KR101494755B1 - Substrate processing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus improved in structure so as to prevent damage to the heater unit and shortening of the life span of the heater unit as the process gas flows into the heater unit. A substrate processing apparatus according to the present invention includes: a chamber in which a space is formed in which processing is performed on a substrate; a susceptor which is installed in a space portion of the chamber so as to be able to move up and down; A heater for heating the substrate; and a non-reactive gas supplying means for supplying the non-reactive gas to the heater so as to prevent the process gas from flowing into the heater.

Substrate, unreacted gas, heater

Description

[0001] Substrate processing apparatus [

The present invention relates to a substrate processing apparatus for performing a predetermined process such as a thin film deposition process or a photolithography process on a substrate.

Generally, in order to manufacture a semiconductor device or a liquid crystal display device, a thin film deposition process for depositing a raw material on a silicon wafer or glass (hereinafter referred to as a substrate), a process for exposing or hiding a selected region of these thin films using a photosensitive material A photolithography process, and the like. Such a process is performed in a substrate processing apparatus.

1 is a schematic cross-sectional view of a conventional substrate processing apparatus.

1, a conventional substrate processing apparatus 9 includes a chamber 1, a susceptor 2 mounted on the inside of the chamber so as to be vertically movable and rotatable, on which a substrate is placed, A showerhead 3 for spraying a process gas to the substrate, and a heater 4 disposed below the susceptor 3 for heating the substrate. The heater unit 4 is for heating the substrate to a process temperature. The heater unit 4 includes a plate-shaped heating member that generates heat when power is applied thereto, and a plurality of heat- .

However, in the case of the conventional substrate processing apparatus 9, as shown by arrows in FIG. 1, the process gas injected from the showerhead 3 flows into the inside of the heater portion through the clearance between the plates. The process gas thus introduced reacts with the heating member or is deposited on the inside of the heater unit (in particular, the heating member). As a result, the heater unit 4 is damaged and its life is shortened.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate processing apparatus which is improved in structure so as to prevent damage to a heater unit and shortening of its service life as a process gas flows into a heater unit .

According to an aspect of the present invention, there is provided a substrate processing apparatus comprising: a chamber in which a space for processing a substrate is formed; a susceptor installed in a space of the chamber so as to be able to move up and down; A heater for heating the substrate; a heater for heating the substrate; a heater for heating the substrate; a heater for heating the substrate; a heater for heating the substrate; a gas supplier for injecting a process gas toward the substrate; And a non-reacted gas supply means for supplying a gas.

According to the present invention, the heater section includes: an inner ring formed in a ring shape and having the drive shaft inserted therein, a plurality of inflow holes formed in a circumferential direction and passing through the inner ring, And an upper plate coupled to the inner ring so as to be disposed on the upper side of the heating member, wherein the nonreactive gas flows into the inlet hole of the inner ring and then flows outwardly .

According to the present invention, the non-reacting gas supply means includes a flow path forming tube formed in a hollow shape and coupled to the chamber and having the drive shaft inserted therein, and a flow path forming tube coupled to the flow path forming tube, And a non-reactive gas supply pipe for supplying the non-reactive gas into the space between the drive shaft and the drive shaft.

According to the present invention, an injection hole communicating with the inside of the inner ring is formed in a bottom portion of the chamber, and the non-reacting gas supply means is connected to the injection hole, And a non-reactive gas supply pipe for supplying a reactive gas.

According to the present invention, since the process gas is prevented from flowing into the heater unit, the heater unit is damaged or the service life is shortened as the heat generating member reacts with the process gas or the process gas is deposited inside the heater unit. .

2 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention.

2, the substrate processing apparatus 100 according to the present embodiment includes a chamber 10, a susceptor 20, a gas supplier 30, a heater unit 40, .

Inside the chamber 10, there is provided a space 11 in which a substrate processing process, that is, a thin film deposition process for depositing a raw material, a photolithography process for exposing or concealing a selected one of the thin films using a photosensitive material, Respectively. The chamber 10 is provided with a gate 12 for carrying in / out the substrate and an exhaust passage 13 for exhausting the gas inside the chamber.

The susceptor 20 is formed in a flat plate shape where the substrate is seated, and a plurality of seating surfaces (not shown) on which the substrate is seated are formed on the susceptor. The susceptor is coupled to the drive shaft 21, and is mounted on the space portion 11 of the chamber so as to be able to move up and down.

The gas supplier 30 is for supplying the process gas toward the substrate. In the case of the present embodiment, the shower head 30 is employed as the gas supplier. The showerhead is installed above the susceptor 20 and injects the process gas toward the substrate. Further, depending on the kind of the process, the showerhead 30 may jet purge gas or the like toward the substrate.

The heater portion 40 is for heating the substrate to the process temperature. The heater 40 is disposed below the susceptor, and includes a heating member 41 and a protection member.

The heating member 41 is for heating the substrate, and is made of a material that generates heat when power is applied. In this embodiment, the heat generating member is made of compressed carbon fiber and is disposed around the drive shaft 21.

The protection member is for protecting the heat generating member 41 from the process gas and made of a quartz material which does not react with the process gas. 2, the protective member includes an inner ring 42, an outer ring 43, an upper plate 44, and a lower plate 45. As shown in FIG. The inner ring 42 is formed in a ring shape and disposed inside the heat generating member 41, and a drive shaft is inserted into the inner ring 42. A plurality of inflow holes 421 are formed through the inner ring 42 along the circumferential direction. The outer ring 43 is formed in a ring shape, and a heating member 41 is disposed inside. The upper plate 44 is formed in an annular plate shape and is disposed on the upper side of the heat generating member 41 by being coupled to the inner ring 42 and the outer ring 43. The lower plate 45 is formed on an annular plate and is disposed on the lower side of the heat generating member 41 by being coupled to the inner ring 42 and the outer ring 43. The upper plate 44 and the lower plate 45 are integrally formed with each other. However, the upper plate 44 and the lower plate 45 may be integrally formed by a plurality of plate pieces May be combined.

The non-reactive gas supply means is for supplying the non-reactive gas to the heater unit 40 so that the process gas is prevented from flowing into the heater unit 40. Here, the non-reacted gas means an inert gas such as argon (Ar) or a gas which does not react in the chamber, such as nitrogen (N ₂ ).

In the case of this embodiment, the non-reacting gas supply means includes a flow path forming tube 51, a lower plate 52 and a non-reacting gas supplying pipe 53. The flow path forming tube 51 is formed in a hollow shape having a larger diameter than the drive shaft 21. [ The flow path forming tube 51 is coupled to the lower end of the chamber and the drive shaft 21 is inserted into the flow path forming tube 51. The lower plate 52 is coupled to the lower end of the flow path forming tube 51. The lower plate 52 is formed with a through hole into which the drive shaft 21 is inserted, and an O-ring (not shown) for sealing is coupled to the through hole. The lower plate 52 is provided with an inflow passage 521 communicating with a space between the flow passage forming tube and the drive shaft. The non-reacted gas supply pipe 53 is connected to the inflow channel 521 and supplies the unreacted gas supplied from the outside (non-reactive gas storage tank) to the inflow channel 521.

In the substrate processing apparatus 100 constructed as described above, when the non-reacted gas is supplied through the non-reacted gas supply pipe 53, the non-reacted gas flows through the inflow path 521, And flows into the interior of the inner ring 42 through the space between the forming tube 51 and the drive shaft 21. Thereafter, the non-reacted gas flows into the inside of the heater through the inflow hole 421 formed in the inner ring 42, flows outward along the heating member, spreads over the entire heater, is discharged through the gap between the upper plate 44 and the outer ring 43 and discharged to the outside through the exhaust flow path 13 as shown in FIG. On the other hand, when the upper plate 44 is formed of a plurality of plate pieces as described above, the upper plate 44 also flows out through gaps between the upper plate pieces as shown by the dotted arrow b in FIG.

In this way, the non-reactive gas flows into the heater 40, so that the pressure in the heater becomes relatively higher than the outside of the heater (above the heater). Therefore, the process gas injected from the showerhead is prevented from flowing into the inside of the heater, and as a result, the process gas is reacted with the heating member 41 or deposited on the heating member, do.

As described above, in this embodiment, since the non-reactive gas is supplied to the inside of the heater portion, the pressure in the heater portion is relatively increased, thereby preventing the process gas from flowing into the heater portion. As a result, Is prevented from being damaged or shortened in service life due to reaction of the heating member with the process gas or deposition of the process gas in the heater unit.

In addition, since the space in which the drive shaft is inserted is used as an inflow path of the non-reactive gas, the present invention can be implemented by adding only a simple structure (a flow path forming tube and a lower plate) without greatly changing the structure of a conventional substrate processing apparatus .

3 is a cross-sectional view of a substrate processing apparatus according to another embodiment of the present invention.

Referring to FIG. 3, an injection hole 14 is formed through the bottom of the chamber 10A. The injection hole 14 is disposed below the inner ring 42 and communicates directly with the interior of the inner ring. The unreacted gas supply pipe 53A is connected to the injection hole 14 and supplies the unreacted gas supplied from the outside to the injection hole. As shown by the arrow in FIG. 3, the supplied unreacted gas is introduced into the interior of the inner ring, and then flows into the interior of the heater through the inlet hole of the inner ring.

4 is a cross-sectional view of a substrate processing apparatus 100B according to another embodiment of the present invention.

4, the heater unit 40B according to the present embodiment includes a heating member 41B, an inner ring 42B, an outer ring 43B, and an upper plate 44B. The heating member 41B is for heating the substrate and is disposed around the driving shaft 21. [ The inner ring 42B is formed in a ring shape and disposed inside the heat generating member 41B, and a drive shaft is inserted into the inner ring 42B. The outer ring 43B is formed in a ring shape, and a heat generating member 41B is disposed therein. The upper plate 44B is formed in an annular plate shape and is disposed on the upper side of the heat generating member 41B by being coupled to the inner ring 42B and the outer ring 43B.

The chamber 10B is provided with an injection hole 14B which is disposed below the heating member and penetrates the bottom of the chamber. In the case of this embodiment, the injection holes 14B are formed in plural along the circumferential direction of the heat generating member 41B. Further, a non-reactive gas supply pipe 53B is connected to each injection hole 14B.

Unreacted gas supplied through the unreacted gas supply pipe 53B flows toward the heat generating member 41B and then spreads to the entire heater unit and then flows into the outer ring 43B and the inner ring 43B, Through the gap between the upper plate 42B and the upper plate 44B, and then discharged to the outside through the exhaust passage.

Also in this embodiment, since the pressure in the heater portion (the pressure of the space in which the heating member is disposed) is relatively high as in the above-described embodiment, the process gas is prevented from flowing into the heater portion, It is prevented that the process gas is reacted with the heating member or the process gas is deposited in the heater unit, thereby causing damage and shortening of the life of the heater unit.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation in the embodiment in which said invention is directed. It will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the appended claims.

For example, although unreacted gas is discharged to the outside through the existing exhaust flow path 13 in the present embodiment, a separate exhaust flow path for discharging the non-reactive gas may be additionally formed in the chamber.

In this embodiment, the non-reacted gas is discharged to the outside of the heater through the gap between the upper plate and the outer ring, but the unreacted gas is discharged through the discharge hole to the outside of the heater It may also constitute an invention.

1 is a cross-sectional view of a conventional substrate processing apparatus.

2 is a cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention.

3 is a cross-sectional view of a substrate processing apparatus according to another embodiment of the present invention.

4 is a cross-sectional view of a substrate processing apparatus according to another embodiment of the present invention.

Description of the Related Art

100 ... substrate processing apparatus 10 ... chamber

20 ... susceptor 21 ... drive shaft

30 ... Showerhead 40 ... Heater

41 ... heat generating member 42 ... inner ring

421 ... inlet ball 43 ... outer ring

44 ... upper plate 45 ... lower plate

51 ... flow path forming tube 52 ... bottom plate

53 ... Non-reacted gas supply pipe

Claims (5)

delete A chamber in which a space is formed in which processing for the substrate is performed; A susceptor mounted on the space of the chamber so as to be able to move up and down; A gas supplier for injecting a process gas toward the substrate; A heater disposed below the susceptor and heating the substrate; And And non-reactive gas supply means for supplying the non-reactive gas to the heater unit so that the process gas is prevented from flowing into the heater unit, The heater unit includes: An inner ring which is formed in a ring shape and into which a drive shaft is inserted and in which a plurality of inflow holes are formed in a circumferential direction, A heating member disposed outside the inner ring and generating heat when power is applied, And an upper plate coupled to the inner ring so as to be disposed on the upper side of the heating member, Wherein the nonreactive gas flows into the inlet hole of the inner ring and then flows outwardly. 3. The method of claim 2, The non-reacted gas supply means includes: A flow path forming tube formed in a hollow shape and coupled to the chamber and having the drive shaft inserted therein, And a non-reacted gas supply pipe connected to the flow path forming pipe and supplying the non-reactive gas into a space between the flow path forming pipe and the drive shaft. 3. The method of claim 2, Wherein an injection hole communicating with the inside of the inner ring is formed in a bottom portion of the chamber, The non-reacted gas supply means includes: And an unreacted gas supply pipe connected to the injection hole and supplying an unreacted gas into the inner ring. A chamber in which a space is formed in which processing for the substrate is performed; A susceptor mounted on the space of the chamber so as to be able to move up and down; A gas supplier for injecting a process gas toward the substrate; A heater disposed below the susceptor and heating the substrate; And And non-reactive gas supply means for supplying the non-reactive gas to the heater unit so that the process gas is prevented from flowing into the heater unit, The heater unit includes: An inner ring formed in a ring shape and having a drive shaft inserted therein, A heating member disposed outside the inner ring and generating heat when power is applied, And an upper plate coupled to the inner ring so as to be disposed on the upper side of the heating member, The chamber is provided with an injection hole formed through the bottom of the chamber and disposed below the heating member, The non-reacted gas supply means includes: And a non-reactive gas supply pipe connected to the injection hole and supplying the non-reactive gas to the heating member.

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