KR101380787B1 - LED lighting apparatus - Google Patents

Abstract

The present invention relates to an LED lighting device that can replace a Fluorescent parallel Lamp (FPL), the diffusion plate for diffusing light generated from the LED; A heat sink for dissipating heat generated from the LED; A fluorescent base having a fluorescent pin and surrounding the assembly when the diffusion plate and the heat sink are combined; An LED PCB positioned in the diffusion plate and having a plurality of LEDs disposed on an upper surface thereof; A circuit PCB disposed on a bottom surface of the LED PCB so as to form a layer with the LED PCB in the heat sink; And fastening means connected to the fluorescent light pins to fasten the LED PCB and the circuit PCB.

Description

LED lighting apparatus {LED lighting apparatus}

The present invention relates to an LED lighting device that can replace a Fluorescent parallel Lamp (FPL) fluorescent lamp.

In general, fluorescent lamps have the advantages of longer life and lower power consumption than incandescent lamps. However, general fluorescent lamps contain environmental wastes such as mercury, which causes disadvantages of environmental problems.

Therefore, in consideration of energy saving and environmental problems, various technologies for replacing general fluorescent lamps have recently been proposed, and representative ones are Fluorescent parallel Lamp (FPL) fluorescent lamps and LED (Light Emitting Diode) fluorescent lamps.

The FPL fluorescent lamp has a shorter length and a lower power consumption than a general fluorescent lamp, but has a short lifespan. In recent years, an FPL fluorescent lamp is used more than an LED fluorescent lamp (or an LED lighting device).

The LED fluorescent lamp consumes less power and has a longer lifespan than the FPL fluorescent lamp, and is advantageous in miniaturization, thinning, and lightening. In addition, the LED fluorescent lamp is strong in impact, has a low failure rate, can exhibit various colors, and has low eye fatigue. have.

1 is a schematic diagram of a fastening relationship between a fluorescent ballast and an LED lighting device.

As shown in FIG. 1, the electronic ballast 100 increases the AC power of 60 Hz used for commercial power to about 20 Khz or more, and provides the corresponding AC power to the LED lighting device 200, thereby providing the LED lighting device 200. It is a lighting control device for controlling the lighting of a plurality of LED (LED lamp) provided in. The electronic ballast 100 is the first to fourth output pin (or terminal) 10 provided on one side is connected to the four input pin (or terminal) 20 of the LED lighting device 200 by the LED lighting Is fastened with the device.

Figure 2 is a perspective view of a conventional FPL type LED lighting device, Figure 3 is a cross-sectional view of the main part of the FPL type LED lighting device shown in FIG.

As shown in FIGS. 2 and 3, the conventional FPL type LED lighting device 200 is made of aluminum, and includes a heat sink (or heat dissipation cover) 201 for dissipating heat generated from the LED, and a translucent material. And a diffuser plate 202 for diffusing the light emitted from 21, and a fluorescent lamp base 203 (terminal cap) and end cap.

A plurality of heat dissipation fins are uniformly distributed on the top surface of the heat dissipation plate 201 so that heat generated from the LED 21 can be discharged out, and the diffusion plate 202 may form a constant inner space when assembled with the heat dissipation plate 201. It is mounted on the bottom of the heat sink 201 to be. The fluorescent base 203 has four input pins 20 connected to the four output pins 10 of the electronic ballast 100, respectively.

In the internal space formed when the heat sink 201 and the diffusion plate 202 are assembled, a circuit PCB 210 and an LED PCB 220 are embedded, and various circuits (electric elements) are disposed in the circuit PCB 210. On the surface of the LED PCB 220, a plurality of LEDs 21 (LED arrays) are arranged in series or in parallel.

A rectangular opening is formed at one side of the circuit PCB 210, and fixing means 212, such as a double-sided tape, is attached to the rear surface of the LED PCB 220 in which the LED 21 is not disposed. The 220 may be fixed to the lower portion of the heat sink 201. The circuit PCB 210 is disposed under the opening of the LED PCB 220 so that a free space for heat dissipation may be formed between various circuits and the LED PCB 220.

In addition, an intermediate PCB 215 is connected between one side of the circuit PCB 210 and one side of the opening, and the other side of the circuit PCB 210 is connected to four of the LED lighting apparatuses 200 through the wiring 22. It is connected to the input pin 20. In addition, fluorescent lamp bases 203 (terminal caps) and ends for protecting the circuit PCB (circuit board) 210 and the LED PCB 220 from the surrounding environment at both ends of the assembly of the heat sink 201 and the diffusion plate 202. An end cap is formed.

Therefore, when the LED lighting device 200 is fastened to the ballast 100, the current output from the ballast 100 is the four input pin 20 → wiring 22 → circuit PCB of the LED lighting device 200 ( 210) → Intermediate PCB 215 → LED PCB 220 flows to cause the plurality of LEDs 21 to light up. In this case, the intermediate PCB 215, the LED PCB 220 and the circuit PCB 210 is fixed to each other with an adhesive and then the wiring 22,

4 is a circuit diagram illustrating an example of a conventional FPL type LED lighting device 200.

As shown in FIG. 4, the FPL type LED lighting device 200 is largely divided into a circuit PCB 210 and an LED PCB 220. The circuit PCB 210 is connected between the output terminal 10 of the electronic ballast 100, the first and second inductors (L1, l2) and two to limit the amount of current output from the electronic ballast 100, The input terminal is connected to one end of the first and second inductors (L1, L2) is composed of a rectifier circuit 30 for converting the AC power output from the electronic ballast 100 to a DC power.

The first inductor L1 is connected in parallel to the first and second output terminals 10 of the electronic ballast 100, and the second inductor L2 is the third and fourth output terminals of the electronic ballast 100. 10 is connected in parallel. The LED PCB 220 includes a plurality of LEDs 21 (LED modules) connected in series or in parallel to the output terminal of the rectifier circuit 30. In addition, a capacitor C1 is connected between the two output terminals of the rectifier circuit 30.

Therefore, in the conventional FPL type LED lighting device 200 by using the first and second inductors (L1, L2) by adjusting the resonance conditions of the resonant circuit (not shown) provided on the output side of the electronic ballast 100 Lights up stably.

However, the conventional FPL type LED lighting device 200 described above has a circuit PCB under the heat sink 201 in an inner space formed when the heat sink 201 and the diffusion plate 202 are assembled, as shown in FIG. 3. 210 and the LED PCB 220 are arranged in a straight line. This arrangement structure is disadvantageous in increasing the number of LEDs and various LED arrangements because the circuit PCB occupies a part of the entire internal space.

In FIG. 3, the circuit PCB 210 and the LED PCB 220 are all disposed on the same surface, that is, the lower portion of the heat sink 201, and the circuit PCB 210 is not completely blocked from the LED PCB 220. Accordingly, heat generated in the plurality of LEDs 21 is transferred to the integrated circuit PCB 210 or light from the plurality of LEDs 21 is reflected by the diffuser plate 202 to affect the circuit PCB 210. .

Therefore, various kinds of circuits (electrical elements) mounted on the circuit PCB 210 may be damaged or severely damaged by the transferred heat and light. In particular, LED fluorescent lamps have a serious disadvantage of heat generation than general lamps, so there is a possibility of a fire due to temperature rise.

In addition, as described above, the LED PCB 220 is fixed to the lower portion of the heat sink 201 by fixing means 212, such as double-sided tape, the intermediate PCB 215, LED PCB 220 and the circuit PCB ( 210 are wired 22 after they are fixed to each other with an adhesive. However, double-sided tape and adhesives have the disadvantage of being susceptible to heat, and in particular, once fixed or adhered, they are difficult to remove again. Due to these disadvantages and properties, it is difficult to replace or recycle necessary parts after separating various fixed or bonded parts of the LED lighting device, resulting in economic losses.

Further, in the circuit diagram of the conventional FPL type LED lighting device 200 shown in Fig. 4, the internal resistance of the LED 21 is very low. As a result, when the voltage of the LED 21 is only slightly higher than the operating voltage, an overcurrent flows and the LED 21 is broken or a protection circuit inside the ballast is activated, which makes LED lighting impossible. In this phenomenon, the output pins (first, second, third, and fourth output pins) 10 of the electronic ballast 100, which are coincided with each other in FIG. 1, are respectively provided with two input pins 20 of the LED lighting device 200. This is because the output impedance of the electronic ballast 100 and the input impedance of the LED in the LED lighting device 200 is not the same when connected to.

In order to prevent such a phenomenon (impedance mismatching), an inductor (coil) is conventionally used to limit the current provided from the electronic ballast 100 to the LED lighting device 200. However, conventionally, as shown in FIG. 4, the first inductor L1 is connected in parallel to the first and second output terminals 10 of the electronic ballast 100, and the second inductor L2 is electronic. Since it is connected in parallel to the third and fourth output terminals 10 of the ballast 100, the current limit is limited and the manufacturing cost is also increased because two inductors are used.

Accordingly, the present invention is to provide a LED lighting device that is compatible with the ballast dedicated to FPL and can effectively solve the cost saving and heat generation problem.

Another object of the present invention is to provide an LED lighting device that can prevent the possibility of fire caused by damage to the circuit PCB and abnormal overheating due to the temperature rise.

Another object of the present invention is to provide a LED lighting device that can be arranged in a hierarchical arrangement of the circuit PCB and the LED circuit to increase the mounting space of the LED and minimize the thermal effect.

Still another object of the present invention is to provide an LED lighting device that is easy to assemble, disassemble and replace each part, thereby increasing recycling efficiency.

Still another object of the present invention is to provide an LED lighting device having a temperature compensation circuit of the LED array.

LED lighting device according to an embodiment of the present invention to achieve the above object, the diffusion plate for diffusing light generated from the LED; A heat sink for dissipating heat generated from the LED; A fluorescent base having a fluorescent pin and surrounding the assembly when the diffusion plate and the heat sink are combined; An LED PCB positioned in the diffusion plate and having a plurality of LEDs disposed on an upper surface thereof; A circuit PCB disposed on a bottom surface of the LED PCB so as to form a layer with the LED PCB in the heat sink; And fastening means connected to the fluorescent light pins to fasten the LED PCB and the circuit PCB.

The length of the LED PCB is equal to the length of the diffuser plate.

One side of the circuit PCB is fixed to the LED PCB by the fastening means, the other side is fixed to the heat sink by the support.

The circuit PCB on which the various circuits are mounted is molded with an insulating material such as silicon or epoxy.

The circuit PCB is provided with a hole is fitted into the LED PCB in the form of a slit is fixed.

The fastening means is a connecting pin in the form of a clip.

The LED PCB is further connected to a temperature compensation circuit for compensating for the change in the current value of the LED according to the temperature change.

The temperature compensation circuit includes: first and second transistors having a collector connected to an input / output terminal of the LED to form a current mirror; A zener diode connected between the emitter of the first transistor and ground; And a resistor connected between the emitter and the ground of the second transistor; wherein the temperature is increased to increase the total current of the LED, thereby reducing the current flowing through the resistor, and decreasing the temperature to reduce the total current of the LED. In this case, the current flowing through the resistor is increased to compensate the total LED current according to the temperature change.

LED lighting device according to another embodiment of the present invention to achieve the above object, the diffusion plate for diffusing light generated from the LED; A heat sink for dissipating heat generated from the LED; A fluorescent lamp base surrounding the assembly when the diffusion plate and the heat sink are combined; An LED PCB positioned in the diffusion plate and having a plurality of LEDs disposed on an upper surface thereof; And a case connected to the LED PCB through a connector formed at one side and molded with various circuits and the PCB by an insulating material.

The inside of the heat sink is an empty space.

It is connected to the LED PCB through a connector formed on one side of the case.

The case takes the form of a fluorescent base to be inserted into the interior of the fluorescent base.

The case is formed separately from the fluorescent base or integrally formed with the fluorescent base.

In this case, the circuit PCB is disposed perpendicularly or obliquely to the LED PCB.

The case in which the circuit PCB is molded is mounted at one end surface of the LED PCB.

The insulating material is silicon or epoxies.

The LED PCB is further connected to a temperature compensation circuit for compensating for the change in the current value of the LED according to the temperature change.

The temperature compensation circuit includes: first and second transistors having a collector connected to an input / output terminal of the LED to form a current mirror; A zener diode connected between the emitter of the first transistor and ground; And a resistor connected between the emitter and the ground of the second transistor; wherein the temperature is increased to increase the total current of the LED, thereby reducing the current flowing through the resistor, and decreasing the temperature to reduce the total current of the LED. In this case, the current flowing through the resistor is increased to compensate the total LED current according to the temperature change.

The present invention expands the mounting space of the LED by installing the circuit PCB on a different surface to have a hierarchical structure with the LED PCB or modularized in a separate case, and compatible with the existing ballast for FPL and reduce the cost and heat generation problems There is an effect that can be effectively solved.

In addition, the present invention has an effect of easily assembling, disassembling and replacing each component by fastening the circuit PCB and the LED PCB using a slip form or a clip form to increase recycling efficiency.

In addition, the present invention protects the LED circuit and prevents the possibility of fire due to abnormal overheating by configuring a temperature compensation circuit for varying the current value of the LED to keep the total current value of the LED constant regardless of the temperature increase or decrease of the LDE array. It can be effective.

1 is a schematic diagram of a fastening relationship between a fluorescent ballast and an LED lighting device.
Figure 2 is a perspective view of a conventional FPL type LED lighting device.
3 is a cross-sectional view of main parts of the FPL LED lighting device shown in FIG.
Figure 4 is a circuit diagram showing an example of a conventional FPL type LED lighting device.
5 is a cross-sectional view of the LED lighting apparatus according to the first embodiment of the present invention.
6 is a cross-sectional view of the LED lighting apparatus according to a second embodiment of the present invention.
7 is a view showing an example of a molded product after inserting the circuit PCB in the case.
8A and 8B illustrate examples of molding a circuit PCB on which various circuits are mounted with an insulating material.
9 is a partial cross-sectional view of the LED lighting apparatus according to the third embodiment of the present invention.
10a to 10d are various circuit diagrams of the LED lighting apparatus according to the present invention.
11 is a circuit diagram of an LED lighting device having a temperature compensation circuit according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention is compatible with the ballast dedicated to the existing FPL, install the circuit PCB on a different surface to have a hierarchical structure with the LED PCB or modularized in a separate case, to expand the mounting space of the LED, to reduce the cost and heat generation problems The LED lighting device can be effectively solved and the assembly, disassembly and replacement of each part can be easily performed. The LED lighting device is used in the same sense as the LED fluorescent lamp.

5 is a cross-sectional view of the LED lighting apparatus according to the first embodiment of the present invention.

As shown in FIG. 5, the LED lighting device 300 according to the first embodiment of the present invention includes a diffuser plate 301 made of a translucent material to diffuse light from a plurality of LEDs 31 (LED arrays). The heat sink 302 is made of aluminum and discharges heat generated by the plurality of LEDs 31, and a fluorescent lamp base 303 which is a terminal cap.

The heat sink 302 is mounted on the bottom of the diffusion plate 301 to form a predetermined internal space when assembling with the diffusion plate 301, four outputs of the electronic ballast (not shown) to the fluorescent base 303 Four input pins 30 are connected to the pins.

The circuit PCB 310 and the LED PCB 320 are embedded in an internal space formed when the diffusion plate 301 and the heat sink 302 are assembled. The circuit PCB 310 and the LED PCB 320 are disposed on different surfaces (hierarchical arrangement). That is, the circuit PCB 310 is disposed on the heat sink 302 side that is shown in bold, and the LED PCB 320 is disposed on the diffusion plate 301 side. In addition, the length of the LED PCB 3200 is set equal to or smaller than the length of the diffusion plate 301.

Various circuits (electronic components) are disposed in the circuit PCB 310 disposed below the LED PCB 320. By such an arrangement structure, a larger number of LEDs 31 may be disposed on the diffusion plate 301, and various circuits (electronic components) are disposed on the heat sink 302 side, so that the LEDs 31 may be generated. The influence of the light reflected from the heat or diffuser plate 301 can be minimized. In this case, the various circuits may be molded in the circuit PCB 310 and separated from the LED PCB 320 as shown in FIG. 8A to be described later.

The circuit PCB 310 and the LED PCB 320 are fastened by a connecting pin 33 in the form of a clip, and are connected to the input pin 30 of the fluorescent lamp base 303 through the wiring 32. In particular, the circuit PCB 310 is formed in the hole to be fixed in the heat sink 302 is fixed to the LED PCB 320 in the form of a slit, one side is fastened with the LED PCB 320 by the connecting pin 33 The other side is fixed in the heat sink 302 by the support 34. The support 34 is at least one. This arrangement and fastening structure can facilitate assembly, disassembly and replacement of the diffusion plate 301 and the heat sink 302, and can minimize the influence of heat.

6 is a cross-sectional view of the LED lighting apparatus according to the second embodiment of the present invention.

As shown in FIG. 6, the LED lighting device 400 according to the second exemplary embodiment of the present invention does not have any components (circuit PCBs and various circuits) disposed in the heat sink 302, and various types of circuit PCBs 310. The circuit is arranged in the case 304 in the form of a fluorescent lamp base 303, which is different from the first embodiment. At this time, the same number is attached to the same number.

The case 304 may be located inside the fluorescent base 303 or on one side of the LED PCB 320. When mounted inside the fluorescent lamp base 303, the case 304 is fixed to the upper and lower surfaces of the fluorescent lamp base 303, and the circuit PCB 310 is disposed perpendicularly or obliquely to the LED PCB 320. Various circuits are mounted on the PCB. The circuit PCB 310 is connected to the input pin 30 of the LED lighting device 400 through the wiring 32, the connector 35 is electrically connected to the LED PCB 320 on one side. When this arrangement is complete, the case 304 is molded and modularized with an insulating material such as silicon or epoxy. In another embodiment, the case 304 may be integrally formed with the fluorescent lamp base 303. The circuit PCB 310 and various circuits may be mounted on the case 304 after molding with an insulating material.

This arrangement structure can place a larger number of LEDs 31 on the diffusion plate 301, and maximize the heat dissipation effect because no components (circuit PCBs and various circuits) are arranged on the heat sink 302 side. In particular, by modularizing the various circuits integrally with the fluorescent lamp base 303, there is an effect that can minimize the effects of heat, as well as make the most of the mounting space.

7 illustrates an example of a molded product after inserting a circuit PCB in a case. 8A and 8B illustrate an example of molding a circuit PCB 310 having various circuits mounted thereon with an insulating material. As shown in FIG. 8A, the circuit PCB 310 in which the circuit is mounted is raised in a case or a frame of a predetermined shape, and then molded by injecting an insulating material such as silicon or epoxy from the top or the side thereof.

8B shows an example of a phenol molded circuit PCB.

As shown in FIG. 8B, when phenol molding a circuit PCB, since phenol is applied along the appearance of various circuits mounted on the circuit PCB, shapes and sizes of various circuits are displayed as they are.

9 is a partial cross-sectional view of the LED lighting apparatus according to the third embodiment of the present invention.

As shown in FIG. 9, the third embodiment of the present invention has a structure in which a molded circuit PCB is disposed at one end of the LED PCB 320. This arrangement structure can minimize the influence of the LED 31 because the circuit PCB on which the various circuits are mounted is already insulated with an insulating material even if disposed on the LED PCB 320.

10A to 10D are various circuit diagrams of the LED lighting apparatuses 300 and 400 according to the present invention, in which the configuration of the circuit PCB 310 is changed.

The LED lighting device according to the present invention shown in FIG. 10A is except that the first and second inductors L11 and Ll2 provided in the circuit PCB 310 are connected in series with the output terminal of the electronic ballast (not shown). 4 is the same as the circuit diagram of FIG. When the first and second inductors L11 and Ll2 are connected in series with an output terminal of an electronic ballast (not shown), the amount of current output from the ballast may be more effectively limited.

The LED lighting apparatus according to the present invention shown in FIG. 10B is an example of using only one inductor L11 without using two inductors L11 and L12 for cost reduction.

As illustrated in FIG. 10C, the DC power output from the rectifier circuit 40 is smoothed through the capacitor C11 (smoothing capacitor), but is not satisfactory. Therefore, the ripple cancellation inductor L13 is formed in series with the plurality of LEDs 31 to perform a smooth operation with the capacitor C11 (smoothing capacitor).

On the other hand, the voltage output from the electronic ballast is 100 V (10 Hz to 50 kHz). Thus, a very high voltage is applied directly to the plurality of LEDs 31 (LED arrays). As shown in FIG. 10D, the transformer T1 is provided at the front end of the rectifier circuit 40, and the output voltage of the ballast is converted into a voltage suitable for driving the LED and applied to the rectifier circuit 40.

The circuits illustrated in FIGS. 10A to 10D have been described separately for convenience of description, but are not limited thereto. The circuits may be combined with each other.

11 is a circuit diagram of an LED lighting device according to the present invention having a temperature compensation circuit.

As shown in FIG. 11, the LED lighting apparatus according to the present invention is connected to a circuit PCB 310, an LED PCB 320, and the LED PCB 320 to adjust a current value of each LED 31 according to a temperature change. It consists of the temperature compensation circuit 50 which changes.

The temperature compensation circuit 50 includes two transistors Q1 and Q2 connected to input terminals and output terminals of the plurality of LEDs 31 (LED arrays) to form a current mirror, and an emitter of the transistor Q1. And a diode D1 connected between and ground, and a resistor R2 connected between the emitter of the transistor Q2 and ground. The diode D1 is a zener diode.

The two transistors Q1 and Q2 have a base connected to each other, and the voltage Vr2 applied to the base-emitter voltage Vbe + resistor R2 of the transistor Q2 is the base of the transistor Q1. It is equal to the emitter voltage Vbe + voltage Vd1 formed on the diode D1. Therefore, the voltage Vr2 formed on the resistor R2 is affected by the voltage Vd1 formed on the diode D1.

The current flowing through the collector of the transistor Q2 is equal to the current of all the LEDs, and since the transistor Q2 and the resistor R2 are connected in series, the current of the transistor Q2 is equal to the current of the resistor R2. . In addition, since the voltage Vr2 applied to the resistor R2 is the same as the voltage Vd1 applied to the diode D1, the current I flowing through the resistor R2 is determined by the following equation (1).

I = V (d1) / R2 ..... (1)

When the temperature of the plurality of LEDs 31 (LED array) rises, the voltage supplied is constant while the voltage formed on the LEDs is lowered, so that the current flowing through the LEDs increases. At this time, since the voltage Vd1 formed in the diode D1 is also lowered at the same rate as the temperature increases, the current I flowing through the resistor R2 is reduced according to Equation (1).

Therefore, the LED current according to the temperature rise is compensated because the current I that can flow through the resistor R2 that determines the current of the entire LED is reduced even if the LED current is going to flow further with the temperature rise. That is, the total current of the LED is always kept constant regardless of the temperature change.

At low temperatures, such as winter, it works the opposite way. Therefore, it is possible to maintain a constant LED current even in cold winter or hot summer, so that the brightness of the LED can be kept constant. Usually the temperature of the heat sink is formed up to 90 degrees. Due to the high temperature of the heat sink, the LED may generate more current, and if a thermal runaway condition occurs, a fire may occur. Therefore, a temperature protection circuit should be used. The temperature compensation circuit can be implemented in the simplest and most effective, it is easy to apply to the LED circuit.

In addition, the LED lighting device shown in Figure 11 may be configured to be selectively coupled with the circuit shown in Figures 10a to 10d.

As described above, the present invention expands the mounting space of the LED by installing the circuit PCB on a different surface to have a hierarchical structure with the LED PCB or modularly arranged in a separate case, and is compatible with the existing FPL-only ballast and cost It can effectively solve the problem of saving and heat generation.

In addition, the present invention has an advantage of easily assembling, disassembling and replacing each component by fastening the circuit PCB and the LED PCB using a slip form or a clip form to increase recycling efficiency.

In addition, the present invention can protect the LED circuit and prevent the possibility of fire due to abnormal overheating by configuring a temperature compensation circuit that constantly maintains the total current value of the LED according to the temperature increase and decrease.

The LED lighting device described above is not limited to the configuration and method of the embodiments described above, the embodiments are configured by selectively combining all or part of each embodiment so that various modifications can be made May be

30: Input pin 31:: LED
32: wiring 33: connecting pin
34: support 35: connector
40: rectifier circuit 50: temperature compensation circuit
300, 400: LED lighting device 301: diffuser plate
302: heat sink 303: fluorescent base
304 case 310: circuit PCB
320: LED PCB

Claims (13)

A diffuser plate for diffusing light generated from the LED;
A heat sink for dissipating heat generated from the LED;
A fluorescent base having a fluorescent pin on one side and surrounding the corresponding assembly when the diffusion plate and the heat sink are combined;
An LED PCB positioned in the diffusion plate and having a plurality of LEDs disposed on an upper surface thereof;
A circuit PCB disposed hierarchically under the LED PCB in the heat sink to mount various circuits, and having a hole inserted into the LED PCB in a slit form to be fixed; And
Consists of a connection pin connected to the fluorescent pins and fastening the LED PCB and the circuit PCB in the form of a clip;
The circuit PCB is one side is fixed to the LED PCB by the connecting pin and the other side is fixed to the heat sink by the support LED lighting device, characterized in that. The circuit PCB of claim 1, wherein the various circuits are mounted.
LED lighting device, characterized in that molded with an insulating material such as silicon or epoxy. delete delete The LED lighting apparatus of claim 1, further comprising: a temperature compensating circuit connected to the LED PCB to compensate for a change in a current value of the LED according to a temperature change of the LED. The method of claim 5, wherein the temperature compensation circuit
A first transistor and a second transistor connected to an input / output terminal of the LED to form a current mirror;
A zener diode connected between the emitter of the first transistor and ground; And
A resistor connected between the emitter of the second transistor and the ground;
When the temperature of the LED increases and the total current of the LED increases, the current flowing through the resistor decreases, and when the temperature decreases and the total current of the LED decreases, the current flowing through the resistance increases, increasing the current of the total LED according to the temperature change. LED lighting device, characterized in that the compensation. A diffuser plate for diffusing light generated from the LED;
A heat sink configured to form an empty space inside to discharge heat generated from the LED;
A fluorescent lamp base surrounding the assembly when the diffusion plate and the heat sink are combined;
An LED PCB positioned in the diffusion plate and having a plurality of LEDs disposed on an upper surface thereof;
A case formed in the fluorescent lamp base and connected to the LED PCB through a connector, and molded with various circuits and circuit PCBs by an insulating material and modularized; and
And a temperature compensation circuit connected to the LED PCB to compensate for the temperature change by changing the current value of each LED according to the temperature change of the LED.
A first transistor and a second transistor connected to an input / output terminal of the LED to form a current mirror;
A zener diode connected between the emitter of the first transistor and ground; And
A resistor connected between the emitter of the second transistor and the ground; and configured to include an increase in the temperature of the LED to increase the total current of the LED, thereby reducing the current flowing through the resistance, and decreasing the temperature to reduce the total current of the LED. The LED lighting device, characterized in that to increase the current flowing through the resistance to reduce the total current of the LED according to the temperature change. The method of claim 7, wherein the insulating material
LED lighting device, characterized in that the silicon or epoxy. The method of claim 7, wherein the case
LED lighting device having a fluorescent base form to be inserted into the interior of the fluorescent base. The method of claim 7, wherein the case
LED lighting device, characterized in that formed separately from the fluorescent base or integrally formed with the fluorescent base. The method of claim 7, wherein the case
LED lighting device, characterized in that mounted on one end surface of the LED PCB.
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