KR101470005B1 - Camera module and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a camera module and a method of manufacturing the same, and is characterized in that a camera module is manufactured using an integrated assembly in which a lens, a holder, and an infrared filter are integrated and a PCB substrate inserted under the integrated assembly. An embodiment of the present invention is a lens barrel comprising: a plurality of lenses; an infrared filter; a holder including the plurality of lenses and the infrared filter; And an image sensor which is placed on the PCB substrate and converts an optical signal passed through the infrared filter into a video signal.

Camera module, lens, holder, bonding, focusing, PCB

Description

[0001] CAMERA MODULE AND METHOD FOR MANUFACTURING [0002]

The present invention relates to a camera module and a manufacturing method thereof.

1 is an exploded perspective view of a camera module and a combined view thereof.

The camera module includes a plurality of lenses 10, a barrel 11 covering the lens 10, a holder 12 contacting the outside of the barrel, an infrared filter 13 provided at the rear of the lens, An image sensor 15 provided behind the filter 13 and a PCB substrate 14 contacting the rear surface of the image sensor 15.

As described above, most of the camera modules currently manufactured have a structure in which the lens-mounted barrel is fastened to the holder through the thread and fixed. Therefore, in order to manufacture such a camera module, a process of fastening and focusing the lens-mounted barrel to the holder, a bonding process of fixing the barrel and holder of the focused lens, and the like are required. In addition, each of these processes requires several seconds of time.

However, such a camera module manufacturing method has a drawback in that foreign matter may flow into the camera module during the process, which may lead to defects, and that the manufacturing time of the focusing process, the bonding process, and the like is prolonged. In addition, there is a problem that it is difficult to uniformly maintain the dimension of the head portion of the lens barrel portion due to the bond for fixing the lens.

Embodiments of the present invention relate to a camera module manufacturing method capable of minimizing the time taken for the focusing process and the bonding process, and minimizing the inflow of foreign substances during the process.

An embodiment of the present invention is a lens barrel comprising: a plurality of lenses; an infrared filter; a holder including the plurality of lenses and the infrared filter; And an image sensor which is placed on the PCB substrate and converts an optical signal passed through the infrared filter into a video signal.

So that the lens is positioned at the point of the holder to be focused.

The lower portion of the holder protrudes in a collapsed structure, and the PCB substrate is positioned so as to be wrapped in the cover. In addition, the PCB substrate is bonded to the inner surface of the covering structure.

According to another aspect of the present invention, there is provided a method of manufacturing a solid state image sensor, including the steps of: integrating a plurality of lenses, a holder, and an infrared filter in an integrated assembly; inserting a PCB substrate having an image sensor mounted thereon into a lower portion of the integrated assembly; And adjusting the height of the PCB to adjust the height of the PCB so that the integrated assembly and the PCB substrate are bonded and fixed at a point of the current PCB substrate .

In the embodiment of the present invention, the PCB substrate is inserted into the holder and the height thereof is adjusted, so that the focusing deviation correction can be performed. In addition, since the bonding fixed to the head portion of the lens barrel of the lens is not performed, the dimension for this portion can also be managed. In addition, the simplification of the shape of the lens barrel portion can be expected to reduce the material cost, process time, and cost.

Hereinafter, a detailed description of embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the same reference numerals are used to denote the same or similar components in the drawings.

FIG. 2 is an exploded perspective view of a camera module according to an embodiment of the present invention, and FIG.

In general, the camera module includes a plurality of lenses, a barrel to which the plurality of lenses are mounted, an infrared filter for blocking infrared rays from the light coming from the lens, and a holder for fixing the barrel and the infrared filter.

Conventionally, in manufacturing a camera module, a focusing process, a barrel of a focused lens and a bonding process for fixing the holder are required. That is, when the lens barrel and the image sensor mounted PCB and holder are screwed together, the lens barrel is focused and fixed. As described above, the conventional camera module is structured to be bonded, so that it is structured to be fragile to cause foreign matter defects, and the manufacturing time becomes long.

However, in the embodiment of the present invention, it is not necessary to have a barrel on which the lens is mounted, and the lens is mounted directly on the holder. That is, a plurality of lenses and a holder in which the lens is fastened to the point to be focused and an infrared filter positioned under the lens are integrally assembled as a single structure.

As a result, it is not necessary to tighten the lens barrel and the holder by assembling a plurality of lenses, a holder to which the lens is fastened at the position to be focused, and an infrared filter located at the lower portion of the barrel as an integral assembly 20 having a single structure .

In addition, since the integrated assembly 20 according to the embodiment of the present invention has a structure for directly surrounding the lens, the diameter of the lens barrel can be drastically reduced because the thread of the fastening part of the conventional barrel and the holder is not needed. That is, when the aperture A of the conventional camera module shown in FIG. 1 is compared with the aperture B of the camera module of the present invention shown in FIG. 2, it can be seen that the aperture B of the camera module without the thread is smaller than the aperture A.

On the other hand, in order to integrally place the lens at the position of the holder to be focused, the lens is designed to be placed at a position of the holder where precise focusing is performed through simulation in advance. It does not have a separate focusing process by placing the lens at the point of the holder designed to be focused.

However, even if the integrated assembly is manufactured by designing the lens to be placed at the position of the focused holder as described above, fine focusing deviations may occur due to the reason of the actual manufacturing process.

The embodiment of the present invention adjusts the height of the PCB substrate 14 to correct the fine focusing deviation to achieve accurate focusing.

An image sensor 15 for converting an optical signal passed through an infrared ray filter into an electrical image signal is mounted on the PCB substrate 14. The image sensor 15 adjusts the height of the PCB substrate 14, The focusing of the optical signal can be finely adjusted. That is, by adjusting the height of the PCB substrate 14 on which the image sensor 15 is placed, that is, consequently, by adjusting the height of the image sensor, precise focusing can be achieved by eliminating microscopic variations in focusing that may occur during the manufacture of the integral assembly Respectively.

For this purpose, the PCB substrate 14 on which the image sensor is placed is inserted into the lower portion of the holder of the integral assembly 20, and the correction of the focusing deviation is performed by adjusting the height of the PCB substrate 14. That is, after inserting the PCB substrate 14 into the lower portion of the integrated assembly 20, the deviation of the focusing can be corrected by adjusting the height of the PCB substrate during the image test.

As described above, the height of the PCB substrate is adjusted and an image test is performed. Then, the assembly is fixed by bonding with the integrated assembly at a point where accurate focusing is performed.

The lower part of the integral assembly 20 protrudes into the structure of the cover 21, and the PCB substrate is embedded in the lower part of the integral assembly. (14). Therefore, the PCB substrate 14 is enclosed in the structure of the protrusion 21 protruding from the lower part of the integrated assembly, so that the PCB substrate 14 is not visible from the outside.

When the point where the focusing deviation is corrected by the height adjustment of the PCB substrate is determined, the inner surface of the PCB substrate 14 and the inner surface of the covering structure 21 are bonded to each other at the corresponding point, thereby bonding and fixing the PCB substrate.

3 is a flowchart illustrating a camera module manufacturing process according to an embodiment of the present invention.

First, there is a process (S31) in which a plurality of lenses, a holder, and an infrared filter are integrally fabricated as an integrated assembly. The point at which the lens is located in the holder allows the lens to be located at a holder point previously designed as a focusing position by simulation. Therefore, since the lens is already focused when it is placed in the holder, no separate focusing process is required as in the conventional case.

Thereafter, a PCB substrate having the image sensor mounted thereon is inserted into the lower portion of the integrated assembly (S32). And adjusting the height of the PCB board inserted into the lower portion of the integral assembly to correct the focusing deviation (S33).

And a step S34 of bonding and fixing the integrated assembly and the PCB substrate at a point of the current PCB substrate positioned by height adjustment when the focusing deviation is corrected by adjusting the height of the PCB substrate and accurate focusing is performed.

By manufacturing the camera module using the integrated assembly as described above, the material ratio, the process time, and the cost can be reduced by shortening the shape of the lens barrel portion.

While the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Accordingly, the scope of the patent of the present invention is not limited by the above-described embodiments, and it will be obvious that the patent scope covers not only the claims but also the equivalents.

1 is an exploded perspective view of a camera module and a combined view thereof.

FIG. 2 is an exploded perspective view of a camera module according to an embodiment of the present invention, and FIG.

3 is a flowchart illustrating a camera module manufacturing process according to an embodiment of the present invention.

Description of the Related Art [0002]

14: PCB substrate 15: Image sensor

20: integral assembly 21:

Claims (5)

An integrated assembly in which a plurality of lenses, a holder to which the lens is mounted, and an infrared filter disposed under the lens are integrated into a single structure; A PCB substrate inserted into a lower portion of the holder, the PCB substrate being bonded inside the lower portion of the integrated assembly after height adjustment for correcting focusing deviation; And An image sensor that is placed on the PCB substrate and converts the optical signal passed through the infrared filter into a video signal; . The camera module of claim 1, wherein the lens is located at a point of the holder being focused. The camera module according to claim 1, wherein a bottom portion of the holder protrudes in a collapsed structure, and the PCB substrate is positioned so as to be wrapped in the cover. The camera module of claim 3, wherein the PCB substrate is bonded to an inner surface of the collapsible structure. A process in which a plurality of lenses, a holder, and an infrared filter are integrally fabricated in an integrated assembly; Inserting a PCB substrate having an image sensor mounted therein into a lower portion of the integrated assembly; Adjusting a height of the PCB substrate to correct a focusing deviation; When precise focusing is performed by adjusting the height of the PCB board, the integrated assembly and the PCB board are bonded and fixed at a point of the current PCB board And a camera module.

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