KR101544305B1 - Method of manufacturing a pattern structure - Google Patents

Abstract

 In the method of manufacturing a pattern structure, barrier rib patterns are formed on a conductive substrate by an imprint lithography process using a polymer mold, and then a metal pattern is formed on the conductive substrate through a plating process between the barrier rib patterns. Thus, a pattern structure having a metal pattern can be formed by a simple process.

Description

METHOD OF MANUFACTURING A PATTERN STRUCTURE [0002]

The present invention relates to a method for manufacturing a pattern structure, and more particularly, to a method for manufacturing a pattern structure for forming a pattern structure on a conductive substrate.

The color of an object recognized by the naked eye is determined by the wavelength of the light reflected from the object. The color of the object can be divided into a color of pigment by the coloring material itself and a color of structure by the structure of the object.

The structural color is caused by interference of light and diffraction phenomenon. For example, objects such as peacock feathers, morpho butterflies in the Amazon forest, and mother-of-pearl can exhibit their structural color as they have nanoscale regular structures on their surfaces.

At this time, the structure selectively reflects according to the wavelength of light to exhibit a beautiful color, and this property is called photonic crystal. In this case, depending on the spacing between the structures having the photonic crystal structure and the size of each of the structures, the structures may implement different colors.

On the other hand, antifouling properties can be realized through the physical structure of the object surface. In this case, when the structure is formed so as to have a change in the contact angle of the solvent and the surface of the object, the solvent exhibits the property that the solvent forms on the surface of the object due to the net energy generated by the interface energy of the solvent and the contact angle between the object and the solvent. At this time, it is resistant to solvents and pollutants and antifouling is realized.
Korean Patent Publication No. 10-2008-0103195 is known as a prior art document.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method of fabricating a pattern structure which can have improved photocrystallinity and antifouling properties and further simplify the process.

In order to accomplish the object of the present invention, in a method of manufacturing a pattern structure according to an embodiment of the present invention, barrier rib patterns are formed on a conductive substrate by an imprint lithography process using a polymer mold, Metal patterns are formed between the barrier rib patterns through a plating process.

In one embodiment of the present invention, the barrier rib patterns on the conductive substrate have a concave pattern corresponding to the barrier rib pattern formed on the surface thereof, and a coating layer is formed to embed the concave pattern. Forming the barrier rib patterns under the conductive substrate by pressing the conductive substrate toward the coating layer, and then separating the barrier rib patterns from the polymer mold. Here, the concave patterns may have sidewalls tilted in the forward direction.

In one embodiment of the present invention, after the barrier rib patterns formed on the conductive substrate are formed, residues remaining between the barrier rib patterns on the conductive substrate may be additionally removed.

In one embodiment of the present invention, each of the metal patterns may have an overhang shape. Alternatively, each of the metal patterns may have a mushroom shape.

In one embodiment of the present invention, a self-assembled monolayer may be additionally formed on the entire surface of the conductive substrate including the metal patterns. The step of forming the self-assembled monolayer may include a hydrocarbon material having a silane group or a thiol group as a reactor, and a coating liquid containing a solvent. The solvent may also include hexane or toluene. Meanwhile, the self-assembled monolayer may be formed through a vapor deposition process.

According to the method for fabricating a pattern structure according to an embodiment of the present invention, barrier rib patterns are formed on a conductive substrate through an imprint lithography process and a metal pattern is formed between the barrier rib patterns through a plating process, A pattern structure having antifouling properties can be formed.

Further, the self-assembled monolayer may be additionally formed on the conductive substrate including the metal pattern to reduce the surface energy, thereby improving the antifouling property.

1 is a flowchart illustrating a method of manufacturing a pattern structure according to an embodiment of the present invention.
2A to 2F are schematic views for explaining an example of a manufacturing method of the pattern structure of FIG.
FIGS. 3A to 3D are schematic views for explaining another example of a method of manufacturing the pattern structure of FIG. 1. FIG.
FIG. 4 is a photograph showing a pattern structure manufactured according to the method of manufacturing a pattern structure described with reference to FIGS. 2A to 2F.
5 is a scanning electron microscope (SEM) photograph for explaining a pattern structure manufactured according to the method of fabricating a pattern structure described with reference to FIGS. 2A to 2F.
FIG. 6 is a scanning electron microscope (SEM) image for explaining a pattern structure manufactured according to the method of manufacturing a pattern structure described with reference to FIGS.
FIGS. 7A and 7B are photographs showing the surface contact angle of ethylene glycol with respect to pattern structures formed through the manufacturing methods of the pattern structure described with reference to FIGS. 2A to 2F and 3A to 3D, respectively, admit.
8 is a photograph showing the surface contact angle with respect to a structure in which a self-assembled monolayer film is coated on a nickel film formed on a conductive substrate through a nickel plating process.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In the accompanying drawings, the sizes and the quantities of objects are shown enlarged or reduced from the actual size for the sake of clarity of the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprise", "comprising" and the like are intended to specify that there is a stated feature, step, function, element, or combination thereof, Quot; or " an " or < / RTI > combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a flowchart illustrating a method of manufacturing a pattern structure according to an embodiment of the present invention. 2A to 2F are schematic views for explaining an example of a manufacturing method of the pattern structure of FIG.

1 to 2A, a polymer mold 10 having a concave pattern 15 formed on its surface is prepared (S111).

The polymer mold 10 may be formed of a material such as polymethylsiloxane (PDMS), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polyacrylate, polymethylmethacrylate, polyurethane, polycarbonate, polyethylene, polypropylene, Acetate butyrate (CAB), copolymers of two or more thereof, and the like.

A concave pattern (15) is formed on the upper surface of the polymer mold (10). The concave pattern 15 may be recessed on the upper surface. The concave pattern 15 may correspond to a partition pattern formed subsequently. That is, a coating layer may be embedded in the recess formed in the concave pattern 15 to form barrier rib patterns.

In the concave pattern 15, for example, a recess in the shape of a pyramid, quadrangular pyramid or quadrangular prism may be formed.

Next, a coating layer 121 for embedding the concave pattern 15 is formed (S113). That is, the coating layer 121 filling the recess formed in the concave pattern 15 is formed. The coating layer 121 may be converted into a subsequent lattice pattern. The coating layer 121 is, for example, HSQ (hydrogenm silanquaxain) or SiO _2, may include an oxide such as ZrO _2, ZnO or TiO _2. Alternatively, the coating layer 121 may include a polymer resin such as polymethylmethacrylate (PMMA), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene phthalate (PET), polyvinyl alcohol (PVA), and polybutylmethacrylate (PBMA).

The coating layer 121 may be formed through a spin coating process. The coating layer 121 may be formed through a chemical vapor deposition process.

Referring to FIGS. 1 and 2C, barrier rib patterns 123 are formed by pressing the coating layer using a conductive substrate 110 (S115).

The conductive substrate 110 may be made of a metal material, for example. Alternatively, the conductive substrate 110 may include an insulating substrate having a metal thin film formed on its surface. Accordingly, the conductive substrate 110 can be used as an electrode in a subsequent plating process.

The coating layer 121 may be planarized as the conductive substrate 110 presses the coating layer 121 so that the barrier rib patterns 123 may be formed on the concave pattern 15.

The barrier rib patterns 123 may have a shape corresponding to the concave pattern 15. That is, when the concave pattern 15 is formed, for example, in a pyramid shape, a quadrangular pyramid shape, or a quadrangular columnar recess, the partition pattern 123 may also have a pyramid shape, a quadrangular pyramid shape, have.

Referring to FIGS. 1 and 2D, the barrier rib patterns 120 may be formed on the conductive substrate 110 by separating the barrier rib patterns from the conductive mold 10 (S117). Here, reference numeral 120 denotes barrier rib patterns formed on the conductive substrate 110.

Thus, the barrier rib patterns 120 can be formed on the conductive substrate 110 through an imprint lithography process. The barrier rib patterns 120 may have a nano size or a micro size.

Meanwhile, in the embodiment of the present invention, when residues remain on the conductive substrate 110 between the barrier rib patterns 120, the residue may be further removed. That is, when the residues are present between the barrier rib patterns 120 as a part of the coating layer 121 and remain on the conductive substrate 110, the electrodes serve as electrodes of the conductive substrate 110 in a subsequent plating process It can interfere. Accordingly, the residue is removed from the conductive substrate 110, and the upper portion of the conductive substrate 110 between the barrier rib patterns 120 is exposed, so that the subsequent plating process can be performed more effectively.

In order to remove the residue, a dry etching process such as a reactive ion etch process or an induced plasma etch process may be performed.

Referring to FIGS. 1 and 2E, metal patterns 130 are formed between the barrier rib patterns 120 and the conductive substrate 110 through a plating process (s120). Thereby, a pattern structure including the metal patterns 130 and the conductive substrate 110 is manufactured. The pattern structure can easily form the metal patterns 130 through a plating process. In addition, since the metal patterns 130 are formed to have various shapes or sizes, the pattern structure may have various photonic crystals.

For example, the metal patterns 130 may have a nano size or a micro size.

The metal patterns 130 may be formed through a single metal plating process or an alloy plating process. In the plating process, the conductive substrate may be used as a first electrode, and a second electrode made of a metal material forming the metal patterns 130 may be used.

In one embodiment of the present invention, after the metal patterns 130 are formed, a process of removing the barrier rib patterns 110 from the conductive substrate may be further performed. In order to remove the barrier rib patterns 110 from the conductive substrate 110, a wet etching process using hydrofluoric acid, sulfuric acid, hydrochloric acid, potassium hydroxide, sodium hydroxide, or the like may be performed. Alternatively, dry etching such as a reactive ion etching process or an inductive plasma etching process can be performed.

An air pocket may be formed between the metal patterns 130 as the step of removing the barrier rib patterns 120 from the conductive substrate 110 is performed. When the metal patterns 130 are exposed to the liquid as the air pockets are formed, a gas, a liquid, and a solid may form an interface between the metal patterns 130. Particularly, a surface tension is generated between the side wall of the metal patterns 130 and the liquid, and the surface tension causes a force to push the liquid vertically upward from the surface of the conductive substrate 110 . Therefore, the pattern structure in which the metal patterns 130 are formed may have antifouling properties with respect to the liquid.

In one embodiment of the present invention, each of the metal patterns 130 may have an overhang shape. Accordingly, each of the metal patterns 130 may include a reverse photographic sidewall. Whereby the air pockets can be effectively formed between the metal patterns 130. [ As a result, each of the metal patterns 130 has an overhang shape, so that the pattern structure can secure excellent antifouling properties.

In one embodiment of the present invention, a self-assembled monolayer 150 may be additionally formed on the entire pattern structure including the metal patterns 130. The self-assembled monolayer 150 may have a predetermined thickness on the metal patterns 130 and the exposed conductive substrate 110.

The self-assembled monolayer 150 may be formed using a dipping method or a vaper deposition method.

The dipping method may be performed by preparing a coating solution in which a self-assembling monolayer and a solvent are mixed, and dipping the conductive substrate 110 having the metal patterns 130 in the coating solution. At this time, the solvent may include toluene, hexane, ethylene glycol or chlorobenzene. The dipping process may be performed for 5 minutes to 10 minutes. Alternatively, the vapor deposition may be performed by providing a self-assembled monolayer vapor to the conductive substrate 110 having the metal patterns 130. Thus, the self-assembled monolayer can be uniformly deposited on the surfaces of the exposed conductive substrate 110 and the metal patterns 130.

The self assembled monolayer may comprise a reactor comprising a silane group or a thiol group and a hydrocarbon chain. As a result, the self-assembled monolayer 150 can have excellent antifouling properties as it has a relatively low surface energy.

The silane group may include a chlorosilane group or an alkoxysilane group. For example, the self-assembled monolayer may comprise octadecyltrichlorosilane (OTS) having a chlorosilane group as a reactor, or hexadecanethiol (HDT) having a thiol group as a reactor. For example, when the conductive substrate 110 is made of a metal, the reactor of the self assembled monolayer may be a thiol group.

The hydrocarbon chain generates a van der Waals attractive force between the conductive substrate and the self-assembled monolayer or between self-assembled monolayer molecules to form the self-assembled monolayer.

FIGS. 3A to 3D are schematic views for explaining another example of a method of manufacturing the pattern structure of FIG. 1. FIG.

Referring to Figs. 1 and 3A, a polymer mold 20 having a square pillar-shaped concave pattern 25 is prepared.

Referring to FIGS. 1 and 3B, a coating layer is formed to cover the concave pattern, and the coating layer is pressed onto the conductive substrate 110 to form barrier rib patterns under the conductive substrate 110.

Referring to FIG. 1 and FIG. 3D, barrier rib patterns 120 are formed on the conductive substrate 110 by releasing the barrier rib patterns 120 from the polymer mold 10.

Metal patterns 130 are then formed between the barrier rib patterns 120 and the conductive substrate 110 through a plating process. The metal patterns 130 may have a mushroom shape. Subsequently, the pattern structure is fabricated by removing the barrier rib patterns 120.

When a liquid is supplied to the upper surface of the pattern structure, air pockets are formed between the metal patterns 130 having the mushroom-like shape. An interface may be formed between each of the gas, the liquid and the metal pattern (solid) in the air pocket. This results in surface tension between the gas, liquid and solid. At this time, the surface tension between the upper portion of the metal patterns 130 and the liquid acts vertically upward with respect to the conductive substrate, so that the force for raising the liquid can be increased. Thus, the pattern structure in which the metal patterns 130 are formed can have excellent antifouling properties.

FIG. 4 is a photograph illustrating a pattern structure manufactured according to the method of fabricating a pattern structure described with reference to FIGS. 2A to 2F. Referring to FIG.

Referring to FIG. 4, it can be seen that the pattern structure reflects light selectively according to the wavelength of light and has excellent color photocrystallinity as it has various colors.

5 is a scanning electron microscope (SEM) photograph for explaining a pattern structure manufactured according to the method of fabricating a pattern structure described with reference to FIGS. 2A to 2F.

Referring to FIG. 5, it can be seen that the metal patterns are formed in a pyramid shape.

FIG. 6 is a scanning electron microscope (SEM) image for explaining a pattern structure manufactured according to the method of manufacturing a pattern structure described with reference to FIGS.

Referring to FIG. 6, it can be seen that the pattern structure manufactured according to the method of manufacturing a pattern structure described with reference to FIGS. 3A to 3D has mushroom-shaped metal patterns.

FIGS. 7A and 7B are photographs showing the surface contact angle of ethylene glycol with respect to pattern structures formed through the manufacturing methods of the pattern structure described with reference to FIGS. 2A to 2F and 3A to 3D, respectively, admit.

Referring to FIGS. 7A and 7B, the surface contact angle of the pattern structure including the self-assembled monolayer formed through the manufacturing method of the pattern structure described with reference to FIGS. 2A to 2F and FIGS. 3A to 3D is measured . In this case, each of the pattern structures exhibits a surface contact angle with respect to ethylene glycol of 94.5 ° and 112.6 °. Therefore, it can be confirmed that each of the pattern structures has a high surface contact angle and thus has excellent oil repellency.

8 is a photograph showing the surface contact angle with respect to a structure in which a self-assembled monolayer film is coated on a nickel film formed on a conductive substrate through a nickel plating process.

Referring to FIG. 8, a nickel thin film made of nickel is formed on a conductive substrate by a plating process, and then a self-assembled monolayer is coated on the nickel thin film to form a structure. It can be seen that the structure has a surface contact angle of 70.2 ° with ethylene glycol. That is, the structure has a relatively low surface contact angle.

According to the above-described method of fabricating a pattern structure, barrier rib patterns are formed on a conductive substrate through an imprint lithography process, and a metal pattern is formed between the barrier rib patterns through a plating process to form pattern structures having various photonic crystals and excellent antifouling properties Can be formed. Further, the self-assembled monolayer may be additionally formed on the conductive substrate including the metal pattern to reduce the surface energy, thereby improving the antifouling property.

A method of manufacturing a pattern structure and an apparatus for manufacturing a pattern structure according to embodiments of the present invention can be applied to form a pattern structure included in a light emitting device, a solar cell, a functional optical film, a display, and a flexible device.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

10: polymer mold 15: concave pattern
110: conductive substrate 120: barrier rib patterns
130: metal patterns 150: self-assembled monolayer

Claims (10)

Forming barrier rib patterns on the conductive substrate by an imprint lithography process using a polymer mold;
Selectively forming metal patterns on the conductive substrate and between the barrier rib patterns through a plating process; And
And removing the barrier rib patterns from the conductive substrate,
Wherein forming the barrier rib patterns on the conductive substrate comprises:
Preparing a polymer mold having concave patterns corresponding to the partition pattern formed on its surface;
Forming a coating layer to embed the concave patterns;
Forming barrier rib patterns under the conductive substrate by pressing the conductive layer toward the coating layer; And
And separating the barrier rib patterns from the polymer mold. delete 2. The method of claim 1, wherein each of the concave patterns has a forward sloped sidewall. The method of claim 1, further comprising forming barrier rib patterns on the conductive substrate,
Further comprising the step of removing residues remaining between the barrier rib patterns on the conductive substrate. delete delete The method of claim 1, further comprising forming a self-assembled monolayer on the entire surface of the conductive substrate including the metal patterns. [8] The method of claim 7, wherein forming the self-assembled monolayer comprises using a hydrocarbon material having a silane group or a thiol group as a reactor and a coating liquid containing a solvent. 9. The method of claim 8, wherein the solvent comprises hexane or toluene. 8. The method of claim 7, wherein forming the self-assembled monolayer is performed through a vapor deposition process.

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