KR101557484B1 - Apparatus for inspecting light emitting diode package - Google Patents

Apparatus for inspecting light emitting diode package Download PDF

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Publication number
KR101557484B1
KR101557484B1 KR1020140083082A KR20140083082A KR101557484B1 KR 101557484 B1 KR101557484 B1 KR 101557484B1 KR 1020140083082 A KR1020140083082 A KR 1020140083082A KR 20140083082 A KR20140083082 A KR 20140083082A KR 101557484 B1 KR101557484 B1 KR 101557484B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
vision probe
stage
axis
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Application number
KR1020140083082A
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Korean (ko)
Inventor
임쌍근
이상윤
주병권
손동규
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(주) 인텍플러스
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Priority to KR1020140083082A priority Critical patent/KR101557484B1/en
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Publication of KR101557484B1 publication Critical patent/KR101557484B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An apparatus for inspecting a light emitting diode package according to the present invention comprises a stage, a vision probe, a transport mechanism, a marker, and a control unit. The stage loads and supports a light emitting diode package wherein light emitting diode modules are connected in an array shape on an upper surface thereof. The vision probe is disposed above the stage. The transport mechanism transports the vision probe relative to the stage in an X-axis, a Y-axis, and a Z-axis direction. The marker is mounted on the vision probe to be transported with the vision probe by the transport mechanism relative to the stage. The control unit transports the vision probe by the transport mechanism relative to the light emitting diode modules on the stage to allow the vision probe to photograph the light emitting diode modules, determines whether the light emitting diode modules are defective based on photographed images, and then transports the marker to a defective light emitting diode module by the transport mechanism to mark the defective light emitting diode module as defective.

Description

[0001] Apparatus for inspecting light emitting diode packages [0002]

The present invention relates to a light emitting diode package inspecting apparatus capable of inspecting a defective light emitting diode package and inspecting the defective light emitting diode module.

BACKGROUND ART [0002] Light emitting diodes (LEDs) have recently been developed to improve the luminous efficacy, and its application range has been increasingly used in early signal display applications such as backlight units (BLU) for mobile phones and liquid crystal displays And is further expanded for a light source and an illumination of a flat panel display. This is because the light emitting diode has less power consumption and longer life than a conventional bulb or a fluorescent lamp.

The light emitting diode can be manufactured as a light emitting diode module. Generally, the light emitting diode module includes a light emitting diode chip, a body on which the light emitting diode chip is mounted, and a fluorescent silicone covering the light emitting diode chip on the body. The light emitting diode module may further include a zener diode beside the light emitting diode chip.

A plurality of such LED modules may be connected in an array form to constitute a light emitting diode package in order to increase the productivity in manufacturing the LED module. After the light emitting diode module is manufactured, the light emitting diode package cuts the connection portion of the light emitting diode modules and allows them to be separated into the respective light emitting diode modules.

On the other hand, when the light emitting diode module is mounted in a light source or a lighting device in a state of being manufactured in a defective state, the device is defective. Accordingly, there is a need for a process of inspecting the LED modules thoroughly in the manufacturing process of the LED package, and then performing a bad marking on the defective LED module. For this purpose, the operator may visually inspect the light emitting diode modules and then perform bad marking on the defective light emitting diode module. However, in this case, a skilled worker is required, which may limit the productivity improvement due to manual operation.

An object of the present invention is to provide a light emitting diode package inspecting apparatus capable of automating defect inspection and bad marking of a light emitting diode package and reducing the overall size of the apparatus, manufacturing cost, and manufacturing period.

According to an aspect of the present invention, there is provided an apparatus for inspecting a light emitting diode package, including a stage, a vision probe, a transfer mechanism, a marker, and a control unit. The stage supports the light emitting diode package having the light emitting diode modules connected in the form of an array on the upper surface thereof. The vision probe is arranged on the upper side of the stage. The transport mechanism transports the vision probe relative to the stage in the X-, Y-, and Z-axis directions. The marker is attached to the vision probe and is transported relative to the stage with the vision probe by the transport mechanism. The control unit causes the transfer mechanism to relatively transfer the vision probe to the light emitting diode modules on the stage so as to photograph the light emitting diode modules. The control unit determines whether the light emitting diode modules are defective based on the photographed images, It is conveyed to the module and bad marking is done.

According to the present invention, it is possible to automate defect inspection and bad marking of a light emitting diode package and to simplify the driving mechanism for transferring the vision pro section and the marker, thereby reducing the size of the entire device, the manufacturing cost, have. Further, according to the present invention, it is possible to provide convenience of the marking pen by automatically drawing out the nib of the marking pen, and when the marking pen is not used, the nib of the pen can be sealed and the use period can be increased.

1 is a configuration diagram of a light emitting diode package inspection apparatus according to an embodiment of the present invention.
Figure 2 is a partial perspective view of Figure 1;
Fig. 3 is a partial sectional view showing an example of a marker in Fig. 2. Fig.
4 is a cross-sectional view for explaining the action of the marker shown in Fig.
FIG. 5 is a perspective view showing the vision probe and marker in FIG. 2; FIG.
Figs. 6 to 8 are front views for explaining working examples of the pushing mechanism shown in Fig. 5;
9 is a front view for explaining an operation example of the height adjuster shown in Fig.

The present invention will now be described in detail with reference to the accompanying drawings. Here, the same reference numerals are used for the same components, and a detailed description of known functions and configurations that may unnecessarily obscure the gist of the present invention will be omitted. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 is a configuration diagram of a light emitting diode package inspection apparatus according to an embodiment of the present invention. Figure 2 is a partial perspective view of Figure 1;

1 and 2, a light emitting diode package inspection apparatus 100 includes a stage 110, a vision probe 120, a transfer mechanism 130, a marker 140, and a controller 150. .

The stage 110 seats and supports the light emitting diode package 10 on its upper surface. Here, the light emitting diode package 10 has a structure in which the light emitting diode modules 11 are connected in an array form. The light emitting diode modules 11 may be arranged and connected to a plurality of rows and a plurality of columns. A support groove for inserting the light emitting diode package 10 may be formed on the stage 110. Although not shown, a fixing mechanism for fixing the light emitting diode package 10 inserted into the support groove of the stage 110 may be provided. In addition, when the light emitting diode package 10 is inspected by applying power, a power supply unit may be provided on the stage 110.

The vision probe 120 is disposed on the upper side of the stage 110. The vision probe 120 is positioned toward the upper surface of the stage 110. [ The vision probe 120 may be configured to include a camera. The camera may be an area scan camera or the like.

The transfer mechanism 130 transfers the vision probe 120 relative to the stage 110 in the X-axis, Y-axis, and Z-axis directions. For example, the stage 110 can be supported by the frame 101 to move horizontally in the Y-axis direction. The stage 110 can be guided to move in the Y-axis direction by the Y-axis linear guide.

Then, the vision probe 120 can be supported on the column 121 to move horizontally in the X-axis direction and move up and down in the Z-axis direction. Here, the column 121 may extend in the X-axis direction and both ends may be fixed to the frame 101. The X-axis movable member 122 can be guided to the column 121 to move in the X-axis direction by the X-axis linear guide. The Z-axis movable member 123 can be guided to the X-axis movable member 122 to move in the Z-axis direction by the Z-axis linear guide. The vision probe 120 is fixed to the Z-axis movable member 123. Therefore, the vision probe 120 can be guided to move in the X-axis direction and the Z-axis direction. The X-axis, Y-axis, and Z-axis linear guides may be formed by known linear guides, respectively.

The feed mechanism 130 includes a Y axis driving mechanism 131 for feeding the stage 110 in the Y axis direction, a Z axis driving mechanism 132 for feeding the Z axis movable member 123 in the Z axis direction, And an X-axis driving mechanism 133 for moving the shaft movable member 122 in the X-axis direction. Accordingly, the vision probe 120 can be photographed with the light emitting diode modules 11 on the stage 110 while being relatively moved in the X-axis, Y-axis, and Z-axis directions with respect to the stage 110. The Y-axis driving mechanism 131, the Z-axis driving mechanism 132, and the X-axis driving mechanism 133 may each be constituted by a linear motor or the like. The stage 110 is fixedly configured and the vision probe 120 is configured to be transferred in the X-axis and Z-axis directions as well as in the Y-axis direction. Therefore, the present invention is not necessarily limited to the illustrated example.

The marker 140 is mounted on the vision probe 120 and is transported relative to the stage 110 together with the vision probe 120 by the transport mechanism 130. When the vision probe 120 is transported in the X-axis and Z-axis directions by the transport mechanism 130, the marker 140 can be transported along the X-axis and Z-axis directions together with the vision probe 120. Therefore, in addition to the feed mechanism 130, a separate driving mechanism for feeding the marker 140 in the X-axis and Z-axis directions can be omitted. Therefore, the size of the entire apparatus 100, the manufacturing cost, . The marker 140 may be mounted on the vision probe 120 with the marking portion directed downward. The marker 140 can be disposed in front of the vision probe 120 based on the direction in which the stage 110 is initially entered.

The control unit 150 causes the transfer mechanism 130 to transfer the vision probe 120 relative to the light emitting diode modules 11 on the stage 110 so that the vision probe 120 can be photographed. Then, the control unit 150 determines whether the light emitting diode modules 11 are defective based on the photographed images. For example, the control unit 150 may compare a photographed image with a reference image to inspect a structural defect of the light emitting diode module 11 or the like. The control unit 150 may determine whether the light emitting diode modules 11 are defective in units of the light emitting diode packages 10.

Thereafter, the control unit 150 feeds the markers 140 to the defective LED module 11 by the feed mechanism 130, thereby marking defective marks. For example, when the control unit 150 finds a defective light emitting diode module 11 in the process of comparing the images photographed with respect to the light emitting diode modules 11 with the reference image, the controller 150 determines the position of the defective light emitting diode module 11 It is stored in memory. When the inspection of the light emitting diode modules 11 is completed, the control unit 150 transfers the vision probe 120 on the X axis and the stage 110 on the Y axis, Bad marking can be performed in association with the defective light emitting diode module 11. When the marker 140 is formed of a marking pen, the controller 150 moves the marker corresponding to the upper side of the defective LED module 11 downward in the Z-axis direction to the defective LED module 11 Bad marking can be performed.

According to the above-described LED package inspection apparatus 100, the light emitting diode modules 11 are inspected during the manufacturing process of the light emitting diode package 10, and the light emitting diode module 11, By automating the process of bad marking, the inspection and bad marking process can be quickly processed into a series of processes. Therefore, the productivity of the light emitting diode package 10 can be improved when the LED package 10 is manufactured.

Meanwhile, as shown in FIGS. 3 and 4, the marker 140 may be a knock type marking pen. The knock marking pen is pulled out of the casing 141 from the state where the pen tip 143 is sealed by the sealing mechanism 144 inside the casing 141 once the knob 142 is pushed, The pen tip 143 may be moved out of the casing 141 to the inside of the casing 141 and sealed by the sealing mechanism 144. [ The knock type marking pen is installed in the vision probe 120 in a state where the pen tip 143 faces downward and the knob 142 faces upward.

Specifically, the upper and lower ends of the casing 141 are opened. The knob 142 is drawn through the upper opening of the casing. The pen tip 143 is pulled out through the lower end opening of the casing 141. An ink cartridge 145 is connected to the upper end of the pen tip 143 and is housed in the casing 141. A spring 146 is provided between the ink cartridge 145 and the sealing mechanism 144. An operation means (not shown) is provided above the ink cartridge 145 and connected to the knob 142. Each time the knob 142 is pressed by the knob 142, the actuating means operates with the spring 146 so that the pen tip 143 can be pulled out of the casing 141 or held in the casing 141 . A known means can be used as the operating means, and therefore, a description thereof will be omitted.

The sealing mechanism 144 includes a sealing member 144a having a hollow and having an upper end and a lower end opened, a cover 144b for opening and closing a lower end opening of the sealing member 144a, And a cover supporting member 144c fixed to the cover 144b.

The sealing member 144a allows the nib 143 to be inserted through the top opening and be drawn out through the bottom opening. The cover 144b is hinged around the lower end opening of the sealing member 144a. The cover supporting member 144c allows the cover 144b to close the lower end opening of the sealing member 144a with the pen tip 143 housed in the sealing member 144a. The cover supporting member 144c is bent when the cover 144b is pushed in a state in which the pen tip 143 is housed in the sealing member 144a. Thus, by positioning the cover 144b to open the lower end opening of the sealing member 144a, the pen point 143 can be drawn out from the sealing member 144a. The cover supporting member 144c is made of a bendable material. The cover supporting member 144c may be made of a string.

The nib 143 is housed in the sealing member 144a when not in use. At this time, since the lower end opening of the sealing member 144a is closed by the cover 144b by the cover supporting member 144c, the pen point 143 is sealed by the sealing member 144a. In this state, when the knob 142 is once pushed, the pen tip 143 is pulled out of the casing 141 by coming out of the sealing member 144a while pressing the cover 144b. Thus, when the pen tip 143 is not used, the pen tip 143 is sealed by the sealing mechanism 144 without the cap closing the lower end opening of the casing 141, so that the ink is not dried, and the use period can be increased. As another example, the marker may be composed of a laser marker or the like for marking by irradiating the laser beam.

As shown in FIGS. 5 to 8, the vision probe 120 may be equipped with a pushing mechanism 160. The pushing mechanism 160 pushes the knob 142 of the knocking marking pen. For example, the pushing mechanism 160 may be a pneumatic cylinder. The pneumatic cylinder is configured to expand and contract the rod 160a using air pressure. The cylinder body 160b is fixed to the vision probe 120 with the pneumatic cylinder arranged to extend and retract the rod 160a above the knob 142 of the knocking marking pen. The cylinder body 160b can be fixed to the vision probe 120 by the fixing bracket 161. [ The fixing bracket 161 can be connected to the cylinder body 172b of the lifting mechanism 172 to be described later. This pneumatic cylinder is capable of pushing the knob 142 of the knocked marking pen by the rod 160a as the rod 160a is stretched.

The pneumatic cylinder is controlled by the control unit 150. Therefore, when the bad marking operation is started, the pneumatic cylinder can push the knob 142 by the control unit 150 to automatically draw the pen tip 143 out of the casing 141. When the bad marking operation is completed, the pneumatic cylinder can push the knob 142 by the control unit 150 so as to automatically store the pen tip 143 into the casing 141. As another example, the pushing mechanism 160 may be configured to include a linear motor, or may include a rotating motor and a cam, or the like.

The marker 140, for example, the knock type marking pen, may be detachable to the vision probe 120. Accordingly, when the ink of the knock type marking pen is exhausted, the knock type marking pen can be easily replaced. The holder 146 may be configured to allow the knock-type marking pen to be detachable. The holder 146 may include a fixed holder portion 146a and a moving holder portion 146b. The fixed holder portion 146a and the movable holder portion 146b are formed so as to surround the circumference of the knock type marking pen together. The fixed holder portion 146a and the movable holder portion 146b can be fastened by the screw member 146c. The movable holder portion 146b can be operated to tighten or loosen the knock type marking pen while being close to or spaced from the fixed holder portion 146a in accordance with the rotational direction of the screw member 146c. Therefore, the operator can attach or detach the knock type marking pen to the holder 146. [ Needless to say, the holder 146 is not limited to the illustrated example, and may be variously configured.

9, the height of the marker 140, for example, the knock type marking pen, with respect to the vision probe 120 can be adjusted by the height adjuster 170. As shown in Fig. Accordingly, the knock type marking pen can be finely adjusted by the height adjuster 170 so that the height of the pen tip 143 drawn out of the casing 141 and the height of the knob 142 are adjusted.

The height adjuster 170 may include a lifting bracket 171 and a lifting mechanism 172 for lifting the lifting and lowering bracket 171. The lifting bracket 171 can be fixed to the holder 146 that supports the knock type marking pen. The lifting mechanism 172 may be a pneumatic cylinder. The cylinder body 172b is fixed to the vision probe 120 with the pneumatic cylinder arranged to extend and retract the rod 172a in the vertical direction. Then, the rod 172a of the pneumatic cylinder is fixed to the lifting bracket 171. Accordingly, the pneumatic cylinder can raise and lower the lifting bracket 171 as the rod 172a is extended and retracted. The knock-type marking pen can be raised and lowered by raising and lowering the lifting bracket 171.

The pneumatic cylinder of the height adjuster 170 can be controlled by the control unit 150. [ When the operator inputs a height adjustment command to the control unit 150 through the operation unit, the control unit 150 can adjust the height of the knocking marking pen by the pneumatic cylinder. Needless to say, the lifting mechanism 172 may include a linear motor such as the pushing mechanism 160, or may include a rotating motor and a cam.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation and that those skilled in the art will recognize that various modifications and equivalent arrangements may be made therein. It will be possible. Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

110 .. stage 120 .. vision probe
130 .. Feed mechanism 140 .. Marker
141. Casing 142. Knob
143 .. nib 144 .. sealing mechanism
146 .. holder 150 .. control unit
160 .. pushing mechanism 170 .. height regulator

Claims (5)

delete A stage in which light emitting diode modules are mounted on an upper surface of a light emitting diode package connected in an array form to support the light emitting diode packages;
A vision probe disposed above the stage;
A transfer mechanism for transferring the vision probe relative to the stage in X-axis, Y-axis, and Z-axis directions;
A marker mounted on the vision probe and transported by the transport mechanism together with the vision probe relative to the stage; And
The vision probe is transported relative to the light emitting diode modules on the stage by the transport mechanism so as to photograph the light emitting diode modules on the basis of the photographed images to determine whether the light emitting diode modules are defective or not, And a controller for feeding the light emitting diode module to the light emitting diode module,
The marker being made of a knocking marking pen;
The knock-type marking pen includes:
When the knob is pushed once, the pen tip is pulled out of the casing from the sealed state by the sealing mechanism inside the casing. When the knob is pushed once again, the pen tip is pulled out of the casing, And wherein the light emitting diode package inspecting device is configured to be moved inside and be sealed by the sealing mechanism. 3. The method of claim 2,
Further comprising a pushing mechanism mounted on the vision probe for pushing a knob of the knock type marking pen. 3. The method of claim 2,
Further comprising a height adjuster for adjusting a height of the knocking marking pen with respect to the vision probe. 3. The method of claim 2,
Wherein the knock type marking pen is detachable from the vision probe.
KR1020140083082A 2014-07-03 2014-07-03 Apparatus for inspecting light emitting diode package KR101557484B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113281629A (en) * 2021-04-10 2021-08-20 深圳市永而佳实业有限公司 Light emitting diode array detection device and using method thereof
CN115312416A (en) * 2022-09-27 2022-11-08 深圳市天成照明有限公司 Integrated circuit LED lamp bead packaging detection device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113281629A (en) * 2021-04-10 2021-08-20 深圳市永而佳实业有限公司 Light emitting diode array detection device and using method thereof
CN113281629B (en) * 2021-04-10 2022-07-01 深圳市永而佳实业有限公司 Light emitting diode array detection device and using method thereof
CN115312416A (en) * 2022-09-27 2022-11-08 深圳市天成照明有限公司 Integrated circuit LED lamp bead packaging detection device
CN115312416B (en) * 2022-09-27 2022-12-06 深圳市天成照明有限公司 Integrated circuit LED lamp bead packaging detection device

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