KR101552777B1 - Biosensor package and packaging method thereof - Google Patents

Abstract

A biosensor package including a communication element and a manufacturing method thereof are disclosed. A method of fabricating a semiconductor package for a biosensor includes: laminating a first metal layer on a base; Forming an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements on the first metal layer; Stacking a second metal layer on a region where the antenna pattern and the SMT circuit pattern are formed; And forming a reference / sensing electrode pattern for measuring a specific component included in the sample introduced into the second metal layer.

Description

TECHNICAL FIELD [0001] The present invention relates to a biosensor package and a method of manufacturing the same.

Embodiments of the present invention relate to a semiconductor package for a biosensor capable of communication and a manufacturing method thereof.

Many modern people have adult diseases such as diabetes, hyperlipidemia, and anemia. It is a simple and useful method to measure the components in the blood as a method for judging whether or not people have such an adult disease.

In particular, measuring blood components using a blood component meter provides useful information to the general public as well as experts such as physicians.

Patent Document 1 (Korean Patent Registration No. KR 10-1003077 B1 (Dec. 21, 2010)) discloses a biosensor.

1 shows a biosensor disclosed in Patent Document 1. A biosensor 1 disclosed in Patent Document 1 includes a lower plate 5 on which a working electrode 2, a reference electrode 3 and a sample recognition electrode 4 are formed, ; A middle plate 7 formed with sample (sample) insertion channels 6 and laminated on the lower plate 5; And an upper plate 8 which is laminated on the middle plate 7. The connection terminals 9 of the working electrode 2, the reference electrode 3 and the sample recognition electrode 4 are formed to be inserted into an external device (i.e., measuring device).

Embodiments of the present invention provide a package for a biosensor capable of wirelessly communicating with an external device by packaging a biosensor, a communication element, a control IC chip, and the like into one semiconductor chip, and a method of manufacturing the same.

Embodiments of the present invention also provide a package for a biosensor and a method of manufacturing the same, which can reduce cost and maximize the function of a biosensor by optimizing the structure of a semiconductor package for a biosensor including a communication element.

According to an embodiment of the present invention, a method of manufacturing a semiconductor package for a biosensor includes: laminating a first metal layer on a base; Forming an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements on the first metal layer; Stacking a second metal layer on a region where the antenna pattern and the SMT circuit pattern are formed; And forming a reference / sensing electrode pattern including a working electrode, a reference electrode, and a sample recognition electrode for measuring a specific component included in the sample introduced into the second metal layer.

According to one aspect, the base may use an insulating material comprising at least one of a polyester film (PET), Teflon, or a ceramic.

According to another aspect of the present invention, the metal layer may be formed of any one of gold, silver, aluminum, and copper, an alloy of nickel-plated copper, an alloy of gold and nickel, an alloy of nickel and gold , And an alloy of copper and tin-plated alloy may be used.

According to another aspect, the step of laminating the first metal layer includes the steps of: laminating the first metal layer to the base using a metal lamination method including at least one of electroplating, sputtering or metal lamination; The metal layer may be attached.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor package for a biosensor, the method comprising: after forming the antenna pattern and the SMT circuit pattern, and before stacking the second metal layer, Bonding the circuit elements; And forming an insulating layer on the entire surface of the first metal layer to which the electronic circuit element is bonded for insulation with the electronic circuit element.

According to another aspect of the present invention, the step of laminating the second metal layer includes the steps of: forming a hole for circuit connection with a part of the SMT circuit pattern and the antenna pattern on the insulating layer; The plating layer may be formed as the second metal layer on the entire surface of the substrate.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor package for a biosensor, comprising the steps of: forming a first polymer film for forming an inlet through which a sample flows into a region other than a part of a region where the reference / ); Applying a dispensing material, which is a sensing material to the sample, to a region of the region where the reference / sensing electrode pattern is formed, to which the first polymer film is not attached; And attaching a second polymer film for forming an outlet through which the sample flows to the region to which the first polymer film is adhered.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor package for a biosensor, comprising the steps of: forming a first polymer film for forming an inlet through which a sample flows into a region other than a part of a region where the reference / ); Attaching a second polymer film for forming an outlet through which the sample flows to the region where the first polymer film is attached; And applying a dispensing material, which is a sensing material for the sample, to a region of the region where the reference / sensing electrode pattern is formed, to which the first polymer film and the second polymer film are not attached can do.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor package for a biosensor, comprising: applying a dispensing material, which is a sensing material for the sample, to a region of a region where the reference / sensing electrode pattern is formed; Attaching a first polymer film for forming an inlet through which the sample flows into a region other than the partial region of the region where the reference / sensing electrode pattern is formed; And attaching a second polymer film for forming an outlet through which the sample flows to the region to which the first polymer film is adhered.

According to another aspect, the primary polymer film and the secondary polymer film may be adhered in a laminated form of an adhesive type and a temperature and pressure type.

According to another aspect, the primary polymer film and the secondary polymer film are formed using a method capable of processing a hole including at least one of a mold method, a laser drilling method, and a mechanical drilling method, So that it can serve as an insulator.

According to another aspect, the dispensing material may correspond to a biosensing material that reacts with the sample.

According to an embodiment of the present invention, a semiconductor package for a biosensor includes: a base; A first metal layer laminated on the base, wherein an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements are formed on the first metal layer; And a second metal layer laminated on the area where the antenna pattern and the SMT circuit pattern are formed. The working electrode, the reference electrode, and the sample recognition electrode are included in the second metal layer for measuring a specific component included in the introduced sample A reference / sensing electrode pattern is formed.

According to the embodiment of the present invention, a communication element, a control IC chip, and the like are packaged as one semiconductor chip, thereby providing a biosensor device capable of wireless communication with an external device.

According to the embodiment of the present invention, by optimizing the structure of the semiconductor package for a biosensor including the communication element, the cost can be reduced and the function of the biosensor can be maximized.

Fig. 1 shows an electrochemical biosensor device disclosed in Patent Document 1. Fig.
Fig. 2 shows an electrochemical biosensor and measuring instrument disclosed in Patent Document 1. Fig.
FIG. 3 shows a biosensor system including an external device such as a biosensor device and a smart phone according to the present invention.
4 shows an electrochemical biosensor device according to the present invention.
5 shows a control IC chip according to the present invention.
6 is a view showing an embodiment of a semiconductor package for a biosensor according to the present invention.
7 is a view illustrating a packaging method of a semiconductor package structure for a biosensor according to an embodiment.
8 is a view illustrating another packaging method of the semiconductor package for a biosensor according to an embodiment.
9 is a view showing another embodiment of a semiconductor package for a biosensor according to the present invention.
10 is a view showing a packaging method of a semiconductor package structure for a biosensor according to another embodiment.
11 is a view showing another packaging method of a semiconductor package structure for a biosensor according to another embodiment.
12 is a view showing still another embodiment of a semiconductor package for a biosensor according to the present invention.
13 is a view illustrating a packaging method of a semiconductor package structure for a biosensor according to another embodiment.
FIG. 14 is a view showing another packaging method of the semiconductor package structure for a biosensor according to another embodiment.
15 is a view showing another packaging method of the semiconductor package structure for a biosensor according to another embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The biosensor 1 disclosed in Patent Document 1 requires that the user possesses a separate measuring instrument. That is, the user must carry the measuring instrument at all times, and the measuring instrument and the biosensor 1 must be physically combined to obtain the measured value.

Recently, many users carry smart phones, smart pads, and so on. Therefore, if the data measured by the biosensor is outputted through the smartphone or the smart pad, the user may not purchase the dedicated measuring instrument.

There is a need for a technique capable of outputting data measured by a biosensor through an external device such as a smart phone or a smart pad that the user always possesses without using a separate dedicated measuring device.

FIG. 3 shows a biosensor system including an external device such as a biosensor device and a smart phone according to the present invention.

4 shows an electrochemical biosensor device according to the present invention.

5 shows a control IC chip according to the present invention.

Referring to FIG. 3, the biosensor system according to an embodiment of the present invention includes an external device 200 such as a smart phone and a biosensor device 100. At this time, the communication element of the biosensor device 100, the reference / sensing electrode (including the working electrode, the reference electrode, the sample recognition electrode), the control integrated circuit chip, etc. are integrated in a common housing.

If the user carries only the biosensor device, the target component in the blood can be measured using the wireless communication between the external device 200 such as a smart phone and the biosensor device. The measured components are output from an external device 200 such as a smart phone or the like.

The biosensor device 100 according to an embodiment of the present invention includes at least three plates (a first plate, a second plate, and a third plate). 4, the communication element 50, the reference / sensing electrode 40, and the controlling integrated circuit chip 60 may be disposed on the first plate 12, as will be described below. Here, the reference / sensing electrode 40 may include a working electrode, a reference electrode, a sample recognition electrode, and a pair of the working electrode and the reference electrode may be used as a component measurement electrode for measuring a specific component of the sample, A recognition electrode can be used to sense the influx of the sample. In addition, the reference / sensing electrode 40 may be provided with an enzyme immobilization unit 3 for fixing the enzyme.

A sample inlet channel 14a for guiding the sample so that the sample reaches the component measurement electrode may be disposed on the second plate 14 at the upper portion of the first plate 12. [ The air outlet 16a for discharging the air inside the housing 10 to the outside can be disposed on the third plate 16 on the upper portion of the second plate 14 as the sample flows in. .

As shown in Fig. 4, the housing 10 has a laminated structure composed of three layers. A reference / sensing electrode (including a working electrode, a reference electrode, a sample recognition electrode) 40, a communication element 50, and a control IC chip 60 are formed on the first plate 12. A reference electrode 40 including a reference electrode and a sample recognition electrode 40, a communication element 50 and a control IC chip 60 are formed on one surface of the first plate 12, 12 form the outer surface of the biosensor device 100. [ For example, the other side of the first plate 12 may include, for example, a pat film, a polyimide film, or the like used in a flexible printed circuit base. In particular, since the biosensor device 100 is manufactured as a disposable device which can not be reused, an inexpensive material for the other side of the first plate 12 can be used.

The present invention has the following advantages in the manufacturing process.

(Including a working electrode, a reference electrode, and a sample recognition electrode) formed on one surface of the first plate 12 when the first plate 12 is used as the other surface of the first plate 12, The conductive element 40 and the communication element 50 may be formed simultaneously as a single process through screen printing, gravure printing, sputtering, laser patterning, wet etching and plating, rather than being formed separately. This has the advantage of reducing the manufacturing cost of the biosensor device 100. At this time, the sensing electrodes (including the working electrode, the reference electrode, the sample recognition electrode) 40, and the communication element 50 are formed of copper, nickel, or copper that is electroless nickel plated with gold, silver, aluminum, copper, Nickel and gold may be formed using at least one of the following electrolessly plated copper / nickel / gold materials.

The component measurement electrode 20 included in the reference / sensing electrode includes a pair of adjacent electrodes. At this time, the enzyme immobilizing unit 30 is disposed between the pair of electrodes. The enzyme immobilization unit 30 provides the enzyme and the sample introduced between the pair of electrodes of the component measurement electrode 20 reacts with the sample provided by the enzyme immobilization unit 30. Due to this reaction, an electrochemical change may occur, and this electrochemical change means the amount of the specific component contained in the sample.

The enzyme immobilizing unit 30 may provide a plurality of enzymes. At this time, the user or the manufacturer can select any one of the plurality of enzymes according to his setting, and the selected enzyme and the sample react with each other. For example, a user or a manufacturer can select an appropriate enzyme for various purposes (blood glucose measurement, anemia measurement, blood coagulation time measurement) and the like.

In addition, since the electric characteristics of the sample are measured by the component measurement electrode 20, fixing the enzyme 30 on the surface of the component measurement electrode 20 can be the most sensitive measurement of the change in electrical characteristics of the sample. For this purpose, the enzyme provided in the enzyme immobilizing section 30 can be immobilized on the surface of the component measuring electrode 20.

The sample recognition electrode is disposed adjacent to the component measurement electrode 20 to provide information as to whether the sample has been introduced or whether a sufficient amount of the sample has been introduced. This information is provided to the controlling integrated circuit chip (described below).

In particular, the operating mode of the controlling integrated circuit chip (or the component measuring electrode, the communication element) may be determined based on whether the sample has been introduced or whether a sufficient amount of the sample has been introduced. For example, the control integrated circuit chip can minimize power consumption in a dormant state when a sample is not introduced or a sufficient amount of sample is not introduced, and when the sample is introduced or a sufficient amount of sample is introduced, The integrated circuit chip enters an active state with relatively large power consumption.

The communication element 50 is formed on the first plate 12. The communication element 50 transmits data on the measured specific component to an external device using a wireless communication method, and can receive power from the outside using a wireless power transmission technique. In particular, the power received from the outside using a wireless power transmission technique is provided to the control IC chip or the like.

The control IC chip 60 is electrically connected to the reference / sensing electrodes (including the working electrode, the reference electrode, the sample recognition electrode) 40 and the communication element 50. The controlling IC chip 60 can sense the proximity of the smart device through the communication element 50. [ At this time, if the proximity of the smart device is detected, the power received through the communication element is supplied to the controlling IC chip 60. [

The control IC chip 60 includes a modulator 61, a signal detector 62, a processor 63 and an A / D converter 64 as shown in Fig. In particular, the controlling IC chip 60 may further include a power generator 65, an amplifier 66, or a signal converter 67 as necessary.

The modulator 61 modulates the data on the measured specific component into a waveform suitable for transmission in order to transmit data on the measured specific component to the smart device 200 or a dedicated measuring device (not shown). In particular, the modulator 61 can modulate the data of the measured specific component into signals of various bands according to the near field wireless communication standard.

The signal detector 62 detects a control signal or data of the external device received through the communication element and transmits the control signal or data of the external device to the processor 63. Due to the modulator 61 and the signal sensor 62, the biosensor device according to the present invention enables communication between the device 100 and the smart device 200 or the dedicated measuring device.

The processor 63 processes the control signal or data of the external device (the smart device 200 or the dedicated measuring device) and the data of the measured specific component, and determines whether or not the sample received from the sample recognition electrode Processing information.

The A / D converter 64 converts an analog signal into a digital signal, and the analog signal detected by the component measuring electrode 20 is converted into a digital signal. The power generator 65 is required when the biosensor device 100 does not include a battery. The power received wirelessly from the external smart device 200 is used by the power generator 65 to drive the control IC chip such as the modulator 61, the processor 63, and the like.

The power generator 65 may be omitted when a battery is incorporated in the control IC chip.

The amplifier 66 amplifies the signal detected by the sensing electrodes (including the working electrode, the reference electrode, the sample recognition electrode) 40 and the component measuring electrode 20 when they are weak.

The signal converter 67 converts a signal suitable for processing the signal detected by the sample recognition electrode 40 and the component measurement electrode 20. For example, the signal converter 67 may convert the current to a voltage, or vice versa.

The control integrated circuit chip senses the flow of the sample using at least one of a non-contact type sensing method and a contact type sensing method, and controls the operation of the controlling integrated circuit chip or other elements depending on whether the sample is introduced . That is, the sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 40 can detect the influx of the sample based on the change in capacitance (non-contact type) By detecting the change, the influx of the sample can be detected (contact method). The control IC chip 60 measures a change in voltage or current on the component measuring electrode 20 when the influx of the sample is detected. When the measured value of the voltage or the current enters the steady state, the controlling IC chip 60 transmits the change amount of the electrical characteristic measured by the component measuring electrode 20 to the external smart device (200) or a dedicated measuring device.

The power required for the operation of the control IC chip 60 is generated and supplied from the external smart device 200 or the dedicated measuring device through the antenna 50 or from the built-in battery. The controlling IC chip 60 may have a passive type for receiving electric power from an external smart device 200 or a dedicated measuring device and may have an active type with a built-in battery capable of supplying electric power. have.

In order to measure a specific component in the sample using the biosensor device 100, the smart device 200 or the dedicated measuring device should be brought close to the biosensor (the frequency bandwidth is 13.56 MHz in the currently standardized short range wireless communication, It is within 20cm. At this time, the biosensor device recognizes the proximity of the external device using the communication element.

When the external device (the smart device 200 or the dedicated measuring device) approaches the biosensor device 100, the power generator 65 of the controlling IC chip 60 applies the electric power transmitted by such electromagnetic induction to the internal elements Supply.

A sample inlet channel 14a through which the sample can flow is formed at one side of the second plate 14. The material of the second plate 14 may be an insulating material to prevent a short circuit between the reference / sensing electrode (including the working electrode, the reference electrode, the sample recognition electrode) 40 and the communication element 50. The second plate 14 is required to be capable of short-range wireless communication between the communication element 50 formed on the first plate 12 and the external smart device 200, so that the second plate 14 can be used in various frequency bands such as NFC / Lt; / RTI > For example, the material of the second plate 14 may be a pat film, a polyimide film, or the like.

The third plate 16 includes a component reference / sensing electrode 40 (including a working electrode, a reference electrode, a sample recognition electrode) 40, an antenna 50, and a control IC chip (60). An air outlet 16a may be formed at a position corresponding to the sample inlet channel 14a formed in the second plate 14 in the third plate 16. [

As the sample flows through the air outlet 16a formed in the upper plate 16, the air inside the housing is discharged to the outside.

According to the above configuration, in the embodiment of the present invention, the antenna 50, which is a communication element, the reference / sensing electrode 40 (including the working electrode, the reference electrode, the sample recognition electrode), the control IC chip 60, It is possible to provide the biosensor device 100 that can communicate with the external smart device 200 wirelessly.

6 to 15, concrete embodiments of a semiconductor package structure and a packaging method of a biosensor device according to the present invention will be described.

FIGS. 7, 8, 10, 11, and 13 to 15 are views taken along the line A-A 'and B-B' in the biosensor device 100 of FIG.

First Embodiment

6 is a view showing an embodiment of a semiconductor package for a biosensor according to the present invention.

The semiconductor package housing for a biosensor according to an embodiment includes a primary plate 610 having an antenna pattern, an SMT circuit pattern, a reference / sensing electrode pattern (including a working electrode, a reference electrode, and a sample recognition electrode) A secondary plate 620 having a sample guide channel formed therein and a tertiary plate 630 having an air outlet for discharging the air inside the package housing to the outside.

In the semiconductor package housing for a biosensor according to an exemplary embodiment, the pattern of the antenna pattern, the SMT circuit pattern, and the reference / sensing electrode (including the working electrode, the reference electrode, and the sample recognition electrode) may be formed on the same surface.

7 is a view illustrating a packaging method of a semiconductor package structure for a biosensor according to an embodiment.

First, a metal layer 720 is deposited on the base film 710 corresponding to the primary plate.

At this time, the base film 710 serves as a base, and a polyester film (PET, polyethyleneterephthalate), Teflon, etc. having high thermal stability and high mechanical strength can be used.

The metal layer 720 may be formed of any one of gold (Au), silver (Ag), aluminum (Al), and copper (Cu), or may be made of an alloy of nickel plated with copper, A plated alloy, an alloy in which nickel is sequentially plated with gold, and the like can be used.

In order to deposit the metal layer 720 on the base film 710, a metal lamination method including at least one of a sputtering method and a metal lamination method may be used.

Next, the circuit structure for implementing the biosensor device including the communication element is patterned in the metal layer 720 deposited on the base film 710.

At this time, an antenna 721, a surface mounting technology (SMT) circuit 722 for a control IC chip, a reference and sensing electrodes (including a working electrode, a reference electrode, a sample recognition electrode) (reference & sensing electrode) 723, and the like.

In this embodiment, the antenna 721, the SMT circuit 722, and the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 723 may be formed on the same growth layer.

The pattern of the antenna 721 may serve as a communication element (for example, NFC, RFID, etc.) in the biosensor device described above, the control IC chip may be mounted on the pattern of the SMT circuit 722, 723) pattern may include a working electrode, a reference electrode, and a sample recognition electrode. The circuit can be configured to be electrically continuous by bonding the electronic component 730 to the surface of the SMT circuit 722. [

Here, the electronic component 730 may be a passive element such as an active element, a resistor R, an inductor L, an inductor, a capacitor C, In the case of an IC that is bonded onto the surface of the SMT circuit 722, it may be necessary to make it in the form of a tape reel.

Next, after the electronic component 730 is bonded on the surface of the SMT circuit 722, a laminate of a bonding type and a temperature and pressure type to form an inlet through which a sample (for example, blood) A first polymer film 740 corresponding to the secondary plate may be attached in the form of a film or the like.

At this time, the first polymer film 740 is electrically connected to a portion of the region where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 723 are formed and the remaining region excluding the region where the electronic component 730 is bonded And an alignment can be made through an alignment mark on the base.

In particular, the first polymer film 740 with holes may be attached to form insulation with the electrodes. In this case, the hole formation on the first polymer film 740 may be performed by a metal stamping, laser, A drill machining method or the like can be used.

Next, a primary dispensing material 750 may be formed in the area where the electronic component 730 is bonded for the safety of the electronic component 730 attached on the surface of the SMT circuit 722.

As the primary dispensing material 750, a liquid insulating material, particularly a mold compound, an underfill material, or the like, which is a semiconductor protecting material, may be used.

Next, a portion of the region where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 72 is formed to form a sensing material is not attached to the first polymer film 740 A second dispensing material 760 may be formed.

At this time, the secondary dispensing material 760 is an enzyme that reacts with the sample. Since the coating material differs depending on the sensing object of the biosensor, the secondary dispensing material 760 can be applied several times.

Finally, in order to form a passage through which the sample can be detected, a region where the first polymer film 740 is adhered and a region where the first dispensing material 750 is applied include a second polymer film corresponding to the third plate (770) can be attached.

At this time, the second polymer film 770 may be adhered in a laminated form of adhesive type and temperature and press method, and the alignment is possible through the alignment mark of the base.

Similarly, holes may be formed on the second polymer film 770 by inserting the second polymer film 770 with holes, and the holes may be formed by a method such as metal stamping, laser or drilling. have.

The sectional structure in the B-B 'direction in which the reference electrode and the sensing electrode (including the working electrode, the reference electrode, and the sample recognition electrode) 723 are located in the semiconductor package grown by the above process is the same as the lower right diagram shown in FIG.

In this embodiment, separate biosensor units can be formed by sawing or stamping to separate a plurality of biosensors formed on the base film 710. [

Second Embodiment

8 is a view illustrating another packaging method of the semiconductor package for a biosensor according to an embodiment.

The semiconductor package housing for a biosensor according to an embodiment is the same as the structure explained with reference to FIG.

First, a metal layer 820 is deposited on the base film 810 corresponding to the primary plate.

At this time, the base film 810 serves as a base, and an insulating material including at least one of a polyester film (PET), Teflon, and ceramics having high thermal stability and high mechanical strength can be used .

The metal layer 820 may be formed of any one of gold, silver, aluminum, and copper, an alloy of copper plated with nickel, an alloy plated with gold and nickel, an alloy plated with nickel, Tin-plated alloys of copper and the like can be used.

In order to deposit the metal layer 820 on the base film 810, a metal lamination method including at least one of a sputtering method and a metal lamination method may be used.

Next, a circuit structure for implementing the biosensor device including the communication element is patterned in the metal layer 820 deposited on the base film 810. [

At this time, the antenna 821, the SMT circuit 822, the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 823 can be separately formed in the metal layer 820 by circuit patterning have.

Similarly, in this embodiment, the antenna 821, the SMT circuit 822, and the reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 823 are formed in the same growth layer as in the first embodiment .

The pattern of the antenna 821 may serve as a communication element (for example, NFC, RFID, etc.) in the biosensor device described above, the control IC chip may be mounted on the pattern of the SMT circuit 822, The working electrode, reference electrode, specimen recognition electrode) 823 pattern can serve as a component measuring electrode.

Next, the circuit can be configured to electrically connect the electronic components 830 on the surface of the SMT circuit 822.

Here, the electronic component 830 may be a passive element such as an active element, a resistor R, an inductor L, a capacitor C, etc. In the case of an IC bonded on the surface of the SMT circuit 822 It is necessary to make all of them in tape reel form.

Next, after the electronic part 830 is bonded on the surface of the SMT circuit 822, a primary dispensing material 840 is formed in the area where the electronic part 830 is bonded for safety of the electronic part 830 can do.

As the primary dispensing material 840, a liquid insulating material such as a mold protecting material, an underfill material, or the like may be used as a semiconductor protecting material.

Next, after forming the primary dispensing material 840, the first dispensing material 840 is applied to the secondary plate in the form of a laminate of a bonding type and a temperature and a press type in order to form an inlet through which a sample (for example, blood) The corresponding primary polymer film 850 can be attached.

At this time, the first polymer film 850 has a region where the primary dispensing material 840 is applied and a portion of the region where the reference electrode and the sensing electrode (including the working electrode, the reference electrode, and the sample recognition electrode) And can be attached to the remaining area, and the alignment is possible through the alignment mark on the base.

In particular, the first polymer film 850 with holes may be attached to form insulation with the electrodes. In this case, the holes formed on the first polymer film 850 may be formed by a metal mold, a laser drilling method, or a mechanical drilling method A method of machining a hole including at least one can be used.

Next, in the region where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 822 are formed to form the sensing material, a portion of the region where the first polymer film 850 is not attached, A fencing material 860 may be formed.

At this time, the secondary dispensing material 860 is an enzyme that reacts with the sample. Since the coating material differs depending on the sensing object of the biosensor, the secondary dispensing material 860 can be applied several times.

Finally, a secondary polymer film 870 corresponding to the tertiary plate may be attached to the area where the primary polymer film 850 is attached to form a passage through which the sample can be detected.

At this time, the second polymer film 870 may be adhered in a laminated form of an adhesive type and a temperature and pressure method, and the alignment is possible through the alignment mark of the base.

Likewise, a hole-formed secondary polymer film 870 may be attached to form insulation with the electrodes, and the hole formation on the secondary polymer film 870 may be accomplished by at least one of a mold method, a laser drilling method, A hole can be machined.

The sectional structure in the B-B 'direction in which the reference electrode and the sensing electrode (including the working electrode, the reference electrode, and the sample recognition electrode) 823 are located in the semiconductor package grown by the above process is the same as the lower right diagram shown in FIG.

In this embodiment, an individual biosensor unit can be formed by separating a plurality of biosensors formed on the base film 810 by a material or a metal stamp.

Third Embodiment

9 is a view showing another embodiment of a semiconductor package for a biosensor according to the present invention.

The semiconductor package housing for a biosensor according to another embodiment includes a primary plate 910 having an antenna pattern, an SMT circuit pattern, a reference / sensing electrode pattern (including a working electrode, a reference electrode, and a sample recognition electrode) A secondary plate 920 having a sample guide channel formed therein and a tertiary plate 930 having an air outlet for discharging the air inside the package housing to the outside. At this time, the secondary plate 920 and the tertiary plate 930 may be laminated together or stacked together at the same time.

Similarly, in the semiconductor package housing for a biosensor according to another embodiment, an antenna pattern, an SMT circuit pattern, and reference / sensing electrodes (including a working electrode, a reference electrode, and a sample recognition electrode) may be formed on the same surface.

10 is a view showing a packaging method of a semiconductor package structure for a biosensor according to another embodiment.

First, a metal layer 1020 is deposited on the base film 1010 corresponding to the primary plate.

At this time, the base film 1010 serves as a base, and an insulating material including at least one of a polyester film (PET), Teflon, and ceramics having high thermal stability and high mechanical strength can be used .

The metal layer 1020 may be formed of any one of gold, silver, aluminum, and copper, an alloy of copper plated with nickel, an alloy plated with gold and nickel, an alloy plated with nickel, Tin-plated alloys of copper and the like can be used.

In order to deposit the metal layer 1020 on the base film 1010, a metal lamination method including at least one of a sputtering method and a metal lamination method may be used.

Next, a circuit structure for implementing the biosensor device including the communication element is patterned in the metal layer 1020 deposited on the base film 1010. [

At this time, the metal layer 1020 may be formed by patterning the antenna 1021, the SMT circuit 1022, the reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 1023, have.

Similarly, in this embodiment, the antenna 1021, the SMT circuit 1022, and the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1023 are formed in the same manner as in the first to second embodiments Can be formed in the same growth layer.

The pattern of the antenna 1021 may serve as a communication element (for example, NFC, RFID, etc.) in the biosensor device described above, the control IC chip may be mounted on the pattern of the SMT circuit 1022, The pattern 1023 (including the working electrode, the reference electrode, and the sample recognition electrode) can serve as a component measuring electrode.

Next, the circuit may be configured to be electrically connected by bonding the electronic component 1030 on the surface of the SMT circuit 1022.

Here, the electronic component 1030 may be a passive element such as an active element, a resistor R, an inductor L, a capacitor C, etc. In the case of an IC bonded on the surface of the SMT circuit 1022 It is necessary to make all of them in tape reel form.

Next, after the electronic component 1030 is bonded onto the surface of the SMT circuit 1022, a bonding method is employed to form an inlet through which a sample (e.g., blood) The first polymer film 1040 corresponding to the plate can be attached.

At this time, the first polymer film 1040 may be formed of a polymer film 1040, which is formed on a portion of the region where the reference electrode and the sensing electrode (including the working electrode, the reference electrode, and the sample recognition electrode) And the alignment is possible through the alignment mark on the base.

In particular, the first polymer film 1040 with holes may be attached to form insulation with the electrodes. In this case, the hole formation on the first polymer film 1040 may be performed by a method such as metal stamping, laser or drilling Can be used.

Next, a secondary polymer film 1050 corresponding to the tertiary plate may be attached to the region where the primary polymer film 1040 is attached to form a passage through which the sample can be detected.

At this time, the secondary polymer film 1050 can be adhered in a laminated form of adhesive type and temperature and pressure type, and the alignment is possible through the alignment mark of the base.

In the same manner, the second polymer film 1050 formed with holes can be attached to form insulation with the electrodes. The holes formed on the second polymer film 1050 can be formed by a method such as metal stamping, laser or drilling have.

Next, for the sake of safety of the electronic component 1030, the primary dispensing material 1060 may be formed in the area where the electronic component 1030 is bonded.

As the primary dispensing material 1060, a liquid insulating material such as a mold protecting material, an underfill material, or the like may be used as a semiconductor protecting material.

Next, the first polymer film 1040 and the second polymer film 1050 in the region where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 102 are formed to form the sensing material are attached The second dispensing material 1070 can be formed in some of the regions.

At this time, the secondary dispensing material 1070 is an enzyme that reacts with the sample. Since the coating material differs depending on the sensing object of the biosensor, the secondary dispensing material 1070 can be applied several times.

The cross-sectional structure in the B-B 'direction in which the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1023 are located in the semiconductor package grown by the above process is the same as the lower right diagram shown in FIG.

In this embodiment, an individual biosensor unit can be formed by separating a plurality of biosensors formed on the base film 1010 by a material or a metal stamp.

Fourth Embodiment

11 is a view showing another packaging method of a semiconductor package structure for a biosensor according to another embodiment.

The semiconductor package housing for a biosensor according to another embodiment is the same as the structure explained with reference to FIG.

First, a metal layer 1120 is deposited on the base film 1110 corresponding to the primary plate.

At this time, the base film 1110 serves as a base, and an insulating material including at least one of a polyester film (PET), Teflon, and ceramics having high thermal stability and high mechanical strength can be used .

The metal layer 1120 may be formed of any one of gold, silver, aluminum, and copper, an alloy of nickel-plated copper, an alloy of gold and nickel, an alloy of nickel and gold, Tin-plated alloys of copper and the like can be used.

In order to deposit the metal layer 1120 on the base film 1110, a metal deposition method including at least one of a sputtering method and a metal lamination method may be used.

Next, the circuit structure for implementing the biosensor device including the communication element is patterned in the metal layer 1120 deposited on the base film 1110.

At this time, the metal layer 1120 may be formed by patterning the antenna 1121, the SMT circuit 1122, the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) have.

Similarly, in this embodiment, the antenna 1121, the SMT circuit 1122, and the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1123 are formed in the same manner as in the first to third embodiments Can be formed in the same growth layer.

The pattern of the antenna 1121 may serve as a communication element (for example, NFC, RFID, etc.) in the biosensor device described above, the control IC chip may be mounted on the pattern of the SMT circuit 1122, The pattern 1123 (including the working electrode, the reference electrode, and the sample recognition electrode) can serve as a component measuring electrode.

Next, the circuit may be configured to electrically connect the electronic components 1130 to the surface of the SMT circuit 1122.

Here, the electronic component 1130 may be a passive element such as an active element, a resistor R, an inductor L, a capacitor C, or the like. In the case of an IC bonded on the surface of the SMT circuit 1122 It is necessary to make all of them in tape reel form.

Next, after the electronic component 1130 is bonded onto the surface of the SMT circuit 1122, the electronic component 1130 is bonded to the secondary plate in a laminated form of a bonding method and a temperature and pressure method to form an inlet through which a sample (for example, blood) The corresponding primary polymer film 1140 can be attached.

At this time, the first polymer film 1140 is electrically connected to a portion of the region where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1122 are formed and the remaining region excluding the region where the electronic component 1130 is bonded And the alignment is possible through the alignment mark on the base.

In particular, it is possible to form insulation with the electrodes by attaching a hole-formed first polymer film 1140. In this case, the hole formation on the first polymer film 1140 may be performed by a metal mold method, a laser drilling method, A method of machining a hole including at least one can be used.

Next, a primary dispensing material 1150 can be formed in the area where the electronic part 1130 is bonded for the safety of the electronic part 1130 attached on the surface of the SMT circuit 1122.

As the primary dispensing material 1150, a liquid insulating material such as a mold protecting material, an underfill material, or the like may be used as the semiconductor protecting material.

Next, after forming the primary dispensing material 1150, a first polymer film (not shown) is formed in the region where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) The second dispensing material 1160 may be formed in a region where the first dispensing material 1140 is not attached.

At this time, the second dispensing material 1160 reacts with the sample, and the second dispensing material 1160 can be applied several times because the coating material differs depending on the sensing object of the biosensor.

Finally, a secondary polymer film 1170 corresponding to the tertiary plate may be attached to the region to which the primary polymer film 1140 is attached to form a passage through which the sample can be detected.

At this time, the second polymer film 1170 may be adhered in a laminated form of adhesive type and temperature and pressure type, and the alignment is possible through the alignment mark of the base.

Likewise, a hole-formed secondary polymer film 1170 may be attached to form insulation with the electrodes, and hole formation on the secondary polymer film 1170 may be accomplished by at least one of a mold method, a laser drilling method, or a mechanical drilling method A hole can be machined.

The cross-sectional structure in the B-B 'direction in which the reference and sensing electrodes (including working electrode, reference electrode, and sample recognition electrode) 1123 are located in the semiconductor package grown in the above-described process is the same as the lower right diagram shown in FIG.

In this embodiment, an individual biosensor unit may be formed by separating a plurality of biosensors formed on the base film 1110 by a material or a metal stamp.

Fifth Embodiment

12 is a view showing still another embodiment of a semiconductor package for a biosensor according to the present invention.

The semiconductor package housing for a biosensor according to another embodiment includes a primary plate 1210 having an antenna pattern, an SMT circuit pattern, a reference / sensing electrode pattern (including a working electrode, a reference electrode, and a sample recognition electrode) A secondary plate 1220 having a guide channel for guiding the sample, and a tertiary plate 1230 having an air outlet for discharging the air inside the package housing to the outside. The first plate 1210 includes a first plate 1210-1 having an antenna pattern and an SMT circuit pattern and a second plate 1210-1 having patterns of reference / sensing electrodes (including a working electrode, a reference electrode, and a sample recognition electrode) And 1210-2, respectively, so that they can be stacked. In other words, in this embodiment, the pattern of the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) can be formed in the growth layer different from the growth pattern in which the antenna pattern and the SMT circuit pattern are formed.

13 is a view illustrating a packaging method of a semiconductor package structure for a biosensor according to another embodiment.

First, a metal layer 1320 is deposited on the base film 1310 corresponding to the first plate of the primary plate.

At this time, the base film 1310 serves as a base, and a polyester film or Teflon having high thermal stability and high mechanical strength can be used.

The metal layer 1320 may be formed of any one of gold (Au), silver (Ag), aluminum (Al), and copper (Cu), or an alloy of nickel and nickel A plated alloy, an alloy in which nickel is sequentially plated with gold, and the like can be used.

In order to deposit the metal layer 1320 on the base film 1310, a metal lamination method including at least one of a sputtering method and a metal lamination method may be used.

Next, an SMT circuit patterning can be performed on the metal layer 1320 deposited on the base film 1310. At this time, the antenna 1321 and the SMT circuit 1322 can be formed by patterning the circuit.

The antenna 1321 pattern can serve as a communication element (for example, NFC, RFID, etc.) in the biosensor device described above, and the control IC chip can be mounted on the SMT circuit 1322 pattern.

Next, the circuit can be configured to be electrically continuous by bonding the electronic component 1330 to the surface of the SMT circuit 1322.

Here, the electronic component 1330 may be an active element such as an NFC, a sensor SoC, a passive element such as a resistor R, an inductor L, a capacitor C, In the case of an IC to be connected to a tape reel.

Next, an insulating layer 1340 corresponding to the second plate of the primary plate is formed on the front surface of the electronic part 1330 in a state where the electronic part 1330 is bonded so as not to be electrically connected to the antenna 1321 and the SMT- The SMT electronic component 1330 can be buried.

Next, a hole 1350 for connecting a part of the SMT circuit 1322 and the antenna 1321 is formed, and then the hole 1350 is formed on the entire surface of the processed insulating layer 1340 with a metal material A plating layer 1360 which is another metal layer can be formed.

Next, reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 1361 can be formed on the plating layer 1360 through circuit patterning. At this time, the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) pattern 1361 can serve as a component measuring electrode in the above-described biosensor device.

In the first to fourth embodiments described above, the circuit configuration for implementing the biosensor device (antenna, SMT circuit, reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 1361 is formed in a growth layer different from the growth layer in which the antenna 1321 and the SMT circuit 1322 are formed in this embodiment. In this embodiment, however, the reference electrode and the sensing electrode (including the working electrode, the reference electrode, .

Next, after the reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 1361 are formed through circuit patterning, the shape and temperature of the adhesive (e.g., blood) the first polymer film 1370 corresponding to the secondary plate can be attached in a laminated form of a temperature and pressure method.

At this time, the first polymer film 1370 may be attached to the remaining region except for a part of the region where the reference electrode and the sensing electrode (including the working electrode, the reference electrode, and the sample recognition electrode) 1361 are formed, It is possible through the alignment mark of.

In particular, it is possible to form insulation with the electrodes by attaching a hole-formed first polymer film 1370, wherein the hole formation on the first polymer film 1370 is performed by a metal mold, a laser drill, A method of machining a hole including at least one can be used.

Next, a portion of the region where the reference and sensing electrodes (including working electrode, reference electrode, specimen recognition electrode) 1360 are formed to form the sensing material is not attached to a region where the first polymer film 1370 is not attached. (1380) can be formed.

At this time, the dispensing material 1380 reacts with the sample, and the dispensing material is changed depending on the sensing object of the biosensor, so that the dispensing material 1380 can be applied many times.

Finally, a secondary polymer film 1390 corresponding to the tertiary plate can be attached to the region to which the primary polymer film 1370 is attached to form a passage through which the sample can be detected.

At this time, the second polymer film 1390 may be adhered in a laminated form of adhesive type and temperature and press method, and the alignment is possible through the alignment mark of the base.

Likewise, a hole-formed secondary polymer film 1390 may be attached to form insulation with the electrodes, and the hole formation on the secondary polymer film 1390 may be formed by at least one of a mold method, a laser drilling method, A hole can be machined.

The cross-sectional structure in the B-B 'direction in which the reference and sensing electrodes (including the working electrode, reference electrode, and sample recognition electrode) 1361 are located in the semiconductor package grown by the above process is the same as the lower right diagram shown in FIG.

In this embodiment, an individual biosensor unit can be formed by separating a plurality of biosensors formed on the base film 1310 by a material or a metal stamp.

Sixth Embodiment

FIG. 14 is a view showing another packaging method of the semiconductor package structure for a biosensor according to another embodiment.

The semiconductor package housing for a biosensor according to another embodiment is the same as the structure explained with reference to FIG.

First, a metal layer 1420 is deposited on the base film 1410 corresponding to the first plate of the primary plate.

At this time, the base film 1410 serves as a base, and a polyester film or Teflon having high thermal stability and high mechanical strength can be used.

The metal layer 1420 may be formed of any one of gold (Au), silver (Ag), aluminum (Al) and copper (Cu), or may be formed of an alloy in which nickel is plated with copper, A plated alloy, an alloy in which nickel is sequentially plated with gold, and the like can be used.

In order to deposit the metal layer 1420 on the base film 1410, a metal lamination method including at least one of a sputtering method and a metal lamination method may be used.

Next, the metal layer 1420 deposited on the base film 1410 may be subjected to SMT circuit patterning. At this time, the antenna 1421 and the SMT circuit 1422 may be formed by patterning the circuit.

The pattern of the antenna 1421 can serve as a communication element (for example, NFC, RFID, etc.) in the biosensor device described above, and the control IC chip can be mounted in the pattern of the SMT circuit 1422.

Next, the circuit can be configured to electrically connect the electronic components 1430 to the surface of the SMT circuit 1422. [

Here, the electronic component 1430 may be an active element such as an NFC, a sensor SoC, a passive element such as a resistor R, an inductor L, a capacitor C, In the case of an IC to be connected to a tape reel.

Next, an insulating layer 1440 corresponding to the second plate of the primary plate is formed on the front surface of the electronic component 1430 in a state where the electronic component 1430 is bonded so as not to be electrically connected to the antenna 1421 and the SMT- The SMT electronic component 1430 can be buried.

Next, a hole 1450 for connecting a part of the SMT circuit 1422 and the antenna 1421 is formed, and then the hole 1450 is formed on the entire surface of the processed insulating layer 1440 with a metal material A plating layer 1460 which is another metal layer can be formed.

Next, reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 1461 can be formed on the plating layer 1460 through circuit patterning. At this time, the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) pattern 1461 can serve as a component measuring electrode in the above-described biosensor device.

In the first to fourth embodiments described above, the circuit configuration for implementing the biosensor device (antenna, SMT circuit, reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) The reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1461 are formed in a growth layer different from the growth layer in which the antenna 1421 and the SMT circuit 1422 are formed. .

Next, after forming the reference and sensing electrodes (including the working electrode, the reference electrode, the sample recognition electrode) 1461 through circuit patterning, the adhesive form and the temperature and the thickness of the sample to form the inlet through which the sample (e.g., blood) The primary polymer film 1470 corresponding to the secondary plate can be attached in a laminated form of the pressure method.

At this time, the first polymer film 1470 may be attached to the remaining region except for some of the regions where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1461 are formed, It is possible through the alignment mark of.

In particular, the first polymer film 1470 with holes may be attached to form insulation with the electrodes. In this case, the holes formed on the first polymer film 1470 may be formed by a metal method, a laser drilling method, or a mechanical drilling method A method of machining a hole including at least one can be used.

Next, a secondary polymer film 1480 corresponding to the tertiary plate may be attached to the region to which the primary polymer film 1470 is attached to form a passage through which the sample can be detected.

At this time, the secondary polymer film 1480 can be adhered in a laminated form of adhesive and temperature and pressure, and the alignment is possible through the alignment mark of the base.

Likewise, a hole-formed secondary polymer film 1480 may be attached to form insulation with the electrodes, and the hole formation on the secondary polymer film 1480 may be accomplished by at least one of a mold method, a laser drilling method, or a mechanical drilling method A hole can be machined.

Finally, a first polymer film 1470 and a second polymer film 1480 in the region where the reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 1461 are formed are formed to form a sensing material The dispensing material 1490 can be formed in the unattached area.

At this time, the dispensing material 1490 is an enzyme that reacts with the sample, and the dispensing material is changed according to the sensing object of the biosensor, so that the dispensing material 1490 can be applied many times.

The sectional structure in the B-B 'direction in which the reference electrode and the sensing electrode (including the working electrode, the reference electrode, and the sample recognition electrode) 1400 are located in the semiconductor package grown by the above process is the same as the bottom right diagram shown in FIG.

In this embodiment, the individual biosensor unit can be formed by separating a plurality of biosensors formed on the base film 1410 by a material or a metal stamp.

Seventh Embodiment

15 is a view showing another packaging method of the semiconductor package structure for a biosensor according to another embodiment.

The semiconductor package housing for a biosensor according to another embodiment is the same as the structure explained with reference to FIG.

First, a metal layer 1520 is deposited on the base film 1510 corresponding to the first plate of the primary plate.

At this time, the base film 1510 serves as a base, and a polyester film or Teflon having high thermal stability and high mechanical strength can be used.

The metal layer 1520 may be formed of any one of gold (Au), silver (Ag), aluminum (Al), and copper (Cu), or an alloy in which nickel is plated with copper, A plated alloy, an alloy in which nickel is sequentially plated with gold, and the like can be used.

In order to deposit the metal layer 1520 on the base film 1510, a metal lamination method including at least one of a sputtering method and a metal lamination method may be used.

Next, the metal layer 1520 deposited on the base film 1510 may be subjected to SMT circuit patterning. At this time, the antenna 1521 and the SMT circuit 1522 may be formed by patterning the circuit.

The antenna 1521 pattern may serve as a communication element (for example, NFC, RFID, etc.) in the biosensor device described above, and the control IC chip may be mounted in the SMT circuit 1522 pattern.

Next, the circuit may be configured to be electrically connected by bonding the electronic component 1530 to the surface of the SMT circuit 1522.

Here, the electronic component 1530 may be an active element such as an NFC, a sensor SoC, a passive element such as a resistor R, an inductor L, a capacitor C, etc., and may be formed on the surface of the SMT circuit 1522 In the case of an IC to be connected to a tape reel.

Next, an insulating layer 1540 corresponding to the second plate of the primary plate is formed on the front surface of the electronic component 1530 in a state where the electronic component 1530 is joined so as not to be electrically connected to the antenna 1521 and the SMT- The SMT electronic component 1530 can be buried.

Next, a hole 1550 for circuit connection to a part of the SMT circuit 1522 and the antenna 1521 is formed, and then a metal material or a metal material is formed on the entire surface of the insulating layer 1540, A plating layer 1560 which is another metal layer can be formed.

Next, reference and sensing electrodes (including a working electrode, a reference electrode, and a sample recognition electrode) 1561 can be formed on the plating layer 1560 through circuit patterning. At this time, the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) pattern 1561 can serve as a component measuring electrode in the above-described biosensor device.

In the first to fourth embodiments described above, the circuit configuration for implementing the biosensor device (antenna, SMT circuit, reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) The reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1561 are formed in a growth layer different from the growth layer in which the antenna 1521 and the SMT circuit 1522 are formed. .

Next, after the reference and sensing electrodes (including working electrode, reference electrode, sample recognition electrode) 1561 are formed through circuit patterning, reference and sensing electrodes (working electrode, reference electrode, sample The dispensing material 1570 may be formed in a part of the region where the sensing electrode 1561 is formed.

At this time, the dispensing material 1570 is an enzyme that reacts with the sample, and the dispensing material is changed depending on the sensing object of the biosensor, so that the dispensing material 1570 can be applied many times.

Next, after forming the dispensing material 1570, a first polymer film 1580 corresponding to the secondary plate in a laminated form of the adhesive type and the temperature and pressure type is formed to form an inlet through which a sample (for example, blood) .

At this time, the first polymer film 1580 may be attached to the remaining region except for a part of the region where the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1560 are formed, It is possible through the alignment mark of.

In particular, the first polymer film 1580 with the holes may be attached to form insulation with the electrodes. In this case, the holes formed on the first polymer film 1580 may be formed by a metal method, a laser drilling method, A method of machining a hole including at least one can be used.

Finally, a secondary polymer film 1590 corresponding to the tertiary plate may be attached to the area to which the primary polymer film 1580 is attached to form a passage through which the sample can be detected.

At this time, the secondary polymer film 1590 may be adhered in a laminated form of adhesive type and temperature and pressure type, and the alignment is possible through the alignment mark of the base.

Similarly, a hole-formed secondary polymer film 1590 may be attached to form insulation with the electrodes, and the hole formation on the secondary polymer film 1590 may be accomplished by at least one of a mold method, a laser drilling method, or a mechanical drilling method A hole can be machined.

The cross-sectional structure in the B-B 'direction in which the reference and sensing electrodes (including the working electrode, the reference electrode, and the sample recognition electrode) 1561 are located in the semiconductor package grown by the above process is the same as the lower right diagram shown in FIG.

In this embodiment, the individual biosensor unit may be formed by separating or stamping a plurality of biosensors formed on the base film 1510.

The semiconductor package grown by the processes of the first to seventh embodiments described with reference to FIGS. 6 to 15 may be packaged as a single semiconductor chip in a biosensor, a communication element, a control IC chip, or the like.

The method for fabricating a semiconductor package for a biosensor capable of wireless communication according to the present invention can combine two or more operations based on the details described with reference to FIGS. 6 to 15, and the sequence and position of operations can be changed. It may also include shorter operations or additional operations.

As described above, according to the embodiment of the present invention, a biosensor device capable of wirelessly communicating with an external device by packaging a communication element, a control IC chip, and the like into one semiconductor chip can be provided. In addition, according to the embodiment of the present invention, by optimizing the structure of the semiconductor package for a biosensor including the communication element, the cost can be reduced and the function of the biosensor can be maximized.

The apparatus described above may be implemented as a hardware component, a software component, and / or a combination of hardware components and software components. For example, the apparatus and components described in the embodiments may be implemented within a computer system, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA) , A programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to execution of the software. For ease of understanding, the processing apparatus may be described as being used singly, but those skilled in the art will recognize that the processing apparatus may have a plurality of processing elements and / As shown in FIG. For example, the processing unit may comprise a plurality of processors or one processor and one controller. Other processing configurations are also possible, such as a parallel processor.

The software may include a computer program, code, instructions, or a combination of one or more of the foregoing, and may be configured to configure the processing device to operate as desired or to process it collectively or collectively Device can be commanded. The software and / or data may be in the form of any type of machine, component, physical device, virtual equipment, computer storage media, or device , Or may be permanently or temporarily embodied in a transmitted signal wave. The software may be distributed over a networked computer system and stored or executed in a distributed manner. The software and data may be stored on one or more computer readable recording media.

The method according to an embodiment may be implemented in the form of a program command that can be executed through various computer means and recorded in a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions to be recorded on the medium may be those specially designed and configured for the embodiments or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

Claims (16)

delete delete delete delete delete delete A method of manufacturing a semiconductor package for a biosensor,
Stacking a first metal layer on a base;
Forming an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements on the first metal layer;
Stacking a second metal layer on a region where the antenna pattern and the SMT circuit pattern are formed; And
Forming a reference / sensing electrode pattern including a working electrode for measuring a specific component included in the sample introduced into the second metal layer, a reference electrode, and a sample recognition electrode
Lt; / RTI >
Attaching a first polymer film for forming an inlet through which the sample flows into the remaining region except for a part of the region where the reference / sensing electrode pattern is formed;
Applying a dispensing material, which is a sensing material to the sample, to a region of the region where the reference / sensing electrode pattern is formed, to which the first polymer film is not attached; And
Attaching a second polymer film for forming an outlet through which the sample flows to the region where the first polymer film is adhered
The method comprising the steps of: A method of manufacturing a semiconductor package for a biosensor,
Stacking a first metal layer on a base;
Forming an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements on the first metal layer;
Stacking a second metal layer on a region where the antenna pattern and the SMT circuit pattern are formed; And
Forming a reference / sensing electrode pattern including a working electrode for measuring a specific component included in the sample introduced into the second metal layer, a reference electrode, and a sample recognition electrode
Lt; / RTI >
Attaching a first polymer film for forming an inlet through which the sample flows into the remaining region except for a part of the region where the reference / sensing electrode pattern is formed;
Attaching a second polymer film for forming an outlet through which the sample flows to the region where the first polymer film is attached; And
Applying a dispensing material, which is a sensing material for the sample, to a region of the region where the reference / sensing electrode pattern is formed, to which the first polymer film and the second polymer film are not attached,
The method comprising the steps of: A method of manufacturing a semiconductor package for a biosensor,
Stacking a first metal layer on a base;
Forming an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements on the first metal layer;
Stacking a second metal layer on a region where the antenna pattern and the SMT circuit pattern are formed; And
Forming a reference / sensing electrode pattern including a working electrode for measuring a specific component included in the sample introduced into the second metal layer, a reference electrode, and a sample recognition electrode
Lt; / RTI >
Applying a dispensing material as a sensing material to the sample in a region of the region where the reference / sensing electrode pattern is formed; And
Attaching a first polymer film for forming an inlet through which the sample flows into a region other than the partial region of the region where the reference / sensing electrode pattern is formed; And
Attaching a second polymer film for forming an outlet through which the sample flows to the region where the first polymer film is adhered
The method comprising the steps of: 10. The method according to any one of claims 7 to 9,
The primary polymer film and the secondary polymer film are adhered in a laminated form of adhesive type and temperature and pressure type
Wherein the step of forming the semiconductor package comprises the steps of: 10. The method according to any one of claims 7 to 9,
Wherein the first polymer film and the second polymer film are formed by forming a hole using a method capable of processing a hole including at least one of a mold method, a laser drilling method, and a mechanical drilling method to serve as an insulator
Wherein the step of forming the semiconductor package comprises the steps of: 10. The method according to any one of claims 7 to 9,
The dispensing material may be a biosensing material that reacts with the sample
A method for manufacturing a semiconductor package for a biosensor delete delete A semiconductor package for a biosensor,
Base;
A first metal layer laminated on the base, wherein an antenna pattern corresponding to a communication element and an SMT circuit pattern for mounting a plurality of electronic circuit elements are formed on the first metal layer; And
A second metal layer laminated on the area where the antenna pattern and the SMT circuit pattern are formed; and a working electrode, a reference electrode, and a sample recognition electrode for measuring a specific component included in the introduced sample, Reference / sensing electrode pattern formed -
/ RTI >
A first polymer film adhered to a region other than a part of the region where the reference / sensing electrode pattern is formed to form an inlet through which the sample is introduced;
A dispensing material which is applied to a part of the area where the reference / sensing electrode pattern is formed as a sensing material for the sample; And
A second polymer film adhered to the area to which the primary polymer film is adhered to form an outlet through which the sample flows out
Wherein the semiconductor package further comprises: delete

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