KR101475342B1 - Adhisive structure of suspension for microspeaker - Google Patents

Adhisive structure of suspension for microspeaker Download PDF

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Publication number
KR101475342B1
KR101475342B1 KR1020130067112A KR20130067112A KR101475342B1 KR 101475342 B1 KR101475342 B1 KR 101475342B1 KR 1020130067112 A KR1020130067112 A KR 1020130067112A KR 20130067112 A KR20130067112 A KR 20130067112A KR 101475342 B1 KR101475342 B1 KR 101475342B1
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South Korea
Prior art keywords
suspension
outer peripheral
attached
sensitive adhesive
adhesive
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KR1020130067112A
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Korean (ko)
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정인호
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주식회사 이엠텍
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/041—Centering
    • H04R9/043—Inner suspension or damper, e.g. spider
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention relates to an adhesive structure of a suspension for a microspeaker. More particularly, the present invention relates to a suspension for a microspeaker which includes an adhesion surface on the center besides the outer circumference of the microspeaker and to which a release sheet is attached. The present invention provides the adhesive structure of the suspension for the microspeaker which includes the center, the outer circumference of a ring shape which is located to be separated from the center, a suspension which includes a connection part which connects the center to the outer circumference, an adhesive which is sprayed on the edge of the center of the suspension and the outer circumference, and the release sheet which is attached to the upper side of the adhesive to protect the adhesive.

Description

마이크로스피커 서스펜션의 접착 구조{ADHISIVE STRUCTURE OF SUSPENSION FOR MICROSPEAKER}ADHESIVE STRUCTURE OF SUSPENSION FOR MICROSPEAKER < RTI ID = 0.0 >

본 발명은 마이크로스피커 서스펜션의 접착 구조에 관한 것이다. 더욱 상세하게는 마이크로스피커의 외주부 외에 중앙부에도 점착면이 형성되고 이형지가 부착된 마이크로스피커 서스펜션에 관한 것이다. The present invention relates to a bonding structure of a micro speaker suspension. More particularly, the present invention relates to a micro speaker suspension in which an adhesive surface is formed in a center portion in addition to an outer peripheral portion of a micro speaker and a release paper is attached.

마이크로스피커는 일반적으로 보이스 코일과 진동판의 진동이 상하 방향으로만 이루어지도록, 즉 편진동과 분할 진동을 방지하여 음질 불량을 방지할 수 있도록 서스펜션을 구비하며, 서스펜션의 상부 또는 하부에 진동판이 부착되고, 보이스 코일이 서스펜션에 의해 지지되도록 보이스 코일의 상단이 서스펜션에 부착되는 것이 일반적이다. In general, a micro speaker has a suspension such that vibration of a voice coil and a diaphragm are made only in a vertical direction, that is, a vibration is prevented and a divided vibration is prevented to prevent sound quality defects. A diaphragm is attached to an upper portion or a lower portion of the suspension , The upper end of the voice coil is generally attached to the suspension so that the voice coil is supported by the suspension.

도 1은 종래 기술에 따른 서스펜션과 진동판의 접착 구조를 도시한 도면이다. 서스펜션(10)은 보이스 코일(미도시)과 진동판(20)의 내주부(21)를 지지하는 중앙부(11)와, 프레임(미도시)에 안착되며 고정된 상태를 유지하며 진동판(20)의 외주부(22)가 부착되는 외주부(12)와, 중앙부(11)와 외주부(12)를 연결하며 중앙부(11)가 외주부(12)에 의해 지지될 수 있도록 하는 연결부(13)를 포함한다. 또한 서스펜션(10)은 도전성 패턴(10a)이 형성되어 보이스 코일(미도시)로 전기적인 신호를 전달하는 역할을 겸할 수 있다. 이때 중앙부(11)에는 보이스 코일(미도시)의 리드 와이어를 납땜하기 위한 본딩부(14)가 마련될 수도 있다. 1 is a view showing an adhesion structure between a suspension and a vibration plate according to the prior art. The suspension 10 includes a central portion 11 for supporting a voice coil (not shown) and an inner peripheral portion 21 of the diaphragm 20 and a central portion 11 for supporting the diaphragm 20 An outer peripheral portion 12 to which the outer peripheral portion 22 is attached and a connecting portion 13 that connects the central portion 11 and the outer peripheral portion 12 and allows the central portion 11 to be supported by the outer peripheral portion 12. In addition, the suspension 10 may also have a role of transmitting an electric signal to a voice coil (not shown) by forming the conductive pattern 10a. At this time, the central portion 11 may be provided with a bonding portion 14 for soldering a lead wire of a voice coil (not shown).

진동판(20)은 전체적으로 링 형상이며, 앞서 설명한 바와 같이 서스펜션(10)의 중앙부(11)에 부착되는 내주부(21)와, 서스펜션(10)의 외주부(12)에 부착되는 외주부(22)와, 내주부(21)와 외주부(22) 사이에 상부 또는 하부로 돌출되는 돔부(23)를 포함한다. The diaphragm 20 is ring-shaped as a whole and includes an inner peripheral portion 21 attached to the central portion 11 of the suspension 10 as described above and an outer peripheral portion 22 attached to the outer peripheral portion 12 of the suspension 10 And a dome portion 23 projecting upward or downward between the inner peripheral portion 21 and the outer peripheral portion 22. [

종래 기술에서는 서스펜션(10)의 외주부(12)와 진동판(20)의 외주부(22)는 서스펜션(10)에 미리 도포된 점착제(15)에 의해 부착된다. 점착제(15)는 진동판(20)과 부착되기 전까지 이형지(30)에 의해 보호되며, 진동판(20)의 부착 시에 점착제(15)를 보호하던 이형지(30)를 제거하고 진동판(20)을 부착한다. 이때, 외주부(22)는 미리 도포된 점착제(15)에 의해 부착되지만, 내주부(21)는 본드(16)를 중앙부(11)의 가장자리에 도포한 다음 부착된다. 따라서 본드(16) 도포 시에 본드(16)의 도포 두께가 균일하지 못할 수 있고, 과량 도포된 본드(16)가 흘러내리는 등의 불량이 발생할 수 있다는 단점이 있었다. The outer peripheral portion 12 of the suspension 10 and the outer peripheral portion 22 of the diaphragm 20 are attached by the adhesive 15 previously applied to the suspension 10 in the prior art. The adhesive agent 15 is protected by the release paper 30 until it is attached to the diaphragm 20 and the release paper 30 protecting the adhesive agent 15 at the time of attachment of the diaphragm 20 is removed and the diaphragm 20 is attached do. At this time, the outer peripheral portion 22 is attached by the previously applied adhesive 15, but the inner peripheral portion 21 is applied after the bond 16 is applied to the edge of the central portion 11. Therefore, the coating thickness of the bond 16 may not be uniform at the time of applying the bond 16, and defects such as the excessive application of the bond 16 may occur.

본 발명은 서스펜션의 외주부뿐만 아니라 내주부에도 점착제(15)가 기 도포된 마이크로스피커 서스펜션의 접착 구조를 제공하는 것을 목적으로 한다. An object of the present invention is to provide a bonding structure of a micro speaker suspension in which a pressure sensitive adhesive (15) is applied not only to the outer periphery but also to the inner periphery of the suspension.

본 발명은 중앙부, 중앙부와 소정 간격을 두고 위치하는 링 형상의 외주부, 중앙부와 외주부를 연결하는 연결부를 포함하는 서스펜션, 서스펜션 중앙부의 가장자리 및 외주부에 도포되는 점착제 및 점착제를 보호하기 위해 점착제 상부에 부착되는 이형지를 포함하는 것을 특징으로 하는 마이크로스피커 서스펜션의 접착 구조를 제공한다.The present invention relates to a suspension having a ring-shaped outer circumferential portion positioned at a predetermined distance from a center portion and a central portion, a suspension including a connecting portion connecting a center portion and an outer circumferential portion, a pressure sensitive adhesive agent applied to the edge and an outer circumferential portion of the suspension central portion, And a releasing paper to which the micro speaker suspension is attached.

또한 본 발명의 다른 일 예로, 이형지는 중앙부의 가장자리에 도포되는 점착제 상부에 부착되는 내주부 이형지 및 외주부에 도포되는 점착제 상부에 부착되는 외주부 이형지를 포함하는 것을 특징으로 하는 마이크로스피커 서스펜션의 접착 구조를 제공한다.According to another aspect of the present invention, there is provided a micro speaker suspension structure, comprising a release sheet having an inner peripheral release sheet attached to an upper portion of a pressure sensitive adhesive applied to an edge of the central portion and an outer peripheral release sheet adhered to an upper portion of the pressure sensitive adhesive applied to the outer peripheral portion, to provide.

또한 본 발명의 다른 일 예로, 이형지는 내주부 이형지와 외주부 이형지를 연결하는 연결부 이형지를 더 포함하는 것을 특징으로 하는 마이크로스피커 서스펜션의 접착 구조를 제공한다. According to another aspect of the present invention, there is provided a bonding structure for a micro speaker suspension, characterized in that the release paper further comprises a connection releasing paper connecting the inner circumference release paper to the outer release paper.

본 발명이 제공하는 마이크로스피커 서스펜션의 접착 구조는 진동판의 내주부가 부착되는 중앙부에도 본드 대신 기 도포된 점착제를 이용함으로써 제조 공정을 단순화시킬 수 있고, 본드의 흘러내림이나 퍼짐과 같은 불량 요인을 제거할 수 있다는 장점이 있다. The adhesive structure of the micro speaker suspension provided by the present invention can simplify the manufacturing process by using a pressure-sensitive adhesive applied in place of the bond in the center portion where the inner peripheral portion of the diaphragm is adhered, and can eliminate the defective factors such as the flowing- There is an advantage to be able to do.

도 1은 종래 기술에 따른 서스펜션과 진동판의 접착 구조를 도시한 도면,
도 2는 본 발명의 일 실시예에 따른 서스펜션과 진동판의 접착 구조를 도시한 도면.1 is a view showing an adhesion structure between a suspension and a vibration plate according to the related art,
2 is a view showing an adhesion structure between a suspension and a diaphragm according to an embodiment of the present invention.

이하 도면을 참조하여 본 발명을 더욱 상세하게 설명한다. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the drawings.

도 2는 본 발명의 일 실시예에 따른 서스펜션과 진동판의 접착 구조를 도시한 도면이다. 2 is a view showing an adhesion structure of a suspension and a vibration plate according to an embodiment of the present invention.

본 발명의 일 실시예에 따른 서스펜션(100)은 보이스 코일(미도시) 및 진동판의 내주부가 부착 지지되는 중앙부(110)와, 프레임(미도시) 상에 안착되며 진동판의 외주부가 부착되는 외주부(120)와, 중앙부(110)와 외주부(120) 사이를 연결하며 진동 가능하도록 다른 부품에 안착되지 않고 공중에 위치한 중앙부(110)를 지지하는 연결부(130)를 포함한다. A suspension 100 according to an embodiment of the present invention includes a central portion 110 to which a voice coil (not shown) and an inner peripheral portion of a diaphragm are attached and supported, an outer peripheral portion And a connection part 130 for supporting the center part 110 which is located in the air without being seated on other parts to connect the center part 110 and the outer peripheral part 120 and oscillate.

진동판(미도시)은 종래 기술과 같이 서스펜션(100)의 중앙부와 외주부에 그 내주부와 외주부가 각각 부착되며, 내주부와 외주부 사이에는 돌출된 돔부가 형성된다. 진동판의 내주부와 외주부를 부착하기 위해, 본 발명의 일 실시예에 따른 서스펜션(100)은 중앙부(110)의 둘레를 따라 내주부 점착제(152)가 도포되고, 외주부(120)에는 외주부 점착제(154)가 도포된다. The diaphragm (not shown) has an inner peripheral portion and an outer peripheral portion attached to a central portion and an outer peripheral portion of the suspension 100, respectively, and a protruded dome portion is formed between the inner peripheral portion and the outer peripheral portion. The suspension 100 according to the embodiment of the present invention is applied with the inner peripheral adhesive agent 152 along the periphery of the central portion 110 and the outer peripheral adhesive agent 154 are applied.

내주부 점착제(152)와 외주부 점착제(154)를 보호하기 위해 이형지(300)가 부착된다. 이형지(300)는 서스펜션(100)과 진동판(미도시)의 부착 전까지 점착제(152, 154)에 부착된 상태를 유지하며 점착제(152, 154)를 보호하다 서스펜션(100)과 진동판(미도시)의 부착 시에 제거되어 점착제(152, 154)를 노출한다. A release paper 300 is attached to protect the inner margin adhesive 152 and the outer margin adhesive 154. The release paper 300 is attached to the suspension 100 and the diaphragm (not shown) until the suspension 100 and the vibration plate (not shown) are attached to the pressure sensitive adhesive 152 and 154, And is exposed to expose the pressure-sensitive adhesive (152, 154).

이형지(300)는 내주부 점착제(152)를 보호하는 내주부 이형지(310)와, 외주부 점착제(154)를 보호하는 외주부 이형지(320)를 포함한다. 좀 더 바람직하게는, 내주부 이형지(310)와 외주부 이형지(320)를 연결하는 연결부 이형지(330)를 더 포함하여, 이형지(300)를 제거하는 작업이 내주부 이형지(310)와 외주부 이형지(320)를 따로 따로 제거하는 것이 아니라 한 번에 이루어지도록 하는 것이 작업 시간 단축에 유리하다. 이때, 연결부 이형지(330)는 서스펜션(100)의 연결부(130)의 형상과 같은 형상을 가지는 것이 이형지(300)의 관리에 유리하다. The release paper 300 includes an inner circumferential release paper 310 for protecting the inner circumferential pressure sensitive adhesive 152 and an outer circumferential release paper 320 for protecting the outer circumferential pressure sensitive adhesive 154. More preferably, the connecting part releasing paper 330 connecting the inner circumferential release paper 310 and the outer circumferential release paper 320 may be removed to remove the release paper 300 from the inner circumference release paper 310 and the outer circumferential release paper 320 is not removed separately but is performed at once, which is advantageous in shortening the working time. At this time, the shape of the connection part releasing paper 330 is the same as the shape of the connecting part 130 of the suspension 100, which is advantageous for managing the releasing paper 300.

Claims (3)

중앙부, 중앙부와 소정 간격을 두고 위치하는 링 형상의 외주부, 중앙부와 외주부를 연결하는 연결부를 포함하는 서스펜션;
서스펜션 중앙부의 가장자리 및 외주부에 도포되는 점착제; 및
점착제를 보호하기 위해 점착제 상부에 부착되며, 중앙부의 가장자리에 도포되는 점착제 상부에 부착되는 내주부 이형지, 외주부에 도포되는 점착제 상부에 부착되는 외주부 이형지 및 내주부 이형지와 외주부 이형지를 연결하는 연결부 이형지를 구비하는 이형지;를 포함하는 것을 특징으로 하는 마이크로스피커 서스펜션의 접착 구조.A ring-shaped outer circumferential portion located at a predetermined distance from the center portion and a central portion, and a connecting portion connecting the center portion and the outer circumferential portion;
A pressure sensitive adhesive applied to an edge and an outer peripheral portion of a suspension central portion; And
An outer peripheral release sheet attached to the upper portion of the pressure sensitive adhesive applied to the outer peripheral portion, and a connection release sheet for connecting the inner peripheral release portion and the outer peripheral release portion, which are attached to the upper portion of the pressure sensitive adhesive to protect the pressure sensitive adhesive, And a releasing paper provided on the micro speaker suspension. 삭제delete 삭제delete
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101673297B1 (en) 2015-06-19 2016-11-08 주식회사 비에스이 Suspension for speaker and method of making the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100265475B1 (en) * 1998-07-09 2000-09-15 이효범 Adhesion use convenience two directions adhesion tape
KR20130017552A (en) * 2011-08-11 2013-02-20 주식회사 이엠텍 Suspension for high power micro speaker and high power micro speaker having the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100265475B1 (en) * 1998-07-09 2000-09-15 이효범 Adhesion use convenience two directions adhesion tape
KR20130017552A (en) * 2011-08-11 2013-02-20 주식회사 이엠텍 Suspension for high power micro speaker and high power micro speaker having the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101673297B1 (en) 2015-06-19 2016-11-08 주식회사 비에스이 Suspension for speaker and method of making the same

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