KR101373990B1 - Alkali soluble resin polymer comprising fluorene group, method for preparing the same and photo-sensitive resin composition comprising the polymer - Google Patents

Abstract

The present invention relates to an alkali-soluble resin polymer containing a fluorene group, a method for preparing the same, and a photosensitive resin composition comprising the same. The alkali-soluble resin polymer according to the present invention has the same development time as compared with a conventional cardo-based binder resin. There is little pattern shaping in, so the straightness is excellent, and compatibility with other compounds in the photosensitive resin composition is also excellent.

Description

Alkali SOLUBLE RESIN POLYMER COMPRISING FLUORENE GROUP, METHOD FOR PREPARING THE SAME AND PHOTO-SENSITIVE RESIN COMPOSITION COMPRISING THE POLYMER}

The present invention relates to an alkali-soluble resin polymer containing a fluorene group having excellent straightness and excellent compatibility with other compounds in the photosensitive resin composition, a method for preparing the same, and a photosensitive resin composition comprising the same.

In general, the photosensitive resin composition may be used in various fields such as color filters, black matrices, overcoats and column spacers constituting the liquid crystal display device, and among them, a cardo-based binder including fluorene groups in the photosensitive material for black matrices, among others. Resin is excellent in the characteristics, such as sensitivity, developability, chemical resistance, etc. compared with other conventional acrylic binders, and it is used a lot in the photosensitive resin composition which forms a black matrix.

However, conventionally known fluorene-based resin synthesis method is to react a diepoxy compound containing a fluorene group with acrylic acid to obtain a diol compound, which is then reacted with an acid dianhydride. Since the group reacts to form an acid group, there is a disadvantage in that the acid value increases with the molecular weight as the polymerization reaction proceeds.

Therefore, since the conventional fluorene-based resin polymer has a high acid value relative to the molecular weight, when applied to the photosensitive resin composition for black matrix, pattern shaping phenomenon and dropping of the end of the pattern become worse during development, thereby reducing the straightness of the overall pattern. And the poor compatibility with other compounds in the photosensitive resin composition.

Therefore, there is a need in the art for research on a fluorene-based resin polymer and a photosensitive resin composition including the same, which have few pattern shaping phenomena, which are excellent in straightness, and have excellent compatibility with other compounds in the photosensitive resin composition.

The present invention is to solve the above problems, by introducing a monomer containing a fluorene group to the acrylic binder resin to provide an alkali-soluble resin polymer having a suitable molecular weight and acid value, a method for preparing the same and a photosensitive resin composition comprising the same For that purpose.

In order to achieve the above object, the present invention provides an alkali-soluble resin polymer represented by the following formula (1).

[Chemical Formula 1]

In Formula 1,

R1, R2 and R3 are the same as or different from each other, and are each independently hydrogen, an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 3 carbon atoms,

X is a direct bond or is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,

Y is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,

A is selected from the group consisting of phenyl group, benzyl oxy carbonyl group, methyl oxy carbonyl group, ethyl oxy carbonyl group, isobutyl oxy carbonyl group, t-butyl oxy carbonyl group, cyclohexyl oxy carbonyl group and isobornyl oxy carbonyl group,

a, b, and c are molar mixing ratios, each independently being 10-40.

In addition,

1) preparing a compound represented by the following Chemical Formula 4 by reacting the compound represented by the following Chemical Formula 2 with the compound represented by the following Chemical Formula 3, and

2) polymerizing the compound represented by Formula 4, the compound represented by Formula 5, and the compound represented by Formula 6

It provides a method for producing an alkali-soluble resin polymer represented by the formula (1) comprising a.

(2)

(3)

[Chemical Formula 4]

[Chemical Formula 5]

[Chemical Formula 6]

In the above Chemical Formulas 2 to 6,

R1, R2 and R3 are the same as or different from each other, and are each independently hydrogen, an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 3 carbon atoms,

X is a direct bond or is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,

Y is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,

A is selected from the group consisting of a phenyl group, benzyl oxy carbonyl group, methyl oxy carbonyl group, ethyl oxy carbonyl group, isobutyl oxy carbonyl group, t-butyl oxy carbonyl group, cyclohexyl oxy carbonyl group and isobornyl oxy carbonyl group.

In addition, the present invention provides a photosensitive resin composition comprising an alkali-soluble resin polymer represented by the formula (1), a polymerizable compound containing an ethylenically unsaturated bond, a photoinitiator and a solvent.

The present invention also provides a photosensitive material comprising the photosensitive resin composition.

Alkali-soluble resin polymer containing a fluorene group according to the present invention, compared with the conventional cardo-based binder resin, the pattern patterning phenomenon is less at the same development time is excellent in straightness, and also compatible with other compounds in the photosensitive resin composition It has excellent features.

1 is an optical micrograph evaluating the straightness of the pattern according to Example 1 of the present invention.
2 is an optical micrograph of the evaluation of the straightness of the pattern according to Example 2 of the present invention.
3 is an optical micrograph of the evaluation of the straightness of the pattern according to Comparative Example 1 of the present invention.
4 is an optical micrograph of the evaluation of the straightness of the pattern according to Comparative Example 2 of the present invention.

Hereinafter, the present invention will be described in more detail.

Alkali-soluble resin polymer according to the invention is characterized in that represented by the formula (1).

In the alkali-soluble resin polymer according to the present invention, the substituents of Formula 1 will be described in more detail.

Examples of the alkyl group include methyl group, ethyl group, propyl group, and the like, but are not limited thereto.

Examples of the alkoxy group include a methoxy group and an ethoxy group, but are not limited thereto.

Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and the like, but are not limited thereto.

Formula 1 may be more preferably represented by the following formula (7).

[Formula 7]

In Formula 7, a, b, and c are molar mixing ratios, each independently 10 to 40.

The alkali-soluble resin polymer according to the present invention preferably has an acid value of 30 to 150 KOH mg / g, and preferably has a weight average molecular weight of 3,000 to 30,000 g / mol.

In addition, the method for producing an alkali-soluble resin polymer represented by the formula (1) according to the present invention 1) to prepare a compound represented by the formula (4) by reacting the compound represented by the formula (2) and the compound represented by the formula (3) Steps, and

2) polymerizing the compound represented by Chemical Formula 4, the compound represented by Chemical Formula 5, and the compound represented by Chemical Formula 6.

In the method for producing an alkali-soluble resin polymer according to the present invention, the compound represented by Chemical Formula 4 is more preferably a compound represented by the following Chemical Formula 8, but is not limited thereto.

[Formula 8]

In the method for preparing an alkali-soluble resin polymer represented by Chemical Formula 1 according to the present invention, the polymerization process using each monomer may use a method known in the art. More specific details are shown in Examples and the like described later.

Since the conventional fluorene resin polymer is a system obtained by reacting a diol compound containing a fluorene group with an acid dianhydride, there is a disadvantage that the acid value increases together with the molecular weight of the polymer as the reaction proceeds. Therefore, in order to improve the above-mentioned problem, the present invention uses a polymerizable monomer having an acryl group or a methacryl group and at the same time containing a fluorene group in polymerization of an acrylic binder resin, such as high sensitivity, heat resistance, chemical resistance, and the like. The advantage is to make the synthesis of the binder resin having a suitable molecular weight and acid value easier while maintaining.

In addition, the photosensitive resin composition according to the present invention includes an alkali-soluble resin polymer represented by Formula 1, a polymerizable compound including an ethylenically unsaturated bond, a photoinitiator, and a solvent.

In the photosensitive resin composition according to the present invention, the content of the alkali-soluble resin polymer represented by Formula 1 is preferably 1 to 20% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.

In the photosensitive resin composition according to the present invention, the polymerizable compound containing an ethylenically unsaturated bond is pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene One or more compounds selected from glycol di (meth) acrylates and the like may be used, but are not limited thereto.

The content of the polymerizable compound containing an ethylenically unsaturated bond is preferably 1 to 30% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.

In the photosensitive resin composition according to the present invention, the photoinitiator is 2,4-trichloromethyl- (4'-methoxyphenyl) -6-triazine, 2,4-trichloromethyl- (4'-methoxysty Aryl) -6-triazine, 2,4-trichloromethyl- (pipelonyl) -6-triazine, 1-hydroxycyclohexyl phenyl ketone, 4- (2-hydroxyethoxy) -phenyl (2 One or more compounds selected from -hydroxy) propyl ketone, benzophenone, 2,4,6-trimethylaminobenzophenone and the like can be used, but are not limited thereto.

The content of the photoinitiator is preferably 0.1 to 5% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.

In the photosensitive resin composition according to the present invention, the solvent is at least one compound selected from methyl ethyl ketone, propylene glycol diethyl ether, propylene glycol methyl ether acetate, 3-methoxybutyl acetate, dipropylene glycol monomethyl ether, and the like. Can be used, but is not limited thereto.

The content of the solvent is preferably 45 to 95% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.

The photosensitive resin composition according to the present invention may further contain one or more kinds selected from the group consisting of a colorant, a curing accelerator, a thermal polymerization inhibitor, a surfactant, a photosensitizer, a plasticizer, an adhesion promoter, .

As the colorant, one or more pigments, dyes, or mixtures thereof may be used. Specifically, examples of the black pigment include metal oxides such as carbon black, graphite, titanium black, and the like. Examples of carbon black include cysto 5HIISAF-HS, cysto KH, cysto 3HHAF-HS, cysto NH, cysto 3M, cysto 300HAF-LS, cysto 116HMMAF-HS, cysto 116MAF, cysto FMFEF-HS , Sisto SOFEF, Sisto VGPF, Sisto SVHSRF-HS and Sisto SSRF (Donghae Carbon Co., Ltd.); Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, # 2700, # 2600, # 2400, # 2350, # 2300, # 2200, # 1000, # 980, # 900, MCF88, # 52, # 50, # 47, # 45, # 45L, # 25, # CF9, # 95, # 3030, # 3050, MA7, MA77, MA8, MA11, MA100, MA40, OIL7B, OIL9B, OIL11B, OIL30B and OIL31B (Mitsubishi Chemical Corporation); PRINTEX-25, PRINTEX-25, PRINTEX-55, PRINTEX-55, PRINTEX-45, PRINTEX-35, PRINTEX- 200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100 and LAMP BLACK-101 (Daegu; 890, RAVEN-880ULTRA, RAVEN-880ULTRA, RAVEN-850R, RAVEN-1080ULTRA, RAVEN-1080ULTRA, RAVEN-1080ULTRA, RAVEN-1080ULTRA, RAVEN-1040ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN- 820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN- RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, RAVEN-1170 (Colombia Carbon) or mixtures thereof. Examples of coloring agents that can be colored include carmine 6B (CI12490), phthalocyanine green (CI 74260), phthalocyanine blue (CI 74160), perylene black (BASF K0084. K0086), cyanine black, lino yellow (CI 21090) Linol Yellow GRO (CI 21090), Benzidine Yellow 4T-564D, Victoria Pure Blue (CI42595), CI PIGMENT RED 3, 23, 97, 108, 122, 139, 140, 141, 142, 143, 144, 149, 166, 168, 175, 177, 180, 185, 189, 190, 192, 220, 221, 224, 230, 235, 242, 254, 255, 260, 262, 264, 272; C.I. PIGMENT GREEN 7, 36; C.I. PIGMENT blue 15: 1, 15: 3, 15: 4, 15: 6, 16, 22, 28, 36, 60, 64; C.I. PIGMENT yellow 13, 14, 35, 53, 83, 93, 95, 110, 120, 138, 139, 150, 151, 154, 175, 180, 181, 185, 194, 213; C.I. PIGMENT VIOLET 15, 19, 23, 29, 32, 37, etc. In addition, white pigments and fluorescent pigments can be used. As the phthalocyanine-based complex compound used as the pigment, a material having zinc as a central metal in addition to copper may be used.

Examples of the curing accelerator include 2-mercaptobenzoimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2,5-dimercaptan-1,3,4-thiadiazole, 2- (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), pentaerythritol tetrakis (2-mercaptoacetate), pentaerythritol tetrakis Trimethylolpropane tris (2-mercaptoacetate), trimethylolpropane tris (2-mercaptoacetate), trimethylolpropane tris (3-mercaptopropionate), trimethylolethane tris (3-mercaptopropionate), and the like, but it is not limited thereto and may include those generally known in the art.

Examples of the thermal polymerization inhibitor include p-anisole, hydroquinone, pyrocatechol, t-butyl catechol, N-nitrosophenylhydroxyamine ammonium salt, N-nitrosophenylhydroxy Amine aluminum salt, and phenothiazine. However, the present invention is not limited thereto, and may include those generally known in the art.

Any of the above-mentioned surfactants, photosensitizers, plasticizers, adhesion promoters, fillers, and the like, which can be included in conventional photosensitive resin compositions, may be used.

The content of the colorant is preferably 0.5 to 20% by weight based on the total weight of the photosensitive resin composition, and the other additives are preferably 0.01 to 5% by weight based on the total weight of the photosensitive resin composition. It is not limited only to this.

Meanwhile, the photosensitive resin composition according to the present invention is used for a roll coater, a curtain coater, a spin coater, a slot die coater, various printing, Or the like. It is also possible to apply it onto a support such as a film and then transfer it to another support or coat it on a first support, transfer it to a blanket or the like, and transfer it to a second support again.

Examples of the light source for curing the photosensitive resin composition of the present invention include, but are not limited to, mercury vapor arcs, carbon arcs, Xe arcs, and the like, which emit light having a wavelength of 250 to 450 nm.

The present invention also provides a photosensitive material comprising the photosensitive resin composition.

The photosensitive resin composition according to the present invention is preferably used for a pigment-dispersed photosensitive material for manufacturing a TFT LCD color filter, a photosensitive material for forming a black matrix of a TFT LCD or an organic light emitting diode, a photosensitive material for forming an overcoat layer, and a photosensitive material for a column spacer , Photocurable paint, photocurable ink, photocurable adhesive, printing plate, photoresist for printed wiring board, other transparent photoresist, and PDP, and the use thereof is not particularly limited. In particular, the photosensitive resin composition according to the present invention is more preferably used as a photosensitive material for a negative color filter or a photosensitive material for a black matrix.

Hereinafter, preferred embodiments of the present invention will be described in order to facilitate understanding of the present invention. However, the following examples are intended to illustrate the invention and are not intended to limit the scope of the invention.

< Example >

< Synthetic example  1> Fluorene group  contain Monomeric  synthesis

92 g of 9-fluorenol, 68 g of 2-Isocyanatoethyl acrylate, 2.5 g of tetrabutyl ammonium bromide, and 0.2 g of thermal polymerization inhibitor BHT were stirred in 240 g of propylene glycol monomethyl ether acetate solvent, The reactor was heated to 110 ° C. while flowing oxygen inside the reactor. After 16 hours, the reaction was terminated to obtain a fluorene group-containing monomer (solid content 40%, molecular weight 320 g / mol).

< Synthetic example  2> Polymerization of Alkali-Soluble Resin

52 g of benzyl methacrylate, 13 g of methacrylic acid, 35 g of the fluorene group-containing monomer synthesized in Synthesis Example 1 and 0.6 g of 3-mercetopropinic acid were mixed with 300 g of propylene glycol monomethyl ether acetate, and the temperature of the reactor under nitrogen atmosphere. Was raised to 60 ° C. When the temperature of the mixture reached 60 ℃ was added 3.3g of AIBN, a thermal polymerization initiator, and stirred for 12 hours. After 12 hours, a fluorene alkali soluble binder resin having a polymerization yield of 98.5%, a molecular weight of 19,000 g / mol and a solid content of 25% was obtained.

< Synthetic example  3> Polymerization of Alkali Soluble Resin

30 g of styrene, 13 g of methacrylic acid, 35 g of the fluorene group-containing monomer synthesized in Synthesis Example 1 and 0.5 g of 3-mercetopropinic acid were mixed with 230 g of propylene glycol monomethyl ether acetate, and the temperature of the reactor was maintained at 60 ° C. under a nitrogen atmosphere. Raised to. When the temperature of the mixture reached 60 ℃ was added 3g AIBN, a thermal polymerization initiator, and stirred for 12 hours. After 12 hours, a fluorene alkali soluble binder resin having a polymerization yield of 98.5%, a molecular weight of 18,000 g / mol and a solid content of 25% was obtained.

<Comparison Synthetic example  1> Polymerization of Alkali Soluble Resin

52 g of benzyl methacrylate, 13 g of methacrylic acid, 24 g of FA513M (manufactured by FANCRYL monomer from HITACHI CHEMICAL) and 0.5 g of 3-mercetopropinic acid were mixed with 270 g of propylene glycol monomethyl ether acetate to keep the temperature of the reactor at 60 ° C under a nitrogen atmosphere. Raised to. When the temperature of the mixture reached 60 ℃ was added 3g AIBN, a thermal polymerization initiator, and stirred for 12 hours. After 12 hours, a fluorene alkali soluble binder resin having a polymerization yield of 98.5%, a molecular weight of 18,000 g / mol and a solid content of 25% was obtained.

<Comparison Synthetic example  2> Polymerization of Alkali-Soluble Resin

30 g of styrene, 13 g of methacrylic acid, 24 g of FA513M (manufactured by FANCRYL monomer from HITACHI CHEMICAL) and 0.4 g of 3-mercetopropinic acid were mixed with 200 g of propylene glycol monomethyl ether acetate to raise the temperature of the reactor to 60 ° C. under a nitrogen atmosphere. When the temperature of the mixture reached 60 ℃ 2.7g of AIBN which is a thermal polymerization initiator was added and stirred for 12 hours. After 12 hours, a fluorene-based alkali-soluble binder resin having a polymerization yield of 98.5%, a molecular weight of 17,000 g / mol and a solid content of 25% was obtained.

< Example  1>

20 parts by weight of the fluorene-based binder resin synthesized in Synthesis Example 2, 100 parts by weight of a carbon black dispersion, 5 parts by weight of CGI-242 as a photoinitiator, 40 parts by weight of dipentaerythritol hexaacrylate, and propylene glycol monomethyl ether acetate as a solvent. After mixing a weight part and stirring for about 3 hours, the photosensitive resin composition was prepared.

< Example  2>

20 parts by weight of the fluorene-based binder resin synthesized in Synthesis Example 3 was mixed in the same composition as used in Example 1, stirred for about 3 hours, and then a photosensitive resin composition was prepared.

< Comparative Example  1>

20 parts by weight of the acrylic binder resin synthesized in Comparative Synthesis Example 1 was mixed in the same composition as used in Example 1, stirred for about 3 hours, and then a photosensitive resin composition was prepared.

< Comparative Example  2>

20 parts by weight of the acrylic binder resin synthesized in Comparative Synthesis Example 2 was mixed in the same composition as used in Example 1, stirred for about 3 hours, and then a photosensitive resin composition was prepared.

< Experimental Example >

After spin coating each of the photosensitive resin composition solutions prepared in Examples 1, 2, Comparative Example 1 and Comparative Example 2 onto a glass substrate, and heat-treating at 100 ° C. for 140 seconds to form a 1.2 μm thick coating film. The photomask was covered on this coating film and exposed to an energy of 50 mJ / cm ² , followed by development for 80 seconds with a 0.04% KOH aqueous solution at 25 ° C. After development, after drying for 30 minutes in a 230 ℃ convection oven, the state of the pattern was observed.

Each pattern state obtained in the above experimental example was observed with an optical microscope to measure linearity and sensitivity, and chemical resistance to an NMP solution, and are shown in Table 1 below and FIGS. 1 to 4.

[Table 1]

In Table 1, the chemical resistance was indicated by immersing each substrate obtained in the Examples and Comparative Examples at 40 ° C. for 30 minutes at 40 ° C., and then observed the appearance change of the coating film. ), A slight state change is usually detected (△), the appearance is peeled off or the color of the solvent is marked as defective (X).

In addition, the sensitivity in Table 1 is the size of the minimum pixel remaining after the exposure and development process, the straightness shown in Figures 1 to 4 is the result of observing each pattern state with an optical microscope at the same development time.

As can be seen in Table 1 and the results of FIGS. 1 to 4, the alkali-soluble resin polymer including the fluorene group according to the present invention has excellent sensitivity and chemical resistance, and has little pattern shaping at the same development time. Straightness is good and compatibility with the other compound in the photosensitive resin composition is also excellent, and it is effective for a negative photosensitive resin composition.

Claims (16)

Alkali-soluble resin polymer represented by the following general formula (1):
[Chemical Formula 1]

In Formula 1,
R1, R2 and R3 are the same as or different from each other, and are each independently hydrogen, an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 3 carbon atoms,
X is a direct bond or is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,
Y is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,
A is selected from the group consisting of phenyl group, benzyl oxy carbonyl group, methyl oxy carbonyl group, ethyl oxy carbonyl group, isobutyl oxy carbonyl group, t-butyl oxy carbonyl group, cyclohexyl oxy carbonyl group and isobornyl oxy carbonyl group,
a, b, and c are molar mixing ratios, each independently being 10-40. The alkali-soluble resin polymer according to claim 1, wherein the general formula (1) is represented by the following general formula (7):
(7)

In Formula 7, a, b, and c are molar mixing ratios, each independently 10 to 40. The alkali-soluble resin polymer according to claim 1, wherein the alkali-soluble resin polymer has an acid value of 30 to 150 KOH mg / g and a weight average molecular weight of 3,000 to 30,000 g / mol. 1) preparing a compound represented by the following Chemical Formula 4 by reacting the compound represented by the following Chemical Formula 2 with the compound represented by the following Chemical Formula 3, and
2) polymerizing the compound represented by Formula 4, the compound represented by Formula 5, and the compound represented by Formula 6
Method for producing an alkali-soluble resin polymer of any one of claims 1 to 3 comprising:
(2)

(3)

[Chemical Formula 4]

[Chemical Formula 5]

[Chemical Formula 6]

In the above Chemical Formulas 2 to 6,
R1, R2 and R3 are the same as or different from each other, and are each independently hydrogen, an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 3 carbon atoms,
X is a direct bond or is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,
Y is selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, an ethylene oxide group and a propylene oxide group,
A is selected from the group consisting of phenyl group, benzyl oxy carbonyl group, methyl oxy carbonyl group, ethyl oxy carbonyl group, isobutyl oxy carbonyl group, t-butyl oxy carbonyl group, cyclohexyl oxy carbonyl group and isobornyl oxy carbonyl group. The method of claim 4, wherein the general formula (4) is represented by the following general formula (8).
[Chemical Formula 8]

The photosensitive resin composition containing the alkali-soluble resin polymer of any one of Claims 1-3, the polymeric compound containing an ethylenically unsaturated bond, a photoinitiator, and a solvent. The photosensitive resin composition of claim 6, wherein the content of the alkali-soluble resin polymer is 1 to 20% by weight based on the total weight of the photosensitive resin composition. The method of claim 6, wherein the polymerizable compound containing an ethylenically unsaturated bond is pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, ethylene glycol di (meth) acrylate and polyethylene glycol di (meth) Photosensitive resin composition comprising at least one member selected from the group consisting of acrylates. The photosensitive resin composition of claim 6, wherein the content of the polymerizable compound including an ethylenically unsaturated bond is 1 to 30 wt% based on the total weight of the photosensitive resin composition. The photoinitiator of claim 6, wherein the photoinitiator is 2,4-trichloromethyl- (4'-methoxyphenyl) -6-triazine, 2,4-trichloromethyl- (4'-methoxystyryl) -6- Triazine, 2,4-trichloromethyl- (pipelonyl) -6-triazine, 1-hydroxycyclohexyl phenyl ketone, 4- (2-hydroxyethoxy) -phenyl (2-hydroxy) propyl A photosensitive resin composition comprising one or more selected from the group consisting of ketones, benzophenones and 2,4,6-trimethylaminobenzophenones. The photosensitive resin composition according to claim 6, wherein the content of the photoinitiator is 0.1 to 5 wt% based on the total weight of the photosensitive resin composition. The method of claim 6, wherein the solvent comprises at least one selected from the group consisting of methyl ethyl ketone, propylene glycol diethyl ether, propylene glycol methyl ether acetate, 3-methoxybutyl acetate, and dipropylene glycol monomethyl ether. Photosensitive resin composition characterized by the above-mentioned. The photosensitive resin composition of claim 6, wherein the content of the solvent is 45 to 95 wt% based on the total weight of the photosensitive resin composition. The method of claim 6, wherein the photosensitive resin composition further comprises one or more selected from the group consisting of a colorant, a curing accelerator, a thermal polymerization inhibitor, a surfactant, a photosensitizer, a plasticizer, an adhesion promoter, a filler and an adhesion aid. Photosensitive resin composition characterized by the above-mentioned. The photosensitive material containing the photosensitive resin composition of Claim 6. The method of claim 15, wherein the photosensitive material is selected from the group consisting of pigment dispersion type photosensitive material for producing color filters, photosensitive material for forming black matrix, photosensitive material for forming overcoat layer, column spacer photosensitive material and photosensitive material for printed wiring board. Photosensitive material.

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