KR101504132B1 - The complex protection device of blocking the abnormal state of current and voltage - Google Patents

Abstract

The present invention relates to a complex overcurrent protection device. More specifically, provided is a complex overcurrent protection device which can be stably operated without being exploded at high current by installing a surface-mounted resistor element and a printed resistor element at the same time, and can realize miniaturization of a product by arranging a printed surface-mounted resistor element in a lower part of the surface-mounted resistor element.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a composite protection device,

The present invention relates to a composite protection device, and more particularly, to a circuit protection device which protects a circuit and a circuit element provided in the circuit with respect to an overvoltage as well as an overcurrent by simultaneously providing a surface-mounted resistance element and a printed resistive element, The present invention relates to a composite protective device capable of realizing miniaturization of a product by disposing a mounting type resistance element below the surface mount type resistance element.

A non-return type protection element that operates in response to an excessive heat generated by an overcurrent of the protected device or an ambient temperature is operated at a predetermined operating temperature to cut off the electric circuit in order to secure the safety of the device. As one example, there is a protection element that generates a resistance by the signal current detecting an abnormality occurring in the device and operates the fuse element by the heat generation.

Korean Patent Laid-Open Publication No. 10-2001-0006916 discloses a low-melting-point metal body having an electrode and a heating element for a low-melting-point metal body formed on a protective element substrate. A low-melting-point metal body is formed directly on the electrode and the heating element. An inner sealing portion made of a solid flux or the like is provided to prevent oxidation, and on the outer side thereof, an outer sealing portion or a cap is provided to prevent the melt from flowing out of the device during melting of the low melting point metal body.

13A and 13B show a protection element in which a fusible element (low-melting metal element) is formed on another type of conventional resistance (heating element).

13A and 13B, a conventional protection device includes a ceramic substrate 1 on which a paste-type resistor 2 is applied, and on the resistor 2, an insulator 3, a fuse terminal 4, The fuse terminal 4 and the case 6 are stacked in this order. The connection portion 4a of the fuse terminal 4 is connected to the resistance terminal 8.

In such a conventional protection device, since the fusible element is provided on the resistor, there is a problem that the thickness of the protection element becomes large.

And since it uses a paste-type resistor, it is difficult to apply it to a high-power application, and it is difficult to cope with various environments.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a surface mount type resistive element and a printed resistive element at the same time to overcome not only an overcurrent but also an overvoltage, And to provide a composite protection device capable of protecting the integrated circuit device.

It is another object of the present invention to provide a composite protection device which is easy to apply an automated process because the product can be downsized by disposing the printed resistive element under the surface mount type resistive element and each resistance element is mounted on the substrate without a lead wire. Device.

It is also an object of the present invention to provide a composite protection device that can be designed and optimized in accordance with a desired resistance value or amount of power by variously combining resistive elements having different structures from each other.

It is another object of the present invention to provide a surface mount type resistive element and a printed resistive element in parallel on both sides of a fusible element to improve the thermal characteristics and shorten the fusing element fusing time when an overvoltage is applied, And to provide a composite protection device that can be used.

It is also an object of the present invention to provide a composite protection device which can realize simplification and miniaturization of the structure by sharing the terminals of the surface mount type resistance element and the terminals of the print type resistance element.

It is also an object of the present invention to provide a composite protection element in which the fusing element can be surely fused upon application of an overvoltage by forming a fusing guide portion in the conductive layer.

To this end, the composite protection device according to the present invention includes a substrate having fuse terminals, first and second resistance terminals, and connection terminals connecting the first and second resistance terminals; A fusible element connected to the fuse terminal; A first surface-mounted resistor element connected to the first resistor terminal; A second surface-mounted resistor element connected to the second resistor terminal; A switching element for controlling the current to flow to the first and second surface-mounted resistor elements when an overvoltage is applied; A first insulating layer formed on the connection terminal; And a conductive layer formed on the first insulating layer, wherein the conductive layer is provided with a fusing inducing portion for inducing cohesion of the fusible element melted by the heat generated by the first and second surface-mounted resistor elements .

The conductive layer of the composite protection device according to the present invention is characterized by comprising the fusing guide portion and a conductive portion extending from one side of the fusing guide portion and connecting the fusible element to the first surface-mounted resistor element .

Further, the conductive layer of the composite protection device according to the present invention further includes a heat transfer portion extending from the other end of the fusing guide portion and contacting the second surface-mounted resistor.

The fusion inducing portion of the composite protection device according to the present invention is disposed directly below the fusible element and has a width larger than that of the conductive portion and the heat transfer portion.

Further, the fusion induction portion of the composite protection device according to the present invention is installed directly below the fusible element, and is protruded in the longitudinal direction of the fusible element.

Also, at least one of the first surface-mounted resistor element and the at least one second surface-mounted resistor element connected to at least one of the first resistor terminal and the second resistor terminal of the composite protection device according to the present invention, A printed resistive element; And a second insulating layer formed on the conductive layer.

The printed resistive element of the composite protection element according to the present invention may further comprise a first printed resistive element disposed directly under the first surface-mounted resistive element and a second printed resistive element disposed directly below the second surface- And a second printed resistive element formed on the second printed resistive element.

The fuseable element, the surface mount type resistance element, and the printed resistive element are juxtaposed on the second insulating layer of the composite protection device according to the present invention, and the second insulating layer is formed on the fuseable element and the conductive layer And a hole is formed so as to be able to be formed.

The second insulation layer of the composite protection device according to the present invention includes a first insulation portion disposed directly below the first printed resistive element and a second insulation portion disposed directly below the second printed resistive element, Wherein the first and second insulating portions are spaced apart from each other, and the fusible element is in contact with the fusing guide portion.

According to the composite protection device of the present invention having the above-described configuration, by providing the surface mount type resistive element and the printed resistive element at the same time, the circuit and the circuit element provided in the circuit can be protected against overvoltage as well as overcurrent .

Further, according to the composite protection element according to the present invention, the printed-type resistive element is arranged below the surface-mounted resistive element so that the product can be downsized.

Further, according to the composite protection device according to the present invention, since the surface mount type resistive element and the printed resistive element are all mounted on the substrate without the lead wire, it is easy to apply the automated process.

Further, according to the composite protection device according to the present invention, various combinations of resistance elements having different structures from each other can be designed and optimized in accordance with a desired resistance value or amount of power.

Further, according to the composite protection device of the present invention, the surface-mounted resistance element and the printed resistive element are disposed on both sides of the fusible element, thereby improving the thermal characteristics, shortening the fusing time of the fusible element when the overvoltage is applied, There is an effect that a sufficient distance can be secured.

Further, according to the composite protection device according to the present invention, the terminal of the surface mount type resistance element and the terminal of the print type resistance element are shared, so that the structure can be simplified and miniaturized.

In addition, according to the composite protection element of the present invention, the fusing element can be surely fused when the overvoltage is applied by forming the fusing guide portion in the conductive layer.

1 is a circuit diagram for explaining a use state of a composite protection device according to the present invention.
2 is a plan view showing a first embodiment of a composite protection device according to the present invention.
3A and 3B are a perspective view and an exploded perspective view showing a first embodiment of the composite protection device according to the present invention, respectively.
4A and 4B are cross-sectional views showing a resistance element according to the present invention, respectively.
Figures 5A-5B are longitudinal cross-sectional views of AA and BB of Figure 3A, respectively.
6 is a circuit diagram showing a state in which the fusible element is fused when an overcurrent is applied to the main circuit.
7 and 8 are a circuit diagram and a plan view respectively showing a state in which the fusible element is fused when an overvoltage is applied to the main circuit.
Fig. 9 is a longitudinal sectional view of CC of Fig. 3A showing a state in which the fusible element is fused when an overvoltage is applied to the main circuit; Fig.
10 is an exploded perspective view showing a second embodiment of the composite protection device according to the present invention.
11 is an exploded perspective view showing a third embodiment of the composite protection device according to the present invention.
12 is a circuit diagram showing a fourth embodiment of the composite protection device according to the present invention.
13A and 13B are a plan view and a cross-sectional view showing a protective element in which a fusible element is formed on a conventional resistor.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a circuit diagram for explaining a use state of a composite protection device according to the present invention.

Referring to FIG. 1, the complex protective device according to the present invention protects circuits and elements connected to the main circuit in an abnormal state by the fusing of the fusible element 10 connected on the main circuit.

The main circuit to which the complex protection device according to the present invention is applied is not particularly limited and may be a charging circuit in which the battery is charged.

On the main circuit, a fusible element 10, a battery, a charger and a fusible element 10 are connected to each other. Specifically, the main circuit may include a plurality of resistive elements 20, 20a, 25, and 25a connected to the fuseable element 10, and a switching element 30 connected to the plurality of resistive elements.

The switching device 30 includes a diode 32 and a control signal for turning on the transistor 31 when the transistor 31 and the overvoltage are applied thereto to control the current flowing to the resistance device And a control unit 33 for controlling the operation of the apparatus.

First, when an overcurrent is applied to the main circuit, the fusible element 10 is fused by heat due to its overcurrent to protect the circuit and the circuit element.

Next, when an overvoltage is applied to the main circuit, the fusible element 10 is fused by the heat of the resistor elements 20, 20a, 25 and 25a to protect the circuit and the circuit elements.

FIG. 2 is a plan view showing a first embodiment of a composite protection device according to the present invention, FIGS. 3A and 3B are a perspective view and an exploded perspective view showing a first embodiment of a composite protection device according to the present invention, 4A and 4B are sectional views showing a resistance element according to the present invention, respectively.

2 through 3B, the complex protection device according to the present invention includes a substrate S, and the fusible element 10, the resistive elements 20, 20a, 25, 25a, A switching element 30 is provided. The resistive elements 20, 20a, 25 and 25a include surface-mounted resistive elements 20 and 20a and printed resistive elements 25 and 25a.

In order to install the fuse element 10 and the resistance elements 20, 20a, 25 and 25a on the substrate S, the substrate S is provided with fuse terminals 50 and 50a, The second resistor terminals 60c and 60d, the first and second connection terminals 40 and 40a and the first and second terminals 55 and 55a are formed.

The fuse terminals 50 and 50a and the first resistor terminals 60a and 60b and the second resistor terminals 60c and 60d are juxtaposed on the same plane.

A fusible element 10 is provided on the fuse terminals 50 and 50a.

A first surface-mounted resistor element 20 and a first printed resistor element 25 are provided on the first resistor terminals 60a and 60b and on the second resistor terminals 60c and 60d, Type resistive element 20 and a second printed resistive element 25a are provided.

The first and second connection terminals 40 and 40a connect the first resistor terminals 60a and 60b to the second resistor terminals 60c and 60d, And the second connection terminal 40a connects the first resistor terminal 60a and the second resistor terminal 60c to each other.

The first terminal 55 is connected to the first resistor terminal 60b and the second terminal 55a is connected to the second resistor terminal 60c.

The fusible element 10 is connected to the fuse terminals 50 and 50a and is fused when an overcurrent is applied to the main circuit to protect the circuit and the circuit elements.

The fusible element 10 may be made of a metal or an alloy having a melting point of 120 to 300 ° C.

The first and second surface mount type resistive elements 20 and 20a function to heat the fusible element 10 when heated by application of an overvoltage and are preferably disposed on both sides of the fusible element 10 Do.

The first and second surface mount type resistive elements 20 and 20a include a body 21 made of a ceramic material, a terminal portion 23 formed at both ends of the body 21, A resistive layer 22 formed and a coating layer 24 protecting the resistive layer 22 (see FIG. 4A).

The first and second surface mount type resistive elements 20 and 20a each have a body 21, a terminal portion 23 formed at both ends of the body 21, a coil 25 on the outer surface of the body 21, Can be exemplified as being the wound resistor element (see Fig. 4B).

However, the present invention is not limited to this, and it is needless to say that various kinds of resistance elements such as resistive elements, helical grooves, melf type, and chip type can be used.

The first and second printed resistive elements 25 and 25a generate heat when applied with an overvoltage and provide heat to the fusible element 10 like the first and second surface-mounted resistive elements 20 and 20a do.

The first and second printed resistive elements 25 and 25a are disposed below the first and second surface mounting resistive elements 20 and 20a and specifically between the both terminal portions 23 and the body 21 Respectively.

On the other hand, a first insulating layer 41, a conductive layer 42, and a second insulating layer 43 are sequentially stacked on the first and second connection terminals 40 and 40a.

The first insulating layer 41 serves to electrically isolate the first and second connection terminals 40 and 40a from the conductive layer 42.

The conductive layer 42 serves to electrically connect the fusible element 10 to the first and second surface mount type resistive elements 20 and 20a and the first and second printed resistive elements 25 and 25a One end of which is connected to the first terminal 55 and the other end of which is configured to be disconnected from the second terminal 55a. The conductive layer 42 may be formed by applying silver (Ag) paste or the like on the first insulating layer 41.

The conductive layer 42 includes a fusing inducing portion 42c and a fusible element 10 extending to one side of the fusing guide portion 42c and electrically connected to the fusible element 10 and the first surface- A conductive portion 42b electrically connecting the resistance element 20 and a heat transfer portion 42a extending from the other end of the fusing inducing portion 42c and physically in contact with the second surface- ).

The fusing guide portion 42c is an area provided directly below the fusible element 10 in the conductive layer 42. The fusible element 42c is formed by the heat generated by the first and second surface mount type resistive elements 20 and 20a And serves to induce melting and agglomeration of the melted fusible element 10.

The fusible guide portion 42c is formed to have a width larger than that of the conductive portion 42b and the heat transfer portion 42a and is formed to protrude in the longitudinal direction of the fusible element 10. [ This is because the melting of the fusible element is promoted because the heat transmitted by the increased area of the fusing guide portion increases.

It is preferable that the front end portion and the rear end portion of the fusing guide portion 42c are each formed in a circular or elliptical shape having a semicircular shape and will be described later.

The second insulating layer 43 electrically blocks the conductive layer 42 and the first and second surface mounting resistive elements 20 and 20a and the printed resistive elements 25 and 25a.

The fusible element 10, the first and second surface mount type resistive elements 20 and 20a and the first and second printed resistive elements 25 and 25a are juxtaposed on the second insulating layer 43 .

A hole 44 is formed in the second insulating layer 43 to connect the fusible element 10 and the conductive layer 42, specifically, the fusing guide portion 42c.

It is preferable that the hole 44 has a size and a shape corresponding to the fusing guide portion 42c.

Figures 5A-5B are longitudinal cross-sectional views of A-A and B-B, respectively, of Figure 3A.

5A, the fusing guide portion 42c of the conductive layer 42 is exposed through the hole 44 and a conductive material such as a solder paste 45 is coated on the exposed fusing guide portion 42c And is connected to the fusible element 10.

When an overvoltage is applied to the main circuit, the current flows in the order of the fusible element 10, the conductive layer 42, and the first terminal 55.

Referring to FIGS. 5A and 3B together, the current applied to the fusible element 10 is diverged in the middle of the fusible element 10 and flows to the first terminal 55 via the conductive layer 42. The current applied to the first terminal 55 flows to the second terminal 55a through the first and second surface-mounted resistor elements 20 and 20a connected in parallel using the first and second connection terminals 40 and 40a I go in. At this time, the first printed resistive element 25 shares the first surface-mounted resistive element 20 with the first resistive terminal 60a and 60b, and the second printed resistive element 25a The first and second surface mount resistor elements 20 and 20a and the first and second print resistor elements 20a and 20b share the second surface mount type resistor element 20a and the second resistor terminal elements 60c and 60d, 25a are connected in parallel and the current applied to the first terminal 55 is branched so that the first and second surface-mounted resistive elements 20, 20a and the first and second printed resistive elements 25a and 25a and then joins again at the second terminal 55a.

On the other hand, the current flows through the first and second surface-mounted resistor elements 20 and 20a and the first and second printed resistive elements 25 and 25a, And the first and second printed resistive elements 25 and 25a generate heat at both sides of the fusible element 10 and this heat not only heats the fusible element 10 in the form of radiant heat, 42) in the form of conductive heat through the heat transfer portion (42a) and the conductive portion (42b) The fusible element 10 is heated so that the fusible element 10 is fused. However, the conductive layer 42 may include only the conductive portion 42b without the heat transfer portion 42a.

Referring to FIG. 5B, a surface-mounted resistor element 20 and a printed resistor element 25 are connected to the first resistor terminals 60a and 60b, respectively.

The first resistor terminals 60a and 60b are respectively connected to a surface mount type resistor terminal portion 61 to which the surface mount type resistor elements 20 and 20a are connected and a printed type resistor terminal portion 61 to which the print type resistor elements 25 and 25a are connected And a connection portion 63 connecting the surface-mounted resistor terminal portion 61 and the printed-type resistance terminal portion 62. At this time, the surface mount type resistor terminal portion 61, the print type resistance terminal portion 62, and the connection portion 63 are preferably integrally formed.

The first printed resistive element 25 is formed of a thin film formed on the first resistive terminals 60 and 60a and the second insulating layer 43 in a printing manner, The thickness of the entire resistive element is not increased.

Therefore, even if the surface mount type resistor element and the print type resistor element are provided at the same time, miniaturization of the product can be realized.

Further, since the printed resistive element distributes the current or the voltage, the thermal characteristic is enhanced and the fusing element can be shortened in the fusing time.

In addition, since the first and second surface mount type resistive elements 20 and 20a having different structures and shapes and the first and second printed resistive elements 25 and 25a are provided together, a protective element corresponding to various power and high power .

On the other hand, since the surface mount type resistors 20 and 20a and the printed resistive elements 25 and 25a of the present invention are all mounted on a substrate without a lead wire, it is easy to apply an automated process.

6 is a circuit diagram showing a state in which the fusible element is fused when an overcurrent is applied to the main circuit.

Referring to FIG. 6, when the surge current is momentarily applied to the main circuit or the overcurrent is continuously applied, the fusible element 10 is fused by self heat.

At this time, the fusible element 10 prevents the damage or explosion of the fusible element 10 because the fusible element 10 is fused in the area of the front end 11 and the main circuit is cut off.

FIGS. 7 and 8 are a circuit diagram and a plan view respectively showing a fusible element being fused when an overvoltage is applied to the main circuit, and FIG. 9 shows a state where the fusible element is fused when an overvoltage is applied to the main circuit Fig.

7 to 9, when the overvoltage exceeding the reference voltage is applied to the main circuit as described above, the current is controlled to flow from the switching element 30 to the resistor elements 20, 20a, 25, and 25a (See Fig. 1)

The fusible element 10 includes an intermediate portion 12 in contact with the fusing guide portion and a front end portion and a rear end portion extending from the front and rear of the intermediate portion, The heat is generated in at least one of the front end region 11 and the rear end region 13 to protect the circuit.

The front end portion 11 and the rear end portion 13 which are not in direct contact with the fusing guide portion 42c because the region of the intermediate portion 12 of the fusible element 10 is heated by the heat radiation as well as the radiant heat, (See Figure 3A). ≪ RTI ID = 0.0 >

Therefore, when the fusible element 10 is heated, the intermediate portion 12 melts before the front end portion 11 and the rear end portion 13, and the front end portion 11 and the rear end portion 13).

At this time, the fusing guide portion 42c is preferably circular or elliptical. This is because the intermediate portion 12 melted on the circular induction portion 42c of the circular shape has a uniform force of molecular force in the center direction and a cohesive force becomes large and the front end portion 11 and the rear end portion 13 are securely It is separated.

10 is an exploded perspective view showing a second embodiment of the composite protection device according to the present invention.

Referring to FIG. 10, unlike the first embodiment, no holes are formed in the second insulating layer 43, and two holes may be formed separately.

Specifically, the second insulation layer 43 includes a first insulation portion 43a disposed directly below the first printed resistive element 25 and a second insulation portion 43b disposed directly under the first printed resistive element 25a. And a second insulating portion 43b disposed on the second insulating layer 43b.

The first and second insulating portions 43a and 43b are spaced from each other and the fusible element 10 is connected to the fusing inducing portion 42c through spaced spaces between the first and second insulating portions 43a and 43b .

11 is an exploded perspective view showing a third embodiment of the composite protection device according to the present invention.

11, the present embodiment may have a structure in which the second insulating layer 43 and the printed resistive elements 25 and 25a are omitted, unlike the first embodiment.

The first surface-mounted resistor elements 20 and 20a, the fusible element 10 and the second surface-mounted resistor elements 25 and 25a are juxtaposed directly on the conductive layer 42. [

12 is a circuit diagram showing a fourth embodiment of the composite protection device according to the present invention.

12, the compound housing according to the present invention is different from that of FIG. 1 in that the first surface-mounted resistor element 20 and the first printed resistor element 25 are connected in parallel, and the second surface- Type resistive element 20a and the second printed resistive element 25a are connected in parallel, the first and second surface-mounted resistive elements 20 and 20a are connected in series, and the first and second printed- The resistance elements 25 and 25a may be connected in series.

As described above, the complex protection device that blocks the current and voltage in the abnormal state according to the present invention can be configured so that a plurality of resistive elements are combined in parallel and in series.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and similarities. Accordingly, the scope of the present invention should be construed as being limited to the embodiments described, and it is intended that the scope of the present invention encompasses not only the following claims, but also equivalents thereto.

10: fusible element 11: front end
12: intermediate portion 13: rear end portion
20, 20a: surface mount type resistor element 21:
22: resistance layer 23: terminal portion
24: Coating layer 25, 25a: Printed resistive element
30: switching element 31: transistor
32: diode 33:
40: connection terminal 41: first insulation layer
42: conductive layer 43: second insulating layer
44: hole 50: fuse terminal
55, 55a: first and second terminals 60: resistance terminal

Claims (10)

A substrate having fuse terminals, first and second resistance terminals, and connection terminals connecting the first and second resistance terminals;
A fusible element connected to the fuse terminal;
A first surface-mounted resistor element connected to the first resistor terminal;
A second surface-mounted resistor element connected to the second resistor terminal;
A switching element for controlling the current to flow to the first and second surface-mounted resistor elements when an overvoltage is applied;
A first insulating layer formed on the connection terminal; And
A fusible element formed on the first insulating layer and disposed directly below the fusible element for conducting heat of the first and second surface-mounted resistive elements to the fusible element to induce fusing of the fusible element; A conductive portion extending from one side of the fusible guide portion and connecting the fusible element to the first surface-mounted resistor element; and a second surface-mounted resistor element extending from the other side of the fusing guide portion, And a conductive layer made of a heat transfer portion in contact therewith,
Wherein the fusing-inducing portion is larger in width than the conductive portion and the heat-conducting portion and is circular or elliptical,
The first and second resistance terminals and the fuse terminals are juxtaposed on the same plane,
Wherein the first and second resistance elements are disposed on both sides of the fusible element,
Wherein the fusible element is fused by conduction heat through the fusing guide portion and radiant heat radiated from both sides of the fusible element. delete delete delete delete delete The method according to claim 1,
At least one printed resistive element connected to at least one of the first resistor terminal and the second resistor terminal and connected to at least one of the first surface-mounted resistor element and the second surface-mounted resistor element; And
And a second insulating layer disposed between the conductive layer and the printed resistive element. 8. The method of claim 7,
Wherein the printed resistive element comprises a first printed resistive element disposed directly below the first surface-mounted resistive element and a second printed resistive element disposed directly below the second surface-mounted resistive element, And a protective layer formed on the protective layer. 9. The method of claim 8,
Wherein the fusible element, the surface-mounted resistor element, and the printed resistive element are juxtaposed on the second insulating layer,
Wherein the second insulation layer is formed with a hole so that the fusible element and the conductive layer can be connected to each other. 9. The method of claim 8,
Wherein the second insulating layer comprises a first insulating portion disposed directly under the first printed resistive element and a second insulating portion disposed directly below the second printed resistive element,
The first and second insulating portions are spaced apart from each other,
Wherein the fusible element is in contact with the fusing guide portion.

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