature change of the light-transmitting insulating liquid 60.

A lens for diffusing light may be formed on an upper portion of the housing 10, that is, a portion where light emitted from the light emitting diode module 20 is transmitted. The lens may be formed on the inner surface 10 of the housing, or may be provided as a separate member.

On the other hand, the sealing portion may be formed with a hollow protrusion 17-1 as shown in FIG. 2B and FIG. The hollow protrusions 17-1 are made of an elastic material, and the inside thereof is filled with air, so that the shape of the hollow protrusions 17-1 can be deformed by the expansion and contraction of the insulating liquid 60. [ Thus, by providing a margin for the temperature change, it is possible to lower the pressure applied to the housing 10 in accordance with the rising or falling of the temperature.

On the other hand, a seal ring 19 is disposed between the base module 11 and the cylinder part 13 in order to improve watertightness. The molding unit 15 forms the first watertight structure and the sealing ring 19 forms the second watertight structure to prevent the light transmitting insulating liquid 60 from leaking to the outside.

The sealing portion 17 is formed in close contact with the inside of the cylinder so as to function as a passageway so that the translucent insulating liquid 60 does not leak out of the sealing portion 17 and the insulating liquid 60 It is brought into close contact with the inner side of the cylinder and becomes finely movable with the frictional force with the inner wall of the cylinder part 13. The sealing portion 17 does not move if the expansion pressure of the insulating liquid 60 is smaller than the frictional force between the inner wall of the cylinder portion 13 and the sealing portion 17. If the expansion pressure of the insulating liquid 60 is higher than the frictional force between the inner wall of the cylinder portion 13 and the sealing portion 17, (17) is greater than the frictional force between the inner wall of the sealing portion (13) and the sealing portion (17). Of course, at this time, the insulating liquid 60 does not leak outside the sealing portion 17, and even if the volume of the insulating liquid expands or shrinks in accordance with the temperature change, no air layer is formed in the insulating liquid, and there is no fear of breakage.

The sealing portion 17 may include at least one of silicone, natural rubber, urethane, and epoxy excellent in insulating properties. Particularly, when the insulating liquid 60 is a mineral oil, if the sealing portion 17 is made of silicon, it is chemically and physically stable, and durability is excellent. The sealing portion 17 is generally made of silicone, rubber, or the like, which is manufactured by molding a polymer material, and has a hardness between 10 and 60 HB. The sealing portion 17 can be moved in the cylinder portion 13 by thermal expansion or thermal contraction of the translucent insulating liquid 60 so that the volume of the insulating liquid 60 expanded or contracted by thermal expansion or contraction can be absorbed And a central protrusion 17-1. The central projecting portion 17-1 can be deformed in shape by expansion or contraction of the insulating liquid.

The light emitting diode module 20 installed in the inner space formed by the cylinder part 13 may include the light emitting diode part 21 and the heat sink 23 attached to the rear surface of the light emitting diode part 21. The light emitting diode portion 21 is a portion irradiated with light and is a portion where light is emitted by a power source supplied from the power source control circuit module 30. [ The heat dissipating plate 23 is a heat dissipating plate for dissipating heat generated in the light emitting diode unit 21, and a heat conducting solid heat dissipating tube 50 described later is attached thereto.

The power control circuit module 30 is supported by the support structure 40 and installed in the cylinder portion 13 to control an external AC power supplied through a power terminal of the base module 11, And supplies the AC power or DC power suitable for the power supply unit 20. As shown in FIG. 4, a DC voltage is supplied to an AC-DC converter (power inverter 31) to supply AC power supplied from the outside of the lighting apparatus to the DC power supply according to the characteristics of the LED package 6 A rectifying circuit 33 and a dimming circuit 35 for controlling the brightness of light by adjusting the amount of the DC voltage.

The support structure 40 is a component for supporting the light emitting diode module 20 and the power supply control circuit module 30. The light emitting diode module 20 is supported by the support structure 40, And the power supply control circuit module 30 is vertically erected therebelow. Particularly, when the power supply control circuit module 30 is set up in the longitudinal direction so that the lighting apparatus 100 according to the present invention is installed upright on the ceiling, the power supply control circuit module 30, So that the area of contact with the flow of the fluid according to the thermal flow is increased, thereby maximizing the heat dissipation effect.

The support structure 40 is made of conductive metal or conductive resin and functions to transfer external power from the power terminal 12 to the power control circuit module 30.

The heat conducting solid heat pipe 50 is attached to the heat radiating plate 23 and its outer surface is brought into close contact with the inner surface of the cylinder portion 13, as shown in the figure. Accordingly, the heat generated in the light emitting diode unit 21 is released to the outside through the cylinder unit 13 by the heat conduction. Since the heat generated in the light emitting diode portion 21 is simultaneously radiated by the thermal current and the heat conduction, the heat radiation efficiency is excellent.

The thermally conductive solid heat sink 50 may include a first sub heat sink 51 and a second sub heat sink 53, as shown in FIG. Here, the first sub heat-radiating pipe 51 is formed of a cylindrical tube to be brought into close contact with the cylinder portion 13, and the second sub-cylinder is attached to the heat radiating plate 23 and may have a cylindrical cup structure have. That is, the outer diameter of the first sub heat-radiating pipe (51) is the same as the inner diameter of the cylinder, and the first sub heat-radiating pipe (51) Since the inner diameter of the sub heat sink 51 is the same, the first and second sub heat sinks 53 are in close contact with each other. Then, the second sub heat-radiating pipe (53) is brought into contact with the heat radiating plate (23). Accordingly, the heat of the heat sink 23 is discharged to the outside through the second sub heat sink 53, the first sub heat sink 51, and the cylinder by heat conduction.

As shown in the drawing, the first sub heat-radiating pipe 51 is formed to have substantially the same length as that of the cylinder portion 13, thereby maximizing the contact area with the cylinder, Can be maximized.

2 and 3, the power supply control circuit module 30 for supplying power to the light emitting diode module 20 includes a cylinder portion 13 in a state of standing vertically by the support structure 40, As shown in FIG. Accordingly, the heat generated in the power supply control circuit module 30 is removed by the thermal flow of the light-transmitting insulating liquid 60. The power supply control circuit module 30 will be described in more detail with reference to FIG.

The insulating liquid 60 absorbs the heat generated from the power supply control circuit module 30 and the LED module 20 through the thermal flow and dissipates the heat to the outside of the housing 10 and transmits the light emitted from the LED module 20 And discharging it out of the housing 10. Therefore, the insulating liquid 60 must have both heat radiation, light transmission and electrical insulation.

FIG. 4 is a block diagram illustrating a power control circuit of a light emitting diode (LED) lighting apparatus having a dual heat dissipation structure according to an embodiment of the present invention. As shown in the figure, a light emitting diode lighting apparatus having a dual heat dissipating structure according to the present invention includes a power supply control circuit 31 including an external power supply 11, a power supply conversion device 31, a rectifier 33, and a dimming circuit 35. [ Module 30 and an LED that emits light by receiving the rated power from the power control circuit module 30.

In the present invention, an example of the power supply control circuit module 30 is a component for changing an AC power supply to a rated DC power supply. The power supply control device 31 includes a rectifier 33 and a dimming circuit 35 However, the present invention is not limited to this, and a power control module 30 for converting an external power source to an AC-AC power source and transmitting the power to the LED may be used.

It is to be understood that the power supply control module 30 may be installed upright in the longitudinal direction by the support structure 40 as shown in FIG. 3 and formed integrally with the light emitting diode module 20.

According to an embodiment of the present invention having the above-described structure, heat generated in the light emitting diode is primarily removed by the thermal flow of the light-transmitting insulating liquid, and secondarily, the thermal conductivity The heat dissipation efficiency can be maximized by being removed by the solid heat radiation pipe.

In addition, according to the present invention, a heavy metal heat dissipation module can be minimized, resulting in weight reduction and manufacturing cost reduction.

The LED lighting apparatus having the dual heat-dissipating structure described above can be applied to all the embodiments or the methods of the embodiments so that various modifications can be made without departing from the scope of the present invention. Some of which may be selectively combined.

10: Housing
11: Base module
13:
15: Molding part
17:
19: seal ring
20: Light emitting diode module
21: Light emitting diode part
23: Heat sink
30: Power supply control circuit module
31: Power converter
33: rectifier
35: Dimming circuit
40: support structure
50: metal heat sink
51: First sub heat-dissipating tube
53: second sub heat-dissipating tube
60: Heat dissipating fluid (light-transmitting insulating liquid)
100: Light emitting diode lighting equipment

Claims (17)

A housing including a power terminal capable of making an electrical connection with an external AC power source;
A light emitting diode module installed in the housing and having a light emitting diode portion and a heat sink attached to a rear surface of the light emitting diode portion;
A power supply control circuit module installed in the housing and connected to the power supply terminal to supply the external AC power to the light emitting diode module;
A supporting structure for supporting the light emitting diode module and the power control circuit module to be fixed to the housing;
A thermally conductive solid heat dissipating tube attached to the heat dissipating plate and closely attached to the inner surface of the housing; And
And a heat dissipating fluid filled in the housing to dissipate heat generated from the light emitting diode module and the power supply control circuit module through a thermal flow.
The method according to claim 1,
Wherein the heat discharging fluid includes a light-transmitting insulating liquid.
3. The method of claim 2,
Wherein the light-transmitting insulating liquid comprises a thermoelectric element.
The method of claim 3,
Wherein the thermoelectric element comprises at least one of CNT particles, graphene particles, and ceramic particles.
3. The method of claim 2,
The housing includes:
A base module having the power terminal formed therein and having a side surface formed with a thread;
A cylinder portion of glass or resin material coupled with the base module;
And a molding part sealing the cylinder part and the base module.
6. The method of claim 5,
Wherein the molding part is attached by ultrasonic welding or high frequency welding.
6. The method of claim 5,
The housing includes:
Further comprising a sealing portion that is movable by expansion or contraction of said light-transmitting insulating liquid.
6. The method of claim 5,
The housing includes:
Further comprising a sealing portion having a hollow protrusion that is deformed by expansion or contraction of the light-transmitting insulating liquid.
8. The method of claim 7,
And a space is formed between the sealing portion and the molding portion so that the sealing portion can be moved by expansion or contraction of the light-transmitting insulating liquid.
The method according to claim 1,
The power control circuit module includes:
An AC-DC converter for converting the AC power into a DC power;
A rectifying circuit connected to the AC-DC converter; And
A dimming circuit connected to the rectifying circuit to adjust a current of the rectified DC power; And a second heat dissipation structure.
The method of claim 1, wherein
The housing is cylindrical,
Wherein the thermally conductive solid heat pipe has an outer diameter equal to an inner diameter of the cylindrical cylinder.
12. The method of claim 11,
The housing is cylindrical, cylindrical,
Wherein the thermally conductive solid heat pipe includes a first sub heat dissipation pipe and a second sub heat dissipation pipe,
Wherein an outer diameter of the first sub heat-dissipating tube is the same as an inner diameter of the housing, an inner diameter thereof is the same as an outer diameter of the second sub-
And the second sub heat-radiating pipe is attached to the heat-radiating plate.
The method according to claim 1,
Wherein the thermally conductive solid heat-dissipating tube is made of copper, aluminum, an alloy thereof, or a thermally conductive resin material.
14. The method of claim 13,
Wherein the thermally conductive solid heat-dissipating tube has a dual heat dissipation structure in which graphene particles or carbon nanotube particles are scattered and arranged on a surface thereof.
The method according to claim 1,
Wherein the power control circuit module is vertically erected and attached to the support structure.
The method according to claim 1,
Wherein the heat dissipating fluid is a liquid material or a vapor material.
The method according to claim 1,
And a lens installed on an inner surface of the upper portion of the housing to diffuse light emitted from the light emitting diode module.

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