KR101493792B1 - Flexible thermoelectric device and fabricating method thereof - Google Patents

Abstract

The present invention relates to a flexible thermoelectric device and a method of fabricating the same. A thermoelectric material is formed on a flexible substrate. A pore included in the thermoelectric material is filled with an organic polymer material. According to the present invention, a pore included in the thermoelectric material is filled with an organic polymer material with excellent flexibility, so that not only the flexibility of the thermoelectric device may be improved but also the physical strength or electric conductivity may be improved.

Description

[0001] FLEXIBLE THERMOELECTRIC DEVICE AND FABRICATING METHOD THEREOF [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible thermoelectric element and a method of manufacturing the same, and more particularly, to a flexible thermoelectric element having improved flexibility by filling pores in a thermoelectric layer with an organic polymer.

The thermoelectric effect collectively refers to the effect of the interaction of thermal energy and electric energy, that is, the Seebeck effect found by Thomas Seebeck and the Peltier effect found by Peltier, Is generally referred to as a thermoelectric device.

Thermoelectric Power Generating Device is a thermoelectric power generating device that uses a Seebeck effect that generates an electromotive force due to a temperature difference, and a cooling device that uses a Peltier effect that absorbs (or generates) heat when a current is applied. Device).

Conventional thermoelectric elements are formed by forming a thermoelectric material made of N-type and P-type semiconductors on a ceramic substrate such as alumina (Al ₂ O ₃ ) and forming a bulk (Bulk ) Structure, and its structure is generally shown in Fig.

1, a conventional thermoelectric element 100 includes a lower substrate 110, a first electrode 120 formed on the lower substrate 110, an n-type thermoelectric material 130 (not shown) formed on the first electrode 120, Type thermoelectric material 140 and a second electrode 150 formed in series with the N-type thermoelectric material 130 and the P-type thermoelectric material 140 together with the first electrode 120, And an upper substrate 160 disposed on the upper substrate 150. The first electrode 120 having a predetermined pattern is formed on the lower substrate 110 and the N-type thermoelectric material 130 and the P-type thermoelectric material 140 are sequentially formed on the first electrode 120, The N-type thermoelectric material 130 and the P-type thermoelectric material 140 are electrically connected to the first electrode 120 and the second electrode 160. In this case, 150 in series. The first electrode 120 and the second electrode 150 are formed on either the lower substrate 110 or the upper substrate 160 so that the N-type thermoelectric material 130 and the P- The first electrode 120 and the second electrode 150 may be connected in series.

However, in the conventional thermoelectric element 100, since a ceramic substrate such as alumina (Al ₂ O ₃ ) is usually used for the lower substrate 110 and the upper substrate 160 and a bulk thermoelectric material is used, Such as automobiles, automobiles, airplanes, and space shuttles, and is difficult to mass-produce due to the complexity of the manufacturing process, resulting in poor economics. In recent years, there has been a growing interest in thermoelectric elements having flexible characteristics in accordance with the development of computers such as wearable computers. However, since the conventional thermoelectric element 100 has no characteristic of being flexible, There is a problem of narrowness.

The above problems can be overcome by forming a thermoelectric material on a flexible substrate such as a PET (polyethylene terephthalate) film by a screen printing method by using a screen printing method. However, in the case of a thermoelectric material thick film formed by a screen printing technique, There is a problem that the flexibility of the thermoelectric element is deteriorated by forming a large number of pores in the thick film. Further, there is a problem that the physical strength of the thermoelectric substance thick film is lowered by the pores.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems of the prior art, and it is an object of the present invention to provide a flexible thermoelectric element which is superior in flexibility to a conventional thick film thermoelectric device, It has its purpose.

Another object of the present invention is to provide a flexible thermoelectric element which is lighter than a conventional bulk type thermoelectric element, has a simple manufacturing process, is easy to mass-produce and is economical, and a method of manufacturing the same.

According to one aspect of the present invention, there is provided a flexible thermoelectric device including a flexible substrate, an N-type thermoelectric material and a P-type thermoelectric material formed on the flexible substrate, an N-type thermoelectric material and a P- Type thermoelectric material and the P-type thermoelectric material include pores therein, and at least a part of the pores are filled with an organic polymer material.

At this time, the organic polymer material may be an organic conductive polymer material, and may be PEDOT: PSS.

The N-type thermoelectric material and the P-type thermoelectric material may be alternately disposed on the flexible substrate and connected in series by the electrode, and the N-type thermoelectric material may be bismuth-tellurium (Bi _x Te _{1 -x} ) Compound, and the P-type thermoelectric material may be an antimony-tellurium (Sb _x Te _{1 -x} ) compound.

(B) forming an N-type thermoelectric material and a P-type thermoelectric material on the flexible substrate; (c) forming the N-type thermoelectric material and the P-type thermoelectric material on the flexible substrate; Filling the pores in the thermoelectric material and the p-type thermoelectric material with an organic polymer material; and (d) forming an electrode so as to electrically connect the n-type thermoelectric material and the p-type thermoelectric material in series.

The step (b) may be performed by a screen printing method. The step (b-1) may include a thermocompression paste synthesis step, (b-2) a thermo-paste printing step, and (b-3) have.

The step (b-1) may be performed by mixing a thermoelectric material powder, a solvent, a binder, and a glass powder, wherein the step (b-3) A second heat treatment step for evaporating the binder, and a third heat treatment step for increasing the thermoelectric properties of the thermoelectric material, wherein the first, second and third heat treatment steps are sequentially higher Temperature < / RTI > At this time, pores may be generated in the thermoelectric material by the step (b-3).

The step (c) may include coating the organic polymer material on the thermoelectric material, and then maintaining the thermoelectric material to permeate the thermoelectric material for a predetermined time.

The method may further include, after the step (c), removing the organic polymer material remaining in the space other than the pores.

Also, the step (d) may be performed before the step (b).

According to the flexible thermoelectric element and the method for fabricating the same according to the present invention, the pores in the thermoelectric material thick film formed on the flexible substrate are filled with the organic polymer material, so that the flexible thermoelectric element is superior in flexibility to the conventional thick film thermoelectric element, It is possible to further improve the physical strength of the substrate.

Further, according to the flexible thermoelectric element and the method of manufacturing the same according to the present invention, it is lightweight, simple in manufacturing process, easy in mass production, and excellent in economical efficiency.

1 is a cross-sectional view of a conventional thermoelectric element
2 is a top view of the flexible thermoelectric element according to the present invention
3 is a cross-sectional view taken along the line AA '
4 is a schematic flow chart of a method of manufacturing a flexible thermoelectric element according to the present invention
FIG. 5 is a flowchart of a thermoelectric material forming step by a screen printing method according to an embodiment of the present invention.
6A is a scanning electron microscope photograph of a thermoelectric material before filling the organic polymer material
6B is a scanning electron micrograph of the thermoelectric material after the organic polymer material filling step
7 is a graph comparing internal resistance changes according to the radius of curvature when the pores in the thermoelectric material are filled with the organic polymer material and when the pores in the thermoelectric material are not filled according to the present invention
8 is a graph showing the change in internal resistance with the radius of curvature of the flexible thermoelectric element fabricated according to the present invention
9 is a graph comparing the dimensionless figure of merit (ZT) of the thermoelectric thick film before and after filling the organic polymer material
10 is a graph showing the output voltage and output power according to the temperature difference of the flexible thermoelectric element manufactured according to the present invention

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or limited by the embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Fig. 2 is a top view of the flexible thermoelectric element according to the present invention, and Fig. 3 is a sectional view taken on line A-A 'in Fig. 2 and 3, the flexible thermoelectric element 200 according to the present invention includes a flexible substrate 210, an N-type thermoelectric material 220 formed on the flexible substrate 210, and a P- Type thermoelectric material 220 and an electrode 240 electrically connecting the material 230, the N-type thermoelectric material 220 and the P-type thermoelectric material 230 in series, 230 is a thick film including pores therein, and at least a part of the pores are filled with an organic polymer material.

The flexible substrate 210 is for supporting a thermoelectric element as a whole and having a characteristic that the thermoelectric element is flexible, and includes a polyimide film, a Kapton film, a polyester film, a PEN film , Plastic film, PDMS, paper, and the like, it is preferable that the material is heat-resistant enough to withstand the subsequent process temperature.

The N-type thermoelectric material 220 and the P-type thermoelectric material 230 formed on the flexible substrate 210 are alternately arranged on the flexible substrate 210 so as to be easily connected in series by the electrode 240 desirable. The thermoelectric materials 220 and 230 may be selected from the group consisting of Si, Al, Ca, Na, Ge, Fe, Pb, (Ti), Bi, Co, Ce, Sn, Ni, Cu, Na, K, Pt, (Ru), Rh, Rh, Au, W, Pd, Ti, Ta, Mo, (Bi _x Te _{1 -x} ) compound, a P-type thermoelectric material 230 (for example, a bismuth-tellurium compound) ) May be an antimony-tellurium (Sb _x Te _{1 -x} ) compound.

Here, the N-type thermoelectric material 220 and the P-type thermoelectric material 230 include pores therein, and at least a part of the pores are filled with an organic polymer material not shown in the figure. Poly (3,4-ethylenedioxythiophene), poly (styrenesulfonate) (PEDOT: PSS), poly (fluorene) s, polyphenylenes, polypyrenes, polyazulenes, polynaphthalenes, poly Poly (3,4-ethylenedioxythiophene) (PEDOT), Poly (polyvinylene) (PPV), Poly (pyrrole) s (PPY), Polycarbazoles, Polyindoles, Polyazepines, or an organic conductive polymer such as p-phenylene sulfide (PPS), or an organic nonconductive polymer such as polydimethylsiloxane (PDMS), poly (methyl methacrylate), poly (p-phenylene terephthalamide) (Organic Non-Conducting Polymer) material, and two or more organic polymer materials may be used together. Since the organic polymer material is excellent in flexibility, if the pores of the thermoelectric materials 220 and 230 are filled with the organic polymer material, flexibility and physical strength degraded by the pores can be improved. In addition, since the pores decrease the electrical conductivity of the thermoelectric materials 220 and 230, the electrical conductivity of the thermoelectric materials 220 and 230 can be improved by filling the pores with the organic conductive polymer material.

As shown in FIG. 3, the N-type thermoelectric material 220 may be removed during or after the filling of the organic polymer material, as described below, except for the pores in the thermoelectric materials 220 and 230, Type thermoelectric material 230 may not exist in the space between the thermoelectric element 230 and the thermoelectric element 230. However, if there is no significant influence on the characteristics of the thermoelectric element 200, a structure in which a part of the organic polymer material remains in the space other than the inside of the pore It is possible.

The electrodes 240 are electrically connected in series between the N-type thermoelectric material 220 and the P-type thermoelectric material 230. As shown in FIGS. 2 and 3, all of the electrodes 240 are electrically connected to the thermoelectric materials 220, 230 may be formed on the flexible substrate 210. Unlike the drawing, all the electrodes 240 may be formed under the thermoelectric materials 220 and 230, that is, between the flexible substrate 210 and the thermoelectric materials 220 and 230 Structure. A part of the electrode 240 may be formed on the thermoelectric material 220 or 230 and a part of the electrode 240 may be formed on the lower part. The electrode 240 is preferably made of a metal material having an excellent electrical conductivity and may be formed of a metal such as Ni, Al, Cu, Pt, Ru, Rh, Au, , Tungsten (W), cobalt (Co), palladium (Pd), titanium (Ti), tantalum (Ta), iron (Fe), molybdenum (Mo), hafnium (Hf), lanthanum (La) , And silver (Ag).

4 is a schematic flow chart of a method of manufacturing a flexible thermoelectric element according to the present invention. 4, a flexible thermoelectric device fabrication method according to the present invention includes a flexible substrate providing step S410, a thermoelectric material forming step S420, an organic polymer material filling step S430, and an electrode forming step S440 ).

The step of providing a flexible substrate (S410) is a step of providing a flexible substrate (210) for forming the thermoelectric material (220, 230) on the upper part thereof so as to have a totally flexible characteristic while supporting the device, Is not particularly limited as long as it is a flexible material, but is preferably made of a material having heat resistance enough to withstand process temperatures such as a thermoelectric material forming step (S420).

The thermoelectric material forming step S420 is a step of sequentially forming the N-type thermoelectric material 220 and the P-type thermoelectric material 230 on the flexible substrate 210. The N-type thermoelectric material 220 and the P- 230 may be formed in the form of a thick film having a thickness of several to several hundreds of micrometers (占 퐉). The manufacturing method of the present invention can be applied regardless of whether thermoelectric materials are formed by natural or artificial pores in at least a part of the thermoelectric materials. However, when a thick film is formed by a screen printing method The manufacturing method of the present invention is particularly suitable when the thermoelectric materials 220 and 230 are formed by a screen printing method. In the screen printing method, a screen mask having a hole patterned in a predetermined pattern is placed on a substrate, and the paste is sprayed on the screen mask or pressed by a pressing means so that the paste is formed in a predetermined pattern on the substrate through the hole of the mask. , Which is suitable for forming a thick film in the range of several to several hundred micrometers.

FIG. 5 is a flowchart illustrating a step S420 of forming a thermoelectric material by the screen printing method according to an embodiment of the present invention. 5, a thermoelectric material forming step (S420) of the screen printing method according to an embodiment of the present invention includes a thermoelectric-paste synthesis step (S510), a thermo-paste printing step (S520), a drying and a heat treatment step (530).

The thermoelectric-paste-synthesizing step S510 is a step of synthesizing a paste material for screen printing. In order to form a uniform thermoelectric-paste pattern, a paste in which thermoelectric powders are uniformly mixed with an appropriate viscosity may be formed A solvent for adjusting the fluidity of the paste, a binder for adjusting the printing resolution, and a glass powder for improving the adhesion can be formed. The thermoelectric powder may be selected from the group consisting of silicon, aluminum, calcium, sodium, germanium, iron, lead, antimony, tellurium, A metal such as Bi, Cobalt, Ce, Sn, Ni, Cu, Na, K, Pt, Ru, (Rh), gold (Au), tungsten (W), palladium (Pd), titanium (Ti), tantalum (Ta), molybdenum (Mo), hafnium (Hf), lanthanum (La) And silver (Ag). For example, it is possible to use a bismuth-tellurium (Bi _x Te _{1 -x} ) compound powder for the synthesis of an N-type thermoelectric material paste, Antimony-tellurium (Sb _x Te _{1 -x} ) compound powder can be used. The glass powder may include glass frit composed of Bi ₂ O ₃ , ZnO, and B ₂ O _3. In addition, Al ₂ O ₃ , ZnO, and B ₂ O ₃ may be used as the glass powder. Glass Frit containing about 1 to 20 wt% of at least three oxides selected from the group consisting of O ₃ , SiO ₂ , CeO ₂ , Li ₂ O, Na ₂ O and K ₂ O can be used.

In the thermo-paste printing step S520, a thermo-paste is formed on the flexible substrate 210 by screen-printing the thermoelectric paste synthesized in the thermoelectric-paste synthesis step S510 with the screen mask placed on the flexible substrate 210 .

On the other hand, the printed thermoelectric paste pattern still contains a solvent and a binder, and a high-temperature annealing process is required in order to exhibit thermoelectric properties, so that the drying and heat treatment step S530 is performed. For example, the flexible substrate 210 printed with a thermoelectric paste pattern is placed in an oven at about 100 to 200 ° C for about 10 to 20 minutes to evaporate the solvent, and the solvent Annealing may be performed at a temperature higher than the temperature at the time of evaporation of the binder in order to heat the binder for a predetermined time at a temperature higher than the evaporation temperature (200 ° C or higher) to evaporate the binder, and finally to increase the thermoelectric property of the thermoelectric thick film. At this time, the annealing temperature may be 450 캜 or higher. In order to prevent the evaporation of tellurium (Te) during the high-temperature heat treatment, it is preferable to conduct heat treatment by inserting a tellurium (Te) powder into a heat treatment oven or a heat treatment furnace.

The thermoelectric material forming step S420 should be performed for both the N-type thermoelectric material 220 and the P-type thermoelectric material 230, and the process of FIG. 5 may be repeated for each thermoelectric material. For example, the N-type thermoelectric material 220 is formed on the flexible substrate 210 by performing an N-type thermoelectric-paste printing step (S520), a drying and a heat-treating step (S530) Type thermoelectric material 230 may be formed on the flexible substrate 210 by performing the P type thermoelectric paste printing step (S520), the drying and the heat treatment step (S530). At this time, if the drying and heat treatment may be performed at the same temperature, the drying and heat treatment step (S530) may be performed simultaneously after the N type thermoelectric paste printing and the P type thermoelectric paste printing.

Referring again to FIG. 4, after the step S420 of forming the thermoelectric material on the flexible substrate 210 is completed, the organic polymer material filling step S430 is performed. After the thermoelectric material forming step S420, the solvent and the binder present in the thermoelectric paste are evaporated and removed in the drying and heat treatment step S530, so that a large number of pores are generated in the thermoelectric material. S430) is a step of filling at least a part of the pores with the organic polymer material.

The organic polymer material filling step (S430) may be performed by any method as long as the organic polymer material can be filled in the pores in the thermoelectric materials 220 and 230. For example, A method may be used in which a solution of an organic polymer material or an organic polymer material is coated and held for a predetermined time so as to sufficiently permeate the film. At this time, the organic polymer material that has not penetrated into the thermoelectric materials 220 and 230 can be removed, and the organic polymer material remaining after the rotation can be removed by rotating the polymer material at a high speed using a spin dryer. It goes without saying that the coating of the organic polymer material and the removal of the residual material can be performed using a single device such as a spin coater. In addition, the organic polymer material filling step (S430) may be performed in a liquid organic polymer material or an organic polymer material solution maintained at a high pressure, thereby increasing the filling rate and shortening the filling time.

As the organic polymer material, an organic conductive polymer material or an organic nonconductive polymer material can be used. When the organic conductive polymer material is used, the pore is filled with the conductive material, thereby providing a side effect of improving the electric conductivity of the thermoelectric material. However, when the organic conductive polymer material remains in a space other than the pores, a leakage current is generated between the N-type thermoelectric material 220 and the P-type thermoelectric material 230 or between the electrodes 240, It is preferable to remove the organic conductive polymer material so as not to remain in the space other than the pores.

After the organic polymer material filling step (S430), the organic polymer material filled in the pores may be further dried. The drying condition is not particularly limited, but may be performed at 200 ° C for 1 hour.

FIG. 6A is a scanning electron microscope photograph of a thermoelectric material before filling the organic polymer material, and FIG. 6B is a scanning electron microphotograph of a thermoelectric material after the organic polymer material filling step (S430). 6A, it can be seen that a large number of large and small pores are present in the thermoelectric material before the organic polymer material filling step (S430). From FIG. 6B, the organic polymer material filling step (S430) It can be confirmed that it is filled.

Referring again to FIG. 4, after the organic polymer material filling step (S430), an electrode forming step S440 for connecting the N-type thermoelectric material 220 and the P-type thermoelectric material 230 in series is performed. The electrode 240 may be formed by a screen printing method or a sputtering method, a vapor deposition method, a chemical vapor deposition method, or a pattern transfer method. . ≪ / RTI > The electrodes 240 are formed on the thermoelectric materials 220 and 230. However, the present invention is not limited thereto and the electrodes 240 may be partially or wholly covered with the flexible substrate 210 and the thermoelectric materials 220 and 230, 230). In this case, the electrode forming step S440 may be performed before the thermoelectric material forming step S420.

Since the thermoelectric element 200 according to the present invention uses a flexible substrate, flexibility is improved by filling the pores in the thermoelectric materials 220 and 230 with an organic polymer material as well as a flexible characteristic. FIG. 7 is a graph comparing internal resistance changes according to radius of curvatures when the pores in the thermoelectric materials 220 and 230 are filled with an organic polymer material and when they are not filled according to the present invention. As the N-type thermoelectric material 220, a bismuth-tellurium (Bi _x Te _{1 -x} ) thick film formed by screen printing is used. As the P-type thermoelectric material 230, antimony-tellurium (Sb was used as the _x Te _1-x), an organic polymer material is a conductive polymer PEDOT organic material was used a poly (styrenesulfonate)): PSS ( poly (3,4-ethylenedioxythiophene).

7 shows that both of the N-type bismuth-tellurium (Bi _x Te _{1 -x} ) thick film and the P-type antimony-tellurium (Sb _x Te _{1 -x} ) thick film are not filled with the organic polymer material PEDOT: PSS The internal resistance increases as the radius of curvature decreases, but the internal resistance does not exhibit a large change even if the radius of curvature becomes small in the case of filling. These results suggest that the organic polymeric materials with high flexibility can be used as a buffer in the pores of the thermotropic thick film to improve the flexibility of the thermotropic thick film.

8 is a graph showing changes in internal resistance according to the radius of curvature of the flexible thermoelectric element 200 manufactured according to the present invention. In the figure, A-A 'represents the bending of the thermoelectric element in the transverse direction, and B-B' represents the bending of the thermoelectric element in the longitudinal direction. 8, when the pores in the thermoelectric materials 220 and 230 are filled with the organic polymer material according to the present invention, a high flexibility property in which the internal resistance of the device does not increase up to a radius of curvature of 3 cm in both the transverse direction and the longitudinal direction Can be confirmed.

9 is a graph comparing the dimensionless figure of merit (ZT) of the thermoelectric thick film before and after the filling of the organic polymer material in order to evaluate the effect on the thermoelectric properties of the thermoelectric thick film when filling the organic polymer material in the pores according to the present invention . The dimensionless figure of merit (ZT) is a reference index for determining the thermoelectric properties, meaning that there is no unit, and the larger the value, the better the thermoelectric property.

9 shows that even after coating the organic conductive polymer PEDOT: PSS with both the P-type antimony-tellurium (Sb _x Te _{1 -x} ) and the N-type bismuth-tellurium (Bi _x Te _{1 -x} ) The results show that even though the organic polymer material is filled in the pores in the thermoelectric layer, there is no sacrifice in terms of thermoelectric properties.

10 is a graph showing an output voltage and an output power according to a temperature difference of the flexible thermoelectric element 200 manufactured according to the present invention. The output voltage (mV) of the device was measured at 85.2 mV at a temperature difference of 50 K and the power per unit area (mW / cm ² ) was measured at 1.2 mW / cm ² .

While the invention has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. For example, although the thermoelectric material is described as a thick film formed by the screen printing method in the above embodiments, the thermoelectric material is not necessarily formed by the screen printing method, To improve the properties such as flexibility and the like. Accordingly, the scope of protection of the present invention should be determined by the description of the claims and their equivalents.

100, 200: thermoelectric element
110: Lower substrate
120: first electrode
130, 220: N-type thermoelectric material
140, 230: P-type thermoelectric material
150: second electrode
160: upper substrate
210: flexible substrate
240: electrode

Claims (14)

Flexible substrate;
An N-type thermoelectric material and a P-type thermoelectric material formed by a screen printing method including printing an N-type and a P-type thermoelectric paste on the flexible substrate, and drying and heat-treating the flexible substrate;
And an electrode electrically connecting the N-type thermoelectric material and the P-type thermoelectric material in series,
The N-type thermoelectric material and the P-type thermoelectric material include pores formed therein during the drying and heat treatment,
Wherein the pores are filled at least in part with an organic polymeric material.
The method according to claim 1,
Wherein the organic polymer material is an organic conductive polymer material.
3. The method of claim 2,
Wherein the organic polymer material comprises PEDOT: PSS. delete The method according to claim 1,
The N-type thermoelectric material is a bismuth-tellurium (Bi _x Te _{1 -x} ) compound,
Wherein the P-type thermoelectric material is an antimony-tellurium (Sb _x Te _{1 -x} ) compound.
A method of manufacturing a flexible thermoelectric element,
(a) providing a flexible substrate;
(b) forming an N-type thermoelectric material and a P-type thermoelectric material on the flexible substrate;
(c) filling the pores in the N-type thermoelectric material and the P-type thermoelectric material with an organic polymer material;
(d) forming an electrode to electrically connect the N-type thermoelectric material and the P-type thermoelectric material in series;
Lt; / RTI >
The step (b) is performed by a screen printing method,
(b-1) thermoelectric-paste-synthesizing step;
(b-2) thermo-paste printing step; And
(b-3) a drying and heat-treating step;
≪ / RTI >
Wherein the pores are generated in the thermoelectric material by the step (b-3).
delete delete The method according to claim 6,
Wherein the step (b-1)
A thermoelectric material powder, a solvent, a binder, and a glass powder are mixed to form a flexible thermoelectric device.
10. The method of claim 9,
The step (b-3)
A first heat treatment step for evaporating the solvent;
A second heat treatment step for evaporating the binder;
A third heat treatment step for increasing a thermoelectric characteristic of the thermoelectric material;
Wherein the first, second, and third thermal processing steps are sequentially performed at a higher temperature.
delete The method of claim 6, wherein
The step (c)
And coating the organic polymer material on the thermoelectric material and holding the thermoelectric material for a predetermined time so as to permeate the thermoelectric material.
The method of claim 6, wherein
Further comprising the step of removing the organic polymer material remaining in the space other than the pores after the step (c).
delete

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