KR101552196B1 - METHOD OF MANUFACTURING PCB capable of mounting a light emitting device - Google Patents

Abstract

The present invention relates to a method for manufacturing a PCB. The method for manufacturing the PCB mounting the light emitting device includes the steps of: preparing a metal layer of a circuit region corresponding to a circuit pattern and a metal layer of mounting region corresponding to a mounting pattern on which the light emitting device is arranged and is not electrically connected to the circuit pattern, on a base substrate; planarizing the metal layer of the mounting region; forming a first protection pattern on the planarized metal layer of the mounting region; processing the surface of the metal layer of the circuit region to have a surface roughness; and forming an insulation layer corresponding to the metal layer of the mounting region and at least part of the metal layer of the circuit region or forming a plating pattern on at least part of the metal layer of the circuit region. The metal layer of the circuit region and the metal layer of the mounting region are formed with integrated metal films or separated metal films.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a printed circuit board capable of mounting a light emitting device,

The present invention relates to a method of manufacturing a printed circuit board. And more particularly, to a method of manufacturing a printed circuit board on which a light emitting device capable of improving light reflection efficiency can be mounted.

In general, a light emitting device such as an LED or a laser diode (LD) is mounted on a printed circuit board (PCB) and used in electronic devices and automobiles. A plurality of elements are mounted on a substrate in order to use the light emitting element for illumination. That is, a plurality of light emitting devices may be arranged in series, parallel, or series-parallel to increase the light efficiency.

1 is a schematic view showing a configuration in which a light emitting device is mounted on a printed circuit board manufactured according to a conventional method of manufacturing a printed circuit board.

The printed circuit board includes a wiring 14 disposed in a circuit region A on a base metal film 10 insulated with a base insulating film 12 and a wiring 14 electrically connected to the light emitting element 24 through a wire 26 A circuit pattern composed of a pad 16 and a via or the like, a pad 16 and a plating pattern 18 formed on the via, a layout region B1 in which the light emitting element 24 is disposed, A pad 16 which is at least a part of the circuit pattern and an insulating layer 22 which has an opening corresponding to the via and the mounting pattern 20; And a light emitting element 24 mounted on the mounting region B1 of the mounting pattern 24. [

The entire metal film before patterning for the formation of the circuit pattern and the mounting pattern 20 is formed in order to improve the adhesion between the circuit pattern and the insulating layer 22 until the light emitting element 24 is mounted, Alternatively, surface pretreatment such as soft etching is performed so that the pad 16, the via, and the mounting pattern 20 of the circuit pattern exposed by the insulating layer 22 have a surface roughness, that is, a rough surface.

As a result, the adhesion with the circuit pattern is improved. However, the surface pretreatment is performed on the unintended portion, that is, the mounting pattern 20, so that the reflection region of the mounting pattern 20 can have a roughness of at most several tens of micrometers or more. When the light emitting element 24 is mounted on the mounting pattern 20, the light of the light emitting element 24 reflected through the reflective region B2 is caused to be diffusedly reflected, ) Is remarkably reduced. In order to increase the light efficiency, it is necessary to mount more light emitting elements 24 in the mounting pattern 20, so that the number of components, power consumption, and the like are increased, and there are restrictions on realizing a light emitting module with low power and high integration.

According to an aspect of the present invention, there is provided a light emitting device, including: a light emitting device having a light emitting element and a light emitting element, And a method of manufacturing a circuit board.

The objects of the present invention are not limited to those mentioned above, and other objects not mentioned may be clearly understood by those skilled in the art from the following description.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board on which a light emitting device can be mounted, the method including: planarizing at least a part of a metal film formed on a base substrate; patterning the planarized metal film, Forming a mounting pattern including an arrangement region and a reflection region of the light emitting device that are not electrically connected to the circuit pattern; forming a first protection pattern on the mounting pattern; Surface treating the circuit pattern so as to have surface roughness and forming an insulating layer having an opening corresponding to at least a part of the circuit pattern and the mounting pattern.

The metal film may be formed of a copper film, and at least a part of the metal film may be planarized using at least one of mechanical polishing, chemical polishing and electrolytic polishing, and the flattened metal film may be formed to have an average roughness of 1 μm or less .

In addition, the first protective pattern may be formed of a liquid that can be cured in a liquid state while having separation selectivity with respect to the insulating layer in a predetermined removing liquid, or may be formed of a physically detachable film.

In the case where the ink of the first protective pattern capable of being cured in a liquid phase with the peeling selectivity is formed of any one of ultraviolet curable ink, thermosetting ink, and photo solder resist (PSR), and the insulating layer is formed of a PSR insulating film Wherein the step of forming the insulating layer includes the steps of: forming a PSR insulating film on the base substrate, the PSR insulating film having at least a part of the circuit pattern and an opening corresponding to the mounting pattern; A step of peeling off using a peeling liquid of the opening, and a step of curing the insulating film having the opening to form the insulating layer.

The step of forming the insulating layer may include forming an insulating film having at least a part of the circuit pattern and an opening corresponding to the mounting pattern, removing the first protective pattern on the mounting pattern, Forming a second protective pattern in which a rubber ink having corrosion resistance is cured on the plating liquid on the mounting pattern after the step of forming the insulating layer; A step of surface-treating the exposed circuit pattern so that the circuit pattern exposed by the opening has a surface roughness, forming a plating pattern on the surface-treated circuit pattern, and removing the second protective pattern The method comprising the steps of:

Further, the plating pattern may be plated with a metal containing at least gold.

After the step of forming the insulating layer, a reflection pattern containing at least one of silver, aluminum, chromium, nickel, and titanium, and a reflection maintaining pattern formed of a metal oxide film or a metal nitride film are sequentially formed on the mounting pattern Step < / RTI >

Further, before the step of planarizing at least a part of the metal film, the step of surface-treating the metal film may be further included.

In addition, the step of surface-treating the circuit pattern may use any one of soft etching using hydrogen peroxide and sulfuric acid, jet scrubbing, brushing, and sandblasting.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board on which a light emitting device is mountable, the method comprising: forming a metal layer on a circuit region corresponding to a circuit pattern and electrically connected to the circuit pattern, The method comprising the steps of: providing a metal layer in a mounting area corresponding to a mounting pattern in which the device is to be placed; flattening a metal layer in the mounting area; forming a first protective pattern on the metal layer in the flattened mounting area; Surface-treating the metal layer of the circuit region so that the metal layer of the circuit region has surface roughness and forming an insulating layer having an opening corresponding to at least a part of the metal layer of the circuit region and the metal layer of the mounting region , Or forming a plating pattern on at least a part of the metal layer of the circuit region , A metal layer of the metal layer and the mounting area of the circuit region is formed integrally with the metal film or a separate metal film.

According to the method for manufacturing a printed circuit board according to the embodiment of the present invention, the mounting pattern or the mounting region including the mounting region or the mounting region, that is, the reflection region where the light of the light emitting element is reflected is flattened, The light reflection efficiency of the light emitting device through the reflection area is significantly improved by performing the surface treatment so as to have a rough surface with respect to the circuit pattern or circuit area where the insulating layer or the plating pattern is formed on the upper part after the first protection pattern is formed At the same time, the adhesion between the insulating layer, the plating pattern and the circuit pattern can be increased.

When the insulating layer is formed of a PSR insulating film, the first protective pattern that is cured in a liquid phase while being peeled off with a predetermined removing liquid before the insulating layer is cured is removed so that the first protection with the curing temperature of the insulating layer, The pattern is not remained, the mounting pattern is formed as a good surface, and further, it does not act as a failure in a subsequent process such as formation of a plating pattern.

In addition, before the surface treatment of the rough surface of the circuit pattern to form the plating pattern, a second protective pattern in which the rubber ink having corrosion resistance is hardened is formed in the plating liquid, It is possible to overcome the fact that the mounting pattern is not protected and to protect the flattened mounting pattern by the initial level planarization process.

  Since the plating pattern is formed of gold and the reflection pattern on the mounting pattern is formed of a metal having excellent reflectance different from that of the plating pattern, the conductivity of the plating pattern and the light reflection efficiency of the mounting pattern can be increased at the same time, It is possible to prevent discoloration due to oxidation or sulphation of the reflection pattern.

The effects of the present invention are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a schematic view showing a configuration in which a light emitting device is mounted on a printed circuit board manufactured according to a conventional method of manufacturing a printed circuit board.
2 is a flowchart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.
3A to 3M are a plan view and a cross-sectional view illustrating a manufacturing process of a method of manufacturing a printed circuit board according to an embodiment of the present invention.
4 is a flowchart illustrating a method of manufacturing a printed circuit board according to another embodiment of the present invention.
5A to 5C are cross-sectional views illustrating a manufacturing process of a method of manufacturing a printed circuit board according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention. The terms described below are defined in consideration of the structure, role and function of the present invention, and may be changed according to the intention of the user, the operator, or the custom.

The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art to which the present invention pertains, It is only defined by the scope of the claims. Therefore, the definition should be based on the contents throughout this specification.

Throughout the specification, when an element is referred to as being "comprising" or "comprising" an element, it is understood that the element may include other elements, not the exclusion of any other element .

(Example 1)

Hereinafter, a method of manufacturing a printed circuit board on which a light emitting device can be mounted according to an embodiment of the present invention will be described in detail with reference to FIGS. 2 to 3m.

FIG. 2 is a flowchart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention, and FIGS. 3A to 3M are a plan view and a cross-sectional view illustrating a manufacturing process of a method of manufacturing a printed circuit board according to an embodiment of the present invention .

2 and 3A, a surface treatment 101 is performed on a surface of a metal film 114 formed on a base substrate having a base metal film 110 insulated with a base insulating film 112 (S205 ).

When a printed circuit board for mounting the light emitting device 136 is formed, the base substrate can be cut by a cutting process in units of modules. Although FIG. 3A shows the entirety of the base substrate, FIG. 3B shows a base substrate corresponding to one light emitting module unit for the sake of simplification. The base metal film 110 may be made of a metal having high thermal conductivity such that heat generated in the base substrate or on the surface thereof is easily discharged to the outside. For example, aluminum or copper made of a metal plate may be used. Various materials may be used, and alloys of various metals may be used. Such a metal sheet can be usually manufactured by a rolling process. The base insulating film 112 may be formed of an insulating film of epoxy or phenol resin type. In addition, the metal film 114 may be formed of a material having high electrical conductivity, such as a copper film. In this embodiment, the base substrate exemplifies a substrate for a heat-dissipating PCB, but the base substrate may be a general PCB substrate having only a base insulating film of an epoxy-based base insulating film and a metal film formed on only one side of the base insulating film, Side PCB in which a metal film is formed on both surfaces of the base insulating film.

The surface treatment 101 removes the oxide film and impurities present on the surface of the metal film 114 so that the metal film 114 has a surface roughness of, for example, an average roughness degree of roughness of several tens of micrometers . ≪ / RTI > The surface treatment 101 may use any one of soft etching using a hydrogen peroxide and sulfuric acid, jet scrubbing, brushing, and sand blasting.

In this embodiment, the step S205 of performing the surface treatment 101 on the surface of the metal film 114 formed on the base substrate is illustrated, but depending on the surface condition of the metal film 114, S205) may be omitted.

Referring to FIGS. 2 and 3B, the planarization process 102 is performed on the surface of the metal film 114 (S210).

The planarization process 102 is performed to planarize the metal film 114 in the mounting region B, and at least one of mechanical polishing, chemical polishing, and electrolytic polishing may be used. In order to substantially increase the light reflection efficiency of the light emitting element 136 in the mounting region B, it is preferable that the metal film 114 is planarized to have an average roughness of 1 m or less. Although the front surface of the metal film 114 disposed on the base substrate is planarized in the present embodiment for the sake of convenience of the process, a part of the metal film 114, for example, the metal film 114 corresponding to the mounting region B 114 or the metal film 114 corresponding to the reflection region B2 which is a region where light in the mounting region B is reflected may be selectively planarized.

2 and 3C, the planarized metal film 114 is patterned to form a circuit pattern including the pad 118, the wiring 116, the via, and the arrangement area B1 of the light emitting element 136. [ A mounting pattern 120 including a reflective region B2 in which light is reflected by the mounting pattern 120 and a first protective pattern 122 are formed on the mounting pattern 120 in operation S220.

The patterning of the planarized metal film 114 proceeds to an application step, an exposure step, a development step, an etching step, a peeling step, and the like to form a circuit pattern on the metal film 114 in the printed circuit board.

The patterning process will be described in more detail. A PSR (Photo Solder Resist) film that can be removed with a peeling solution such as sodium hydroxide or potassium hydroxide is coated on the planarized metal film 114 and cured to form a circuit region A and a mounting region B to form a pattern of the PSR film remaining on the circuit region A and the mounting region B to form a pattern of the PSR film remaining on the circuit region A and the mounting region B by developing the PSR film with the above- The planarized metal film 114 is etched using the pattern of the PSR film to form the circuit pattern and the mounting pattern 120. [ In the case of performing the patterning process using the PSR film, since the PSR film adheres well to the flattened metal film 114, the surface roughness for strengthening the adhesion between the metal film 114 and the PSR film is given to the metal film 114 No surface treatment is required.

The first protective pattern 122 may be formed of a liquid curable ink having a peeling selectivity for the insulating layer 126 to be formed in the subsequent step in a peeling liquid such as sodium hydroxide or potassium hydroxide , ≪ / RTI > or a physically removable film.

Specifically, the ink of the first protective pattern 122 which can be cured in the liquid phase while having peeling selectivity may be formed of any one of ultraviolet curable ink, thermosetting ink, and PSR.

In the case where the first protective pattern 122 is formed of an ultraviolet curable ink or a thermosetting ink, a process of forming the first protective pattern 122 is performed by disposing a screen exposing the mounting pattern 120 on the base substrate, A hardening ink is coated on the mounting pattern 120 exposed by the adhesive layer 120 and cured with ultraviolet rays or infrared rays to remove the screen. The curing in the ultraviolet curable ink can use an ultraviolet lamp, and the curing in the heat curable ink can be carried out by heating to a temperature of 100 to 150 degrees.

 In another embodiment, when the ink formed on the first protective pattern 122 is formed of a PSR (Photo Solder Resist) having peeling selectivity with respect to the insulating layer 126 to be formed subsequently in the peeling liquid, The process of forming the pattern 122 is such that the PSR having the peeling selectivity is applied on the base substrate, the PSR having the peeling selectivity is exposed using a mask having an opening corresponding to the mounting pattern 120, The PSR may be developed to form the first protective pattern 122 formed by the PSR on the mounting pattern 120. [

In this embodiment, the first protection pattern 122 is formed after the circuit pattern and the mounting pattern 120 are formed. However, after the planarization process for the metal film 114 is performed before the formation of the pattern, The first protective pattern 122 may be formed on the metal film 114 corresponding to the mounting region B. [

Referring to FIG. 2 and FIG. 3D, a circuit pattern having the pad 118, the wiring 116, and the via has a surface roughness. In addition to the surface roughness of the circuit pattern, (Step S225).

The surface treatment 103 may use any one of soft etching using a hydrogen peroxide and sulfuric acid, jet scrubbing, brushing, and sand blasting, so as to have an average roughness of several tens of micrometers. .

Since the mounting pattern 120 is protected by the first protective pattern 122 in the surface treatment of the circuit pattern, the mounting pattern 120 maintains the average roughness of 1 占 퐉 or less formed by the planarizing treatment, It does not.

2 and 3E, an insulating film 124 having at least a portion of a circuit pattern, for example, a pad 118 and an opening corresponding to the via and the mounting pattern 120 is formed (S230).

The insulating film 124 may be formed of a PSR insulating film. The insulating film 124 having an opening may be formed by a conventional method such as a coating process, an exposure process, and a developing process, The detailed description thereof will be omitted.

When the first protective pattern 122 is formed of a liquid curable ink such as ultraviolet ray or thermosetting ink or PSR, the insulating film 124 having an opening is used for peeling off the first protective pattern 122 Or a PSR having a peeling-preventing property that is not peeled off against a peeling liquid such as sodium hydroxide or potassium hydroxide.

The insulating film 124 having an opening is formed so as to cover the wiring 116 of the circuit pattern so that the insulating film 124 can be formed with a high adhesion force on the wiring 116 due to the rough surface on the wiring 116 have.

2 and 3F, the first protective pattern 122 on the mounting pattern 120 is removed (S235), and then the hardening process 104 is performed on the insulating film 124 having the opening to form the same shape The insulating layer 126 is formed (S240).

When the first protective pattern 122 is formed of cured ink, the first protective pattern 122 is removed using a peeling liquid such as sodium hydroxide or potassium hydroxide, and the first protective pattern 122 is removed If formed, the first protective pattern 122 may be physically removed.

Then, the insulating film 124 having the openings is formed into the insulating layer 126 by performing the curing treatment 104 at a temperature of 100 to 150 degrees. The peeling off of the first protective pattern 122 before the curing process 104 of the insulating film 124 is more effective when the first protective pattern 122 is formed of a liquid that can be cured. Since the first protective pattern 122 formed of ink is fixed or changed in physical properties at the curing temperature of the insulating film 124, it is preferable that the first protective pattern 122 is removed after the curing treatment 104 of the insulating film 124 It can remain unremoved and can act as a cause of defects in subsequent processes. Further, since the first protective pattern 122 formed of ink can be corroded against the plating liquid used for forming the plating pattern, which is a subsequent process, there is a limitation in protecting the surface of the mounting pattern 120. [ For this reason, it is preferable that the first protective pattern 122 formed of the ink is peeled off before the curing treatment 104 of the insulating film 124. [

Referring to FIGS. 2 and 3G, the plating solution used in forming the plating pattern 130 as a subsequent process on the circuit pattern exposed by the opening of the insulating layer 126 is subjected to curing A second protective pattern 128 is formed (S245).

The second protective pattern 128 is formed by disposing a stencil mask for exposing the mounting pattern 120 on the base substrate and forming a plating solution on the mounting pattern 120 exposed by the stencil mask, And the second protective pattern 128 is formed by dry-curing, and the stencil mask may be removed. The second protective pattern 128 has a pattern accuracy lower than that of the first protective pattern 122 formed of ink but has sufficient strength as a protective film for protecting the mounting pattern 120 in the subsequent surface treatment 105, , And can be manufactured in a relatively simple manner.

Referring to FIGS. 2 and 3H, the pad 118 of the circuit pattern exposed by the insulating layer 126, the non-eye surface roughness, and the oxide film and impurities on the surface of the circuit pattern generated during the above- A surface pattern processing 105 is performed on the circuit pattern (S250).

The surface treatment 105 may use any one of soft etching using a hydrogen peroxide and sulfuric acid, jet scrubbing, brushing, and sand blasting, so as to have an average roughness of several tens of microns .

The mounting pattern 120 is protected by the second protection pattern 128 in the surface treatment of the circuit pattern so that the mounting pattern 120 maintains the average roughness of 1 占 퐉 or less formed by the planarizing treatment So that the flat surface is not damaged.

2 and 3I, a plating process is performed on the pads 118 of the surface-treated circuit patterns and vias to form a plating pattern 130 (S255).

The plating pattern 130 may be formed of a metal containing gold. In the case where the plating pattern 130 is made of nickel (Ni), palladium (Pd) and gold (Au), the plating process is carried out to improve the affinity between the pad 118 and the copper of the via, Electroless palladium (Pd) plating is performed on the nickel plated layer to improve the adhesion of the wire 138 and the adhesion of the plating pattern 130 by performing plating of a nickel layer of 5 to 8 탆 thick by performing a nickel plating A palladium plating layer having a thickness of 0.15 mu m is formed, and gold plating is performed, so that gold having a thickness of 0.05 m or more and having excellent electrical conductivity can be plated.

In forming the circuit pattern pads 118 and the plating pattern 130 in the vias the plating pattern 130 is adhered to the pad 118 and the via with high adhesion due to the pad 118 and the rough surface on the via .

2, 3J, and 3K, the second protection pattern 128 on the mounting pattern 120 is physically removed (S260), and the reflection pattern 132 and the reflection holding pattern 132 are formed on the mounting pattern 120 (134) are sequentially formed (S265).

The reflection pattern 132 may be formed to contain at least one of silver, aluminum, chromium, nickel, and titanium to further increase the light reflection efficiency of the reflection region B2 of the mounting pattern 120. [ The reflection pattern 132 may be formed by a coating technique such as plating or thin film growth.

The reflection maintaining pattern 134 may be formed of a metal oxide film or a metal nitride film of a transparent material in order to prevent the reflection pattern 132 from reacting with oxygen and sulfur in the atmosphere and being discolored by high temperature, . For example, the reflection maintaining pattern 134 may be formed of any one of an aluminum oxide film, a silicon nitride film, a titanium oxide film, an aluminum nitride film, and a silicon oxide film, and may be formed by a sol-gel coating or a thin film process.

In this embodiment, the plating pattern 130 and the reflection pattern 132 are formed of materials different from each other. However, in the case where both patterns are formed of the same material, before the formation of the plating pattern 130 (S255) 2 protection pattern 128 may be removed and formation of the plating pattern 130 (S255) and formation of the reflection pattern 132 may proceed at the same time.

Since the plating pattern 130 and the reflection pattern 132 are formed of a metal containing gold and a metal having a different reflectance from the plating pattern as in the present embodiment, the conductivity of the plating pattern 130 and the pattern The reflection pattern 132 can be prevented from being discolored by the high temperature, high humidity, oxidation, or sulfuration, thereby further improving the light reflection efficiency of the reflection pattern 132. Further, Can be maintained.

2 and 3m, the base substrate is cut to separate into the light emitting module units, and the light emitting device 136 is disposed in the placement region B1 of the mounting pattern 120, 118 (S270). The light emitting element 136 may be an LED or a laser diode (LD).

When the light emitting device 136 is mounted on the printed circuit board manufactured according to the present embodiment, the light reflection efficiency of the light emitting device 136 through the reflective region B2 is remarkably improved, and the insulating layer 126, The adhesion between the pattern 130 and the circuit pattern can be increased.

Specifically, since the average roughness of the mounting pattern 120 of the conventional printed circuit board according to FIG. 1 reaches several tens of micrometers, it is possible to prevent the mounting pattern 120 of the conventional printed circuit board shown in FIG. 1 from passing through the reflection region B2 of the light emitting element 136 under a temperature of 85 degrees and humidity of 85% The light reflectance through the reflective region B2 is increased to about 95% because the average lightness of the mounting pattern 120 of the printed circuit board according to FIG. Accordingly, the number of the light emitting elements 136 to be mounted on the light emitting module can be reduced, and the power consumption and integration can be contributed.

(Example 2)

Hereinafter, a method of manufacturing a printed circuit board on which a light emitting device can be mounted according to another embodiment of the present invention will be described with reference to FIGS. 4 to 5C. In the following, the same reference numerals as those of the first embodiment are used for the same configurations as those of the first embodiment, and the same configurations and processes as those of the first embodiment are omitted, and the steps having differences are mainly described.

Referring to FIG. 4, surface treatment is performed on the surface of a metal film formed on a base substrate having a base metal film 110 insulated with a base insulating film 112, as in S205 of FIG. 2 of Embodiment 1 S405).

Referring to Figs. 4 and 5A, similar to S215 of Fig. 2 of Embodiment 1, a circuit pattern including the pad 118, the wiring 116, the via, and the arrangement region B1 of the light emitting element 136 An assembly pattern 120 including a reflection region B2 in which light is reflected is formed (S410).

Referring to FIGS. 4 and 5B, the planarization process 106 is selectively performed on the surface of the mounting pattern 120 (S415).

The planarization process 106 may use at least one of mechanical polishing, chemical polishing, and electrolytic polishing. In order to substantially increase the light reflection efficiency of the light emitting element 136 in the mounting region B, it is preferable that the metal film 114 is planarized to have an average roughness of 1 m or less.

Although the selective planarization process is described in the above embodiments, the planarization process may be performed over the entire surface of the mounting pattern 120 and the circuit pattern.

Next, referring to FIGS. 4 and 5C, a first protective pattern 122 is formed on the mounting pattern 120, similarly to S220 of FIG. 2 of the first embodiment (S420). Subsequently, the subsequent process may proceed in the same manner as the subsequent process of S220 of FIG. 2 of the first embodiment.

(Example 3)

The pad 118 exposed by the opening of the insulating layer 126, the surface treatment 105 for the via, the pad 118 exposed by the opening of the insulating layer 126, and the pad 118 exposed by the opening of the insulating layer 126, in order to increase the adhesion between the plating pattern 130 and the pad 118 of the circuit pattern, The surface treatment 105 may be omitted. In this case, formation (S245) and removal (S260) of the second protective pattern 128 are also omitted.

(Example 4)

In the first embodiment, the patterning process using the PSR film is used to form the circuit pattern and the mounting pattern 120, but a dry photo resist may be used instead of the PSR film in the patterning process. Unlike the PSR film, the dry photoresist is not well adhered to the planarized metal film 114, and in order to increase the adhesion, the metal film 114 is preferably surface-treated to have surface roughness.

According to this, the third protection pattern can be formed on the mounting region B among the metal films 114 flattened by the planarization step 102 of S210 in Fig. Like the first protective pattern 122, the third protective pattern may be formed of any one of an ultraviolet curable ink, a thermosetting ink, and a PSR which can be removed by a peeling liquid such as sodium hydroxide or potassium hydroxide and cured in a liquid phase. The third protection pattern on the metal film 114 of the mounting area B is formed substantially the same as the formation process of the first protection pattern.

Next, the surface treatment for the metal film 114 is performed so that the flattened metal film 114 excluding the third protective pattern has a surface roughness. The surface treatment may be performed using any one of soft etching, jet scrubbing, brushing, and sand blasting using hydrogen peroxide and sulfuric acid, and is performed so as to have an average roughness of several tens of μm.

 Next, a pattern of a dry photoresist having openings exposing the circuit region A and the mounting region B is formed on the metal film 114 having a surface roughness except for the mounting region (B). The pattern of the dry photoresist is formed in substantially the same process as the pattern of the PSR film mentioned in Embodiment 1 and the dry film of the photoresist is formed on the surface of the metal film 114 Can be adhered well.

Subsequently, the pattern of the dry photoresist is used as a mask to etch the metal film 114 to form a circuit pattern of the pad 118, the wiring 116, vias, etc., and the mounting pattern 120, The pattern of the dry photoresist and the third protective pattern are removed at the same time using a removing solution such as potassium hydroxide. The subsequent process can be carried out in the same manner as the process subsequent to S215 in Fig.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

110: base metal film 112: base insulating film
116: wiring 118: pad
120: mounting pattern 122: first protection pattern
124: insulation layer 126: second protection pattern
128: plating pattern 130: reflection pattern
132: reflection holding pattern 134: light emitting element

Claims (10)

A method of manufacturing a printed circuit board on which a light emitting element can be mounted,
Planarizing at least a portion of the metal film formed on the base substrate;
Patterning the planarized metal film to form a mounting pattern that is not electrically connected to the circuit pattern and the circuit pattern, and includes an arrangement region and a reflection region of the light emitting device;
Forming a first protective pattern on the mounting pattern;
Surface-treating the circuit pattern so that the circuit pattern has surface roughness; And
And forming an insulating layer having at least a part of the circuit pattern and an opening corresponding to the mounting pattern. The method according to claim 1,
Wherein the metal film is formed of a copper film and at least one of mechanical polishing, chemical polishing, and electrolytic polishing is used to planarize at least a part of the metal film, and the flattened metal film is formed to have an average roughness A method of manufacturing a circuit board. The method according to claim 1,
Wherein the first protective pattern is formed of a liquid that can be cured in a liquid state while having separation selectivity with respect to the insulating layer in a predetermined removing solution, or is formed of a physically detachable film. The method of claim 3,
In the case where the ink of the first protective pattern capable of being cured in a liquid phase with the peeling selectivity is formed of any one of an ultraviolet curable ink, a thermosetting ink and a photo solder resist (PSR), and the insulating layer is formed of a PSR insulating film, The step of forming the insulating layer includes:
Forming a PSR insulating film on the base substrate, the PSR insulating film having at least a part of the circuit pattern and an opening corresponding to the mounting pattern;
Peeling the first protective pattern on the mounting pattern using a predetermined removing liquid; And
And curing the insulating film having the opening to form the insulating layer. The method according to claim 1,
Wherein the step of forming the insulating layer includes the steps of forming an insulating film having at least a part of the circuit pattern and an opening corresponding to the mounting pattern, removing the first protective pattern on the mounting pattern, And curing the insulating film to form the insulating layer,
After forming the insulating layer,
Forming a second protective pattern on the mounting pattern by curing the rubber ink having corrosion resistance to the plating liquid;
Surface treating the exposed circuit pattern so that the circuit pattern exposed by the opening has a surface roughness;
Forming a plating pattern on the surface-treated circuit pattern; And
And removing the second protective pattern. ≪ Desc / Clms Page number 20 > 6. The method of claim 5,
Wherein the plating pattern is plated with a metal containing at least gold. The method according to claim 1,
Sequentially forming a reflective pattern containing at least one of silver, aluminum, chromium, nickel, and titanium on the mounting pattern, and a reflective holding pattern formed of a metal oxide film or a metal nitride film on the mounting pattern, ≪ / RTI > The method according to claim 1,
Further comprising the step of surface-treating the metal film before the step of planarizing at least a part of the metal film. The method according to claim 1,
Wherein the step of surface-treating the circuit pattern uses any one of soft etching using hydrogen peroxide and sulfuric acid, jet scrubbing, brushing, and sand blasting. A method of manufacturing a printed circuit board on which a light emitting element can be mounted,
Providing a metal layer of a circuit region corresponding to a circuit pattern on a base substrate and a metal layer of a mounting region which is not electrically connected to the circuit pattern and corresponds to a mounting pattern in which the light emitting element is to be arranged;
Planarizing a metal layer in the mounting area;
Forming a first protective pattern on a metal layer of the planarized mounting area;
Surface-treating the metal layer of the circuit region so that the metal layer of the circuit region has surface roughness; And
Forming an insulating layer having an opening corresponding to at least a part of the metal layer of the circuit region and the metal layer of the mounting region or forming a plating pattern on at least a part of the metal layer of the circuit region,
Wherein the metal layer of the circuit region and the metal layer of the mounting region are formed of an integral metal film or a separate metal film.

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