KR101470131B1 - Antenna assembly and manufacturing method thereof - Google Patents

Abstract

The antenna assembly includes a substrate; And a wireless filler antenna pattern formed on the substrate, wherein the cross-section of the wireless filler antenna pattern has a plurality of internal angles. The antenna assembly may further include a wireless communication antenna pattern formed on the substrate and disposed outside the wireless charging antenna pattern. The cross section of the wireless communication antenna pattern may have a plurality of internal angles. The cross-section of the wireless communication antenna pattern may correspond to a plurality of angular values of a plurality of inner angles, and a cross-section of the wireless charging antenna pattern may correspond to a plurality of angular values of a plurality of inner angles, respectively.

Description

Technical Field [0001] The present invention relates to an antenna assembly and a method of manufacturing the antenna assembly.

The present invention relates to an antenna assembly and a method of manufacturing the same. And more particularly, to an antenna assembly including a wireless charging antenna and a method of manufacturing the same.

In the 1800s, electric motors and transformers using electromagnetic induction principles began to be used, and then radio waves and lasers were used to transmit the electric energy to the desired devices wirelessly. A method of transmitting electrical energy by radiating the same electromagnetic wave has also been attempted. Our electric toothbrushes and some wireless shavers are actually charged with electromagnetic induction. Electromagnetic induction is a phenomenon in which a voltage is induced and a current flows when a magnetic field is changed around a conductor. The electromagnetic induction method is rapidly commercialized mainly in small-sized devices, but there is a problem in that the transmission distance of electric power is short.

Up to now, the energy transmission method using a wireless method includes a resonance method in addition to electromagnetic induction and a remote transmission technique using a short wavelength radio frequency.

However, in general, the antenna assembly built in the terminal has a problem that the thickness thereof is large and the manufacturing process is complicated.

An aspect of the present invention is to provide an antenna assembly including a wireless charging antenna, which is reduced in thickness and can simplify a manufacturing process, and a manufacturing method thereof.

In one embodiment, the antenna assembly includes a substrate; And a wireless filler antenna pattern formed on the substrate, wherein the cross-section of the wireless filler antenna pattern has a plurality of internal angles.

The antenna assembly may further include a wireless communication antenna pattern formed on the substrate and disposed outside the wireless charging antenna pattern.

The cross section of the wireless communication antenna pattern may have a plurality of internal angles. The cross-section of the wireless communication antenna pattern may correspond to a plurality of angular values of a plurality of inner angles, and a cross-section of the wireless charging antenna pattern may correspond to a plurality of angular values of a plurality of inner angles, respectively.

According to the embodiment, the magnetic substrate and the coil part can be spaced apart through the adhesive layer to improve the antenna performance.

According to the embodiment, it is possible to simplify the manufacturing process of the antenna assembly by directly arranging the coil portion on the upper surface of the nonmagnetic insulating substrate through only the laminating and etching processes.

According to the embodiment, the manufacturing process of the antenna assembly can be simplified by connecting the internal terminal of the helical antenna pattern and the connection terminal disposed outside the antenna pattern with a conductive bridge.

According to an embodiment of the present invention, an extension pattern of an antenna pattern is cut along with a substrate, the cut substrate is folded to electrically connect an inner terminal of the helical antenna pattern and a connection terminal disposed outside the antenna pattern, Can be simplified.

According to the embodiment, it is possible to simplify the manufacturing process of the antenna assembly by simultaneously forming a relatively thick wireless charging antenna pattern and a wireless communication antenna pattern through etching.

According to the embodiment, the coil portion and the short-range communication antenna are directly disposed on the upper surface of the magnetic substrate to maintain a high power transmission efficiency, and at the same time, to communicate with an external device.

According to the embodiment, a conductive pattern can be formed inside the magnetic substrate to greatly reduce the thickness of the antenna assembly.

According to the embodiment, a conductive pattern can be formed inside a magnetic substrate to have a high power transmission efficiency, and at the same time, it is possible to communicate with an external device using a short-range communication antenna.

According to the embodiment, as the connection portion is disposed in the accommodation space of the magnetic substrate, the overall thickness of the antenna assembly can be greatly reduced by the thickness of the connection portion.

According to the embodiment, by using the tape member as the connection portion, the overall size of the antenna assembly can be reduced.

According to the embodiment, by using the lead frame as the connecting portion, the wiring layer included in the connecting portion can be protected from heat, moisture, impact or the like from the outside, and mass production can be achieved.

According to the embodiment, the direction of the magnetic field directed to the outside can be changed to the coil part side by the conductive pattern formed inside the magnetic substrate, the power transmission efficiency can be increased and the amount of the magnetic field leaking to the outside can be reduced, The influence of a harmful magnetic field can be minimized.

According to an embodiment of the present invention, an antenna assembly can be manufactured through only a process of forming a pattern groove and a process of inserting a coil portion, thereby simplifying the manufacturing process.

Meanwhile, various other effects will be directly or implicitly disclosed in the detailed description according to the embodiment of the present invention to be described later.

1 is an exploded perspective view of an antenna assembly according to an embodiment of the present invention.
2 is a plan view of an antenna assembly according to an embodiment of the present invention.
3 is a cross-sectional view of an antenna assembly according to an embodiment of the present invention.
4 is a plan view of an antenna assembly according to an embodiment of the present invention.
5 is a cross-sectional view of an antenna assembly according to an embodiment of the present invention.
6 is a plan view of an antenna assembly according to another embodiment of the present invention.
7 is a bottom view of an antenna assembly according to another embodiment of the present invention.
8 is a cross-sectional view of an antenna assembly according to another embodiment of the present invention.
9 is a plan view of an antenna assembly according to another embodiment of the present invention.
10 is a bottom view of an antenna assembly according to another embodiment of the present invention.
11 is a cross-sectional view of an antenna assembly according to another embodiment of the present invention.
12 is a perspective view of an antenna assembly according to another embodiment of the present invention.
13 is a plan view of an antenna assembly according to another embodiment of the present invention.
FIG. 14 is a cross-sectional view of the antenna assembly taken along line A-A 'shown in FIG. 13; FIG.
15 to 19 are views for explaining a method of manufacturing an antenna assembly according to an embodiment of the present invention.
FIG. 20 is a cross-sectional view of an antenna assembly according to another embodiment of the present invention when cut from A to A 'along the dotted line shown in the contact portion of FIG. 13;
21 is a plan view of an antenna assembly according to another embodiment of the present invention.
22 is a perspective view of an antenna assembly according to another embodiment of the present invention.
23 is a plan view of an antenna assembly according to another embodiment of the present invention.
FIG. 24 is a cross-sectional view of an antenna assembly according to another embodiment of the present invention when cut from B to B 'along the point shown in FIG. 23;
25 is a perspective view of an antenna assembly according to another embodiment of the present invention.
26 is a plan view of an antenna assembly according to another embodiment of the present invention.
FIG. 27 is a cross-sectional view of an antenna assembly according to another embodiment of the present invention cut from C to C '. FIG.
28 to 32 are views for explaining a method of manufacturing an antenna assembly according to another embodiment of the present invention.
33 is a view for explaining a change in inductance, resistance, and Q value of an inner antenna according to a use frequency when a coil part is disposed on a magnetic substrate according to another embodiment of the present invention.
FIG. 34 is a diagram for explaining a change in inductance, resistance, and Q value of an inner antenna according to a used frequency when a coil part is arranged in a pattern groove in a magnetic substrate according to another embodiment of the present invention.
35 is an H-field for showing a radiation pattern of a magnetic field when a coil part is arranged on the top surface of a magnetic substrate according to another embodiment of the present invention.
36 is an H-field for showing a radiation pattern of a magnetic field when a coil part is arranged in a pattern groove in a magnetic substrate according to another embodiment of the present invention.
37 is an exploded perspective view of an antenna assembly according to another embodiment of the present invention.
38 is a perspective view of an antenna assembly according to another embodiment of the present invention.
39 is a cross-sectional view of an antenna assembly according to another embodiment of the present invention.
40 to 48 are views for explaining a method of manufacturing an antenna assembly according to another embodiment of the present invention.
49 is a flowchart of a method of manufacturing an antenna assembly according to an embodiment of the present invention.
50 and 51 show cross-sectional views of a conductive pattern formed by etching according to an embodiment of the present invention.
52 is a flowchart of a method of manufacturing the connection portion 500 of the antenna assembly according to an embodiment of the present invention.
53 is a graph showing the performance of the conductive bridge according to the number of times of printing of the conductive paste according to the embodiment of the present invention.
54 is a flowchart of a method of manufacturing a connection portion of an antenna assembly according to another embodiment of the present invention.
55 is a flowchart of a method of manufacturing a connection portion of an antenna assembly according to another embodiment of the present invention.

Throughout the specification, when a part is referred to as being "electrically connected" to another part, it is not necessarily the case that it is " directly electrically connected " .

1 is an exploded perspective view of an antenna assembly according to an embodiment of the present invention.

2 is a plan view of an antenna assembly according to an embodiment of the present invention.

3 is a cross-sectional view of an antenna assembly according to an embodiment of the present invention. Particularly, FIG. 3 is a cross-sectional view of the antenna assembly shown in FIG. 1 cut from A to A '.

1 to 3, an antenna assembly 1000 according to an embodiment of the present invention includes a magnetic substrate 100, an inner antenna 200, a contact portion 300, a substrate 400, a connection portion 500, An antenna 600, and an adhesive layer 700.

The antenna assembly 1000 may be electrically connected to a terminal device having a battery and a wireless communication module that are objects of wireless charging.

The antenna assembly 1000 may be embedded in an electronic device such as a terminal device. The terminal device may be a conventional mobile phone such as a cellular phone, a Personal Communication Service (PCS) phone, a GSM phone, a CDMA-2000 phone, a WCDMA phone, a portable multimedia player (PMP), a personal digital assistant (PDA) Mobile Broadcast System) phone, but is not limited thereto. In particular, the antenna assembly 1000 may be embedded in the back cover of the terminal device. When the back cover of the terminal device is coupled to the terminal device, the antenna assembly 1000 can be electrically connected to the terminal device through the contact portion 300 of the antenna assembly 1000.

When the antenna assembly 1000 is coupled to a terminal device, the magnetic substrate 100 is positioned between the metal portion of the terminal device and the antenna within the antenna assembly 1000, and a magnetic field induced in the antenna within the antenna assembly 1000 It is prevented from being lost by the metal part of the terminal device, and the path of the magnetic flux is made. In particular, the metal portion of the terminal device may be a metal case of the battery of the terminal device. The magnetic substrate 100 may change the direction of the magnetic field transmitted from the transmitter. The magnetic substrate 100 may change the direction of the magnetic field transmitted from the transmitter to reduce the amount of the magnetic field that can leak to the outside. As a result, a shielding effect can be generated. The magnetic substrate 100 changes the direction of the magnetic field transmitted from the transmitter to the lateral direction so that the magnetic field can be transmitted more intensively to the inner antenna 200 and the outer antenna 600. [ The magnetic substrate 100 may absorb a magnetic field leaking out of a magnetic field transmitted from a transmitter, and may discharge the magnetic field. If the amount of the magnetic field leaking outside is reduced, a situation that may have harmful effects on the human body can be prevented. The magnetic substrate 100 may include a magnetic body 110 and a support 120. The magnetic body 110 may have a particle shape, and the material thereof may be ceramic. The material of the support 120 may include a thermosetting resin or a thermoplastic resin. The magnetic substrate 100 may be formed in the form of a sheet, and may have a flexible property.

The substrate 400 may be a printed circuit board (PCB), or a flexible printed circuit board (FPCB). The substrate 400 may be a non-magnetic insulating substrate. Particularly, the material of the substrate 400 may be a polyimide (PI) film. The polyimide film usually has a high temperature of over 400 degrees Celsius, a low temperature of minus 269 degrees Celsius, super heat resistance and ultra low temperature resistance, and is thin and flexible. The polyimide film has strong chemical resistance and abrasion resistance and can maintain stable performance in a harsh environment.

The inner antenna 200 may be disposed on the substrate 400. As will be described later, the inner antenna 200 may be an antenna pattern. At this time, the cross section of the antenna pattern may be a polygon having a predetermined angle, not a circular shape which is a general coil shape. Particularly, the cross section of the antenna pattern may be a quadrangular shape, more specifically, a trapezoidal shape, or more narrowly, a rectangular shape. The antenna pattern may be formed on the substrate 400 by a laminating process and an etching process. The inner antenna 200 may have a planar spiral shape. The inner antenna 200 may be a wireless charging antenna for wireless charging. The inner antenna 200 includes an outer terminal 210 positioned on the outside of the plane spiral, an inner terminal 220 located on the inner side of the plane spiral, and a plane helical inner coil 230 can do. At this time, the coil may be a coil pattern.

The outer antenna 600 may be disposed on the substrate 400. As will be described later, the outer antenna 600 may be an antenna pattern. At this time, the cross section of the antenna pattern may be a polygon having a predetermined angle, not a circular shape which is a general coil shape. Particularly, the cross section of the antenna pattern may be a quadrangular shape, more specifically, a trapezoidal shape, or more narrowly, a rectangular shape. The antenna pattern may be formed on the substrate 400 by a laminating process and an etching process. The outer antenna 600 may have a flat spiral shape. The outer antenna 600 may be a wireless communication antenna for wireless communication. In particular, the outer antenna 600 may be a near field communication (NFC) antenna. The outer antenna 600 includes an inner terminal 610 located inside the plane spiral, an outer terminal 620 located outside the plane spiral, and a planar spiral outer coil 630 can do. At this time, the coil may be a coil pattern.

The layer in which the inner antenna 200 is formed may be the same as the layer in which the outer antenna 600 is formed. The line width of the coil pattern of the inner antenna 200 may be larger than the line width of the coil pattern of the outer antenna 600. [ The line spacing of the coil patterns of the inner antenna 200 may be greater than the line spacing of the coil patterns of the outer antenna 600. [

The thickness of the magnetic substrate 100 may be 0.3 to 0.6 mm and the thickness of the inner antenna 200 and the outer antenna 600 may be 0.8 to 1.4 mm. In particular, the thickness of the magnetic substrate 100 is 0.43 mm, the thickness of the inner antenna 200 and the outer antenna 600 is 0.1 mm, and the thickness of the inner antenna 200 and the outer antenna 600 is 0.53 mm. However, this figure is only an example.

The adhesive layer 700 bonds one surface of the magnetic substrate 100 and one surface of the substrate 400. One surface of the substrate 400 contacting the adhesive layer 700 may be a surface on which the inner antenna 200 and the outer antenna 600 are formed from two surfaces of the substrate 400.

The contact portion 300 is in electrical contact with the terminal device and includes a plurality of connection terminals 310, a plurality of connection wires 320, a substrate 330, and a plurality of contact terminals 340. The plurality of connection terminals 310 includes a first connection terminal 311, a second connection terminal 312, a third connection terminal 313 and a fourth connection terminal 314. The plurality of connection wires 320 include a first connection wire 321, a second connection wire 322, a third connection wire 323 and a fourth connection wire 324. The plurality of contact terminals 340 includes a first contact terminal 341, a second contact terminal 342, a third contact terminal 343 and a fourth contact terminal 344.

The plurality of connection terminals 310 may be disposed outside the inner antenna 200. In addition, the plurality of connection terminals 310 may be disposed outside the outer antenna 600.

The plurality of connection conductors 320 may be disposed outside the inner antenna 200. In addition, a plurality of connection conductors 320 may be disposed outside the outer antenna 600.

The plurality of contact terminals 340 may be disposed outside the inner antenna 200. In addition, the plurality of contact terminals 340 may be disposed outside the outer antenna 600. [

The plurality of connection terminals 310 are connected to the outer terminal 210 of the inner antenna 200, the inner terminal 220 of the inner antenna 200, the inner terminal 610 of the outer antenna 600, And the outer terminal 620, respectively. The plurality of connection wires 320 correspond to the plurality of connection terminals 310, respectively. The plurality of contact terminals 340 correspond to the plurality of connection conductors 320, respectively. The plurality of contact terminals 340 are electrically connected to corresponding connection terminals 310 through corresponding connection leads 320.

Specifically, the first contact terminal 341 is electrically connected to the corresponding first connection terminal 311 through the first connection conductor 321. The second contact terminal 342 is electrically connected to the corresponding second connection terminal 312 through the second connection lead 322. And the third contact terminal 343 is electrically connected to the corresponding third connection terminal 313 via the third connection lead 323. [ The fourth contact terminal 344 is electrically connected to the corresponding fourth connection terminal 314 through the fourth connection lead 324.

The plurality of connection terminals 310, the plurality of connection wires 320, and the plurality of contact terminals 340 may be a conductive pattern. The conductor pattern may be formed on the substrate 330 by a laminating process and an etching process. In particular, the plurality of connection terminals 310, the plurality of connection wires 320, and the plurality of contact terminals 340 may be formed on the same layer.

The substrate 330 may be a printed circuit board, a flexible circuit board. In addition, the substrate 330 may be a nonmagnetic insulating substrate. Particularly, the material of the substrate 330 may be a polyimide film.

As will be described below, in one embodiment, the substrate 330 may be a separate substrate separate from the substrate 400.

In yet another embodiment, the substrate 330 and the substrate 400 may be integrally formed. In this case, the plurality of connection terminals 310, the plurality of connection wires 320, the plurality of contact terminals 340, the inner antenna 200, and the outer antenna 600 may be formed on the same layer.

When the inner cover 200 is a wireless charging antenna and the outer antenna 600 is a wireless communication antenna and a back cover of the terminal unit is coupled to the terminal unit a plurality of contact terminals electrically connected to the inner antenna 200 The inner antenna 200 is electrically connected to the battery of the terminal device through the plurality of contact terminals 340 electrically connected to the outer antenna 600 and the outer antenna 600 is connected to the wireless communication module As shown in FIG. The inner antenna 200 is electrically connected to the battery of the terminal device through the first contact terminal 341 electrically connected to the inner antenna 200 and the second contact terminal 342, The external antenna 600 can be electrically connected to the wireless communication module of the terminal device through the contact terminal 343 and the contact terminal 344 which are electrically connected to each other.

The connection portion 500 electrically connects the inner antenna 200 to the contact portion 300. Also, the connection portion 500 electrically connects the outer antenna 600 to the contact portion 300. Specifically, the connection unit 500 includes a first sub connection unit 501, a second sub connection unit 502, a third sub connection unit 503, and a fourth sub connection unit 504. The first sub connection unit 501 electrically connects the outer terminal 210 of the inner antenna 200 to the first connection terminal 311. The second sub connection part 502 electrically connects the inner terminal 220 of the inner antenna 200 to the second connection terminal 312. The third sub connection portion 503 electrically connects the inner terminal 610 of the outer antenna 600 to the third connection terminal 313. The fourth sub connection portion 504 electrically connects the outer terminal 620 of the outer antenna 600 to the fourth connection terminal 314. Various embodiments of the connection portion 500 will be described later.

4 is a plan view of an antenna assembly according to an embodiment of the present invention.

5 is a cross-sectional view of an antenna assembly according to an embodiment of the present invention. 5 is a cross-sectional view of the antenna assembly shown in FIG. 4 cut from A to A '.

In particular, the embodiment of FIGS. 4 and 5 embodies the connection 500 in the antenna assembly of FIGS. 1-3.

Referring to FIGS. 4 and 5, the substrate 330 and the substrate 400 are integrally formed.

In one embodiment, the first sub-connection 501, the second sub-connection 502, the third sub-connection 503, and the fourth sub-connection 504 are conductive bridges 520.

The fourth sub connection portion 504 is a conductive bridge 520 and the fourth sub connection portion 504 is a conductive bridge on the substrate 330. The first sub connection portion 501, the second sub connection portion 502 and the third sub connection portion 503 are conductive bridges 520, As shown in FIG. This is because there is no other conductive pattern between the outer terminal 620 and the fourth connection terminal 314 of the outer antenna 600 to prevent formation of the conductive pattern. Hereinafter, it is assumed that the fourth sub connection unit 504 is a conductor pattern formed on the substrate 330. [

The connection part 500 further includes an insulating layer 531. [ The insulating layer 531 covers a part of the antenna pattern and a part of the substrate 400 to the extent that the conductive bridge 520 is not electrically connected to the antenna pattern. In one embodiment, the insulating layer 531 may be an insulating ink dried after application. That is, the insulating layer 531 may be formed by applying the insulating ink after drying. In another embodiment, the insulating layer 531 may be an insulating sheet. That is, the insulating layer 531 may be formed by a laminating process with an insulating sheet.

The conductive bridge 520 is formed on the top of the insulating layer 531.

The conductive bridge 520 may include a first sub-bridge 521 formed by a conductive paste and a second sub-bridge 522 formed by plating. The material of the first sub-bridge 521 may be a volatilized conductive paste. Here, the conductive paste may be a silver paste. Copper plating may be used to form the lower bridge.

The first sub-bridge 521 may be formed on the upper portion of the insulating layer 531 and the second sub-bridge 522 may be formed on the upper portion of the first sub-bridge 521.

6 is a plan view of an antenna assembly according to another embodiment of the present invention, FIG. 7 is a bottom view of an antenna assembly according to another embodiment of the present invention, FIG. 8 is a cross- Sectional view of the assembly. Particularly, FIG. 8 is a cross-sectional view of the antenna assembly shown in FIG. 7 cut from A to A '.

In Fig. 6, the dotted line shows the conductive pattern on the opposite side of the face shown in Fig. 6, and the dotted line in Fig. 7 shows the conductive pattern on a part of the opposite side of the face shown in Fig.

In particular, the embodiments of FIGS. 6-8 illustrate the connection 500 in the antenna assembly of FIGS. 1-3.

6 to 8, the substrate 330 and the substrate 400 are integrally formed.

In one embodiment, the first sub-connection 501, the second sub-connection 502, the third sub-connection 503, and the fourth sub-connection 504 are conductive bridges 520.

The fourth sub connection unit 504 is connected to the second sub connection unit 502 and the third sub connection unit 503 is electrically connected to the second sub connection unit 502. In other embodiments, the first sub connection unit 501, the second sub connection unit 502 and the third sub connection unit 503 are conductive bridges 520, It may be a conductive pattern formed on the upper portion. This is because there is no other conductive pattern between the outer terminal 620 and the fourth connection terminal 314 of the outer antenna 600 to prevent formation of the conductive pattern. Hereinafter, it is assumed that the fourth sub connection unit 504 is a conductor pattern formed on the substrate 330. [

The conductive bridge 520 is formed at the bottom of the substrate 400. In this case, since the substrate 400 is insulating, there is no need to form a separate insulating layer.

The outer terminal 210 of the inner antenna 200 is electrically connected to the first sub connection part 210 through the conductive via provided in the via hole 533 formed in the lower part of the outer terminal 210 of the inner antenna 200 in the substrate 400. [ And is electrically connected to one end of the conductive bridge 520 of the first electrode 501.

The first connection terminal 311 is electrically connected to the conductive bridge 520 of the first sub connection portion 501 through the conductive via provided in the via hole 533 formed in the lower portion of the first connection terminal 311 in the substrate 400. [ As shown in Fig.

A conductive via provided in a via hole 533 formed in a lower portion of the inner terminal 220 of the inner antenna 200 in the substrate 400 is electrically connected to the inner terminal 220 of the inner antenna 200 in the first sub- And is electrically connected to one end of the conductive bridge 520.

The second connection terminal 312 is electrically connected to the conductive bridge 520 of the first sub connection portion 501 through the conductive vias provided in the via hole 533 formed in the lower portion of the second connection terminal 312 in the substrate 400. [ And is electrically connected to the stage.

The outer terminal 610 of the outer antenna 600 through the conductive vias provided in the via hole 533 formed in the lower portion of the outer terminal 610 of the outer antenna 600 in the substrate 400 is connected to the first sub- And is electrically connected to one end of the conductive bridge 520 of FIG.

The third connection terminal 313 is electrically connected to the conductive bridge 520 of the first sub connection portion 501 through the conductive via provided in the via hole 533 formed in the lower portion of the third connection terminal 313 in the substrate 400. [ And is electrically connected to the stage.

The inner terminal 610 of the outer antenna 600 through the conductive vias provided in the via hole 533 formed in the lower portion of the inner terminal 610 of the outer antenna 600 in the substrate 400 is connected to the first sub- And is electrically connected to one end of the conductive bridge 520 of FIG.

The fourth connection terminal 314 is electrically connected to the conductive bridge 520 of the first sub connection portion 501 through the conductive via provided in the via hole 533 formed in the lower portion of the fourth connection terminal 314 in the substrate 400. [ And is electrically connected to the stage.

The conductive bridge 520 may include a first bridge 521 formed by silver paste and a second bridge 522 formed by plating. In particular, copper plating may be used to form the lower bridge.

The first sub-bridge 521 may be formed below the substrate 400 and the second sub-bridge 522 may be formed below the first sub-bridge 521.

FIG. 9 is a plan view of an antenna assembly according to another embodiment of the present invention, FIG. 10 is a bottom view of an antenna assembly according to another embodiment of the present invention, and FIG. 11 is a plan view of an antenna according to another embodiment of the present invention. Sectional view of the assembly. 11 is a cross-sectional view of the antenna assembly shown in FIG. 10 cut from A to A '.

In Fig. 9, the dotted line shows the conductive pattern on the opposite side of the face shown in Fig. 6, and the dotted line in Fig. 7 shows the conductive pattern on the part of the opposite side of the face shown in Fig.

In particular, the embodiments of FIGS. 6-8 illustrate the connection 500 in the antenna assembly of FIGS. 1-3.

9 to 11, the substrate 330 and the substrate 400 are integrally formed.

The substrate 400 includes a first perforation line 411, a first folding line 421, a first cutout 431, a second perforation line 412, a second fold line 422, A third tear line 413, a third tear line 423, and a third cutout 433. The third cut line 423, the third cut line 423,

The first sub connection unit 501 includes a first extension pattern 541 and a first sub-substrate 551. The first extension pattern 541 is an extension pattern extending from the outer terminal 210 of the inner antenna 200.

The first sub-board 551 and the board 400 are integrally formed on the first folding line 421.

The first perforation 411 forms an open figure and the engagement of the first perforation line 411 and the first perforation line 421 forms a closed figure.

The size and shape of the closed figure formed by the combination of the first cutting line 411 and the first folding line 421 corresponds to the size and shape of the first cutout 431 and the size and shape of the first cutout 431 And the shape correspond to the size and shape of the first sub-substrate 551.

The first folding line 421 is a line for folding the first sub-substrate 551 cut out by the first perforation line 411.

The first sub-substrate 551 is sized and shaped to accommodate the first extension pattern 541.

The first cut-out portion 431 is formed by cutting the substrate 400 along the first perforation line 411 and folding the first sub-substrate 551 along the first line 421.

The second sub connection portion 502 includes a second extension pattern 542 and a second sub substrate 552. The second extension pattern 542 is an extension pattern extending from the inner terminal 220 of the inner antenna 200.

The second sub-substrate 552 and the substrate 400 are integrally formed at the second folding line 422.

The second perforations 412 form an open figure and the engagement of the second perforations 412 and the second perforations 422 forms a closed figure.

The size and shape of the closed figure formed by the combination of the second and third fold lines 422 and 422 corresponds to the size and shape of the second cut portion 432 and the size of the second cut portion 432 And shape correspond to the size and shape of the second sub-substrate 552.

The second folding line 422 is a line for folding the second sub-substrate 552 cut out by the second perforation line 412.

The second sub-substrate 552 is sized and shaped to accommodate the second extension pattern 542.

The second cut-out portion 432 is formed by cutting the substrate 400 along the second perforation line 412 and folding the second sub-substrate 552 along the second line 422.

The third sub connection portion 503 includes a third extension pattern 543 and a third sub-substrate 553. The third extension pattern 543 is an extension pattern extending from the inner terminal 610 of the outer antenna 600.

The third sub-substrate 553 and the substrate 400 are integrally formed at the third folding line 423.

The third perforation 413 forms an open figure and the engagement of the third perforation line 413 and the third perforation line 423 forms a closed figure.

The size and shape of the closed graphic formed by the combination of the third and fourth folding lines 413 and 423 correspond to the size and shape of the third cutout 433 and the size and shape of the third cutout 433 And the shape correspond to the size and shape of the third sub-substrate 553.

The third folding line 423 is a line for folding the third sub-substrate 553 formed by cutting by the third perforation line 413.

The third sub-substrate 553 is sized and shaped to accommodate the third extension pattern 543.

The third cut-away portion 433 is formed by cutting the substrate 400 along the third perforation line 413 and folding the third sub-substrate 553 along the third line 423.

In one embodiment, the fourth sub connection 504 may be a conductive pattern formed on the top of the substrate 330. [ In this case, a perforated line and a folding line are not provided around the conductor pattern corresponding to the fourth sub-connection portion 504, and instead, the conductor pattern corresponding to the fourth sub-connection portion 504 is connected to the fourth contact terminal 344 And is electrically connected.

In another embodiment, the substrate 400 may include a fourth perforation line (not shown), a fourth fold line (not shown), and a fourth cutout (not shown).

The fourth sub connection portion 504 may include a fourth extension pattern (not shown) and a fourth sub-substrate (not shown). The fourth extension pattern is an extension pattern extending from the inner terminal 610 of the outer antenna 600.

The fourth sub-substrate and the substrate 400 are integrally formed at the fourth fold line.

The fourth perforation forms an open figure, and the combination of the fourth perforation line and the fourth fold line forms a closed figure.

And the fourth folding line is a line for folding the fourth sub-substrate formed by cutting by the fourth perforation line.

The size and shape of the closed graphic formed by the combination of the fourth and fourth fold lines corresponds to the size and shape of the fourth cut portion and the size and shape of the fourth cut portion corresponds to the size and shape of the fourth sub-

The fourth sub-substrate has a size and shape capable of accommodating a fourth expansion pattern (not shown).

The fourth cut-out portion is formed by cutting the substrate 400 along the fourth perforation line and folding the fourth sub-substrate along the fourth line.

Referring to FIGS. 9 to 11, when the first sub-substrate 551 along the first folding line 421 is folded, a first sub-substrate 551 is formed below the substrate 400. A first extension pattern 541 is formed under the first sub-board 551. The terminals of the first connection terminal 311 and the first extension pattern 541 are electrically connected to the via hole 533 formed in the lower portion of the first connection terminal 311 in the substrate 400 and the via hole 533 formed in the first sub- And may be electrically connected by a via hole 533 formed on the terminal of the first extension pattern 541. In particular, the terminals of the first connection terminal 311 and the first extension pattern 541 may be electrically connected to each other by a conductive material provided around the conductive via, that is, the thermal compression of the conductive via provided in the via hole 533. [ Here, the conductive material may be a conductive paste, a solder.

When the second sub-substrate 552 along the second folding line 422 is folded, a second sub-substrate 552 is formed under the substrate 400. [ A second extension pattern 542 is provided under the second sub-substrate 552. The terminals of the second connection terminal 312 and the second extension pattern 542 are electrically connected to each other through the via hole 533 formed in the lower portion of the second connection terminal 312 in the substrate 400 and the via hole 533 formed in the second sub substrate 552 And may be electrically connected by a via hole 533 formed in the upper portion of the terminal of the second extension pattern 542. In particular, the terminals of the second connection terminal 312 and the second extension pattern 542 may be electrically connected to each other by a conductive material provided around the conductive via, that is, the thermal compression of the conductive via provided in the via hole 533. [ Here, the conductive material may be a conductive paste, a solder.

When the third sub-substrate 553 along the third folding line 423 is folded, a third sub-substrate 553 is formed under the substrate 400. [ A third extension pattern 543 is formed under the third sub-substrate 553. The terminals of the third connection terminal 313 and the third extension pattern 543 are electrically connected to each other in the via hole 533 formed in the lower portion of the third connection terminal 313 and the third sub- And may be electrically connected by a via hole 533 formed on the terminal of the third extension pattern 543. In particular, the terminals of the third connection terminal 313 and the third extension pattern 543 may be electrically connected to each other by a conductive material provided around the conductive via, that is, the thermal compression of the conductive via provided in the via hole 533. [ Here, the conductive material may be a conductive paste, a solder.

FIG. 12 is a perspective view of an antenna assembly 1000 according to another embodiment of the present invention, FIG. 13 is a plan view of an antenna assembly 1000 according to another embodiment of the present invention, FIG. 14 is a cross- 300 taken along the dashed line A 'to A' in FIG.

Referring to FIGS. 12 to 14, the antenna assembly 1000 may include a magnetic substrate 100, an inner antenna 200, and a contact portion 300. The contact portion 300 may include a first contact terminal 341, a second contact terminal 342, a first connecting wire 321, a second connecting wire 322, and a substrate 330. 13 and 14, the first contact terminal 341, the second contact terminal 342, the first connection wire 321, the second connection wire 322, and the substrate 330 are omitted.

The antenna assembly 1000 can receive power wirelessly from the transmitting side. In one embodiment, the antenna assembly 1000 may receive power wirelessly using electromagnetic induction. In one embodiment, the antenna assembly 1000 can receive power wirelessly using resonance.

12, the inner antenna 200 may include an outer terminal 210, an inner terminal 220, an inner terminal 220, and an inner coil 230. The inner coil 230 may form a conductive layer or a conductive pattern.

The outer terminal 210 is located at one end of the inner coil 230 and the inner terminal 220 is located at the other end of the inner coil 230.

The outer terminal 210 and the inner terminal 220 are terminals necessary for electrical connection with the contact portion 300.

The inner coil 230 can form a coil pattern in which one conductor is wound a plurality of times. In one embodiment, the coil pattern may be a planar spiral structure, but it need not be limited thereto, and various patterns can be formed.

The inner antenna 200 may be disposed directly on the upper surface of the magnetic substrate 100. In an embodiment, an adhesive layer (not shown) may be further disposed between the inner antenna 200 and the magnetic substrate 100.

The inner antenna 200 may comprise a conductor. The conductor may be a metal or an alloy. In one embodiment, the metal may be silver or copper, but is not limited thereto.

The inner antenna 200 can transmit the power received from the transmitter wirelessly to the contact 300. [ The inner antenna 200 can receive power using electromagnetic induction or resonance from the transmitting side.

The first connection terminal 311 of the contact portion 300 may be electrically connected to the outer terminal 210 of the inner antenna 200 and the second connection terminal 312 of the contact portion 300 may be electrically connected to the inner terminal of the inner antenna 200. [ And may be electrically connected to the inner terminal 220.

The substrate 330 may include a wiring layer, and a wiring layer such as a receiving circuit described later may be disposed.

The contact unit 300 may connect the receiving circuit (not shown) and the inner antenna 200 to transmit the power received from the inner antenna 200 to a load (not shown) through a receiving circuit (not shown). The receiving circuit may include a rectifying circuit for converting AC power into DC power and a smoothing circuit for removing the ripple component from the converted DC power and delivering it to the load.

13 to 14 are views for explaining the detailed configuration of the antenna assembly 1000 according to another embodiment of the present invention when the inner antenna 200 and the contact portion 300 are connected.

13 is a plan view of an antenna assembly 1000 according to another embodiment of the present invention.

13 shows a state in which the inner antenna 200 and the contact portion 300 are connected to each other.

In one embodiment, the electrical connection between the inner antenna 200 and the contact 300 may be by solder. Concretely, the first sub connecting part 501 corresponds to the solder 10 and the second sub connecting part 502 corresponds to the solder 20. That is, the outer terminal 210 of the inner antenna 200 and the first connection terminal 311 of the contact portion 300 can be electrically connected by the first solder 10 and the inner terminal 200 of the inner antenna 200 220 and the second connection terminal 312 of the contact portion 300 may be electrically connected by the second solder 20. [ Specifically, the outer terminal 210 of the inner antenna 200 can be electrically connected to the first connection terminal 311 of the contact portion 300 through the via hole of the first solder 10, The inner terminal 220 may be electrically connected to the second connection terminal 312 of the contact portion 300 through the via hole of the second solder 20. [

A cross section cut from A to A 'along a dotted line shown in the contact portion 300 in FIG. 13 will be described with reference to FIG.

14 is a cross-sectional view of the antenna assembly 1000 taken along line A-A 'in the contact portion 300 of FIG.

14, an outer terminal 210, an inner terminal 220, and an inner coil 230, which are components of the inner antenna 200, are disposed on the upper surface of the magnetic substrate 100.

The antenna assembly 1000 according to another embodiment of the present invention includes the inner antenna 200 directly disposed on the upper surface of the magnetic substrate 100 so that the overall thickness of the inner antenna 200 is different from the case where the coil pattern is formed on the FPCB Can be greatly reduced.

As described above, the thickness of the magnetic substrate 100 may be 0.3 to 0.6 mm, and the thickness of the inner antenna 200 may be 0.8 to 1.4 mm. Particularly, the thickness of the magnetic substrate 100 is 0.43 mm, the thickness of the inner antenna 200 is 0.1 mm, and the thickness of the inner antenna 200 is 0.53 mm. However, this figure is only an example.

That is, the thickness of the antenna assembly 1000 can be reduced by configuring the inner antenna 200 in the form of a conductor, a conductive pattern, or a thin film. If the present invention is applied to an electronic apparatus that requires a slimness such as a portable terminal, it can have a useful effect for receiving power from a transmitter while reducing the thickness of the portable terminal.

On the upper side of the inner antenna 200, a contact portion 300 is directly disposed. The contact portion 300 can be easily connected to the inner antenna 200 and the contact portion 300 by directly arranging the contact portion 300 on the upper side of the inner antenna 200. [

The outer terminal 210 of the inner antenna 200 is connected to the first connection terminal 311 of the contact portion 300 by the solder 10.

The inner terminal 220 of the inner antenna 200 is connected to the second connection terminal 312 of the contact portion 300 by the solder 20.

The width W and the thickness T of the inner coil 230 can be designed to have predetermined values. The distance between the inner coil 230 and the inner coil 230 can also be designed to have a predetermined distance value.

15 to 19 are views for explaining a method of manufacturing the antenna assembly 1000 according to an embodiment of the present invention.

The configuration of the antenna assembly 1000 may be essentially combined with that described in Figs. 12-14.

First, referring to FIG. 15, a magnetic substrate 100 is formed.

Next, referring to FIG. 16, the conductor 201 is directly stacked on the upper surface of the magnetic substrate 100. In one embodiment, the adhesive layer may be laminated on the upper surface of the magnetic substrate 100, and then the conductor 201 may be laminated.

A method of laminating the conductor 201 on the upper surface of the magnetic substrate 100 in the embodiment is a method in which a laminating process for heating the conductor 201 at a predetermined temperature and then applying a predetermined pressure is used . The laminating process refers to a process of adhering different types of metal foil or paper using heat and pressure.

17, a mask 50 is stacked on the upper surface of the conductor 201. [ The mask 50 may be stacked only on the upper surface of the position where the outer terminal 210, the inner terminal 220 and the inner coil 230 of the inner antenna 200 are to be formed.

Next, referring to FIG. 18, in the state of FIG. 17, the groove portion where the dipping surface mask 50 is not placed is etched into the etching solution. Then, the conductor 201 forms a constant conductive pattern.

Thereafter, when the mask 50 is removed, the inner antenna 200 of the antenna assembly 1000 is formed.

19, a soldering operation is performed so that the inner antenna 200 and the contact portion 300 are connected to each other.

That is, the outer terminal 210 of the inner antenna 200 and the third connection terminal 310 of the contact portion 300 are connected by the solder 10 and the second connection terminal 200 of the inner antenna 200 The fourth connection terminal 320 of the contact portion 300 is connected by the solder 20.

By disposing the inner antenna 200 directly on the surface of the magnetic substrate 100 as described above, the entire thickness of the antenna assembly 1000 can be greatly reduced, and the antenna assembly 1000 can be fabricated only through the laminating and etching processes There is an effect that the manufacturing process can be simplified.

20 is a cross-sectional view of an antenna assembly 1000 according to another embodiment of the present invention when cut from A to A 'along the dotted line shown in the contact portion 300 of FIG.

20, the antenna assembly 1000 may include a magnetic substrate 100, an inner antenna 200, a contact portion 300, and an adhesive layer 700.

The magnetic substrate 100, the inner antenna 200, and the contact portion 300 are the same as those described in Fig.

The adhesive layer 700 is disposed between the magnetic substrate 100 and the inner antenna 200 to bond the magnetic substrate 100 and the inner antenna 200 together.

21 is a plan view of an antenna assembly 1000 according to another embodiment of the present invention.

Referring to FIG. 21, the antenna assembly 1000 may include a magnetic substrate 100, an inner antenna 200, a contact portion 300, and an outer antenna 600. The contact portion 300 includes a first connecting terminal 311, a second connecting terminal 312, a third connecting terminal 313, a fourth connecting terminal 314, a first connecting wire 321, The second contact terminal 342, the third contact terminal 343, the fourth contact terminal 344, the second contact terminal 322, the third connection lead 323, the fourth connection lead 324, the first contact terminal 341, But the illustration is omitted.

The description of the magnetic substrate 100, the inner antenna 200, and the contact portion 300 is the same as that described with reference to Figs.

The outer antenna 600 includes an inner terminal 610, an outer terminal 620, and an outer coil 630.

The inner terminal 610 and the outer terminal 620 of the outer antenna 600 are connected to the contact portion 300.

The outer antenna 600 can perform communication with a reader capable of short-range wireless communication. The outer antenna 600 serves as an antenna for transmitting and receiving information to and from the reader.

In one embodiment, the outer antenna 600 may be located at the outer periphery of the inner antenna 200. [ When the inner antenna 200 is disposed at the center of the magnetic substrate 100, the outer antenna 600 may be disposed along the outer periphery of the magnetic substrate 100 so as to surround the inner antenna 200. The outer antenna 600 may have a quadrangular structure in which one conductor is wound a plurality of times, but it is not limited thereto.

The outer antenna 600 may form a conductive pattern or a conductive layer like the inner antenna 200.

Various techniques can be used for the local communication standard used in the outer antenna 600, but it is preferable to use NFC (Near Field Communication). Near Field Communication (NFC) has a bandwidth of 13.56 MHz and is a technology for wireless communication at a short distance.

The outer antenna 600 may be disposed directly on the upper surface of the magnetic substrate 100.

The method in which the outer antenna 600 is disposed on the magnetic substrate 100 may be the same as the manufacturing method described with reference to FIG.

22 to 24, a detailed configuration of the antenna assembly 1000 according to another embodiment of the present invention will be described.

22 is a perspective view of an antenna assembly 1000 according to another embodiment of the present invention.

Referring to FIG. 22, the antenna assembly 1000 includes a magnetic substrate 100, an inner antenna 200, and a contact portion 300. The contact portion 300 may include a first contact terminal 341, a second contact terminal 342, a first connecting wire 321, a second connecting wire 322, and a substrate 330. 23 and 24, the illustration of the first contact terminal 341, the second contact terminal 342, the first connecting conductor 321, the second connecting conductor 322 and the substrate 330 is omitted.

The description of the inner antenna 200 and the contact portion 300 is the same as that described with reference to FIG. However, in the case of the magnetic substrate 100, some structures are different from each other, and therefore, the magnetic substrate 100 will be mainly described.

Referring to FIG. 22, the magnetic substrate 100 forms a receiving region 130 having the same structure as that of the contact portion 300. 12, the inner antenna 200 is disposed on the upper surface of the magnetic substrate 100 and the contact portion 300 is connected to the inner antenna 200. In the case of FIG. 22, the magnetic substrate 100 itself The receiving portion 130 may be formed in a portion corresponding to the structure of the contact portion 300 and the contact portion 300 may be disposed on the lower side of the inner antenna 200. [

23 is a plan view of an antenna assembly 1000 according to another embodiment of the present invention.

23 shows a state in which the inner antenna 200 and the contact portion 300 are connected to each other.

The thickness of the contact portion 300 may be equal to or less than the thickness of the magnetic substrate 100. The contact portion 300 may be implemented as a flexible printed circuit board (FPCB).

The contact portion 300 may be disposed in the receiving region 130 of the magnetic substrate 100.

Unlike the embodiment of FIG. 14, if the thickness of the contact portion 300 is equal to or less than the thickness of the magnetic substrate 100, the overall thickness of the antenna assembly 1000 may be reduced by the thickness of the contact portion 300. In addition, since the magnetic substrate 100 requires less magnetic body 110 and support 120 than the receiving region 130, there is a cost advantage.

24 is a cross-sectional view of the antenna assembly 1000 taken along the line B 'in FIG. 23, taken along the line 300'.

It is assumed that the thickness of the contact portion 300 is smaller than the thickness of the magnetic substrate 100.

24, the outer terminal 210, the inner terminal 220, and the inner coil 230, which are components of the inner antenna 200, are disposed on the upper surface of the contact portion 300.

A contact portion 300 is disposed under the inner antenna 200.

The outer terminal 210 of the inner antenna 200 is connected to the first connection terminal 311 of the contact portion 300 by the solder 10 corresponding to the first sub connection portion 501.

The inner terminal 220 of the inner antenna 200 is connected to the second connection terminal 312 of the contact portion 300 by the solder 20 corresponding to the first sub connection portion 501.

The width W and the thickness T of the inner coil 230 can be designed to have predetermined values. The distance between the inner coil 230 and the inner coil 230 can also be designed to have a predetermined distance value.

24, since the thickness of the contact portion 300 is smaller than the thickness of the magnetic substrate 100, unlike the embodiment of FIG. 14, the overall thickness of the antenna assembly 1000 decreases by the thickness of the contact portion 300 . Further, since the magnetic substrate 100 requires less magnetic body 110 and support body 120 than the receiving region 130 shown in Fig. 21, there is a cost advantage.

Next, an antenna assembly 1000 according to another embodiment of the present invention will be described in detail with reference to FIGS. 25 to 31. FIG.

FIG. 25 is a perspective view of an antenna assembly 1000 according to another embodiment of the present invention, FIG. 26 is a plan view of an antenna assembly 1000 according to another embodiment of the present invention, and FIG. FIGS. 28 to 32 are views for explaining a method of manufacturing the antenna assembly 1000 according to another embodiment of the present invention. FIG.

Referring to FIG. 25, an antenna assembly 1000 according to another embodiment of the present invention may include a magnetic substrate 100, an inner antenna 200, and a contact portion 300.

In one embodiment, the antenna assembly 1000 can receive power by electromagnetic induction from the transmitting side. In this case, the coil 210 of the inner antenna 200 can receive power wirelessly by electromagnetic induction with the coil on the transmitting side.

In one embodiment, the antenna assembly 1000 can receive power from the transmitting side by resonance. In this case, the inner coil 230 of the inner antenna 200 operates at a resonance frequency with the transmission-side resonance coil of the transmission side, and is coupled to the reception resonance coil and the reception resonance coil for receiving the electric power, And a receiving induction coil.

The magnetic substrate 100 can change the direction of the magnetic field transmitted from the transmission side.

The magnetic substrate 100 can change the direction of the magnetic field transmitted from the transmission side and reduce the amount of the magnetic field that can leak to the outside. Thereby, a shielding effect can be obtained.

The magnetic substrate 100 changes the direction of the magnetic field transmitted from the transmission side to the lateral direction so that the magnetic field can be transmitted more intensively to the inner antenna 200. [

The magnetic substrate 100 may absorb a magnetic field leaking to the outside among the magnetic field transmitted from the transmission side and release it as heat. If the amount of the magnetic field leaking outside is reduced, a situation that may have harmful effects on the human body can be prevented.

Referring to FIG. 27, the magnetic substrate 100 may include a magnetic body 110 and a support 120.

The magnetic body 110 may include a form of particles or ceramics. In one embodiment, the magnetic body 110 may be any one of a spinel type, a hexate type, a sendust type, and a permalloy type magnetic body.

The support 120 may include a thermosetting resin or a thermoplastic resin and supports the magnetic substrate 100.

The magnetic substrate 100 may be formed in the form of a sheet, and may have a flexible property.

Referring again to FIG. 25, the inner antenna 200 may include an outer terminal 210, an inner terminal 220, and an inner coil 230. The inner coil 230 may form a conductive layer or a conductive pattern.

The inner antenna 200 may be disposed inside the magnetic substrate 100. Specifically, the inner antenna 200 can be disposed in the interior of the magnetic substrate 100. More specifically, the magnetic substrate 100 may include a pattern groove, and the inner antenna 200 may be disposed in the pattern groove. The pattern groove may have the same shape as a conductive pattern or a conductive layer formed by the inner antenna 200.

The thickness of the inner antenna 200 is smaller than the thickness of the magnetic substrate 100 and the upper surface of the inner antenna 200 can be exposed to the outside of the magnetic substrate 100.

A process in which the inner antenna 200 and the contact portion 300 are disposed on the magnetic substrate 100 to manufacture the antenna assembly 1000 will be described later with reference to FIG. 28 to FIG.

The outer terminal 210 of the inner antenna 200 is located at one end of the inner coil 230 and the inner terminal 220 is located at the other end of the inner coil 230.

The outer terminal 210 and the inner terminal 220 of the inner antenna 200 are terminals necessary for connection with the contact portion 300.

The inner coil 230 can form a pattern in which one conductor is wound a plurality of times. In one embodiment, the pattern may be a planar spiral structure, but need not be limited thereto, and various patterns can be formed.

The inner antenna 200 can transmit the power received from the transmitter wirelessly to the contact 300. [ The inner antenna 200 can transmit the received power to the contact portion 300 using electromagnetic induction or resonance from the transmitting side.

The contact portion 300 may include a first connection terminal 311, a second connection terminal 312, and a substrate 330.

The first connection terminal 311 of the contact portion 300 may be connected to the outer terminal 210 of the inner antenna 200 and the second connection terminal 312 of the contact portion 300 may be connected to the inner side of the inner antenna 200 Terminal 220 can be connected.

The substrate 330 may include a wiring layer, and the wiring layer may include a receiving circuit or the like to be described later.

The contact unit 300 may connect the receiving circuit (not shown) and the inner antenna 200 to transmit the power received from the inner antenna 200 to a load (not shown) through the receiving circuit. The receiving circuit may include a rectifying circuit (not shown) for converting AC power into DC power and a smoothing circuit (not shown) for removing the ripple component from the converted DC power and delivering the same to the load.

26 to 27 are views for explaining the detailed configuration of the antenna assembly 1000 according to another embodiment of the present invention when the inner antenna 200 and the contact portion 300 are connected.

26 shows a state in which the inner antenna 200 and the contact portion 300 are connected to each other.

The connection between the inner antenna 200 and the contact portion 300 can be made by solder.

27, the outer terminal 210 of the inner antenna 200 and the first connection terminal 311 of the contact portion 300 can be connected by the first solder 10 and the inner terminal 200 of the inner antenna 200 The terminal 220 and the second connection terminal 312 of the contact portion 300 may be connected by the second solder 20. Specifically, the outer terminal 210 of the inner antenna 200 can be connected to the first connection terminal 311 of the contact portion 300 through the via hole of the first solder 10, The first connection terminal 220 may be connected to the second connection terminal 312 of the contact portion 300 via a via hole of the second solder 20. [

In one embodiment, the via hole may be formed using a laser. At this time, the laser may be a UV laser, a CO2 laser, or the like.

27, a cross-sectional view of an antenna assembly 1000 in which a magnetic substrate 100 and an inner antenna 200 are connected to a contact portion 300 is shown.

That is, the outer terminal 210, the inner terminal 220, and the inner coil 230, which are components of the inner antenna 200, may be disposed in the pattern groove 140 of the magnetic substrate 100.

In addition, a state in which the magnetic substrate 100 and the inner antenna 200 are connected to the contact portion 300 is shown.

The width W and the thickness T of the inner coil 230 and the thickness T1 of the magnetic substrate 100 can be designed to have predetermined values. In one embodiment, the thickness of the inner coil 230 may be 0.1 mm and the thickness of the magnetic substrate 100 may be 0.43 mm, but this is only an example. In one embodiment, the thickness T of the inner coil 230 may be less than the thickness T1 of the magnetic substrate 100.

The antenna assembly 1000 according to another embodiment of the present invention includes the inner antenna 200 directly disposed in the pattern groove 140 of the magnetic substrate 100 so that the antenna assembly 1000 Can be reduced. If another embodiment of the present invention is applied to an electronic apparatus having an antenna assembly 1000 such as a portable terminal, the effect of reducing the overall thickness of the portable terminal, which is required to be slim, can be obtained.

In the antenna assembly 1000 according to another embodiment of the present invention, when the inner antenna 200 is disposed in the pattern groove 140 of the magnetic substrate 100 and a coil pattern is formed on the conventional FPCB The overall size of the electronic device in which the antenna assembly 1000 is mounted can be reduced.

28 to 32 are views for explaining a method of manufacturing the antenna assembly 1000 according to another embodiment of the present invention.

Hereinafter, a manufacturing method of the antenna assembly 1000 according to another embodiment of the present invention will be described in connection with the contents of FIGS. 25 to 27. FIG.

First, referring to FIG. 28, a magnetic substrate 100 is disposed. In one embodiment, the magnetic substrate 100 may be fabricated by applying a sendust alloy (Al, Fe, SiO2) metal powder over a polyethylene-based rubber and forming an oxide coating on the surface.

Next, referring to FIG. 29, heat and pressure are simultaneously applied to the magnetic substrate 100 by using the metal mold 1 to form a pattern groove capable of accommodating the inner antenna 200. The mold 1 can be made to have the same shape as the inner antenna 200. [ In one embodiment, the material of the mold 1 may be an aluminum alloy, a copper alloy, cast iron, or the like.

The mold 1 may be provided with a protrusion corresponding to a position where the inner antenna 200 for wirelessly receiving power is disposed.

When heat is applied by using the metal mold 1, heat having a specific temperature is applied in consideration of the characteristics of the metal powder of the sendust alloy, which is a component of the magnetic substrate 100. In one embodiment, when the magnetic substrate 100 is manufactured by applying a sendust alloy metal powder onto the polyethylene rubber, when heat and pressure are applied using the metal mold 1, And then cooled to a temperature of 100 degrees or less, and then the mold 1 is separated from the magnetic substrate 100. When the mold 1 is immediately separated from the magnetic substrate 100 by applying the pressure to the magnetic substrate 100 using the mold 1, the pattern groove 140 to be originally formed due to the heat remaining in the pattern groove 140 is formed It is necessary to separate the mold 1 from the magnetic substrate 100 after cooling to 100 degrees or less.

When the Sendust alloy metal powder is used as the magnetic substrate 100, the temperature and pressure to be applied depend on the arrangement and density of the powders. That is, higher temperature and pressure should be applied when the powder arrangement is not uniform, and lower temperature and pressure may be applied when the powder arrangement is uniform than when the powder arrangement is not uniform. Further, when the density of the powder is low, a lower temperature and pressure may be applied as compared with a case where the density is high. In addition, the temperature and the pressure applied depending on the components of the powder, that is, the alloy constituting the powder, may vary.

As such, the temperature applied depending on the arrangement, density, and components of the powder may be varied.

In one embodiment, instead of applying heat and pressure, the mold 1 may be irradiated with a laser to form a pattern groove in the magnetic substrate 100 to accommodate the inner antenna 200. [ The pattern grooves may be formed using an excimer laser that emits a laser beam having a wavelength in the ultraviolet region. As the excimer laser, a KrF excimer laser (krypton fluorine, center wavelength: 248 nm) or an ArF excimer laser (argon fluorine, central wavelength: 193 nm) can be used.

Next, referring to FIG. 30, FIG. 30 shows the state of the magnetic substrate 100 in which the pattern groove 140 is formed when the mold 1 is separated from the magnetic substrate 100.

31, the inner antenna 200 is inserted into the pattern groove 140 formed in the magnetic substrate 100 in the state of FIG. When the inner antenna 200 is inserted, a constant conductive pattern is formed in the pattern groove 140 of the magnetic substrate 100.

The process of inserting the inner antenna 200 into the pattern groove 140 of the magnetic substrate 100 includes a method of inserting an etched metal so as to have a conductive pattern formed by the inner or outer antenna 200 Can be used.

Specifically, the inner antenna 200 may be formed by plating the pattern groove 140 with a metal material. The metal material may be any one selected from among Cu, Ag, Sn, Au, Ni, and Pd. The metal material may be filled by electroless plating, electroplating, screen printing, sputtering ), Evaporation (Ecaporation), inkjetting, and dispensing, or a combination thereof may be used.

32, soldering is performed so that the inner antenna 200 and the contact portion 300 are connected to each other.

That is, the outer terminal 210 of the inner antenna 200 and the first connection terminal 311 of the contact portion 300 are connected by the solder 10 and the second connection terminal 200 of the inner antenna 200 And the second connection terminal 312 of the contact portion 300 is connected by the solder 20.

The method of manufacturing the antenna assembly 1000 according to another embodiment of the present invention includes forming the pattern groove in the magnetic substrate 100 and disposing the inner antenna 200 in the formed pattern groove, The antenna assembly 1000 can be manufactured only through the process of forming the pattern grooves and the process of inserting the coil part, thereby simplifying the manufacturing process.

FIG. 33 is a view for explaining changes in inductance, resistance and Q value of the coil part according to the frequency of use when the coil part is arranged on the top surface of the magnetic substrate according to still another embodiment of the present invention, Resistance and Q value of the inner antenna 200 according to the frequency of use when the coil portion is disposed in the pattern groove in the magnetic substrate according to another embodiment of the present invention.

The relational expression of the inductance, resistance and Q value of the inner antenna 200 can be expressed by the following equation (1).

 [Equation 1]

Q = w * L / R

 In Equation (1), w denotes a frequency used in power transmission, L denotes an inductance of the inner antenna 200, and R denotes a resistance of the inner antenna 200.

 As shown in Equation (1), the inductance of the inner antenna 200 increases as Q increases. As the Q value increases, the power transmission efficiency can be improved. The resistance of the inner antenna 200 is a numerical value of the amount of power loss generated in the inner antenna 200 itself, and the Q value increases as the value decreases.

33 and FIG. 34, compared with the case where the inner antenna 200 is disposed on the magnetic substrate 100 according to another embodiment of the present invention, When the inner antenna 200 is arranged in the pattern groove 140 in the magnetic substrate 100 according to another embodiment of the present invention, the inductance of the inner antenna 200 is about 3533.42 um at about 9986.92 um to about 10339.34 um And the resistance of the inner antenna 200 is about 0.853 ohms at about 0.910 ohms, which is reduced by 0.057 ohms. As a result, the Q value increases by an amount of increase in inductance and a decrease in resistance.

Therefore, the antenna assembly 1000 according to another embodiment of the present invention can increase the Q value by disposing the inner antenna 200 in the pattern groove in the magnetic substrate 100. [

FIG. 35 is an H-field for showing a radiation pattern of a magnetic field when a coil part is arranged on the top surface of a magnetic substrate according to another embodiment of the present invention. FIG. Field is an H-field for showing a radiation pattern of a magnetic field when a coil part is arranged in an inner pattern groove.

35 and 36, in the case where the inner antenna 200 is disposed in the pattern groove in the magnetic substrate 100, the inner antenna 200 is arranged in the pattern groove inside the magnetic substrate 100, It can be confirmed that the magnetic field is radiated from the outside of the magnetoresistive element. This is because the direction of the magnetic field directed to the outside is changed to the side of the inner antenna 200 by the structure in which the inner antenna 200 is embedded in the magnetic substrate 100.

In the case where the inner antenna 200 is disposed in the pattern groove in the magnetic substrate 100 as compared with the case where the inner antenna 200 is disposed on the upper surface of the magnetic substrate 100, The more radiated it is. This is because the direction of the magnetic field directed to the outside is changed to the side of the inner antenna 200 by the structure in which the inner antenna 200 is embedded in the magnetic substrate 100.

Referring to FIGS. 35 and 36, the antenna assembly 1000 may further include an outer antenna 600.

The outer antenna 600 can perform communication with a reader capable of short-range wireless communication. The outer antenna 600 serves as an antenna for transmitting and receiving information to and from the reader.

In one embodiment, the outer antenna 600 may be located at the outer periphery of the inner antenna 200. [ When the inner antenna 200 is disposed at the center of the magnetic substrate 100, the outer antenna 600 may be disposed along the outer periphery of the magnetic substrate 100 so as to surround the inner antenna 200. The outer antenna 600 may have a quadrangular structure in which one conductor is wound a plurality of times, but it is not limited thereto.

The outer antenna 600 may form a conductive pattern or a conductive layer like the inner antenna 200.

Various techniques can be used for the local communication standard used in the outer antenna 600, but it is preferable to use NFC (Near Field Communication).

Next, an antenna assembly according to another embodiment of the present invention will be described with reference to FIGS. 37 to 48. FIG.

FIG. 37 is an exploded perspective view of an antenna assembly 1000 according to another embodiment of the present invention, FIG. 38 is a perspective view of an antenna assembly 1000 according to another embodiment of the present invention, and FIG. Sectional view of an antenna assembly 1000 according to another embodiment.

FIG. 38 is a perspective view showing the components of the antenna assembly 1000 shown in FIG. 37, and some components are omitted and combined.

The antenna assembly 1000 according to another embodiment of the present invention may be mounted on an electronic device such as a portable terminal.

37 to 39, the antenna assembly 1000 includes a magnetic substrate 100, an inner antenna 200, a contact portion 300, an outer antenna 600, an adhesive layer 700, a first double-sided adhesive layer 710, A second double-sided adhesive layer 720, a protective film 800, and a release layer 730. [

First, referring to FIG. 37, the magnetic substrate 100 can change the direction of the magnetic field transmitted from the transmitting side.

The magnetic substrate 100 may change the direction of the magnetic field transmitted from the transmitting side to the inner antenna 200 to reduce the amount of the magnetic field that can leak to the outside. Thereby, a shielding effect can be obtained.

The magnetic substrate 100 changes the direction of the magnetic field transmitted from the transmission side to the lateral direction so that the magnetic field can be transmitted more intensively to the inner antenna 200. [

The magnetic substrate 100 may absorb the magnetic field leaking out of the magnetic field transmitted from the transmitting side to the inner antenna 200 and emit it as heat. If the amount of the magnetic field leaking outside is reduced, a situation that may have harmful effects on the human body can be prevented.

Referring to FIG. 39, the magnetic substrate 100 may include a magnetic body 110 and a support 120.

The magnetic body 110 may include a form of particles or ceramics. In one embodiment, the magnetic body 110 may be any one of a spinel type, a hexate type, a sendust type, and a permalloy type magnetic body.

The support 120 may include a thermosetting resin or a thermoplastic resin and supports the magnetic substrate 100.

Referring again to FIG. 37, the magnetic substrate 100 may be formed in the form of a sheet, and may have a flexible property.

The magnetic substrate 100 may have a receiving space 130 in a certain area. The receiving space 130 may have the same shape as that of the contact portion 300 and the contact portion 300 may be disposed in the receiving space 130 and connected to the inner antenna 200.

The inner antenna 200 can receive power wirelessly using electromagnetic induction or resonance from the transmitting side. The inner antenna 200 may include an outer terminal 210, an inner terminal 220, and an inner coil 230, as described with reference to FIG. The inner coil 230 may be formed of a conductive layer or a conductive pattern.

The contact unit 300 may connect between the inner antenna 200 and a receiving circuit (not shown) to transmit the power received from the inner antenna 200 to a load (not shown) through the receiving circuit.

The contact portion 300 may include a wiring layer, and the wiring layer may include the receiving circuit. The receiving circuit may include a rectifying circuit for rectifying the power received from the inner antenna 200, a smoothing circuit for removing the noise signal, and a main IC chip for performing an overall operation for wirelessly receiving power.

In addition, the receiving circuit may transmit a signal received from the outer antenna 600 to a local communication signal processing unit (not shown).

The contact portion 300 is disposed in the receiving space 130 of the magnetic substrate 100 and is connectable to the inner antenna 200. Referring to FIG. 38, it is confirmed that the contact portion 300 is disposed in the accommodation space 130 of the magnetic substrate 100.

The contact portion 300 may include a first connection terminal 311, a second connection terminal 312, a third connection terminal 313 and a fourth connection terminal 314, The terminal 311 may be connected to the first connection terminal 311 of the inner antenna 200 and the second connection terminal 312 of the contact portion 300 may be connected to the inner terminal 220 of the inner antenna 200 And the third connection terminal 313 of the contact portion 300 can be connected to the inner terminal 610 of the outer antenna 600 and the fourth connection terminal 314 of the contact portion 300 can be connected to the outer antenna 600).

The contact portion 300 may have the same shape as the shape of the receiving space 130 and may be disposed in the receiving space 130. The total thickness of the antenna assembly 1000 can be greatly reduced by the thickness of the contact portion 300 as the contact portion 300 is disposed in the accommodation space 130 of the magnetic substrate 100. [ Therefore, the thickness of an electronic device such as a portable terminal on which the antenna assembly 1000 is mounted can be greatly reduced.

In one embodiment, the contact portion 300 may be a flexible printed circuit (FPCB), a tape substrate (TS), or a lead frame (LF). When the tape member is used as the contact portion 300, the thickness of the contact portion 300 may be reduced to reduce the overall size of the antenna assembly 1000.

When the lead frame is used as the contact portion 300, the wiring layer included in the contact portion 300 can be protected from heat, moisture, impact or the like from the outside, and mass production can be achieved.

Referring again to FIG. 37, the outer antenna 600 can perform communication with a reader capable of short-range wireless communication. The outer antenna 600 may perform a function of transmitting / receiving information to / from the reader.

The local communication signal processing unit (not shown) may receive and process the signal received by the outer antenna 600 through the contact unit 300.

Various techniques can be used for the local communication standard used in the outer antenna 600, but it is preferable to use NFC (Near Field Communication).

In one embodiment, the outer antenna 600 may be located at the outer periphery of the inner antenna 200. [ 38, when the inner antenna 200 is disposed on the magnetic substrate 100, the outer antenna 600 may be disposed along the outer periphery of the magnetic substrate 100 so as to surround the inner antenna 200 . The outer antenna 600 may have a rectangular shape in which one conductor is wound a plurality of times, but it need not be limited thereto.

Referring again to FIG. 37, the adhesive layer (not shown) may be disposed below the protective film 800, and the protective film 800 may be attached to the inner antenna 200 and the outer antenna 600. This will be described later.

The first double-sided adhesive layer 710 is disposed between the inner antenna 200 and the outer antenna 600 and the magnetic substrate 100 so that the inner antenna 200 and the magnetic substrate 100 can be attached. This will be described later. The first double-sided adhesive layer 710 may be provided with a receiving space having the same shape as that of the contact portion 300, like the magnetic substrate 100.

Referring to FIG. 39, the second double-sided adhesive layer 720 can adhere the protective film 800 and the release layer 730. This will be described later.

The inner antenna 200 may be disposed on the magnetic substrate 100 and may have a spiral type structure, but is not limited thereto.

Next, a method of manufacturing the antenna assembly 1000 according to another embodiment of the present invention will be described with reference to FIGS. 40 to 48. FIG.

When the process starts, a conductor 201, an adhesive layer 700, and a protective film 800 are prepared as shown in Fig.

In one embodiment, the conductor 201 may be formed of an alloy containing copper, and copper may be used as a rolled foil or electrolytic foil. The conductor 201 may have various thicknesses depending on the specifications of the required product. In one embodiment, the thickness of the conductor 201 may be 100 um, but this is only an example.

The adhesive layer 700 is for enhancing the adhesive force between the conductive material 201 and the protective film 800, and may be a thermosetting resin, but is not limited thereto. Preferably, the thickness of the adhesive layer 700 may be 17 um, but this is only an example.

The protective film 800 serves to protect the conductor 201 in the process of forming a constant conductive pattern by the conductor 201. Specifically, the protective film 800 can protect the conductor 201 to support the conductor 201 in an etching process to be described later to form a constant conductive pattern.

In one embodiment, the protective film 800 may be formed of a polyimide film (PI Flim: Polyimide Film), but is not limited thereto.

Next, as shown in Fig. 41, the conductor 201 and the protective film 800 may be attached through the adhesive layer 700. Fig. The attachment may be performed by a laminating process. The laminating process is a process of bonding materials of different materials by applying a predetermined heat and pressure.

Next, as shown in Fig. 42, the photosensitive film 900 is attached to the upper surface of the conductor 201. Then, as shown in Fig. The photosensitive film is used to etch the conductor 201 to form a constant conductive pattern, and a UV exposure type or LDI exposure type film may be used. In another embodiment, a photosensitive coating liquid may be applied to the upper surface of the conductor 201 instead of the photosensitive film 900. [

Next, as shown in FIG. 43, the photosensitive film 900 is exposed and developed to form a mask pattern 910. Next, as shown in FIG.

The mask pattern 910 may be formed on the upper surface of the position where a certain conductive pattern is to be formed through the exposure and development processes.

The exposure means separating a portion where a conductive pattern is to be formed and a portion not to be formed to irradiate the photosensitive film 900 with light. That is, the exposure is a step of irradiating light to a portion where a conductive pattern is not formed. The development means a step of removing a portion irradiated with light by exposure.

A mask pattern 910 may be formed at a portion where the inner antenna 200 and the outer antenna 600 are to be formed by the exposure and development processes. The portion of the conductor 201 exposed by the mask pattern 910 can be etched.

Next, as shown in FIG. 44, a groove portion where the mask pattern 910 is not formed can be etched through an etching process. The etching is performed by using a material chemically reacting with the conductor 201 located in a portion where the mask pattern 910 is not formed to etch the conductor 201 located in a portion where the mask pattern 910 is not formed it means. In one embodiment, the conductor 201 may be patterned by wet or dry etching.

45, when the mask pattern 910 is removed, the outer terminal 210 and the inner terminal 220 of the inner antenna 200, the inner terminal 610 and the outer terminal 620 of the outer antenna 600 An inner coil 230 having a constant conductive pattern, and an outer antenna 600 having a constant conductive pattern may be formed.

46, a soldering process is performed so that the inner antenna 200 and the outer antenna 600 are connected to the contact portion 300. As shown in FIG. In one embodiment, the soldering process may be, but not necessarily limited to, a reflow process. The reflow process is a process of applying a high-temperature heat source to melt the solder cream to stably bond the inner coil 230 and the electrical connection between the outer antenna 600 and the contact portion 300.

The outer terminal 210 of the inner antenna 200 can be connected to the first connection terminal 311 of the contact portion 300 by the solder 30 and the inner terminal 220 of the inner antenna 200 can be connected to the contact portion The inner terminal 610 of the outer antenna 600 can be connected to the third connection terminal 313 of the contact portion 300 and the solder 30 And the outer terminal 620 of the outer antenna 600 can be connected to the fourth connection terminal 314 of the contact portion 300 by the solder 30. [

47, the magnetic substrate 100 may be stacked on the conductive patterns located on portions other than the area occupied by the contact portion 300, that is, on the inner coil 230 and the upper surface of the outer antenna 600. [

The magnetic substrate 100 having the accommodating space corresponding to the contact portion 300 can be obtained. The receiving space of the magnetic substrate 100 may be formed to conform to the shape of the contact portion 300.

37, as the contact portion 300 is disposed in the accommodation space 130 of the magnetic substrate 100, the entire thickness of the antenna assembly 1000 is greatly reduced by the thickness of the contact portion 300, . Therefore, the thickness of an electronic device such as a portable terminal on which the antenna assembly 1000 is mounted can be greatly reduced.

At this time, the inner coil 230 and the outer antenna 600 and the magnetic substrate 100 can be attached by the first double-sided adhesive layer 710. In one embodiment, the thickness of the magnetic substrate 100 may range from 100 um to 800 um, but is not limited thereto. In one embodiment, the thickness of the first double-sided adhesive layer 710 may range from 10 um to 50 um, but is not limited thereto.

Next, as shown in Fig. 48, the peeling layer 730 may be attached to one side of the protective film 800 through the second double-sided adhesive layer 720. Fig. The peeling layer 730 is a paper layer attached to protect the second double-sided adhesive layer 720, and can be removed when attached to a case of an electronic device such as a portable terminal.

49 is a flowchart of a method of manufacturing an antenna assembly according to an embodiment of the present invention.

In particular, Figure 49 relates to a method of manufacturing the antenna assembly according to Figures 1-11.

Referring to FIG. 49, a substrate 400 is formed (S101).

Next, the conductive plate 81 is directly laminated on the upper surface of the substrate 400 (S103). At this time, the conductive plate 81 may be a copper plate.

In one embodiment, after the adhesive layer is laminated on the upper surface of the magnetic substrate 100, the conductive plate 81 may be laminated on the adhesive layer.

In another embodiment, a laminating process may be used in which the conductive plate 81 is heated at a predetermined temperature, and then a predetermined pressure is applied. The laminating process refers to a process of adhering different types of metal foil or paper using heat and pressure.

Next, a mask 83 is attached to the upper surface of the conductive plate 81 (S105). The shape of the mask 83 may be a shape including the shape of the inner antenna 200 and the shape of the outer antenna 600.

Next, the substrate 400 on which the conductive plate 81 with the mask 83 is laminated is put into the etching solution (S107), and the portion to which the mask 83 is not attached is etched so that the conductive plate 81 Thereby forming a mask-like pattern. Next, a cross section of a conductive pattern formed by etching will be described with reference to FIGS. 50 and 51. FIG.

50 and 51 show cross-sectional views of a conductive pattern formed by etching according to an embodiment of the present invention.

50A shows a cross-section of a conductive pattern formed by under-etching according to an embodiment of the present invention, and FIG. 50A is a cross-sectional view of a portion FIG. 50A shows a cross section of a conductive pattern formed by fine etching according to an embodiment of the present invention. FIG. 50A shows a cross section of a conductive pattern formed by over-etching.

Referring to FIGS. 50 and 51, the cross section of the inner coil 230 corresponding to the coil pattern can be simplified to a polygon having a plurality of inner angles. Simplification then means averaging relatively small irregularities or rounded corners within the sides of the section. The cross section of the inner coil 230 corresponding to the coil pattern may be a square, specifically, a trapezoid.

The cross section of the outer coil 630 corresponding to the coil pattern can be simplified to a polygon having a plurality of inner angles. The cross section of the outer coil 630 corresponding to the coil pattern may be a square, specifically, a trapezoid.

Hereinafter, the case where the inner coil 230 has a rectangular cross section and the outer coil 630 has a rectangular cross-section will be described.

The cross section of the inner coil 230 has a left upper side internal angle A1, an upper right side internal angle A2, a lower left side internal angle A3, and a lower right side internal angle A4.

The cross section of the outer coil 630 has a left upper side internal angle A5, an upper right side internal angle A6, a lower left side internal angle A7 and a lower right side internal angle A8.

The inner coil 230 and the outer coil 630 are formed of the same conductive plate 81 so that the thickness of the inner coil 230 and the thickness of the outer coil 630 may be the same. The layer where the inner coil 230 is located and the layer where the outer coil 630 is located may be the same. The upper surface of the substrate 400 and the upper surface of the inner coil 230 are parallel and the upper surface 400 of the substrate and the upper surface of the outer coil 630 may be parallel. The height Hp1 from the upper surface of the substrate 400 to the upper surface of the inner coil 230 may be equal to the height Hp2 from the upper surface of the substrate 400 to the upper surface of the outer coil 630. [

In an embodiment, the thickness of the inner coil 230 and the outer coil 630 corresponding to the coil pattern may be greater than 80um, which is larger than a general conductor pattern, in order to reduce the resistance component of the coil pattern and increase the Q value. The thickness of the inner coil 230 and the outer coil 630 corresponding to the coil pattern may be 100 m or more in order to further reduce the resistance component of the coil pattern and increase the Q value.

In the embodiment, since the inner coil 230 and the outer coil 630 are formed from the same conductive plate 81 through the same etching process,

The left upper side internal angle A1 of the cross section of the inner coil 230 may be the same as the left upper side internal angle A5 of the cross section of the outer coil 630. [ The upper right side inner angle A2 of the cross section of the inner coil 230 may be the same as the right side upper side inner angle A6 of the cross section of the outer coil 630. [ The left lower internal angle A3 of the section of the inner coil 230 may be the same as the left lower internal angle A7 of the section of the outer coil 630. [ The lower right inner angle A4 of the cross section of the inner coil 230 may be the same as the lower right side inner angle A8 of the cross section of the outer coil 630. [

The upper left side internal angle A1 of the cross section of the inner coil 230 may be the same as the upper right side internal angle A2 of the cross section of the inner coil 230. [ The left lower side inner angle A3 of the section of the inner coil 230 may be the same as the lower right side inner angle A4 of the end surface of the inner coil 230. [ The left upper side internal angle A5 of the cross section of the outer coil 630 may be the same as the right side upper side internal angle A6 of the cross section of the outer coil 630. [ The left lower side inner angle A7 of the cross section of the outer coil 630 may be the same as the right lower side inner angle A8 of the cross section of the outer coil 630. [

The upper left side internal angle A1, the upper right side internal angle A2, the lower left side internal angle A3 and the lower right side internal angle A4 of the cross section of the inner coil 230 are substantially Which corresponds to 90 degrees. The upper left side internal angle A5, the upper right side internal angle A6, the lower left side internal angle A7 and the right lower side internal angle A8 of the cross section of the outer coil 630 are set to be the same, May be substantially 90 degrees.

The upper left inner angle A1 of the cross section of the inner coil 230 is larger than the upper right side inner angle A2 of the cross section of the inner coil 230. [ The lower left side internal angle A3 of the section of the inner coil 230 is larger than the lower right side internal angle A4 of the end face of the inner coil 230. [ The upper left side internal angle A5 of the cross section of the outer coil 630 is larger than the upper right side internal angle A6 of the cross section of the outer coil 630. [ The lower left inner angle A7 of the cross section of the outer coil 630 is larger than the lower right side inner angle A8 of the cross section of the outer coil 630. [

The upper left internal angle A1 of the cross section of the inner coil 230 is smaller than the upper right side internal angle A2 of the cross section of the inner coil 230. [ The lower left inner angle A3 of the section of the inner coil 230 is smaller than the lower right side inner angle A4 of the section of the inner coil 230. [ The left upper side internal angle A5 of the cross section of the outer coil 630 is smaller than the right side upper side internal angle A6 of the cross section of the outer coil 630. [ The lower left inner angle A7 of the cross section of the outer coil 630 is smaller than the lower right side inner angle A8 of the cross section of the outer coil 630. [

Since the Q value of a well-etched antenna is greater than the Q value of an under-etched or over-etched antenna, the Q value of a well-etched antenna is insufficient Is better than the performance of an under-etched or over-etched antenna. Therefore, when the maximum value among the angles of the four internal angles of the cross section of the under-etched or over-etched antenna pattern is set to 95 degrees or less and the minimum value among the angles of the four internal angles is set to 85 degrees or more, Can be expected.

49 is described again.

Thereafter, when the mask 83 is removed (S109), the inner antenna 200 and the outer antenna 600 of the antenna assembly 1000 are formed.

On the other hand, the contact portion 300 is formed (S111).

In one embodiment, when the substrate 400 and the substrate 330 of the contact portion 300 are integrally formed, the inner antenna (not shown) of the antenna assembly 1000 is formed by the steps S103, S105, S107, and S111 described above 200, the outer antenna 600, and the contact portion 300 may be simultaneously formed.

The patterns of the contact portion 300 may be formed on the inner antenna 200 and the outer antenna 300 of the antenna assembly 1000. In this case, 600 may be formed by a separate process.

Thereafter, a connecting portion 500 is formed (S113). A method of forming the connection portion 500 according to various embodiments will be described later.

The adhesive layer 700 is formed on the substrate 400 on which the contact portion 300 and the connection portion 500 are formed (S115).

The magnetic substrate 100 is formed on the adhesive layer 700 (S117).

Next, the distance between the magnetic substrate 100 separated by the adhesive layer 700 and the antenna patterns will be described with reference to FIGS. 50 and 51. FIG.

50 and 51, the inner coil 230 of the inner antenna 200 has the line width W1 and the inter-line spacing S1, and the inner coil 230 is bonded to the magnetic substrate 100 ) And the separation distance Ha1. The external coil 630 of the external antenna 600 has a line width W2 and a line spacing S2 and the external coil 630 is spaced apart from the magnetic substrate 100 by a distance Ha2 by the adhesive layer 700 do. The adhesive layer used for separating the inner coil 230 from the magnetic substrate 100 and the adhesive layer used for separating the outer coil 630 from the magnetic substrate 100 are the same and the separation distance Ha1 is the separation distance Ha2).

Table 1 shows the case where the external antenna 600 is an NFC antenna and the line width W2 of the external antenna 600 is 400um and the line spacing S2 of the external antenna 600 is 200um, The NFC communication performance of the external antenna 600 according to the distance Ha2 between the magnetic substrate 100 and the external antenna 600 is shown as a result of the EMVCo Load modulation test.

In Table 1, (x, y, z) represents the relative positional relationship between the test equipment and the antenna assembly 1000. In particular, the x value in (x, y, z) represents the distance between the test equipment and the antenna assembly 1000.

In Table 1, A < X < B indicates a range of performance values for passing the test. For example, in the relative position relationship (0, 0, 0), the performance value of the antenna must be greater than 8.8 mV and less than 80 mV for the test pass. The resonance frequency is 15.79 MHz and the antenna performance of the external antenna 600 is 29.15 mv. Therefore, when the external antenna 600 having a line width of 400 um, a line spacing of 200 um, and a spacing distance of 30 um is used ) Can be concluded to be appropriate.

However, at the relative position relationship (3, 0, 0), the performance value of the antenna must be greater than 4.0 mV and less than 80 mV for the test pass. The resonance frequency is 15.79 MHz and the antenna performance of the external antenna 600 is 3.8 mv. Therefore, when the external antenna 600 having a line width of 400 um, a line spacing of 200 um, and a spacing distance of 30 um is used ) Can be concluded not to be appropriate.

Table 2 shows the case where the external antenna 600 is an NFC antenna and the line width W2 of the external antenna 600 is 500 mu and the line spacing S2 of the external antenna 600 is 500 mu m, The NFC communication performance of the external antenna 600 according to the distance Ha2 between the magnetic substrate 100 and the external antenna 600 is shown as a result of the EMVCo Load modulation test.

As can be seen from Tables 1 and 2, the increase in the line width and the increase in the line-to-line spacing lead to a decrease in the resistance component, leading to an increase in the Q value and the performance of the external antenna 600 can be improved.

In particular, from Table 1 and Table 2, when the line width of the external antenna 600 is smaller than 400um and smaller than 200um of the external antenna 600, the performance of the external antenna 600 is affected by the distance Ha2 Of the total. When the line width of the external antenna 600 is smaller than 400um and smaller than the line-to-line spacing 200um of the external antenna 600, it is preferable that the separation distance Ha2 is 35um or more in consideration of the margin.

As described above, the performance of the external antenna 600 can be expected to be improved by using the adhesive layer 700 having a thickness of 10um or more, which is a general adhesive layer thickness.

Table 3 shows that the external antenna 600 is an NFC antenna and the line width W2 of the external antenna 600 is 400um and the line spacing S2 of the external antenna 600 is 200um, Of the external antenna 600 according to the distance Ha2 between the magnetic substrate 100 and the external antenna 600 separated by the adhesive layer 700 when the relative positional relationship between the external antenna 600 and the external antenna 600 is (3, 0, 0) NFC communication performance is shown as a result of the EMVCo Load modulation test.

It can be seen from Table 3 that EMVCo Load modulation test of the external antenna 600 can not be passed if the separation distance Ha2 is smaller than 30 mu m when the line width W2 is 400 m and the inter- . Therefore, it is preferable that the separation distance Ha2 is larger than 30 mu m.

It can be seen that the EMVCo Load modulation test of the external antenna 600 can not be passed if the line width W2 is 400um and the line spacing S2 is 200um and the separation distance Ha2 is larger than 70um. Therefore, it is preferable that the separation distance Ha2 is smaller than 70 mu m.

It can be seen that the EMVCo Load modulation test of the external antenna 600 is passed if the separation distance Ha2 is larger than 40um and smaller than 60um when the line width W2 is 400um and the line spacing S2 is 200um . Therefore, the separation distance Ha2 may be greater than 40 um, preferably smaller than 60 um.

Table 4 shows test results of the test equipment and the antenna assembly 1000 when the external antenna 600 is an NFC antenna, the line width W2 of the external antenna 600 is 500 占 퐉, the line spacing S2 of the external antenna 600 is 500 占 퐉, Of the external antenna 600 according to the distance Ha2 between the magnetic substrate 100 and the external antenna 600 separated by the adhesive layer 700 when the relative positional relationship between the external antenna 600 and the external antenna 600 is (3, 0, 0) NFC communication performance is shown as a result of the EMVCo Load modulation test.

It can be seen that the EMVCo Load modulation test of the external antenna 600 can not be passed if the line width W2 is 500 μm and the line interval S2 is 500 μm and the separation distance Ha2 is less than 20 μm. Therefore, it is preferable that the separation distance Ha2 is larger than 20 mu m.

It can be seen that the EMVCo Load modulation test of the external antenna 600 can not be passed if the line width W2 is 500 μm and the line interval S2 is 500 μm and the separation distance Ha2 is larger than 70 μm. Therefore, it is preferable that the separation distance Ha2 is smaller than 70 mu m.

It can be seen that the EMVCo Load modulation test of the external antenna 600 is passed if the separation distance Ha2 is greater than 30 um and less than 60 um when the line width W2 is 500 um and the line spacing S2 is 500 um . Therefore, the separation distance Ha2 may be larger than 30 mu m and smaller than 60 mu m.

From Table 3 and Table 4, it can be seen that if the separation distance Ha2 is greater than 35 um and less than 65 um, then both of the above tests pass. This means that it is easy to set the resonance frequency within the range of 16.2 to 16.3 MHz, which is the target frequency, when the distance Ha2 is greater than 35 um and smaller than 65 um. That is, if the separation distance Ha2 is smaller than the predetermined value, it means that the impedance matching is not easy.

53 is a flowchart of a method of manufacturing the connection portion 500 of the antenna assembly according to an embodiment of the present invention.

Particularly, FIG. 53 relates to a manufacturing method of the connection part 500 of the antenna assembly according to FIGS.

First, an insulating layer 531 is formed on a substrate 400 on which an inner antenna 200 and an outer antenna 600 are formed (S301).

The insulating layer 531 does not cover a part of the outer terminal 210 of the inner antenna 200 but covers a portion where the conductive bridge 520 corresponding to the first sub connecting portion 501 meets the inner coil 230, And the conductive bridge 520 corresponding to the first sub connecting portion 501 may cover the portion where the conductive bridge 520 meets the outer coil 630.

The insulating layer 531 does not cover a part of the inner terminal 220 of the inner antenna 200 and the portion where the conductive bridge 520 corresponding to the second sub connection portion 502 meets the inner coil 230 And cover the portion where the conductive bridge 520 corresponding to the second sub connection portion 502 meets the outer coil 630.

The insulating layer 531 does not cover a part of the inner terminal 610 of the outer antenna 600 and covers the portion where the conductive bridge 520 corresponding to the third sub connection portion 503 meets the inner coil 230, And the conductive bridge 520 corresponding to the third sub connection portion 503 may cover the portion where the conductive bridge 520 contacts the outer coil 630.

The insulating layer 531 does not cover a part of the outer terminal 620 of the outer antenna 600 and covers a portion where the conductive bridge 520 corresponding to the fourth sub connection portion 504 meets the inner coil 230, And the conductive bridge 520 corresponding to the fourth sub connection portion 504 may cover the portion where the conductive bridge 520 meets the outer coil 630.

In one embodiment, the insulating layer 531 may be an insulating sheet. The insulating sheet may be attached to an upper portion of the substrate 400 on which the inner antenna 200 and the outer antenna 600 are formed by an adhesive layer or a laminating process.

In yet another embodiment, the insulating layer 531 may be an insulating ink dried after application. In this case, a mask for forming the insulating layer 531 is attached to the upper portion of the substrate 400 on which the inner antenna 200 and the outer antenna 600 are formed. Here, the mask for forming the insulating layer 531 may include at least one of the inner terminal 220 of the inner antenna 200, the outer terminal 210 of the inner antenna 200, the inner terminal 610 of the outer antenna 600, And does not cover the portion where the conductive bridge 520 corresponding to the first sub connection portion 501 is formed but does not cover the portion where the conductive bridge 520 corresponding to the second sub connection portion 502 is formed, So that the portion where the conductive bridge 520 corresponding to the third sub connection portion 503 is formed is not covered. The mask for forming the insulating layer 531 covers at least a part of the outer terminal 620 of the outer antenna 600 and the fourth sub connection portion 504 The conductive bridge 520 may be formed in a shape that does not cover the portion where the conductive bridge 520 is formed. The insulating layer 531 may be formed by insulating ink by applying an insulating ink to an upper portion of the substrate 400 on which the mask for forming the insulating layer 531 is formed and drying the mask to remove the mask.

Then, a mask for forming the conductive bridge 520 is attached to the upper portion of the substrate 400 on which the insulating layer 531 is formed (S303). The mask for forming the conductive bridge 520 includes a portion where the conductive bridge 520 corresponding to the first sub connecting portion 501 is formed and a portion where the conductive bridge 520 corresponding to the second sub connecting portion 502 is formed The portion where the conductive bridge 520 corresponding to the third sub connection portion 503 is formed and the portion where the conductive bridge 520 corresponding to the fourth sub connection portion 504 is formed are not covered, Can be covered.

The conductive paste is printed a predetermined number of times on the substrate 400 on which the mask for forming the conductive bridge 520 is formed (S305) to form the first sub-bridge 521. [

The table below shows the performance of the conductive bridges according to the number of prints of the conductive paste.

Number of prints L (uH) R (ohms) Q DCR (ohm) One 7.607 1.699 2.833 1.717 3 7.608 1.291 3.706 1.320 5 7.588 1.245 4.102 1.250 6 7.613 1.153 4.277 1.067

54 is a graph showing the performance of the conductive bridge according to the number of times of printing of the conductive paste according to the embodiment of the present invention.

As shown in Fig. 54, as the number of times of printing of the conductive paste increases, the resistance value of the conductive bridge decreases, and the Q value increases.

In particular, as shown in FIG. 54, when the number of times of printing of the conductive paste is less than 3 times, the decrease of the resistance value or the increase of the Q value with the increase of the number of printing of the conductive paste is abrupt. When the number of times of printing of the conductive paste is larger than 3, the decrease of the resistance value or the increase of the Q value with the increase of the number of printing of the conductive paste is gentle.

In order to improve the performance of the antennas in the antenna assembly, the conductive bridge may have a thickness corresponding to the printing of three or more conductive pastes.

In particular, an increase in the number of times of printing of the conductive paste means an increase in the complexity of the manufacturing process of the antenna assembly 1000, so that the conductive bridge can have a thickness corresponding to the printing of three conductive pastes.

Further, in the case where the conductive bridge includes the second sub-bridge 522 formed by plating, an additional resistance value reduction by the second sub-bridge 522 is expected, so that the conductive bridge is formed of one or more conductive pastes It may have a thickness corresponding to printing.

The upper portion of the first sub-bridge 521 is plated to form the second sub-bridge 522 (S307). At this time, the upper portion of the first sub-bridge 521 may be plated with copper.

55 is a flowchart of a method of manufacturing a connection portion 500 of an antenna assembly according to another embodiment of the present invention.

Particularly, FIG. 55 relates to a method of manufacturing the connection portion 500 of the antenna assembly according to FIGS.

A lower portion of the inner terminal 200 of the inner antenna 200, a lower portion of the inner terminal 220 of the inner antenna 200, a lower portion of the inner terminal 610 of the outer antenna 600, A via hole 533 is formed in the lower portion of the outer terminal 620 of the outer antenna 600 (S501).

A mask for forming the conductive bridge 520 is attached to a lower portion of the substrate 400 on which the via hole 533 is formed (S503). The mask for forming the conductive bridge 520 includes a portion where the conductive bridge 520 corresponding to the first sub connecting portion 501 is formed and a portion where the conductive bridge 520 corresponding to the second sub connecting portion 502 is formed The portion where the conductive bridge 520 corresponding to the third sub connection portion 503 is formed and the portion where the conductive bridge 520 corresponding to the fourth sub connection portion 504 is formed are not covered, Can be covered.

The conductive paste is printed a predetermined number of times on the substrate 400 on which the mask for forming the conductive bridge 520 is formed (S305) to form the first sub-bridge 521. [ The performance of the conductive bridge according to the number of times of printing of the conductive paste is as described above.

The lower portion of the first sub-bridge 521 is plated (S507), and the second sub-bridge 522 is formed. At this time, the lower portion of the first sub-bridge 521 may be plated with copper.

56 is a flowchart of a method of manufacturing the connection portion 500 of the antenna assembly according to another embodiment of the present invention.

In particular, FIG. 56 relates to a method of manufacturing the connection part 500 of the antenna assembly according to FIGS. 9 to 11.

A via hole is formed in the substrate 400 under the connection terminals 311, 312, and 313 (S701).

A via hole is formed on the terminals of the extension patterns 541, 542, and 543 (S703).

The substrate 400 is cut along the perforations 411, 412, and 413 to form the sub-substrates 551, 552, and 553, respectively (S705).

The sub-substrates 551, 552 and 553 are folded according to the folding lines 421, 422 and 423 to bring the bottom of the substrate 400 and the upper portions of the sub-substrates 551, 552 and 553 into contact with each other (S707).

The connection terminals 311, 312 and 313 and the extension patterns 541 and 542 are connected to each other by a via hole formed on the lower ends of the connection terminals 311, 312 and 313 and the terminals of the extension patterns 541, 542 and 543, 542, and 543 are electrically connected to each other (S709). The terminals of the connection terminals 311, 312 and 313 and the extension patterns 541, 542 and 543 are electrically connected to each other by thermocompression of the conductive vias provided in the via hole 533, Can be connected.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

Claims (14)

Board;
And a wireless communication antenna pattern disposed on the outside of the wireless charging antenna pattern,
Wherein a plurality of angular values of the internal angles of the cross section of the radio communication antenna pattern correspond to angular values of a plurality of internal angles of a cross section of the radio-
Antenna assembly. delete The method according to claim 1,
Wherein the thickness of the wireless charging antenna pattern is equal to the thickness of the wireless communication antenna pattern
Antenna assembly. The method of claim 3,
The layer in which the wireless charging antenna pattern is located is the same as the layer in which the wireless communication antenna pattern is located
Antenna assembly. 5. The method of claim 4,
Wherein the upper surface of the substrate and the upper surface of the wireless filler antenna pattern are parallel,
Wherein the upper surface of the substrate and the upper surface of the wireless communication antenna pattern are parallel
Antenna assembly. 6. The method of claim 5,
The height from the upper surface of the substrate to the upper surface of the wirelessly-charged antenna pattern is equal to the height from the upper surface of the substrate to the upper surface of the wireless communication antenna pattern
Antenna assembly. 7. The method according to any one of claims 1 to 6,
Wherein the cross section of the wirelessly-charged antenna pattern is a rectangle having an upper left side inner angle, an upper right side inner angle, a lower left inner angle, and a lower right side inner angle,
The cross section of the wireless communication antenna pattern is a square having an upper left side inner angle, an upper right side inner angle, a lower left inner angle, and a lower right side inner angle
Antenna assembly. 8. The method of claim 7,
Wherein a left upper side internal angle of the wireless charging antenna pattern is the same as an upper left side internal angle of the wireless communication antenna pattern,
Wherein an upper right side inner angle of the wireless charging antenna pattern is the same as an upper right side inner angle of the wireless communication antenna pattern,
The inner bottom left angle of the wireless charging antenna pattern is the same as the bottom left inner angle of the wireless communication antenna pattern,
The lower right inner angle of the wireless charging antenna pattern is the same as the lower right inner angle of the wireless communication antenna pattern
Antenna assembly. 9. The method of claim 8,
Wherein an upper left side internal angle of the wireless charging antenna pattern is the same as an upper right side internal angle of the wireless charging antenna pattern,
Wherein a lower left inner angle of the wireless charging antenna pattern is the same as a lower right inner angle of the wireless charging antenna pattern,
The upper left side internal angle of the wireless communication antenna pattern is the same as the upper right side internal angle of the wireless communication antenna pattern,
The lower left inner angle of the wireless communication antenna pattern is the same as the lower right inner angle of the wireless communication antenna pattern
Antenna assembly. 10. The method of claim 9,
The inner left angle of the wireless charging antenna pattern is the same as the inner left angle of the wireless charging antenna pattern
Antenna assembly. 10. The method of claim 9,
The inner left angle of the wirelessly-charged antenna pattern is different from the inner-left angle of the wirelessly-charged antenna pattern
Antenna assembly. 10. The method of claim 9,
The maximum value among the angles of the four internal angles of the wirelessly-charged antenna pattern is 95 or less,
A minimum value among angles of four internal angles of the wireless communication antenna pattern is 85 or more
Antenna assembly. The method according to claim 1,
Wherein the thickness of the wireless charging antenna pattern is 80um or more,
Wherein the thickness of the wireless communication antenna pattern is 80um or more
Antenna assembly. Board;
And a wireless charging antenna pattern formed on the substrate,
Wherein the wireless charging antenna pattern is formed by any one of over etching and under etching,
Wherein an angle value of an upper inner angle angle and an angle value of a lower inner angle angle of a cross section of the wirelessly-charged antenna pattern are different from each other.

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