KR101514921B1 - Method and System for Life Prediction of Electromagnetic Relay - Google Patents
Method and System for Life Prediction of Electromagnetic Relay Download PDFInfo
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- KR101514921B1 KR101514921B1 KR1020140037549A KR20140037549A KR101514921B1 KR 101514921 B1 KR101514921 B1 KR 101514921B1 KR 1020140037549 A KR1020140037549 A KR 1020140037549A KR 20140037549 A KR20140037549 A KR 20140037549A KR 101514921 B1 KR101514921 B1 KR 101514921B1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/327—Testing of circuit interrupters, switches or circuit-breakers
- G01R31/3277—Testing of circuit interrupters, switches or circuit-breakers of low voltage devices, e.g. domestic or industrial devices, such as motor protections, relays, rotation switches
- G01R31/3278—Testing of circuit interrupters, switches or circuit-breakers of low voltage devices, e.g. domestic or industrial devices, such as motor protections, relays, rotation switches of relays, solenoids or reed switches
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Abstract
Description
The present invention relates to a method and system for estimating the life of an electronic relay. More particularly, the present invention relates to a method and system for predicting the service life of an electronic relay through a change in characteristics of bouncing, which is a mechanical characteristic occurring at a contact point.
In general, a relay is a device that operates when an input reaches a certain value to open or close another circuit, such as a contactless relay or a contactless relay, and a pressure, temperature, or light relay.
The importance of relays is increasing at a time when demand for smart grids, electric vehicles, and LED lighting control devices in the electric field is high in high voltage and high current control. The advantage of such a relay is that it is not only costly in terms of control convenience and cost through the contact point but also has a reliable and stable system by simple relay replacement in maintenance.
The control of the internal contacts of the relay is made up of a coil part for using the power of the electromagnet and a contact part for conducting current. The types of relays can be divided into an armature relay with a combination of a coil part and a contact part, and a latching relay with a permanent magnet of an armature relay. In the case of a self-holding type relay using a permanent magnet, it is possible to reduce the power consumption of the relay itself generated during driving by forming a magnetic path in the internal device, and to maintain the contact state during the power failure to maintain the efficiency of the device using the relay An effect of improving the stability can be obtained.
In addition, when the contact of the relay is moved by the solenoid force of the relay, bouncing phenomenon occurs at the contact point regardless of the type of the relay. Here, bouncing phenomenon occurs when the movable contact of the contact and the stationary contact are coupled with each other, the contact is momentarily bounced by the hardness of the contact point, and then falls again in the process of arcing. In this process, .
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method and apparatus for estimating the lifetime of a relay through a change in characteristics of bouncing which is a mechanical characteristic occurring at a contact point during operation of an electromagnetic relay, The present invention also provides a method and system for predicting the service life of an electronic relay, which can determine the repair and replacement timing by determining the replacement timing of the relay in accordance with the present invention.
According to an aspect of the present invention, there is provided a method for predicting the service life of an electromagnetic relay, comprising: measuring a force acting on a contact using a force sensor; Analyzing a component of the contact; And applying a voltage to the contact to measure a bouncing phenomenon acting on the contact as the deterioration progresses.
Measuring a force acting on the contact comprises: measuring the force by mounting the thin film type force sensor on the rear surface of the contact; And measuring the force through a calibration process with an universal testing machine.
Analyzing the components of the contact point comprises: analyzing the components of the contact point using an element analyzer; And changing the hardness characteristic by alloying the contact according to the use purpose.
Wherein the step of measuring the bouncing phenomenon acting on the contact according to the progress of the deterioration includes: advancing the deterioration within a range where arc generation occurs but no fusion occurs; And connecting the voltage and the resistance to the contact to form a circuit, and measuring the bouncing phenomenon.
According to another aspect of the present invention, there is provided a system for predicting the service life of an electromagnetic relay, comprising: a force measuring unit for measuring a force acting on the contact by mounting a thin film type force sensor on a rear surface of the contact; An analyzer for analyzing a component of the contact and alloying the contact according to a use purpose to change a hardness characteristic; And a bouncing measuring unit for measuring a bouncing phenomenon acting on the contact point, wherein the deterioration of the contact point occurs when an arc is generated but does not cause fusion, and a voltage and a resistance are connected to the contact point to form a circuit.
According to the embodiments of the present invention, the life of the relay is predicted by changing the characteristics of bouncing, which is a mechanical characteristic occurring at the contact point during the operation of the electromagnetic relay, and a constant load is applied to the relay, It is possible to provide a method and system for estimating the service life of an electronic relay that can determine the repair and replacement timing by determining the replacement timing of the relay according to the change, thereby improving the reliability and safety.
1 is a flowchart illustrating a method of predicting the service life of an electromagnetic relay according to an embodiment of the present invention.
FIG. 2 is a graph showing an electrical conductivity of a resistor according to an embodiment of the present invention. FIG.
FIG. 3 is a graph showing the results of measurement of the Arduino according to an embodiment of the present invention.
FIG. 4 is a flowchart illustrating a method and system for estimating the life of an electromagnetic relay according to an embodiment of the present invention.
5 is a view illustrating a load bank according to an embodiment of the present invention.
FIG. 6 is a graph illustrating experimental results of bouncing of an initial contact according to an embodiment of the present invention. Referring to FIG.
FIG. 7 is a graph illustrating a bouncing average according to an embodiment of the present invention.
8 is a graph illustrating classification according to bouncing length according to an embodiment of the present invention.
9 is a graph showing a bouncing phenomenon through a load experiment according to an embodiment of the present invention.
10 is a view showing a contact in a load experiment according to an embodiment of the present invention.
11 is a block diagram showing a life prediction system of an electromagnetic relay according to an embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In the present invention, in order to determine the lifetime due to the deterioration of the relay, the duration and number of bouncing phenomena are observed at the contacts of the relay through the method of measuring the bouncing phenomenon occurring at the contact point without using a method such as decomposition, The present invention provides a method and system for enhancing the reliability and stability of a device that performs control by applying a relay to repair and replace a relay in a timely manner.
1 is a flowchart illustrating a method of predicting the service life of an electromagnetic relay according to an embodiment of the present invention.
In
First, the force sensor having a thin film type may be mounted on the rear surface of the relay contact to measure the force. In order to measure the force acting on the relay contact, a separate test equipment should be manufactured and the force should be measured by attaching a force sensor such as a load cell to the back of the contact. However, in order to measure the force of the finished product itself, it is impossible to mount a relatively large load cell on the rear side of the contact. In order to overcome this problem, a thin film type sensor can be used to measure the force acting on the contact point.
For example, when measuring the force acting on a contact point, the force acting on the contact point can be measured using a FlexiForce A201 sensor from Tekscan, which is a pressure sensor that minimizes the thickness problem. The thickness of the sensor is 0.203 mm and the sensor range has a diameter of 9.53 mm. The sensors used are flexible and easy to use and have relatively high reliability due to linearity of the results and high accuracy within ± 3%.
In order to drive the pressure sensor, a simple circuit can be constructed using an Arduino board and a reference resistance (1 k? To 100 k?). In the case of using Arduino, input values can be analyzed in real time in conjunction with Matlab, and results can be stored and analyzed continuously through a computer.
In order to use the sensor more reliably, it is preferable to measure the force acting on the contact point through a calibration process by applying a dynamic / static universal testing machine.
For example, a universal tester (such as Instron 5569) can be used to increase the force acting on the sensor used in the experiment by 0.2 N and to measure the change. First, the change in resistance according to the force can be measured with a multimeter (Tektronix TX3), and a graph representing resistance in terms of electrical conductivity is shown in FIG. Referring to FIG. 2, when the electric conductivity value is analyzed using a method of least squares, a coefficient of determination (R2, Coefficient of determination ) Is 0.998, which is a high correlation.
Referring to FIG. 3, it can be seen that the values measured using the arduino and the reference resistance of 20 k? Are linear, and the correlation coefficient is 0.990. Then, the force acting on the contact point was measured using a force sensor, and the measured value was about 5.78V. Therefore, if the force acting on the contact is obtained by substituting the resultant value into the derived least squares method (Equation 1), it can be seen that about 5.45N acts on the contact point.
In
The analysis of the contact material can be performed using an element analyzer. For example, you can analyze the components of a contact according to an EDS element analyzer.
FIG. 4 is a diagram illustrating an analysis of a contact according to an EDS element analyzer according to an embodiment of the present invention.
For example, the analysis of the components of the contact point can be performed using an elementary analyzer of EDS (Energy Dispersive X-ray Spectroscopy). The FE-SEM / EDS (S-4200 / HITACHI) can do.
As shown in FIG. 4, as a result of analysis, the material of the contact point is a stable characteristic at the time of opening and closing because the contact resistance is relatively low due to the Ag-Ni contact point. Since AgNi17 is used as the material of the contact and the hardness is low in the case of Ag100, the hardness characteristics should be changed through the silver alloy depending on the long-term reliability of the contact and the use of the contact. At this time, depending on the analysis result of the component of the contact point, the hardness characteristic can be changed through the metal alloy without being limited to the silver alloy.
The change of the contact hardness and the conductivity according to the ratio of Ag-Ni can be shown as [Table 1].
Here, since the hardness indicates the degree of hardness of the contact, a change in hardness under a condition where a constant pressure is applied to the contact point can greatly affect the bouncing shape which can be referred to as vibration due to the impact at the contact point.
In
First, in order to observe the bouncing phenomenon according to the wear characteristics of the contacts of the relay, the arc generation at the contact point occurs sufficiently and the deterioration can proceed within a range where no fusion occurs. Then, by applying a voltage to the contact and connecting the resistor to the circuit, the bouncing phenomenon acting on the contact can be measured.
For example, the applied voltage is single phase AC 347V / 30A and the power factor can be experimented by counting the number of operation at intervals of On / Off = 1.5s / 1.5s (
To measure the bouncing phenomenon at the contact point, a circuit can be constructed by connecting a resistor of 6V DC to the contact point. The voltage value that changes when the relay is turned on can be measured using an oscilloscope (500MHz, 5GS / s) and the waveform and data can be saved to the computer via GPIB.
The bouncing measurement interval according to the deterioration of the relay contacts is measured based on 10,000 cycles (1 cycle = 3s), and the experiment can be performed up to 200,000 times of on / off operation of the contact point. Measurements can be analyzed using averages of the number and duration of bouncing with five measurements per experiment.
6 to 9 are diagrams illustrating examples of experimental results according to an embodiment of the present invention.
FIG. 6 is a graph illustrating experimental results of bouncing of an initial contact according to an embodiment of the present invention. Referring to FIG.
Referring to FIG. 6, bouncing has a short bounce that occurs over a very short period of time as opposed to a long bounce that lasts for a relatively long period of time. If the duration of bouncing is short, it is known that the influence on the contact point is insignificant. In this case, since there is no separate criterion for bouncing, the length of bouncing is classified based on the duration of bouncing of 0.2 ms. You can analyze the number and duration of bouncing using Excel stored files.
FIG. 7 is a graph illustrating a bouncing average according to an embodiment of the present invention.
Referring to FIG. 7, the average value of bouncing at the beginning was 17.6 times (short: 15.8 times, long: 1.8 times), which was relatively higher than the load experiment data. In the case of a contact before the load of the relay is applied, there may be an oxide film on the contact surface, so that bouncing may result in bouncing measurement in a state where the bouncing is not sufficiently removed. Therefore, it is preferable to analyze the result graphically after excluding the initial value in Fig. That is, the number of bouncing is about 60,000 times to 13 times lower than the initial value, and then it increases again.
8 is a graph illustrating classification according to bouncing length according to an embodiment of the present invention.
Referring to FIG. 8, bouncing of 0.5 ms or more in bouncing of 0.2 ms or more is further classified. Bouncing of 0.5 ms or more also shows a tendency to decrease as the load test progresses. Bouncing increases at a certain level of deterioration (after about 140,000 times).
9 is a graph showing a bouncing phenomenon through a load experiment according to an embodiment of the present invention.
Referring to FIG. 9, the bouncing average duration is also minimized at about 100,000 times, and then gradually increases. The bouncing phenomenon of the contact through the load test shows that the number of times of bouncing and the duration of bouncing are steadily decreased at about 100,000 times as the deterioration progresses. In this case, since the force acts on the vertical axis in the case of the contact, the bouncing phenomenon can be said to be a vibration that moves up and down. At this time, a spring is used to move a fixed force to the lower part of the movable contact device in order to increase the contact force of the contact, and when the bobbin pushes the movable contact, the contact is engaged under the action of the spring force. Thereafter, if a rebound phenomenon occurs due to a metal impact, then the vibration of the spring may act.
The following is the expression (2) for the frequency (frequency) and the oscillation period.
here,
And, the spring constant is the value that can be obtained about the force acting on the spring and the amount of deformation of the spring. At this time, it is assumed that the spring constant value of the spring used in this experiment is constant.
When the total mass of the contact decreases due to the arc generated at the contact of the relay, the frequency (frequency) becomes large because the spring constant is constant. As a result, the oscillation period is reduced and the amplitude is also reduced. Therefore, it can be confirmed that the contact angle itself affects the number of times of bouncing and the duration of bouncing due to the minute mass change at the contact point due to the arc generated at the contact point.
10 is a view showing a contact in a load experiment according to an embodiment of the present invention.
Referring to FIG. 10, the contact point is enlarged 10 times with respect to the initial contact point and the contact point subjected to the 200,000 load test. In FIG. 10 (a), as the deterioration progresses at the initial contact point, the shape of the contact point is irregular It can be seen that it is deformed. Therefore, in the beginning, a force acts on the upper part of the contact, so that the movable contact and the stationary contact are stably connected. As the deterioration progresses, it is expected that the union of the contacts is unbalanced.
It can be seen that the bouncing phenomenon initially occurring at the contact point decreases gradually as the deterioration proceeds. However, it can be seen that the bouncing phenomenon is minimized and then increases again. This result shows that the change of the contact surface caused by the influence of the continuous load after the shape of the contact point is optimized according to the load test shows that the change of the bouncing is observed and the bouncing phenomenon is the weight of the contact, It can be seen that the characteristics change depending on various factors such as the change of the surface shape and the like.
For example, when a constant load of the relay is applied and a repetitive experiment for 3 seconds is performed about 200,000 times, the number of times of bouncing and the duration of the bouncing at the contact point are steadily decreased, . Bouncing is minimized when about 100,000 experiments are performed, and bouncing phenomena similar to the initial level are observed after 200,000 times.
Thus, it can be seen that when a high load is continuously applied to the relay contact, the initial bouncing state is changed. However, as the reaction progresses, the bouncing phenomenon may be stabilized by the weight of the contact point and the stabilization of the contact surface, but this result is not an alternative in terms of reliability. Therefore, the contact structure should be fabricated to initially exhibit low bouncing phenomena and the arc should be minimized so that it can be maintained over the long term.
In addition, due to the contact weight change and the contact surface change of the bouncing phenomenon of the relay, the number and duration of bouncing move from the initial instability to the stable state and again to the unstable state. As the deterioration progresses, the phenomenon of bouncing of the contact point is minimized. As a result, it can be seen that the weight of the contact point is greatly affected by the deterioration of the contact point. After minimization, unstable bouncing phenomenon appears again for the same reason as the contact surface shape change of the contact point, and the number of times of bouncing and the duration increase.
Since the bouncing phenomenon can not exclude mechanical effects, it is impossible to eliminate the phenomenon itself. Therefore, the bouncing phenomenon must be minimized.
11 is a block diagram showing a life prediction system of an electromagnetic relay according to an embodiment of the present invention.
Referring to FIG. 11, the
The force measuring unit 210 can measure a force acting on the contact by mounting a thin film type force sensor on the rear surface of the contact.
The analyzer 220 analyzes the components of the contact and can change the hardness characteristics by alloying the contact according to the application.
The bouncing measuring unit 230 measures the bouncing phenomenon acting on the contact point by forming a circuit by connecting a voltage and a resistance to the contact point, have.
Since a detailed description thereof has been described above, repeated description will be omitted.
According to the present invention, it is possible to determine the replacement time of the relays by observing the duration and the number of times of bouncing phenomenon at the contacts of the electric relay, and to improve the reliability of the apparatus for controlling the relays by applying the relays have.
The apparatus described above may be implemented as a hardware component, a software component, and / or a combination of hardware components and software components. For example, the apparatus and components described in the embodiments may be implemented within a computer system, such as, for example, a processor, controller, arithmetic logic unit (ALU), digital signal processor, microcomputer, field programmable array (FPA) A programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to execution of the software. For ease of understanding, the processing apparatus may be described as being used singly, but those skilled in the art will recognize that the processing apparatus may have a plurality of processing elements and / As shown in FIG. For example, the processing apparatus may comprise a plurality of processors or one processor and one controller. Other processing configurations are also possible, such as a parallel processor.
The software may include a computer program, code, instructions, or a combination of one or more of the foregoing, and may be configured to configure the processing device to operate as desired or to process it collectively or collectively Device can be commanded. The software and / or data may be in the form of any type of machine, component, physical device, virtual equipment, computer storage media, or device , Or may be permanently or temporarily embodied in a transmitted signal wave. The software may be distributed over a networked computer system and stored or executed in a distributed manner. The software and data may be stored on one or more computer readable recording media.
The method according to an embodiment may be implemented in the form of a program command that can be executed through various computer means and recorded in a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions to be recorded on the medium may be those specially designed and configured for the embodiments or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.
Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.
Claims (5)
Analyzing a component of the contact; And
A step of applying a voltage to the contact point and measuring a bouncing phenomenon acting on the contact point as the deterioration progresses,
Lt; / RTI >
The step of measuring the force acting on the contact
Mounting the thin film type force sensor on the rear surface of the contact to measure the force; And
A step of measuring the force through a calibration process with an universal testing machine
Wherein the life expectancy of the electronic relay is determined based on the estimated life.
Analyzing a component of the contact; And
A step of applying a voltage to the contact point and measuring a bouncing phenomenon acting on the contact point as the deterioration progresses,
Lt; / RTI >
The step of analyzing the components of the contact
Analyzing the components of the contact using an element analyzer; And
Changing the hardness characteristic by alloying the contact according to the use purpose
Wherein the life expectancy of the electronic relay is determined based on the estimated life.
Analyzing a component of the contact; And
A step of applying a voltage to the contact point and measuring a bouncing phenomenon acting on the contact point as the deterioration progresses,
Lt; / RTI >
Measuring the bouncing phenomenon acting on the contact point as the deterioration progresses
Arcing occurs and progresses the deterioration within a range where fusion does not occur; And
Connecting a voltage and a resistor to the contact to form a circuit, and measuring the bouncing phenomenon
Wherein the life expectancy of the electronic relay is determined based on the estimated life.
An analyzer for analyzing a component of the contact and alloying the contact according to a use purpose to change a hardness characteristic; And
A bouncing measurement unit for measuring the bouncing phenomenon acting on the contact point, a circuit is formed by connecting a voltage and a resistance to the contact point,
Wherein the life prediction system comprises:
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| KR1020140037549A KR101514921B1 (en) | 2014-03-31 | 2014-03-31 | Method and System for Life Prediction of Electromagnetic Relay |
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| KR1020140037549A KR101514921B1 (en) | 2014-03-31 | 2014-03-31 | Method and System for Life Prediction of Electromagnetic Relay |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111079299A (en) * | 2019-12-20 | 2020-04-28 | 哈尔滨工业大学 | Method for calculating closing bounce electric contact mechanical property of electromagnetic relay under capacitive load |
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|---|---|---|---|---|
| JP2002340961A (en) * | 2001-05-17 | 2002-11-27 | Advantest Corp | Contact point life diagnosis method |
| JP2011028855A (en) * | 2009-07-21 | 2011-02-10 | Panasonic Electric Works Co Ltd | System and method for adjustment of relay characteristics |
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2014
- 2014-03-31 KR KR1020140037549A patent/KR101514921B1/en active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002340961A (en) * | 2001-05-17 | 2002-11-27 | Advantest Corp | Contact point life diagnosis method |
| JP2011028855A (en) * | 2009-07-21 | 2011-02-10 | Panasonic Electric Works Co Ltd | System and method for adjustment of relay characteristics |
Non-Patent Citations (2)
| Title |
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| 논문 (2013) * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111079299A (en) * | 2019-12-20 | 2020-04-28 | 哈尔滨工业大学 | Method for calculating closing bounce electric contact mechanical property of electromagnetic relay under capacitive load |
| CN111079299B (en) * | 2019-12-20 | 2022-03-25 | 哈尔滨工业大学 | Method for calculating closing bounce electric contact mechanical property of electromagnetic relay under capacitive load |
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