KR101546585B1 - Method of forming electrode for dye sensitive solar cell using surface pattering - Google Patents

Method of forming electrode for dye sensitive solar cell using surface pattering Download PDF

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KR101546585B1
KR101546585B1 KR1020130131111A KR20130131111A KR101546585B1 KR 101546585 B1 KR101546585 B1 KR 101546585B1 KR 1020130131111 A KR1020130131111 A KR 1020130131111A KR 20130131111 A KR20130131111 A KR 20130131111A KR 101546585 B1 KR101546585 B1 KR 101546585B1
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substrate
metal substrate
corrosion
dye
coating layer
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KR1020130131111A
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KR20150049922A (en
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강정현
이재호
전유택
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현대제철 주식회사
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/542—Dye sensitized solar cells

Abstract

A method of forming an electrode for a dye-sensitized solar cell using surface patterning is disclosed.
According to another aspect of the present invention, there is provided a method of forming an electrode for a dye-sensitized solar cell, comprising: patterning a surface of a metal substrate to increase surface roughness of the metal substrate; Forming a corrosion resistant coating layer on the patterned metal substrate; And forming a semiconductor electrode on the corrosion-resistant coating layer, wherein the surface roughness of the metal substrate surface is maintained even after the corrosion-resistant coating layer is formed, so that the contact area between the semiconductor electrode and the corrosion- .

Description

TECHNICAL FIELD [0001] The present invention relates to a method for forming a dye-sensitized solar cell using surface patterning,

More particularly, the present invention relates to a method of forming an electrode for a dye-sensitized solar cell using surface patterning, and a dye-sensitized solar cell including the electrode formed therefrom.

1 schematically shows a general dye-sensitized solar cell.

Referring to FIG. 1, a dye-sensitized solar cell is formed between a pair of glass substrates 110 and 130. More specifically, the dye-sensitized solar cell includes a semiconductor electrode 120 on which a dye for generating electrons is absorbed, a counter electrode 140 facing the semiconductor electrode, and an electrolyte 150 interposed therebetween. .

The pair of glass substrates 110 and 130 are coated with a conductive transparent electrode. As the conductive transparent electrode, fluorine doped tin oxide (FTO) is mainly used because the FTO has the lowest reactivity with the electrolyte and is stable even for a long time.

However, the FTO-coated glass substrate is relatively expensive, occupying 60% of the total cost of the solar cell, has a relatively large resistance of 10 to 15? / Cm 2, and is fragile.

Particularly, in the case of a glass substrate, it is difficult to apply to a flexible solar cell because it does not bend easily.

A background art related to the present invention is Korean Patent Registration No. 10-0786334 (published on Dec. 17, 2007). The above document discloses a glass substrate on which an FTO thin film is deposited.

It is an object of the present invention to provide a method of forming an electrode for a dye-sensitized solar cell using surface patterning.

Another object of the present invention is to provide a dye-sensitized solar cell comprising an electrode formed by the above method.

According to another aspect of the present invention, there is provided a method of forming an electrode for a dye-sensitized solar cell, comprising: patterning a surface of a metal substrate to increase surface roughness of the metal substrate; Forming a corrosion resistant coating layer on the patterned metal substrate; And forming a semiconductor electrode on the corrosion-resistant coating layer, wherein the surface roughness of the metal substrate surface is maintained even after the corrosion-resistant coating layer is formed, so that the contact area between the semiconductor electrode and the corrosion- .

At this time, the surface patterning of the metal substrate may be performed by a photoetching method, a sandblasting method, or a microparticle pressing method.

Also, the surface patterning of the metal substrate may be performed such that the depth of the patterned portion is 10 to 30 占 퐉.

Also, the metal substrate may be made of stainless steel, and the corrosion-resistant coating layer may be made of titanium.

In addition, the corrosion-resistant coating layer is preferably formed to a thickness of 0.5-1 탆.

According to another aspect of the present invention, there is provided a dye-sensitized solar cell comprising: a first substrate on which a corrosion-resistant coating layer is formed on a surface-patterned metal substrate; A semiconductor electrode formed on the first substrate and having a dye adsorbed thereon; A second substrate facing the first substrate; A counter electrode formed on the second substrate; And an electrolyte formed between the semiconductor electrode and the counter electrode.

At this time, the metal substrate may be made of stainless steel, and the corrosion-resistant coating layer may be made of titanium.

According to the method for forming an electrode for a dye-sensitized solar cell according to the present invention, the contact area with the semiconductor electrode can be enlarged by performing surface patterning on a metal substrate, thereby improving solar cell efficiency.

In addition, according to the electrode forming method of the present invention, since the surface roughness of the metal substrate can be maintained in forming the corrosion-resistant coating layer, it is possible to use a relatively inexpensive metal substrate such as a stainless steel substrate.

In addition, the dye-sensitized solar cell using the surface-patterned metal substrate according to the present invention can exhibit good solar cell efficiency even though it has a rear-incidence structure.

In addition, the dye-sensitized solar cell according to the present invention can further increase the flexibility as compared with a conventional dye-sensitized solar cell based on a glass substrate by using a metal substrate.

1 schematically shows a general dye-sensitized solar cell.
2 to 4 illustrate a metal substrate manufacturing process applied to the present invention.
5 is a schematic view of a dye-sensitized solar cell according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

Hereinafter, a method of forming an electrode for a dye-sensitized solar cell using surface patterning according to a preferred embodiment of the present invention and a dye-sensitized solar cell including the electrode formed by the method will be described in detail with reference to the accompanying drawings.

In the dye-sensitized solar cell according to the present invention, a metal substrate on which a semiconductor electrode is formed and a glass or polymer substrate on which a counter electrode is formed are used. In this case, since light can not be incident on the metal substrate, light is incident on the glass or polymer substrate on which the counter electrode is formed (rear incidence). In this case, the incident light is lost due to the counter electrode and the electrolyte, and the solar cell efficiency is reduced by about 30% as compared with the case where the light is incident on the glass substrate on which the conventional semiconductor electrode is formed (front incidence) .

Accordingly, the inventors of the present invention have found out a method of increasing solar cell efficiency in a rear incident structure after a long study.

The method for forming an electrode for a dye-sensitized solar cell according to the present invention includes a step of patterning a surface of a metal substrate, a step of forming a corrosion-resistant coating layer, and a step of forming a semiconductor electrode.

First, in order to pattern the surface of the metal substrate, a metal substrate 211 as shown in the example of FIG. 2 is provided.

The metal substrate may be formed of a material such as stainless steel, titanium, aluminum, platinum, nickel, or the like. Among them, the metal substrate is preferably made of stainless steel in consideration of corrosion resistance, flexible characteristics, electric conductivity and price.

Wet etching or dry etching may be performed to remove foreign substances on the surface of the metal substrate, remove the oxide film, and the like before the surface patterning described later.

Next, the surface of the metal substrate 211 is patterned to form a patterned portion 212 as in the example shown in Fig. Through this process, the surface roughness of the metal substrate is increased and the surface area is also widened.

Of course, it is also possible to perform surface patterning after first forming the corrosion-resistant coating layer 213 described later, but in this case, there is a problem that the corrosion-resistant coating layer can be completely etched in the thickness direction. Accordingly, in the present invention, the corrosion-resistant coating layer is formed after the surface of the metal substrate is first patterned.

The surface patterning of the metal substrate can be performed by a photo-etching method, a sand blasting method, or a micro-particle pressing method, and a photoetching method is more preferable. The photoetching method may be performed by a series of processes such as photoresist coating, photomasking, exposure, development, etching, and striping, as is well known.

Also, the surface patterning of the metal substrate is preferably performed such that the depth of the patterned portion 212 is 10 to 30 占 퐉. When the depth of the patterned portion 212 is less than 10 mu m, the surface roughness or surface area increasing effect is insufficient. On the contrary, if the depth of the patterned portion 212 exceeds 30 μm, there is a possibility that the semiconductor electrode is formed only in the patterned portion in the subsequent semiconductor electrode formation process, the upper and lower electrodes are short-circuited, The improvement can be made difficult.

In the surface patterning of the metal substrate, the size of the patterned portion 212 may be about 1 to 100 mu m, but is not limited thereto.

Next, as shown in FIG. 4, a corrosion-resistant coating layer 213 is formed on the patterned metal substrate 211.

Since the corrosion-resistant coating layer 213 can be corroded on the electrolyte by using only a metal substrate made of, for example, stainless steel, it plays a role of suppressing it and also serves to transfer electrons to the metal substrate.

Therefore, the corrosion-resistant coating layer 213 should be formed of a material having excellent corrosion resistance and electrical conductivity. The corrosion-resistant coating layer 213 may be formed of a material including titanium, such as titanium or titanium nitride. More preferably, .

On the other hand, the corrosion-resistant coating layer 213 is preferably formed to a thickness of 0.5-1 탆. If the thickness of the corrosion-resistant coating layer 213 is less than 0.5 mu m, the effect of improving the corrosion resistance of the metal substrate may be insufficient. On the contrary, when the thickness of the corrosion-resistant coating layer 213 exceeds 1 占 퐉, the adhesion to the metal substrate may be lowered without further improving the corrosion resistance.

Thereafter, a semiconductor electrode is formed on the corrosion-resistant coating layer.

A method of forming the semiconductor electrode is as follows.

First, a TiO 2 paste is printed on a surface-patterned metal substrate, more specifically, a corrosion-resistant coating layer 213 by a screen printing method, a doctor blade method, a spray coating method or the like. Thereafter, heat treatment is performed at 400 to 500 ° C for about 20 to 60 minutes. Then, the dye is impregnated in a dye solution such as a ruthenium dye solution for 6 to 24 hours to adsorb the dye.

According to the method for forming an electrode for a dye-sensitized solar cell according to the present invention, the surface roughness can be maintained even after the corrosion-resistant coating layer is formed by first patterning the surface of the metal substrate. As a result, the contact area between the semiconductor electrode and the metal substrate, more specifically, the corrosion-resistant coating layer can be increased, and as a result, the amount of dye adsorption can be increased to improve the solar cell efficiency.

5 is a schematic view of a dye-sensitized solar cell according to an embodiment of the present invention.

Referring to FIG. 5, the dye-sensitized solar cell includes a first substrate 210, a semiconductor electrode 220, a second substrate 230, a counter electrode 240, and an electrolyte 250.

The first substrate 210 is a substrate on which semiconductor electrodes are formed. In the present invention, the above-described substrate made of a metal material, more specifically, a surface-patterned metal substrate is used for imparting flexible characteristics.

A polymer substrate may be used for the first substrate 210. However, in this case, since the heat treatment temperature is lowered when the semiconductor electrode is formed, the photoelectric efficiency is not so high when the solar cell is driven. Therefore, in the present invention, a metal substrate is used as the first substrate 210.

However, in the case of the metal substrate itself, the corrosion resistance is insufficient for the electrolyte. Accordingly, in the present invention, a corrosion-resistant coating layer is formed on a metal substrate to improve the corrosion resistance of the metal substrate.

Further, in the present invention, the surface roughness and the surface area are larger than those of the conventional first substrate by using the first substrate having the corrosion-resistant coating layer formed on the surface-patterned metal substrate, so that the contact area with the semiconductor electrode , Thereby improving the solar cell efficiency.

The semiconductor electrode 220 is formed on the first substrate 210, more specifically, on the first corrosion resistant coating layer 212 of the first substrate 210. The semiconductor electrode 220 may be formed of at least one selected from the group consisting of TiO 2 , SnO 2 , ZrO 2 , SiO 2 , MgO, Nb 2 O 5 , Zinc (ZnO) or the like.

The semiconductor electrode 220 may include a ruthenium dye such as Ruthenium 535-bisTBA (N719) or Ruthenium 620-1H3TBA (black dye), an organic dye, a quantum-dot or a natural dye The same dye is adsorbed.

The second substrate 230 faces the first substrate. The second substrate 230 may be formed of a glass or polymer material having transparency for light reception, and is preferably formed of a polymer material having excellent flexible characteristics. Examples of the polymer material include polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), polyimide (PI), and the like.

The second substrate 230 is coated with a conductive material such as ITO or FTO.

The counter electrode 240 is formed on the second substrate, more specifically on the conductive material coated on the second substrate. The counter electrode 240 is in contact with the electrolyte 250 so as to participate in the reduction process of the electrolyte 250. The counter electrode 240 may be formed of platinum (Pt), silver (Ag), carbon black, or the like

The electrolyte 250 is formed between the semiconductor electrode 220 and the counter electrode 240. Examples of the electrolyte include 3-propyl-1,2-dimethyl imidazolium iodide (DMPImI), lithium iodide (LiI) and I 2 in acetonitrile I solubilized I 3 - / I - electrolyte can be presented. The electrolyte supplies electrons to the dye through oxidation-reduction (for example, I 3 - ↔ 3 I - ).

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

The contents not described here are sufficiently technically inferior to those skilled in the art, and a description thereof will be omitted.

1. Manufacture of dye-sensitized solar cell

(1) First substrate

Example 1

A stainless steel substrate having a thickness of 0.1 mm was patterned by a photoetching method under the conditions of the size of the patterned portion: an average of 75 탆 and the depth of the patterned portion: 26 탆, and then a Ti layer having a thickness of 900 nm was formed by sputtering, Respectively.

Comparative Example 1

A Ti layer with a thickness of 900 nm was formed by sputtering on a stainless steel substrate having a thickness of 0.1 mm to prepare a first substrate.

(2) Preparation of dye-sensitized solar cell

A dye-sensitized solar cell was fabricated using the first substrate according to Example 1 and Comparative Example 1. The material used for the dye-sensitized solar cell in addition to the first substrate is as follows.

Second substrate: FTO coated Glass

Semiconductor electrode: TiO 2 , Dye: Ruthenium 535-bisTBA (N719)

Counter electrode: Pt

Electrolyte: 0.6M DMPImI, 0.1M LiI, 40 mM I 2 , solvent: acetonitrile

2. Evaluation of electrical characteristics

A short circuit current (Jsc), an open-circuit voltage (Voc), a fill factor (FF), and the like were measured for each of the dye-sensitized solar cells using the first substrate according to Example 1 and Comparative Example 1, And photoelectric efficiency were measured. The results are shown in Table 1.

In addition, dye desorption experiments were carried out to examine the dye adsorption amounts of the dye-sensitized solar cells using the first substrate according to Example 1 and Comparative Example 1, respectively. To this end, the dye was adsorbed on the first substrate, and then the first substrate was immersed in 0.1 M NaOH aqueous solution to desorb the dye. After the desorption of the dye, the amount of the desorbed dye, that is, the amount of adsorbed dye was calculated by UV measurement.

[Table 1]

Figure 112013099137513-pat00001

Referring to Table 1, in the case of the dye-sensitized solar cell using the surface-patterned metal substrate according to Embodiment 1, a solar cell having a relatively higher solar cell than the dye- Efficiency is shown.

In addition, in the case of the dye-sensitized solar cell according to Example 1, the current value (Jsc) was much increased as compared with the dye-sensitized solar cell according to Comparative Example 1. This can be confirmed through dye desorption experiments. That is, the amount of desorbed dye in Example 1 using the surface-patterned first substrate is greater than the amount of desorbed dye in Comparative Example 1 using the first substrate on which no surface pattern was performed, which means that the amount of desorbed dye was larger, The amount of dye adsorbed was large, so that it was possible to generate a large amount of electric current.

From the above results, it can be clearly seen that the solar cell efficiency is improved by increasing the surface roughness when patterning the surface of the metal substrate.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

210: first substrate 211: metal substrate
212: patterned portion 213: corrosion-
220: semiconductor electrode 230: second substrate
240: counter electrode 250: electrolyte

Claims (6)

Patterning the surface of the metal substrate to increase the surface roughness of the metal substrate;
Forming a corrosion resistant coating layer on the patterned metal substrate; And
And forming a semiconductor electrode on the corrosion-resistant coating layer,
Wherein the surface of the metal substrate is patterned first to maintain the surface roughness even after the formation of the corrosion-resistant coating layer, thereby increasing the contact area between the semiconductor electrode and the corrosion-resistant coating layer.
The method according to claim 1,
Wherein the surface patterning of the metal substrate is performed by a photo-etching method, a sand blasting method, or a micro-particle pressing method.
The method according to claim 1,
Wherein the surface of the metal substrate is patterned such that the depth of the patterned portion is 10 to 30 占 퐉.
The method according to claim 1,
Wherein the metal substrate is made of stainless steel,
Wherein the corrosion-resistant coating layer is made of titanium-containing material.
The method according to claim 1,
Wherein the corrosion-resistant coating layer is formed to a thickness of 0.5 to 1 占 퐉.
A first substrate on which a corrosion-resistant coating layer is formed on a surface-patterned metal substrate;
A semiconductor electrode formed on the first substrate and having a dye adsorbed thereon;
A second substrate facing the first substrate;
A counter electrode formed on the second substrate; And
And an electrolyte formed between the semiconductor electrode and the counter electrode,
Wherein the corrosion-resistant coating layer formed on the surface-patterned metal substrate has surface roughness.
KR1020130131111A 2013-10-31 2013-10-31 Method of forming electrode for dye sensitive solar cell using surface pattering KR101546585B1 (en)

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JP2008121087A (en) 2006-11-15 2008-05-29 Japan Carlit Co Ltd:The Corrosion resistant, electrically conductive coated material, and its production method

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JP2008121087A (en) 2006-11-15 2008-05-29 Japan Carlit Co Ltd:The Corrosion resistant, electrically conductive coated material, and its production method

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