KR101406337B1 - A ondol panel and method of thermal conductor a ondol panel - Google Patents

A ondol panel and method of thermal conductor a ondol panel Download PDF

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KR101406337B1
KR101406337B1 KR1020120158375A KR20120158375A KR101406337B1 KR 101406337 B1 KR101406337 B1 KR 101406337B1 KR 1020120158375 A KR1020120158375 A KR 1020120158375A KR 20120158375 A KR20120158375 A KR 20120158375A KR 101406337 B1 KR101406337 B1 KR 101406337B1
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South Korea
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hot water
panel
heat
grooves
water pipe
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KR1020120158375A
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Korean (ko)
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이영수
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(주)화영
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/141—Tube mountings specially adapted therefor
    • F24D3/142—Tube mountings specially adapted therefor integrated in prefab construction elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/44—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose
    • E04C2/52—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits
    • E04C2/521—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling
    • E04C2/525—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling for heating or cooling
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
    • E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Engineering & Computer Science (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

The present invention relates to an ondol panel using a magnesium plate, and, more specifically, to an ondol panel which has: a magnesium plate having a high heat absorption property and having a guide groove; and an ondol XL-pipe inserted into the guide groove. A hot-water panel (100) according to the present invention comprises: a thermal insulation member (10) having multiple U-shaped pipe line grooves (11) on the upper surface thereof and multiple semicircular dented grooves (12) on the lower surface thereof; and a thermal conductor plate (20) integrally having U-shaped pipe mounting grooves (21) arranged to correspond to the pipe line grooves (11) on the top of the thermal insulation member (10), wherein the thermal insulation member (10) and the thermal conductor plate (20) are pressed to be integrated with each other.

Description

열전도체를 이용한 온돌판넬 및 그 시공방법{A ondol panel and method of thermal conductor a ondol panel}[0001] The present invention relates to an ondol panel and a method of manufacturing the same,

본 발명은 열전도체를 이용한 온돌판넬 및 그 시공방법에 관한 것으로 좀 더 상세하게는 발열 흡수가 뛰어난 열전도체판에 온수파이프 매입홈을 만들어 온수 파이프를 매입시켜서 온돌바닥면의 두께를 동일한 두께로 시공하여 온돌바닥면에 열 전달이 빠르고 균일하게 데워주며 열전도체판이 더운 열기를 흡수하여 오랫동안 열기를 유지할 수 있도록 한 것이다.
The present invention relates to an Ondol panel using a thermal conductor and a method of manufacturing the Ondol panel. More particularly, the present invention relates to an Ondol panel using a thermal conductor, and more particularly, to a hot- So that the heat transfer on the bottom floor of the ondol can be quickly and uniformly warmed, and the heat conductor plate absorbs the heat to keep the heat for a long time.

종래에 사용되고 있는 온돌판넬은 대부분 온수 파이프가 판넬의 상단부분에 돌출 설치되게 하여 온수 파이프를 배관한 다음 그 상단에 몰탈로 매립하여 사용하고 있는 것이 대부분이다.Most of the conventionally used ondol panels have a hot water pipe which is installed on the upper part of the panel so that the hot water pipe is piped, and then the hot water pipe is filled with mortar.

상기와 같은 온수 판넬에 있어서는 온수파이프가 온수판넬 면의 윗부분에 돌출되어 고정되므로 몰탈로 시공되는 바닥면의 두께가 온수파이프의 직경 크기 만큼 차이가 생겨 균일한 온도가 되지 못하는 점이 있다.In the hot water panel as described above, since the hot water pipe is protruded and fixed to the upper part of the hot water panel surface, the thickness of the bottom surface formed by the mortar differs by the diameter of the hot water pipe and the temperature is not uniform.

또한, 몰탈이 온수 파이프와 판넬 위부분에서 굳어져 일체로 됨에 따라 온수 판넬을 시공 후 사용함에 있어 노후되어 온수 파이프를 교체하고자 하면 굳어져 있는 몰탈을 제거할 시 몰탈과 함께 온수 파이프와 온수 판넬을 모두 제거한 다음 처음 시공시와 같이 재시공하여야 한다.In addition, since mortar is hardened at the upper part of hot water pipe and panel, it is used after using hot water panel. If you want to replace old hot water pipe, when you remove hardened mortar, hot water pipe and hot water panel All of them should be removed and reworked as in the first construction.

상기와 같은 온수판넬과 함께 또 다른 온수판넬에 있어서는 온수파이프를 중앙의 축열부분에 매입하여 일체 형상으로 제작된 것이 대부분으로 규격화된 판넬상의 중간부분에 온수 파이프를 매입하여 제작되어 판넬을 연결시 각각의 온수 파이프를 연결하여 일체로 사용하고 있으며, 온수판넬 자체에서 온수파이프가 매입되어 있어 온수판넬의 상단에 시공되는 몰탈부분과 온수파이프 부분이 상호간에 간격이 많이 떨어져 빠른시간에 온돌바닥이 데워지지 않는 문제가 있다.
In another hot water panel together with the hot water panel as described above, the hot water pipe is embedded in the central heat storage part, and the hot water pipe is manufactured in the middle part of the standardized panel. And the hot water pipe is embedded in the hot water panel itself, so that the mortar part and the hot water pipe part installed on the upper part of the hot water panel are spaced from each other, There is no problem.

본 발명은 이러한 문제점을 개선하기 위해 개발한 것으로 열전도체에 온수파이프 매입홀을 만들어 온수파이프가 매입되게 하여 온수파이프의 열을 최대한 많이 흡수될 수 있도록 하며 흡수된 열은 최대한 단열부재 아래의 지면부분으로 흡수되지 않고 상부의 몰탈 바닥면으로 발산되게 하여 적은 연료비용으로 최대한의 열효율을 얻고자 한 것이다.
The present invention has been developed in order to solve such a problem, and a hot water pipe embedding hole is formed in a heat conductor to embed a hot water pipe so that the heat of the hot water pipe can be absorbed as much as possible, To be absorbed into the bottom of the mortar of the upper part to obtain the maximum thermal efficiency at a low fuel cost.

본 발명은 상부면에 U형상의 파이프라인홈을 여러 개 형성하고, 하부면에는 반원형 요입홈을 다수 개 형성한 단열부재와, 상기 단열부재의 상단 파이프라인홈과 동일한 위치에 배열한 U형상의 파이프 안치홈을 일체로 형성한 열전도체판을 일체로 압착하여 온수판넬의 구조로 일체로 만들어 빠른 시공을 할 수 있으며 오랜 사용 후 온수파이프의 교체시 몰탈부분과 덮개보호판만 제거하면 재활용할 수 있음으로 경제적인 것이다.
The present invention relates to a heat exchanger comprising a heat insulating member having a plurality of U-shaped pipeline grooves formed on its upper surface and a plurality of semicircular grooves formed on a lower surface thereof, and a U- It is possible to make fast construction by integrating with the structure of hot water panel by integrally pressing the thermoconductive plate formed with the integral pipe groove in one body. When replacing the hot water pipe after long use, it is possible to recycle it by removing only the mortar portion and the cover protection plate. It is economical.

상기와 같은 본 발명은 발열체판을 단열부재와 일체로 하고 온수파이프가 발열체판 상단면 위치 노출되지 않도록 함에 그 특징이 있는 것으로 온수판넬의 구조를 일체로 만들어 빠른 시공을 할 수 있으며, 시공시 온수파이프가 몰탈에 매입되지 않도록 함으로 오랜 사용 후 온수파이프의 교체시 몰탈부분과 덮개보호판 만 제거하면 온돌판넬 부분은 전혀 손상됨이 없어 재활용할 수 있어 온수파이프만 교체 후 다시 몰탈마감 작업을 할 수 있어 빠른 시간내 재시공이 가능하며, 이에 따른 생활 폐기물을 최소화 할 수 있음과 동시에 시공비를 절감할 수 있어 경제적인 효과도 뛰어난 것이다.
The present invention as described above is characterized in that the heating plate is integrated with the heat insulating member and the hot water pipe is not exposed at the upper surface of the heating plate. Thus, the structure of the hot water panel can be integrated, When the hot water pipe is replaced after long use by preventing the pipe from being embedded in the mortar, only the mortar part and cover protection plate can be recycled because there is no damage to the Ondol panel part. It is possible to re-work within hours, minimize the waste of municipal waste, and reduce the construction cost.

도 1은 본 발명의 사시도
도 2는 본 발명의 저면도
도 3은 본 발명의 도 2의 A-A선 단면도
도 4는 본 발명의 시공 단면도
도 5는 본 발명의 다른 실시 예의 사시도
도 6은 본 발명의 다른 실시 예의 저면도
도 7은 본 발명의 다른 실시 예의 도 6의 B-B선 단면도
도 8은 본 발명의 다른 실시 예의 시공 단면도
도 9는 본 발명의 시공 상태를 나타낸 적층 분해 사시도
도 10은 본 발명의 온돌판넬을 여러장 펼친 상태의 실시 예의 사시도 BRIEF DESCRIPTION OF THE DRAWINGS FIG.
2 is a bottom view of the present invention
3 is a sectional view taken along the line AA in Fig. 2 of the present invention
Figure 4 is a cross-
5 is a perspective view of another embodiment of the present invention
6 is a bottom view of another embodiment of the present invention
7 is a sectional view taken along the line BB in Fig. 6 of another embodiment of the present invention
8 is a cross-sectional view of another embodiment of the present invention
Fig. 9 is a laminated exploded perspective view showing the construction of the present invention
Fig. 10 is a perspective view of an embodiment in which the ondol panel of the present invention is extended in multiple sheets

본 발명은 상부면에 U형상의 파이프라인홈(11)을 여러 개 형성하고, 하부면에는 반원형 요입홈(12)을 다수 개 형성한 단열부재(10)와,The present invention is characterized in that a plurality of U-shaped pipeline grooves (11) are formed on the upper surface and a plurality of semicircular grooves (12) are formed on the lower surface,

상기 단열부재(10)의 상단 파이프라인홈(11)과 동일한 위치에 배열한 U형상의 파이프 안치홈(21)을 일체로 형성한 열전도체판(20)을 일체로 압착하여 온수판넬(100)의 구조로 된 것이다.The heat conductive plate 20 integrally formed with the U-shaped pipe fitting grooves 21 arranged in the same position as the upper end pipeline groove 11 of the heat insulating member 10 is integrally pressed to form the hot water panel 100, .

상기의 열전도체판(20)은 마그네슘 부재를 사용하며 U형상의 파이프 안치홈(21)에 온수파이프(50)가 완전히 매입되는 깊이로 형성된다.The heat conductor plate 20 uses a magnesium member and is formed at a depth where the hot water pipe 50 is completely embedded in the U-shaped pipe fitting groove 21.

상기의 단열부재(10) 두께는 8 내지 10 cm 정도가 바람직하며 하부면의 반원형 요입홈(12)은 3cm 정도의 깊이로 형성되도록 한다.The thickness of the heat insulating member 10 is preferably about 8 to 10 cm, and the semicircular groove 12 of the lower surface is formed to have a depth of about 3 cm.

상기와 같이 된 본 발명에 있어 온수판넬(100)을 이용하여 난방바닥(65)에 시공하고자 하면 먼저 난방시공하고자 하는 바닥 정지작업을 하여 그 위에 석분부재(55)를 깔은 다음 석분층이 수평이 되게 평탄작업을 한다.In the present invention as described above, when the hot water panel 100 is used to heat the floor 65, a floor stop operation is first performed to heat the floor, and a stone member 55 is laid on the floor, This is a flat work.

상기 처럼 바닥의 평탄작업이 완료되면 온수판넬(100)을 평탄작업을 완료한 석분층 위에 배치하여 깔아준다.When the flattening of the floor is completed as described above, the hot water panel 100 is laid out on the flattened stone layer.

상기와 같이 온수판넬(100)을 깔아주는 배치작업이 완료되면 온수파이프(50)를 열전도체판(20)의 U형상의 파이프 안치홈(21)에 매입되게 지그재그 형상으로 배관하여 설치한다.When the laying work for laying the hot water panel 100 is completed as described above, the hot water pipe 50 is installed in a zigzag form so as to be embedded in the U-shaped pipe laying groove 21 of the heat conductor plate 20. [

상기와 같이 온수파이프(50)의 배관이 완료되면 열전도체판(20)의 상단에 덮개용 보호판(60)을 덮어주게 되면 온수파이프(50)가 U형상의 파이프 안치홈(21)에 완전히 매립되는 상태로 된다.When the piping of the hot water pipe 50 is completed as described above, when the lid protecting cover 60 is covered on the upper end of the heat conductor plate 20, the hot water pipe 50 is completely buried in the U-shaped pipe laying groove 21 .

상기와 같은 상태에서 몰탈(70)을 일정한 뚜께 만큼 깔아주게 되면 시공이 완료되는 것이다.If the mortar 70 is laid down to a certain height in the above-described state, the construction is completed.

이와같이 된 본 발명은 온수파이프(50)가 열전도체판(20)의 U형상의 파이프 안치홈(21)에 완전히 매입되어 상단에 덮개용 보호판(60)을 덮어주게 되면 상단부분이 평탄면으로 유지되어 몰탈(70)의 높이가 일정한 두께로 시공이 가능하여 몰탈 두께를 최소한 높이로 시공하여 빠르게 온열을 몰탈(70) 바닥면에 전달할 수 있어 난방 비용을 최소한으로 줄일 수 있고 난방면적 전체에 동일한 온도를 유지할 수 있어 균일한 난방효과를 볼 수 있는 것이다.In the present invention as described above, when the hot water pipe 50 is completely embedded in the U-shaped pipe fitting groove 21 of the heat conductor plate 20 and covers the cover plate 60 at the upper end thereof, Since the height of the mortar 70 can be made to be constant, the thickness of the mortar can be applied to a minimum height, and the heat can be transferred to the bottom surface of the mortar 70 quickly. Therefore, the heating cost can be minimized, So that a uniform heating effect can be obtained.

상기와 같이된 본 발명에 있어 단열부재(10)의 하부에 형성한 반원형 요입홈(12)은 단열부재(10)가 난방바닥(65)에서 3cm 정도 공간부가 형성되어 열전도체판(20)에서 발생하는 열이 반원형 요입홈(12)에 모여지게 됨으로 단열부재(10) 아래로 흡수됨을 지연시켜주어 단열부재(10)에 전달되는 더운 온열을 지면으로 곧바로 배출되지 않고 더운 열기가 오랫동안 유지되어 난방비 절감 효과를 볼 수 있는 것이다.In the present invention as described above, the semicircular groove 12 formed in the lower part of the heat insulating member 10 has a space of about 3 cm from the heat floor 65 of the heat insulating member 10, The generated heat is collected in the semicircular concave groove 12 so that the absorption of heat below the heat insulating member 10 is delayed and the hot heat transferred to the heat insulating member 10 is not immediately discharged to the ground but hot heat is retained for a long time, It is possible to see a reduction effect.

상기와 같이된 본 발명에 있어 다른 실시 예로 단열부재(10) 각각의 반원형 요입홈(12) 사이에 관통공(30)을 형성하고 관통공(30)이 형성된 상단 외주연에 환단턱(31)을 형성하여 T형상의 지지편(35)을 삽입한 다음 상기 열전도체판(20)을 상부면에 일체로 한다.In another embodiment of the present invention as described above, the through holes 30 are formed between the semicircular concave grooves 12 of each of the heat insulating members 10, and the convex holes 31 are formed on the upper outer circumference, And the T-shaped support pieces 35 are inserted. Then, the heat conductor plate 20 is integrated with the upper surface.

상기와 같은 다른 실시 예로 구성된 온수판넬(100)에 있어서는 U형상의 파이프 안치홈(21)의 사이에 형성되는 공간면 부분이 휘어짐이 없이 사용될 수 있도록 T형상의 지지편(35)을 더 보강한 것으로, 이와 같은 다른 실시 예의 온수판넬(100)을 사용하여 시공시에는 먼저 시공 바닥면의 평탄작업을 완료한 다음 단열부재보호판(40)을 바닥에 설치한 다음 그 위에 온수판넬(100)을 안치시켜 온돌면을 완성하는 것이다.In the hot water panel 100 constructed as described above, the T-shaped supporting piece 35 is further reinforced so that the space portion formed between the U-shaped pipe fitting grooves 21 can be used without bending In the case of using the hot water panel 100 of this embodiment, first, after the flat work of the floor surface of the installation is completed, the heat insulating member protection plate 40 is installed on the floor, and then the hot water panel 100 is placed on the floor. To complete the ondol face.

상기와 같이 된 다른 실시예에 있어서는 단열부재(10) 각각의 반원형 요입홈(12) 사이에서 T형상의 지지편(35)이 상기 열전도체판(20)을 상부면 저면을 받쳐주고 있으므로 온돌판넬(100)의 강도를 한층 더 높일 수 있는 것이다.In another embodiment as described above, since the T-shaped support piece 35 between the semicircular grooves 12 of each of the heat insulating members 10 supports the bottom surface of the upper surface of the heat conductive plate 20, The strength of the base 100 can be further increased.

상기와 같이된 본 발명의 시공방법의 실시 예를 설명하면 다음과 같다.An embodiment of the construction method of the present invention as described above will be described as follows.

먼저 난방시공하고자 하는 바닥 정지작업을 하여 그 위에 석분부재(55)를 깔은 다음 석분층이 수평이 되게 평탄작업을 한다. First, a floor stop work is performed for heating, and a stone member 55 is laid on the floor. Then, the stone layer is horizontally flattened.

상기 처럼 바닥의 평탄작업이 완료되면 온수판넬(100)을 평탄작업을 완료한 석분층 위에 배치하여 깔아준다.When the flattening of the floor is completed as described above, the hot water panel 100 is laid out on the flattened stone layer.

상기와 같이 온수판넬(100)을 깔아주는 배치작업이 완료되면 온수파이프(50)를 열전도체판(20)의 U형상의 파이프 안치홈(21)에 매입되게 지그재그 형상으로 배관하여 설치한다.When the laying work for laying the hot water panel 100 is completed as described above, the hot water pipe 50 is installed in a zigzag form so as to be embedded in the U-shaped pipe laying groove 21 of the heat conductor plate 20. [

상기와 같이 온수파이프(50)의 배관이 완료되면 열전도체판(20)의 상단에 덮개용 보호판(60)을 덮어주게 되면 온수파이프(50)가 U형상의 파이프 안치홈(21)에 완전히 매립되는 상태로 된다.When the piping of the hot water pipe 50 is completed as described above, when the lid protecting cover 60 is covered on the upper end of the heat conductor plate 20, the hot water pipe 50 is completely buried in the U-shaped pipe laying groove 21 .

상기와 같은 상태에서 몰탈(56)을 일정한 뚜께 만큼 도포한 다음 일정시간 양생하여 주면 시공이 완료되는 것이다.In this state, the mortar 56 is coated with a certain amount of water and cured for a certain period of time, thereby completing the construction.

이와같이 된 본 발명은 온수파이프(50)가 열전도체판(20)의 U형상의 파이프 안치홈(21)에 완전히 매입되어 상단에 덮개용 보호판(60)을 덮어주게 되면 상단부분이 평탄면으로 유지되어 몰탈(70)의 높이가 일정한 두께로 시공이 가능하여 몰탈 두께를 최소한 높이로 시공하여 빠르게 온열을 몰탈 바닥면에 전달할 수 있어 난방 비용을 최소한으로 줄일 수 있고 난방면적 전체에 동일한 온도를 유지할 수 있어 균일한 난방효과를 볼 수 있는 것이다.In the present invention as described above, when the hot water pipe 50 is completely embedded in the U-shaped pipe fitting groove 21 of the heat conductor plate 20 and covers the cover plate 60 at the upper end thereof, Since the height of the mortar (70) can be constructed with a certain thickness, the mortar can be installed at the minimum height, and the heat can be transferred to the bottom of the mortar quickly, so that the heating cost can be minimized and the same temperature can be maintained throughout the heating area So that a uniform heating effect can be seen.

상기와 같이된 본 발명에 있어 단열부재(10)의 하부에 형성한 반원형 요입홈(12)은 단열부재(10)가 지면과 일정하게 떨어지게 되면 열전도체판(20)에서 발생하는 열을 아래로 흡수되는 것을 차단하여 주는 단열부재(10)에 전달되는 더운 온열을 지면으로 곧바로 배출되지 않고 반원형 요입홈(12)의 공간으로 인해 더운공기가 모여지는 효과가 있어 더운 열기가 오랫동안 유지되어 난방비 절감 효과를 볼 수 있는 것이다.In the present invention as described above, the semicircular concave groove 12 formed in the lower part of the heat insulating member 10 is formed in such a manner that when the heat insulating member 10 is separated from the ground surface, The hot heat transferred to the heat insulating member 10 blocking the absorption is not immediately discharged to the ground but the hot air is collected due to the space of the semicircular groove 12 so that the hot heat is retained for a long time, Can be seen.

상기와 같이된 본 발명에 있어 다른 실시 예로 단열부재(10) 각각의 반원형 요입홈(12) 사이에 관통공(30)을 형성하고 관통공(30)이 형성된 상단 외주연에 환단턱(31)을 형성하여 T형상의 지지편(35)을 삽입한 다음 상기 열전도체판(20)을 상부면에 일체로 한다.In another embodiment of the present invention as described above, the through holes 30 are formed between the semicircular concave grooves 12 of each of the heat insulating members 10, and the convex holes 31 are formed on the upper outer circumference, And the T-shaped support pieces 35 are inserted. Then, the heat conductor plate 20 is integrated with the upper surface.

상기와 같은 다른 실시 예로 구성된 온수판넬(100)에 있어서는 U형상의 파이프 안치홈(21)의 사이에 형성되는 공간면 부분이 휘어짐이 없이 사용될 수 있도록 보강한 것으로, 이와 같은 다른 실시 예의 온수판넬(100)을 사용하여 시공시에는 먼저 시공하고자 하는 난방바닥(65)을 평면작업 한 후 석면부재(55)를 깔아 석분층으로 평탄작업을 하는 단계를 거쳐 석분층의 위에 단열부재보호판(40)을 펼쳐 깔아준 다음 그 위에 온수판넬(100)을 안치시키고 온수파이프(50)를 열전도체판(20)의 파이프 안치홈(21)에 매입되게 배관을 한 다음 열전도체판(20)의 상단에 덮개용 보호판(60)을 덮어준 다음 몰탈(70)로 마감하여 주는 것이다.In the hot water panel 100 constructed as described above, the space surface portion formed between the U-shaped pipe fitting grooves 21 is reinforced so that it can be used without bending. In the hot water panel 100 of the other embodiment 100, the floor of the heating floor 65 to be installed is first planarized and then the asbestos member 55 is laid on the floor to perform a flat work with a stone layer, The hot water pipe 100 is laid on the hot water pipe 100 and the hot water pipe 50 is piped so as to be embedded in the pipe pipe groove 21 of the heat conductor plate 20, The protective plate 60 is covered and then the mortar 70 is closed.

상기와 같이 된 다른 실시예에 있어서는 단열부재(10) 각각의 반원형 요입홈(12) 사이에서 T형상의 지지편(35)이 상기 열전도체판(20)을 상부면을 받쳐주고 있고 T형상의 지지편(35)의 하부 끝단부가 단열부재보호판(40)에 의해 받쳐주고 있으므로 튼튼하게 열전도체판(20)을 보호하여 준게 되는 것이다.
In another embodiment as described above, the T-shaped support piece 35 between the semicircular grooves 12 of each of the heat insulating members 10 supports the upper surface of the heat conductive plate 20, and the T- The lower end portion of the support piece 35 is supported by the heat insulating member protection plate 40, so that the heat conduction plate 20 is securely protected.

10: 단열부재 11: 파이프라인홈
12: 반원형 요입홈 20: 열전도체판
21: 파이프 안치홈 30: 관통공
31: 환단턱 35: 지지편
100: 온수판넬10: Insulating member 11: Pipeline groove
12: semicircular recess 20: thermally conductive plate
21: Piping groove 30: Through hole
31: Revolution step 35: Support piece
100: Hot water panel

Claims (5)

삭제delete 상부에 U형상의 파이프라인홈(11)을 여러 개 형성하고, 하부면에는 반원형 요입홈(12)을 다수 개 형성한 단열부재(10)와, 상기 단열부재(10)의 상단 파이프라인홈(11)과 동일한 위치에 배열한 U형상의 파이프 안치홈(21)을 일체로 형성한 마그네슘판 부재의 열전도체판(20)을 일체로 압착하여 온수판넬(100)의 구조로 하는 온돌판넬에 있어서,
상기 단열부재(10) 각각의 반원형 요입홈(12) 사이에 관통공(30)을 더 형성하고 상기 관통공(30)이 형성된 상단 외주연에 환단턱(31)을 더 형성하여 T형상의 지지편(35)을 관통공(30)에 삽입한 다음 상기 열전도체판(20)을 상부면에 올려 단열부재(10)와 일체로 함을 특징으로 한 온돌판넬.
(10) having a plurality of U-shaped pipeline grooves (11) on its upper portion and a plurality of semicircular concave grooves (12) formed on its lower surface, and an upper pipe line groove In the on-hall panel having the structure of the hot water panel 100 by integrally pressing the thermally conductive plate 20 of the magnesium plate member integrally formed with the U-shaped pipe laying groove 21 arranged at the same position as the hot- ,
A through hole 30 is further formed between the semicircular concave grooves 12 of each of the heat insulating members 10 and a ring-shaped concave portion 31 is further formed on the upper outer circumference at which the through hole 30 is formed, And the heat conductive plate (20) is placed on the upper surface to be integrated with the heat insulating member (10).
삭제delete 삭제delete 삭제delete
KR1020120158375A 2012-12-31 2012-12-31 A ondol panel and method of thermal conductor a ondol panel KR101406337B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170073377A (en) * 2015-12-18 2017-06-28 엠토 주식회사 Dry Ondol panel for heating room and thereof manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07332687A (en) * 1994-06-13 1995-12-22 Nippon Hiiteingu Plan:Kk Heat-equalizing panel for floor heating, heat insulating panel for floor heating and floor heating structure
JP2003222345A (en) * 2001-11-20 2003-08-08 Toshio Iizuka Hot water type floor heating panel and method for constructing floor heating
KR100704058B1 (en) 2004-06-04 2007-04-05 칭 다오 피티엘 켐 리미티드 Ondol panel heating system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07332687A (en) * 1994-06-13 1995-12-22 Nippon Hiiteingu Plan:Kk Heat-equalizing panel for floor heating, heat insulating panel for floor heating and floor heating structure
JP2003222345A (en) * 2001-11-20 2003-08-08 Toshio Iizuka Hot water type floor heating panel and method for constructing floor heating
KR100704058B1 (en) 2004-06-04 2007-04-05 칭 다오 피티엘 켐 리미티드 Ondol panel heating system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170073377A (en) * 2015-12-18 2017-06-28 엠토 주식회사 Dry Ondol panel for heating room and thereof manufacturing method
KR101864428B1 (en) * 2015-12-18 2018-06-04 (주)에스에프씨 Dry Ondol panel for heating room and thereof manufacturing method

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