KR101404720B1 - Heatpipe, cooler having the heatpipe - Google Patents

Heatpipe, cooler having the heatpipe Download PDF

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Publication number
KR101404720B1
KR101404720B1 KR1020130041944A KR20130041944A KR101404720B1 KR 101404720 B1 KR101404720 B1 KR 101404720B1 KR 1020130041944 A KR1020130041944 A KR 1020130041944A KR 20130041944 A KR20130041944 A KR 20130041944A KR 101404720 B1 KR101404720 B1 KR 101404720B1
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KR
South Korea
Prior art keywords
main body
heat
heat pipe
hole
heating medium
Prior art date
Application number
KR1020130041944A
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Korean (ko)
Inventor
김인석
Original Assignee
주식회사 독스타엘이디
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Priority to KR1020130041944A priority Critical patent/KR101404720B1/en
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Publication of KR101404720B1 publication Critical patent/KR101404720B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Abstract

The present invention relates to a heat pipe and a heat dissipation module using the heat pipe. More particularly, the present invention relates to a heat pipe and a heat dissipation module using the heat pipe. In particular, in the process of manufacturing the heat pipe, A heat pipe and a heat dissipation module that are formed to be shorter than the length of the heat dissipation member to be coupled so that the heat generated in the lighting device can be quickly and effectively dissipated and cooled, and a heat dissipation module using the heat pipe.

Description

Heat pipe, heat dissipating module using the same [

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat pipe and a heat dissipation module using the same, and more particularly, to a heat pipe improved in heat transfer efficiency by cooling a heat medium injected into a heat pipe and then heating the heat pipe.

In general, LED (Light Emitting Diode) is a type of semiconductor. When a voltage is applied, electric energy is changed into light energy to emit light. The light using such LED is low in electricity consumption, It is possible to implement color easily, and it is getting a lot of attention recently as an eco-friendly technology.

However, since the illumination using the LED generates considerable heat, it is necessary to dissipate the generated heat quickly and efficiently. Various heat dissipation technologies are being developed because the heat dissipation performance in LED lighting is directly related to the lifetime.

Such heat dissipation technology has LED illumination using a metal base substrate, but it is difficult to sufficiently secure heat dissipation, and LED lighting using an aluminum nitride (AIN) plate having a high thermal conductivity has a problem of high manufacturing cost.

Accordingly, in order to solve such a problem, the LED lighting using the heat pipe shown in Fig. 1 has been proposed in Japanese Patent Application Laid-Open No. 10-2008-0071812 (hereinafter referred to as "cited invention"). The above-mentioned cited invention has an advantage that heat generated by a LED manufacturing process can be dissipated quickly and effectively by providing a cooling device using a heat pipe.

Accordingly, there is a demand for a heat pipe capable of maximizing the heat dissipation performance without further improving the above-mentioned cited invention, and research for developing the heat pipe has been actively conducted.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to improve the structure of a heat pipe and to easily manufacture the heat pipe, thereby maximizing heat dissipation performance.

In order to achieve the above object, a heat pipe according to the present invention is a heat pipe having a bar-shaped conduction bar having a certain length in a cylindrical body into which a hollow heat medium is injected, one end of which is in contact with the heat medium, Wherein the heating medium is injected to occupy 15 to 50% of the internal volume of the main body through the through hole formed at one end of the main body, and the main body is introduced into the cooler before the inside of the main body is evacuated in the vacuum chamber Wherein the conduction rod is formed to have a diameter smaller than the diameter of the through hole and the other end of the through hole is sealed in the vacuum chamber so that the inside of the body is maintained in a vacuum state, Wherein the body is welded to the through hole so as to be fixed to the body, the body includes a pipe-shaped body, The length of the body is shorter than the length of the body 210 so that the space is formed in the upper part of the body and the body 210 is protruded downward from the body. .
In order to accomplish the above object, the present invention provides a heat dissipation module using a heat pipe. The heat dissipation module includes a bar-shaped conduction bar having a certain length inside a cylindrical body into which a hollow heat medium is injected, one end of which is in contact with the heat medium, Wherein the heating medium is injected so as to occupy 15 to 50% of the internal volume of the main body through a through hole formed at one end of the main body, and before the inside of the main body is evacuated in the vacuum chamber, Wherein the conduction rod is formed to have a diameter smaller than the diameter of the through-hole, and the through-hole is sealed in the vacuum chamber so that the inside of the body is maintained in a vacuum state A heat pipe welded to the through hole so that the other end is fixed to the main body; And a radiating member including a pipe-shaped body into which the main body is inserted and a radiating fin formed along an outer circumferential surface of the main body, wherein a length of the main body is shorter than a length of the main body, And is fitted to be protruded downward from the body at the same time.

According to the present invention, heat transfer performance and heat dissipation performance are maximized and applied to an LED lighting apparatus, thereby obtaining a heat pipe and a heat dissipation module capable of rapidly and effectively dissipating heat generated in a lighting apparatus to cool the same.

1 is a cross-sectional view showing a structure of a conventional heat pipe,
2 is a perspective view of a heat pipe according to the present invention,
3 is a sectional view showing the internal structure of a heat pipe according to the present invention,
FIG. 4 is an exemplary view showing a state in which the heat pipe of the present invention is turned upside down;
FIG. 5 is a perspective view showing the structure of a heat dissipating member applied to the heat dissipating module according to the present invention, FIG.
FIG. 6 is a perspective view illustrating a heat dissipation module using a heat pipe according to the present invention. FIG.
7 is an exemplary view showing a process of bonding a heat pipe according to the present invention to a heat dissipating member;
8 is a cross-sectional view illustrating a heat dissipation module using a heat pipe according to the present invention bonded to a substrate.
9 is a flowchart showing a process of a heat pipe manufacturing method according to the present invention,
10 is an exemplary view showing the injection of a heating medium into the heat pipe main body according to the present invention,
11 is an illustration showing cooling of a heat pipe into which a heating medium is injected,
Fig. 12 is an exemplary view showing the heat pipe body into which the heating medium is injected by vacuuming and sealing. Fig.

Hereinafter, the present invention will be described in detail with reference to FIGS. 2 to 12 attached hereto.

FIG. 2 is a perspective view of a heat pipe according to the present invention, FIG. 3 is a cross-sectional view showing an internal structure of the heat pipe according to the present invention, and FIG.

As shown in the figure, the heat pipe 100 according to the present invention includes a main body 110, which is made of metal and has a hollow cylindrical shape, and a heating medium A is injected into the main body 110 to occupy 15 to 50% do. In addition, a conductive bar 120 made of a material having excellent thermal conductivity is provided, one end of which is in contact with the heating medium A and the other end of which is fixed to the upper end of the main body 110.

The main body 110 is preferably formed of a material having a high thermal conductivity. In general, copper (Cu) is generally used, but the present invention is not limited thereto. For example, copper has a thermal conductivity of 500 to 340 ㎉ / ºC, aluminum (Al) has a thermal conductivity of about 175 ㎉ / ºC, and copper is twice as effective as aluminum, so copper is mainly used.

The body 110 may be formed in various shapes. The inside is hollow, and it can be formed into various shapes such as a cylinder, a rectangular tube, and a triangular tube. It is preferable that the metal plate is formed through a drawing process in consideration of the injection of the heating medium A to be vaporized in the main body 110, thereby minimizing the point of connection or welding.

A through hole 111 is formed in the upper end of the main body 110. The through hole 111 serves as an inlet for injecting the heating medium A and at the same time serves as a passage for extracting air from the inside of the main body 110, .

The heating medium A is preferably a liquid material having a low boiling point, but is not limited thereto, and a gas or a solid may be used. When a liquid material is used as the heating medium (A), methyl alcohol may be used. However, the present invention is not limited to this, and various types of materials can be used if the liquid has a low boiling point.

The heating medium A injected as described above is heated and vaporized by heat. As a result, the heat is spread evenly inside the heat pipe 100 and heat is transferred. This heating medium A becomes liquid again when it is cooled.

The conductive bar 120 is fixed to the upper end of the main body 110 by being welded in the form of a bar in a state where the upper end is positioned in the through hole 111 formed at the upper end of the main body 110, Or untouched.

The diameter of the conductive rod 120 may be such that it can penetrate the through hole 111 and also has a diameter that forms a certain degree of clearance with the wall surface of the through hole 111 to inject the heat medium A, 110 are formed so that the through holes 111 can serve as passages when the internal air is drawn out.

The heat medium A and the conduction rod 120 can effectively transmit heat, and in particular, even when the main body 110 is set up in a fixed position, as well as when the main body 110 is turned upside down, So that the heat can be effectively transmitted to the entire body 110.

FIG. 5 is a perspective view showing a structure of a heat dissipating member applied to a heat dissipating module according to the present invention, FIG. 6 is a perspective view showing a heat dissipating module using the heatpipe according to the present invention, FIG. 8 is a cross-sectional view illustrating a state where a heat dissipation module using a heat pipe according to the present invention is coupled to a substrate. FIG.

As shown in the figure, the heat pipe 100 according to the present invention is formed of a heat dissipation module that is combined with the heat dissipating member 200 to be applied to various lighting devices or mechanical devices that generate heat such as LED light.

5, the heat dissipating member 200 includes a pipe-shaped body 210 into which the heat pipe 100 is inserted, and a radiating fin 220 formed along an outer circumferential surface of the body 210 do.

 The heat dissipation fins 220 are formed in a direction perpendicular to the body 210, and a plurality of heat dissipation fins 220 are radially disposed. As shown in FIG. 5, the cross-sectional shape in a state where the plurality of heat-radiating fins 220 are disposed may be circular, but is not limited thereto. That is, the space efficiency of the heat dissipation module 200 may be maximized by forming a triangle, a square, a pentagon, or the like.

The heat pipe 100 is inserted into the body 210 as shown in FIG. 6A. At this time, the heat pipe 100 is fitted using a press or the like as shown in FIG. The state where the heat pipe 100 is coupled to the body 210 is as shown in FIG. 6 (b).

The heat dissipation module according to the present invention dissipates the heat received from the heat pipe 100 to the outside while the convection current is generated due to the temperature difference around the heat dissipation fin 220. [ As shown in FIG. 6 (b) and FIG. 8, the heat pipe 100 is inserted into the upper part of the body 210 so as to form a space therebetween, do. The length of the heat pipe 100 is formed to be shorter than the length of the body 210, thereby forming a space naturally.

The height of the space is preferably 10 to 20% of the length of the body 210. However, the present invention is not limited thereto, and it can be increased or decreased as needed. However, if the space is formed too narrow or too large, heat dissipation performance is lowered.

The lower end of the heat pipe 100 may protrude from the body 210. And protrudes downward from the lower end of the body 210. In this state, when the lower end of the heat pipe 100 is fixed to a position where heat such as the substrate 10 is generated, the heat dissipating member 220 is spaced apart to a certain extent, It becomes separated. Therefore, the convection can be smoothly performed.

The heat pipe 100 may be screwed to the lower end of the heat pipe 100 at a point where the heat is generated by projecting a screw. However, the present invention is not limited thereto, and it is natural that a known fixing method can be appropriately adopted and fixed.

Although not shown in the drawings, the body 210 has a diameter larger than that of the lower portion of the body 210, so that the heat pipe 100 can be fitted thereto in an interference fit manner. And the outer side is in contact with the inner side of the body 210 to smoothly transmit heat.

Hereinafter, a process for manufacturing the heat pipe 100 according to the present invention will be described. FIG. 9 is a flowchart showing a process of manufacturing a heat pipe according to the present invention. FIG. 10 is a view illustrating an injection of a heat medium into the heat pipe body according to the present invention. Fig. 12 is an exemplary view showing that the heat pipe body into which the heat medium is injected is vacuumed and sealed.

(a) preparation step

In order to manufacture the heat pipe 100 according to the present invention, the step of installing the conduction bar 120 in the body 110 includes the main body 110 having an inner cylindrical shape and injecting the heating medium A.

As shown in FIG. 10, the heating medium A is injected through the through hole 111 after the main body 110 is set up using an injector. At this time, the heating medium A is injected to occupy 15 to 50% of the internal volume of the main body 110. At this time, the conduction rod 120 is inserted into the body 110, and the heating medium A can be injected while the upper end of the conduction rod 120 is positioned in the through hole 111. This is because if the heating medium A is first injected and the conduction rod 120 is inserted, the amount of loss of the heating medium A again may increase.

(b) cooling step

The main body 110 in which the heating medium A is injected and the conduction rod 120 is installed is cooled by using a cooler as shown in FIG. (A) injected into the main body (110) by rapidly cooling the main body (110). By thus freezing the heating medium A, it is possible to prevent the heating medium A from flowing out of the main body 110 in a vacuum stage to be described later.

The temperature and time to be cooled are adjusted in consideration of the freezing point of the heating medium (A). For example, when the heating medium (A) is methyl alcohol, since the freezing point is -97.8 ° C, the cooling is performed at a temperature lower than -97.8 ° C, and the time is preferably about 10 to 50 minutes.

In the cooling step, it is preferable that the main body 110 is cooled in a state where it is laid down in the cooler. When the main body 110 is laid down on the cooler, the area of the heating medium A, which is made of the liquid injected into the inside thereof, is in contact with the cooler. Therefore, it is possible to cool the main body 110 in a shorter time than the case where the heat pipe 100 is kept in a standing state.

(c) Vacuum step

A vacuum chamber may be used as shown in FIG. 12 to bring the interior of the cooled body 110 into a vacuum state. When the heat pipe 100 is fixed in the vacuum chamber and air in the vacuum chamber is sucked in, air in the main body 110 is sucked out. Thus, the heat pipe 100 is in a vacuum state. At this time, the vacuum range

Figure 112013033253790-pat00001
~
Figure 112013033253790-pat00002
Torr.

The conduction rod 120 is only partially connected to the main body 110 in the vacuum stage so that fine gaps are formed between the through holes 110 and the conduction rods 120. As described above, Only the air in the main body 110 can flow out because the main body A is frozen.

(d) Sealing step

The inside of the main body 110 is evacuated through the vacuum step, and then the main body 110 is completely sealed to maintain the vacuum state.

The upper end of the conduction rod 120 is welded to the through hole 111 and sealed and the conduction rod 120 is fixed to the upper end of the inside of the body 110. [

The sealing step can be done in a vacuum chamber. Thereby preventing external air from being introduced into the main body 110 again. To this end, a vacuum chamber may be provided with a device for welding.

The heat pipe 100 according to the present invention is formed through the above process. The heat pipe 100 thus formed is coupled to the heat dissipating member 200 to form a heat dissipating module, thereby being applied to various devices for generating heat, thereby maximizing the heat dissipating performance.

A: heating medium 10: substrate
100: heat pipe 110: body
111: Through hole 120:
200: heat dissipating member 210: body
220: heat sink fin

Claims (9)

A bar-shaped conduction rod 120 having a certain length is fixed to the upper end of the main body 110 with one end thereof abutting against the heating medium A and the other end thereof being fixed to the upper end of the main body 110 in the cylindrical main body 110 into which the hollow heating medium A is injected. Respectively,
The heating medium A is injected to occupy 15 to 50% of the internal volume of the main body 110 through the through hole 111 formed at one end of the main body 110, The main body 110 is rapidly cooled and cooled by being laid down in the cooler before the inside of the chamber is evacuated,
The conduction rod 120 is formed to have a diameter smaller than the diameter of the through hole 111 and the through hole 111 is sealed so that the inside of the body 110 is maintained in a vacuum state in the vacuum chamber And the other end is welded to the through hole 111 so as to be fixed to the main body 110,
The body 110 is inserted into a body 210 of a heat dissipating member 200 including a pipe-shaped body 210 and a radiating fin 220 formed along an outer circumferential surface of the body 210,
Wherein a length of the body 110 is shorter than a length of the body 210 so that a space is formed on the body 210 and the body 210 is protruded downward from the body 210. A bar-shaped conduction rod 120 having a certain length is fixed to the upper end of the main body 110 with one end thereof abutting against the heating medium A and the other end thereof being fixed to the upper end of the main body 110 in the cylindrical main body 110 into which the hollow heating medium A is injected. Respectively,
The heating medium A is injected to occupy 15 to 50% of the internal volume of the main body 110 through the through hole 111 formed at one end of the main body 110, The main body 110 is rapidly cooled and cooled by being laid down in the cooler before the inside of the chamber is evacuated,
The conduction rod 120 is formed to have a diameter smaller than the diameter of the through hole 111 and the through hole 111 is sealed so that the inside of the body 110 is maintained in a vacuum state in the vacuum chamber A heat pipe welded to the through hole (111) so that the other end is fixed to the main body (110);
A radiating member 200 including a tubular body 210 into which the body 110 is inserted and radiating fins 220 formed along an outer circumferential surface of the body 210,
Wherein a length of the main body 110 is shorter than a length of the main body 210 so that a space is formed on the main body 210 and the main body 210 is fitted so as to project downward from the main body 210. [ . delete delete delete delete delete delete delete
KR1020130041944A 2013-04-17 2013-04-17 Heatpipe, cooler having the heatpipe KR101404720B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100439258B1 (en) * 2001-12-27 2004-07-07 김영하 A Heat Pipe Manufacturing Method
KR20100029301A (en) * 2008-09-08 2010-03-17 주식회사 정진멀티테크놀로지 Coil spring wick, heat pipe and heat exchanger, led lighting apparatus using heat exchanger
KR101211678B1 (en) * 2012-07-30 2012-12-20 그린엘이디 주식회사 Radiating module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100439258B1 (en) * 2001-12-27 2004-07-07 김영하 A Heat Pipe Manufacturing Method
KR20100029301A (en) * 2008-09-08 2010-03-17 주식회사 정진멀티테크놀로지 Coil spring wick, heat pipe and heat exchanger, led lighting apparatus using heat exchanger
KR101211678B1 (en) * 2012-07-30 2012-12-20 그린엘이디 주식회사 Radiating module

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