KR101453492B1 - Method for forming circuit pattern - Google Patents

Abstract

The present invention relates to a circuit pattern implementation method. The method includes the steps of forming an injection molded body having a predetermined shape, pretreating the surface of the injection molded body with a plating masking liquid, etching the mask formed on the surface of the injection molded body with a laser, , Plating the exposed object with the surface corresponding to the circuit pattern by the plating liquid, and removing the mask. According to the above method, not only the precision of the circuit pattern can be enhanced, but also the manufacturing cost in implementing the manufacturing circuit pattern can be reduced.

Description

METHOD FOR FORMING CIRCUIT PATTERN [0002]

The present invention relates to a circuit pattern implementation method. More particularly, the surface of an object is pre-treated with a plating masking liquid to form a mask on the surface of the object, and then the mask is etched with a predetermined circuit pattern using a laser to perform a plating process on the exposed object. To a circuit pattern implementation method for implementing a circuit pattern on a surface.

A large number of various electronic devices have been developed and released. In order to develop such electronic devices, it is required to design and implement circuits according to functions of electronic devices.

It is necessary to design a circuit and design a circuit pattern on a circuit board. There are LDS (Laser Direct System) process or PDS (Print Direct System) process to implement a circuit pattern. Implement circuit patterns in the same way.

In the LDS process, the surface of an injection molded article made of a special resin for LDS is marked with a laser according to a predetermined circuit pattern, and a plating process is performed on the marked portion to form a circuit pattern. Meanwhile, the PDS process is a method of forming an antenna pattern by printing a predetermined circuit pattern on an injection-molded article made of general resin, and then performing a plating process only on a printing area.

There is a disadvantage that the cost of manufacturing the circuit pattern is high because only LDS special resin having a high production cost is used as the composition of the injection molding. In addition, since the PDS process forms a circuit pattern by using a printing method with a low precision, there is a disadvantage that not only a defective rate of a circuit pattern is high but also a manufacturing cost is high due to a high manufacturing cost of a mold.

It is an object of the present invention to provide a circuit pattern implementation method capable of reducing a defect rate of a circuit pattern and lowering a manufacturing cost.

The objects of the present invention are not limited to those mentioned above, and other objects not mentioned may be clearly understood by those skilled in the art from the following description.

According to another aspect of the present invention, there is provided a method of fabricating a circuit pattern, the method comprising: forming an injection molded body having a predetermined shape; pretreating the surface of the molded body with a plating masking liquid; Etching the mask formed on the surface of the semiconductor substrate with a laser according to a predetermined circuit pattern, plating the exposed object exposed with the surface corresponding to the circuit pattern with a plating liquid, and removing the mask.

The injection molded article may be formed of a mixture of at least one of acrylonitrile butadiene styrene (ABS) and polycarbonate-acrylonitrile butadiene styrene (PC-ABS).

In addition, the circuit pattern embodying method may further include a step of pre-treating the surface of the injection product with a plating masking liquid, followed by drying the injection product.

The step of plating the injection product with a plating solution may include a first plating step of plating the injection product with a plating solution to form a copper film, a step of forming a nickel film on the copper film, A second plating step of plating the injection product with a plating solution, and a third plating step of plating the injection product with a plating solution for forming a gold coating to form a gold coating on the nickel coating .

Further, the first plating treatment step, the second plating treatment step and the third plating treatment step may be performed by an electroless plating method.

The first plating process, the second plating process, and the third plating process may include a step of removing impurities on the surface of the injection molded article, a step of forming fine irregularities on the surface of the molded article using an etching solution A step of adsorbing a catalytic metal on the surface of the injection molding using a catalyst liquid, a step of producing palladium on the surface of the injection molding using a reaction promoter, and a step of forming a copper film, And forming a film.

In addition, the step of plating the injection product with the plating solution may be a first plating treatment step of plating the injection product with a plating solution for forming a copper film.

Also, the first plating step may be performed by an electroless plating method.

The first plating step may include a step of removing impurities on the surface of the injection molded article, a step of forming fine irregularities on the surface of the molded article using an etching liquid, a step of forming catalyst metal , Forming palladium on the surface of the injection molding using a reaction promoter, and forming the copper coating on the injection molding.

The method for fabricating a circuit pattern may further include a second plating step of plating the injection material with a plating liquid for forming a nickel coating to form a nickel coating on the copper coating after the mask is removed, And a third plating step of plating the injection product with a plating solution for forming a gold film to form a gold film on the first plating film.

Further, the second plating step and the third plating step may be performed by an electrolytic plating method.

According to the method of implementing a circuit pattern according to the present invention, the mask formed on the surface of the injection mold is pretreated with a plating masking liquid to form a circuit pattern, and the precision of the circuit pattern is improved because the mask is etched according to a circuit pattern using a laser.

According to the circuit pattern embodying method of the present invention, the surface of an object is directly marked with a laser according to a circuit pattern to perform a plating process for forming a circuit pattern, Since the plating process for forming the pattern is performed, the method of implementing the circuit pattern according to the present invention can be applied not only to the injection-molded object made of special resin but also to the injection-molded object made of various kinds of resin, Can be saved.

The effects of the present invention are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a flowchart of a method of implementing a circuit pattern according to a first embodiment of the present invention.
2 is a flowchart of a method of implementing a circuit pattern according to a second embodiment of the present invention.
3 is a view showing an example of implementing a circuit pattern by applying the method of implementing a circuit pattern according to the second embodiment of the present invention.
Fig. 4 is a flowchart of an electroless plating method applicable to the first to third plating steps of Fig. 2. Fig.
5 is a flowchart of a method of implementing a circuit pattern according to a third embodiment of the present invention.
6 is a view showing an example of implementing a circuit pattern by applying the method of implementing a circuit pattern according to the third embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unnecessary. The terms described below are defined in consideration of the structure, role and function of the present invention, and may be changed according to the intention of the user, the intention of the operator, or the custom.

The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art to which the present invention pertains, It is only defined by the scope of the claims. Therefore, the definition should be based on the contents throughout this specification.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Hereinafter, a method of implementing a circuit pattern according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart of a method of implementing a circuit pattern according to a first embodiment of the present invention.

Referring to FIG. 1, the method for fabricating a circuit pattern according to the first embodiment of the present invention includes forming an injection object having a predetermined shape (S110), pre-treating the surface of the injection object with a plating masking liquid (S120) (S140) etching the mask formed on the surface of the injection object according to a predetermined circuit pattern, performing a plating process on the injection material with a plating liquid (S140), and removing the mask formed on the surface of the injection object S150).

The method of implementing a circuit pattern according to the first embodiment of the present invention can implement a circuit pattern on the surface of the molded object having a predetermined shape by performing the steps described above. The step of performing the plating process (S140) with the plating liquid by the plating liquid may be performed several times using a plating liquid composed of different components to laminate a plurality of metal coatings made of different materials. In this case, the step S140 of performing the plating process with the plating liquid may be performed after the plating process is performed (first process) before the mask removing process (S150) and after the mask removing process (S150) (A second case) in which the first and second embodiments are performed.

According to the first case and the second case, the first embodiment described above can be embodied and embodied in the second embodiment and the third embodiment.

Hereinafter, in the method of implementing a circuit pattern according to the first embodiment of the present invention, the first case will be referred to as a second embodiment, the second case will be referred to as a third embodiment, The third embodiment will be described in detail.

FIG. 2 is a flowchart of a method of implementing a circuit pattern according to a second embodiment of the present invention, and FIG. 3 is a view illustrating an example of implementing a circuit pattern by applying the method of implementing a circuit pattern according to the second embodiment of the present invention .

2 and 3, first, an injection molded article 110 having a predetermined shape is formed (S210, see FIG. 3A). The injection object 110 corresponds to an object to which a predetermined circuit pattern is to be formed, and the material constituting the injection object 110 may be a resin. At this time, the resin may be a mixture of at least one of ABS, Acrylonitrile Butadiene Styrene (ABS) or Poly-Carbonate-Poly Carbonate Acrylonitrile Butadiene Styrene (PC-ABS).

At this time, the molded product 110 may be formed into a predetermined shape using a mold or die-casting mold, but is not limited thereto.

When the molded product 110 is formed, the surface of the molded product 110 is pretreated with a plating masking solution (S220). At this time, the step of pretreating the surface of the injection product 110 with the plating masking liquid may be performed by a spraying method, a printing method, an immersion method, or the like.

The spraying method is a method in which the plating masking liquid is sprayed onto the surface of the injection object 110 through a separate spray device. In the printing method, the plating masking liquid is sprayed onto the surface of the injection object 110 Or the plating masking liquid is applied to the surface of the injection product 110 through silk printing. In addition, the flooding method is a method in which the injection material 110 is immersed in a plating masking solution stored in a predetermined container to apply the plating masking solution to the surface of the injection product 110. The spraying method, the printing method, or the flooding method is merely an example of a method for applying the plating masking liquid to the surface of the injection object 110. If the method for applying the plating masking liquid to the surface of the injection object 110 It is also applicable.

A predetermined adhesive may be added to the plating masking solution so that the plating masking liquid adheres well to the surface of the molding 110.

After the injection product 110 is pre-treated with the plating masking liquid, the injection product 110 is dried in the next step (S230). The plating masking liquid applied to the surface of the injection product 110 is cured and the mask 120 is formed on the surface of the injection product 110 (refer to FIG. 3B)

Then, the mask 120 formed on the surface of the molded product 110 is etched by a laser according to a predetermined circuit pattern (S240, see Fig. 3 (c)). The portion of the mask 120 corresponding to the circuit pattern is removed by the etching treatment with the laser, and the surface of the molded product 110 corresponding to the circuit pattern can be exposed.

3 (d), (e), and (f)), the step S250 of performing the plating process is performed as follows. And may include a detailed process.

The detailed process includes a step of performing a first plating process (S250a, refer to FIG. 3 (d)) of the injection product 110 by a plating liquid for forming the copper coating 130, a step of forming a plating liquid for forming the nickel coating 140 (S250c, Fig. 3 (e)) of the injection molded body 110 by the plating process for forming the gold film 150 (F) of FIG.

The first plating process S250a is a process of plating an injection material 110 having a surface corresponding to a circuit pattern exposed by a plating liquid for forming a copper coating 130 (see FIG. 3 (d)), The plating process (S250a) may be performed by an electroless plating process.

Next, the second plating process (S250b) is a process of plating the injection material 110 that has undergone the first plating process (S250a) with the plating liquid for forming the nickel coating 140 ) And the second plating process (S250b) may be performed by an electroless plating method.

Finally, the third plating process (S250c) is a process of plating the injection material 110 having undergone the second plating process (S250b) by the plating liquid for forming the gold coating 150 ), And the third plating process (S250c) may be performed by an electroless plating method.

The first plating process (S250a), the second plating process (S250b), and the third plating process (S250c) described above may be performed by an electroless plating method, and the electroless plating process is performed as follows .

Fig. 4 is a flowchart of an electroless plating method applicable to the first to third plating steps of Fig. 2. Fig.

As shown in FIG. 4, the electroless plating method includes a degreasing step (S310) for removing foreign substances such as oil and fingerprints on the surface of the injection molded body 110, a fine unevenness A catalytic step S330 for adsorbing a catalytic metal on the surface of the injection product 110 using a catalyst liquid, a step for forming palladium on the surface of the injection product 110 using a reaction promoter, And a plating step (S350) of performing plating by a plating liquid for forming copper, nickel or gold coatings (130, 140, 150) on the injection product 110. [

At this time, the plating masking solution may be formed of a mixed solution which does not cause a chemical reaction with the etchant, the catalyst solution, the reaction promoter and the plating solution. The mixed solution may be produced by melting a vinyl synthetic resin such as polyvinyl chloride or vinyl acetate resin.

After the plating process S250a, S250b, S250c is completed on the surface of the molded product 110, the mask 120 formed on the surface of the molded product 110 is removed (S260, FIG. 3 (g)). By removing the mask 120, only the circuit pattern by plating is left on the surface of the molded product 110.

The third plating process S250c is performed before the step S260 of removing the mask 120 and the third plating process S250c is performed before the mask 120 is removed. May be performed after the step S260. At this time, the third plating process (S250c) may be performed by an electrolytic plating method.

FIG. 5 is a flowchart of a method of implementing a circuit pattern according to a third embodiment of the present invention, and FIG. 6 is a view illustrating an example of implementing a circuit pattern by applying the method of implementing a circuit pattern according to the third embodiment of the present invention .

Hereinafter, a description of the same parts as those of the circuit pattern implementation method according to the second embodiment of the present invention will be omitted, and a circuit pattern rounding method according to the third embodiment of the present invention will be described, focusing on the different parts.

Referring to Figs. 5 and 6, first, an injection molded article 210 having a predetermined shape is formed (S410, see Fig. 6 (a)).

Then, the surface of the injection molded article 210 is pretreated with a plating masking liquid (S420).

The injection material 210 pretreated with the plating masking liquid is dried at step S430 and a mask 220 is formed on the surface of the injection material 210 (see FIG. 6 (b)).

Then, the mask 220 formed on the surface of the injection molded article 210 is etched according to a predetermined circuit pattern (S440, see Fig. 6 (c)).

In addition, the first plating process is performed by the plating liquid for forming the copper coating 230 on the projected material 210 whose surface corresponding to the circuit pattern is exposed by etching (S450, see Fig. 6 (d)) . In this case, the first plating process (S450) may be performed by an electroless plating process.

When the copper film 230 is formed along the circuit pattern on the surface of the molded product 210, the mask 220 formed on the surface of the molded product 210 is removed (S460, FIG. 6 (e)).

Then, a second plating process (S470) is performed on the injection molded product 210 by a plating solution for forming the nickel coating 240 on the copper coating 230 (see FIG. 6 (f)). At this time, the second plating process (S470) may be performed by an electrolytic plating method.

Finally, a step of performing a third plating process S480 on the nickel film 240 with the plating solution for forming the gold film 250 is performed (see FIG. 6 (g)). At this time, the third plating process (S480) may be performed by an electrolytic plating method.

Thus, the copper film 230, the nickel film 240, and the gold film 250 are sequentially laminated on the surface of the injection molded article 210 corresponding to the circuit pattern to complete the circuit pattern.

According to the embodiment described above, the mask formed on the surface of the injection molded article is pre-treated with a plating masking liquid to form a circuit pattern, and the mask is etched according to a circuit pattern using a laser, so that the precision of the circuit pattern can be improved.

In addition, according to the embodiment described above, the plating process for forming the circuit pattern using the mask etched according to the circuit pattern is performed without directly marking the surface of the object with the laser according to the circuit pattern and performing the plating process Therefore, the embodiments described above can be applied not only to injection molded articles made of special resins, but also to injection molded articles made of various kinds of resins, thereby reducing manufacturing costs in implementing circuit patterns.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

110, 210: Injection
120, 220: mask
130, 230: Copper film
140, 240: Nickel coating
150, 250: gold coating

Claims (12)

Forming an injection molding of a predetermined shape;
Pretreating the surface of the injection product with a plating masking liquid;
Etching the mask formed on the surface of the molding by a laser according to a predetermined circuit pattern, the mask being pre-treated by the plating masking liquid;
Plating the exposed object exposed on the surface corresponding to the circuit pattern with a plating liquid; And
And removing the mask,
Wherein the plating masking liquid is formed of a mixed solution produced by melting a vinyl synthetic resin,
Circuit pattern implementation method.
The method according to claim 1,
The injection molded article may be formed of a mixture of at least one of acrylonitrile butadiene styrene (ABS) or polycarbonate-acrylonitrile butadiene styrene (PC-ABS)
Circuit pattern implementation method.
The method according to claim 1,
The method
Further comprising the step of pre-treating the surface of the injection product with a plating masking liquid, followed by drying the injection product.
Circuit pattern implementation method.
The method according to claim 1,
The step of plating the injection molded body with the plating liquid may include:
A first plating treatment step of plating the injection product by a plating solution for forming a copper film;
A second plating treatment step of plating the injection material with a plating solution for forming a nickel coating to form a nickel coating on the copper coating; And
And a third plating step of plating the injection object by a plating liquid for forming a gold coating to form a gold coating on the nickel coating,
Circuit pattern implementation method.
5. The method of claim 4,
Wherein the first plating treatment step, the second plating treatment step and the third plating treatment step are performed by an electroless plating method,
Circuit pattern implementation method.
6. The method of claim 5,
Wherein the first plating treatment step, the second plating treatment step and the third plating treatment step comprise:
Removing foreign substances on the surface of the injection molded article;
Forming fine irregularities on the surface of the molded article using an etching liquid;
Adsorbing a catalytic metal on a surface of the injection product using a catalyst liquid;
Generating palladium on the surface of the injection product using a reaction promoter; And
And forming a copper film, a nickel film or a gold film on the injection product.
Circuit pattern implementation method.
The method according to claim 1,
The step of plating the injection molded body with the plating liquid may include:
A first plating step of plating the injection material with a plating liquid for forming a copper film,
Circuit pattern implementation method.
8. The method of claim 7,
Wherein the first plating step is performed by an electroless plating method,
Circuit pattern implementation method.
9. The method of claim 8,
Wherein the first plating step comprises:
Removing foreign substances on the surface of the injection molded article;
Forming fine irregularities on the surface of the molded article using an etching liquid;
Adsorbing a catalytic metal on a surface of the injection product using a catalyst liquid;
Generating palladium on the surface of the injection product using a reaction promoter; And
And forming the copper film on the injection product.
Circuit pattern implementation method.
8. The method of claim 7,
The method comprises:
After the step of removing the mask
A second plating treatment step of plating the injection material with a plating solution for forming a nickel coating to form a nickel coating on the copper coating; And
And a third plating step of plating the injection material with a plating liquid for forming a gold film to form a gold film on the nickel film,
Circuit pattern implementation method.
11. The method of claim 10,
Wherein the second plating treatment step and the third plating treatment step are performed by an electroplating method,
Circuit pattern implementation method. The method according to claim 1,
Wherein the mixed solution is formed by melting at least one vinyl synthetic resin of polyvinyl chloride and vinyl acetate resin,
Circuit pattern implementation method.

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