KR101356632B1 - Fabrication method of high stable carbon nanotube field emitters against electrical discharge using metal binders and the carbon nanotube electron emitters fabricated thereby - Google Patents

Abstract

A high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder and a method of manufacturing the same are disclosed. The manufacturing method of the carbon nanotube field emission electron beam emitter may include a first step of purifying carbon nanotubes; Dissolving the purified carbon nanotubes in a volatile solvent; A third step of preparing a carbon nanotube paste by mixing the carbon nanotube solution and the metal binder; A fourth step of polishing the negative electrode substrate through a mechanical and chemical process; A fifth step of suspending the carbon nanotube paste on a polished anode substrate by hanging a liquid droplet on a paste support substrate; And a sixth step of drying and hot sintering the negative electrode substrate coated with the carbon nanotube paste.

Description

Fabrication method of high stable carbon nanotube field emitters against electrical discharge using metal binders and method of manufacturing high stability carbon nanotube field emission electron beam emitter resistant to discharge using metal binder the carbon nanotube electron emitters fabricated thereby}

The present invention draws a strong adhesion between the negative electrode substrate and the carbon nanotubes by using a mixture ratio of the ideal metal binder and a high temperature manufacturing method to discharge with a high-voltage device and a metal binder having high safety against the discharge frequently generated during experiments. It is to provide a method for producing a strong high stability carbon nanotube field emission electron beam emitter and a carbon nanotube field emission electron beam emitter manufactured thereby.

As an electron beam source of a conventional electron gun, metals and metal oxides such as tungsten, LaB ₆ and Ba-Oxide are formed into a filament form, and hot electrons generated when heated to a high temperature are extracted to an electron beam by using a charged electrode and an electrode aperture. do. Hot electron withdrawal is due to free electron diffusion of the heated hot electron cathode according to Richardson Relation of Equation (1), and a higher current density can be obtained when using a low work function filament material.

The electrons generated by the heated cathode have an initial random energy of about 1 to 1.5 eV. This causes the electron beam trajectory to be uneven during electron beam acceleration and focusing, resulting in electron beam loss, which is a fundamental reason why the electron beam focusing point cannot be gathered in one place. In addition, the heating temperature should be lower than the filament vaporization temperature, and the low work function cathode material is also limited, so that the generated current density cannot be drawn out more than several hundred A / cm ² . It is pointed out that at least two insulated wires must be provided for electron beam drawing by heating current through the filament resistance, making it difficult to miniaturize.

In contrast, an electric field is applied at the tip of a sharp conductor and a semiconductor electron beam cathode, so that free electrons in the cathode are induced and drawn to the surface of the cathode by a quantum tunneling effect. It follows the Fowler-Nordheim relation as shown in Equation (2) below, and the generated current density varies according to the shape of the cathode, the applied electric field, and the work function of the cathode.

Recently developed nano field emitters, such as carbon nanotubes, are one-dimensional nano wires, nano rods, and nanotubes based on high aspect ratio conductors or semiconductor materials. tube).

Through this, the current density of the field emission can be increased by acquiring high electric field contrast, and the technique of growing or coating nanomaterials on the cathode substrate of various shapes is developed to utilize a wide range from ultra-small electron beam sources to large-area and large-capacity electron beam sources. This is expected.

The nano field emitters do not generate heat because the electron beam is drawn out by the electric field application method, and the structure and the driving power supply are simple because the single electrode is used for the electric field application. In addition, the current density of the generated electron beam is 10 times to 1000 times or more according to the shape of the negative electrode substrate, which can generate a high power electron beam, and also can reduce the size of the cathode. The advantage is that the time structure can be easily adjusted.

To date, field emission sources based on nanomaterials have been developed through chemical vapor deposition, dielectrophoresis, arc discharge, ion collision, and paste printing. It is grown and coated on various cathode substrates. In the chemical vapor deposition method, since the gas reduction catalyst dispersed in the negative electrode substrate reduces the gas molecules to grow the one-dimensional nanofield emission source, the choice of the negative electrode substrate shape is very free. However, since the adhesion area between the gas reduction catalyst and the negative electrode substrate is narrow and the adhesion between dissimilar metals is limited, it is difficult to manufacture a long-life field emission source. Electrophoresis, arc discharging, and ion bombardment are also limited to electric field application sites, discharge contacts, and ion bombardment contacts.

Adhesive printing is a method of coating a surface of a negative electrode substrate by mixing a nano-field emission powder and a sinterable binder that strongly adheres it to the negative electrode substrate.

However, all of the above manufacturing methods have a fatal disadvantage of failing to overcome the discharge generated frequently during high voltage devices and experiments, which is one of the biggest problems of the cold field emission source that has not yet been solved worldwide.

The problem to be solved by the present invention is a method of manufacturing a high stability carbon nanotube field emission type electron beam emitter resistant to discharge using a high-voltage device and a metal binder capable of overcoming the discharge frequently generated during the experiment and the carbon nanoparticles manufactured by the same To provide a tube field emission electron beam emitter.

The field emission electron beam emitter manufacturing method according to an embodiment of the present invention for solving the above problems is a first step of purifying carbon nanotubes; Dissolving the purified carbon nanotubes in a volatile solvent; A third step of preparing a carbon nanotube paste by mixing the carbon nanotube solution and the metal binder; A fourth step of polishing the negative electrode substrate through a mechanical and chemical process; A fifth step of suspending the carbon nanotube paste on a polished anode substrate by hanging a liquid droplet on a paste support substrate; And a sixth step of drying and hot sintering the negative electrode substrate coated with the carbon nanotube paste.

The carbon nanotube of the first step is characterized in that the acid treatment process for 0.5 to 24 hours by a purification solution consisting of sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide or a mixture thereof.

As the volatile solvent of the second step, isopropyl alcohol, dichloromethane, dichloroethane, or dichlorobenzene is used.

The carbon nanotubes of the second step are separated from the carbon nanotubes for 0.5 to 5 hours by a solution having a power consumption of 50 to 300 W, which is mixed at a ratio of 0.1 to 5% by weight in a volatile solvent. do.

The metal binder of the third step is characterized by consisting of a mixed metal binder of silver, copper and indium.

The carbon nanotubes of the third step and the mixed metal binder may be mixed at a weight ratio of 1: 8 to 1:15.

The negative electrode substrate of the fourth step may be a plate, a wire, a rod, and any type of negative electrode substrate.

The material of the negative electrode substrate of the fourth step is tungsten (W), iron (Fe), nickel (Ni) titanium (Ti), silver (Ag), copper (Cu), Kovar (Sova), Or palladium (Pd).

The negative electrode substrate of the fourth step is characterized in that the polishing, grinding, buffing, anodizing or oxidizing treatment of one end or the entire surface.

The method includes fabricating a large area field emission electron beam emitter according to the carbon nanotube paste coating method of the fifth step, making a large number of independent island type field emission electron beam emitters on a large area substrate, and film type field emission electron beam. Emitter fabrication, or a small area emitter can be produced in a local area.

The paste support substrate of the fifth step is characterized in that the cross section is made of a long rod, syringe, wire having a conical, cylindrical, concave, convex, triangular, square and polygonal.

The drying of the sixth step is 1 to 30 minutes natural drying at atmospheric pressure in the case of volatile solvent, 1 to 5 minutes drying in a vacuum of 10 ^-1 to 10 ^-3 torr or hot gun using a pump in the case of general polar solvent And using a dryer for 1 to 5 minutes characterized in that a uniform coating through a dry.

The sintering of the sixth step is characterized in that it is carried out for 20 to 80 minutes at an ultra-high temperature of 600 ~ 1500 ℃ in a vacuum of 10 ^-1 ~ 10 ^-7 torr.

The roughness of the negative electrode substrate of the fourth step is characterized in that the height and width have a 0.01 ㎛ ~ 2 mm.

The field emission type electron beam emitter according to another embodiment of the present invention for solving the above problems is manufactured by the method of claim 1 that the carbon nanotubes on the surface of the negative electrode substrate is an emitter with strong adhesion due to the metal binder It features.

The field emission electron beam emitter is characterized in that it has a constant field emission characteristic even in the strike of the discharge.

Method for producing a carbon nanotube field emission source using a metal binder according to the present invention and the carbon nanotube field emission source produced by the present invention is to increase the contact surface with the substrate and to form a metal binder on the negative electrode substrate It is possible to achieve strong bonding between the carbon nanotube and the substrate due to the improvement of the wettability with the substrate due to the mixing ratio adjustment and the diffusion into the substrate.

In addition, the high temperature vacuum sintering process may help the strong bonding between the carbon nanotube paste and the substrate, and impurities on the carbon nanotube may be removed at a high temperature, thereby improving the amount of electric field emission current even when the same potential is applied. These factors can cause a strong bond between the substrate and the carbon nanotubes to significantly reduce the resistance between the negative electrode substrate and the carbon nanotubes and dissimilar materials, in particular, it can show high safety against high voltage devices and discharges that occur frequently during experiments. This is stronger than thermal breakdown that can occur during high temperature brazing compared to the field emission source manufactured at low temperature, and can accelerate the realization of high voltage devices such as high power electron guns.

It can also be applied to the radiographic, medical, nano and entanglement machine industries, such as high-brightness X-ray tubes, implantable non-destructive X-ray tubes, space probe X-ray tubes, ultra-small X-ray tubes for the treatment of proximity cancer, and field emission displays (FED). .

1 is a flow chart illustrating a method of manufacturing a field emission electron beam emitter according to an embodiment of the present invention.
FIG. 2 is an exemplary view illustrating coating a carbon nanotube paste on a negative electrode substrate using a paste support substrate using the manufacturing method illustrated in FIG. 1.
3 is an exemplary view showing a field experiment of the field emission through the field emission electron beam emitter made in the present invention.
4 is a scanning electron micrograph of a carbon nanotube field emission source according to the present invention.
Figure 5 is a graph of the field emission characteristics analysis of the discharge carbon nanotube field emission source according to the present invention.
FIG. 6 is a graph illustrating field emission characteristics of a carbon nanotube field emission source using only a single metal binder for comparison with a carbon nanotube field emission source according to the present invention.
7 is a graph illustrating electron beam extraction characteristics for measuring safety against discharge of a carbon nanotube field emission source and a comparative example according to the present invention.
8 is a scanning electron micrograph after the field emission and safety experiment for the discharge of the carbon nanotube field emission source according to the present invention.
9 is a scanning electron micrograph after the field emission and safety experiment for the discharge of the carbon nanotube field emission source using only a single metal binder for comparison with the carbon nanotube field emission source according to the present invention.

Specific structural and functional descriptions of embodiments according to the concepts of the present invention disclosed in this specification or application are merely illustrative for the purpose of illustrating embodiments in accordance with the concepts of the present invention, The examples may be embodied in various forms and should not be construed as limited to the embodiments set forth herein or in the application.

Embodiments in accordance with the concepts of the present invention can make various changes and have various forms, so that specific embodiments are illustrated in the drawings and described in detail in this specification or application. However, this is not intended to limit the embodiments in accordance with the concept of the present invention to a particular disclosed form, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms such as first and / or second may be used to describe various components, but the components should not be limited by the terms. The terms may be referred to as a first component second component only for the purpose of distinguishing one component from another component, for example without departing from the scope of the right according to the concept of the present invention, The two components can also be named as the first component.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof that is described, and that one or more other features or numbers are present. It is to be understood that the steps, acts, components, parts or combinations thereof, but do not preclude the presence or the possibility of addition thereof, are to be understood.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and are not construed in ideal or excessively formal meanings unless expressly defined herein. Do not.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing a field emission type electron beam emitter according to an exemplary embodiment of the present invention, and FIG. 2 is a cathode substrate using a paste support substrate on a carbon nanotube paste using the manufacturing method illustrated in FIG. 1. Exemplary diagram showing coating on the.

As shown in FIG. 1, the method of manufacturing the field emission type electron beam emitter of the present invention includes a first step S110 to a fifth step S150.

The first step (S110) is a step of purifying the carbon nanotubes 21.

For reference, the carbon nanotubes 21 are made of carbon only to be non-polar and have strong adhesion properties between the carbon nanotubes. Since this property lowers the efficiency in the field emission and the utilization of carbon nanotubes, it is necessary to purify the carbon nanotubes spaced apart between the carbon nanotubes.

In addition, since the prepared carbon nanotubes contain impurities, the sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide and a mixture thereof are used for about 0.5 to 24 hours to dilute the carbon nanotubes well in a polar solvent and remove impurities. It is preferable to purify.

In addition, in the case of the purified solution, sulfuric acid, nitric acid, hydrochloric acid, and hydrogen peroxide or a mixture of these strong acidic solution or carbon nanotubes with a functional group can be polarized, to help the separation between all carbon nanotubes Solution is possible.

In the present invention, the carbon nanotubes were specifically purified for about 24 hours using a mixed solution of sulfuric acid: nitric acid = 3: 1.

The second step S120 may be a step of dissolving the carbon nanotubes 21 in the volatile solvent 23.

In the case of the carbon nanotubes 21, both single-walled or multi-walled carbon nanotubes may be possible. In the case of the solvent, isovolatile alcohol, isopropyl alcohol, dichloromethane (dichloromethane), dichloro ethane (dichloro ethane), and dichlorobenzene (dichlorobenzene) is a highly volatile and polar solvent to help the separation between the carbon nanotubes Any solvent can be given.

Here, the carbon nanotubes purified by the first step (S110) is mixed with 0.1 to 5% by weight in the volatile solvent to dissolve the carbon nanotubes while melting for 1 to 5 hours through sonication (sonication). A step is necessary.

In the present invention, the carbon nanotube solution was completed by mixing 1 wt% single-walled carbon nanotubes with 99 wt% of dichlorobenzene solvent through a 2 hour sonication process.

The third step (S130) may be a step of manufacturing the carbon nanotube paste 2 by mixing the carbon nanotube solution and the metal binder 22 made in the second step (S120).

The metal binder of the third step (S130) is to compensate for the low adhesion between the negative electrode substrate and the carbon nanotubes to add a metal binder 22 can lead to a strong adhesion on the negative electrode substrate of the carbon nanotubes.

The metallic binder 22 of the third step S130 is made of aluminum, tin, copper, indium, silver, gold, manganese, nickel, iron, titanium, and mixed metal binders thereof, and at atmospheric pressure ˜10 ⁻⁷ torr It can be sintered at a high temperature of 600 ~ 1500 in a vacuum of.

In addition, by controlling the mixing ratio of the carbon nanotube solution and the metal binder in the carbon nanotube paste, the viscosity can be adjusted, the adhesion between the carbon nanotube and the negative electrode substrate, and the field emission characteristics of the final field emission electron beam emitter Can also affect.

In the present invention, specifically, silver (65% by weight), copper (22% by weight) and indium (13% by weight) are mixed to make a metal binder, and 0.4 g of the metal binder is carbon produced in the first step (S110). Mix with 20 μl of nanotube solution to present carbon nanotube paste.

The fourth step S140 may be a step of polishing the negative electrode substrate 31 through mechanical and chemical processes.

The cathode substrate may be a large area or a small area cathode substrate of various types such as a large area plate, wire or rod of a conductor or a semiconductor.

In addition, the material of the cathode substrate is tungsten (W), iron (Fe), nickel (Ni) titanium (Ti), silver (Ag), copper (Cu), Kovar (Sova), stainless (Sus), and palladium ( Pd) and the like can be used. Roughness of the negative electrode substrate may cause a discharge during the field emission experiment, and generally, it is preferable to undergo mechanical and chemical polishing processes.

There are various methods of polishing, such as polishing, grinding, buffing, anodizing and oxidizing. In the present invention, specifically, one end surface of 0.8 mm diameter and 8 mm long tungsten wire was cleaned using acetone after mechanical treatment through grinding, and one end surface of the negative electrode substrate, which had been polished, had a height of 0.1 μm. And a roughness of 0.4 μm in width.

In the fifth step S150, the carbon nanotube paste 2 prepared in the third step is suspended on the paste support substrate 11 with a liquid drop to coat the negative electrode substrate 31 polished in the fourth step. It may be a step.

When the form of the negative electrode substrate has a plate or a wide diameter, the paste supporting substrate serves to transfer the carbon nanotube paste onto the negative electrode substrate.

However, when the viscosity of the carbon nanotube paste is weak and the diameter of the negative electrode substrate is narrow, the paste supporting substrate serves to prevent the carbon nanotube paste from flowing down the negative electrode substrate by the weak surface tension. The material of the paste support substrate may be any material that is not affected or not affected by the carbon nanotube paste, and has a roughness, and is easy to support the paste, and has a sharp shape that can be easily removed after coating the carbon nanotube paste on the anode substrate. desirable. But it is not limited to this shape.

The carbon nanotube paste can be easily controlled in a small amount or in a large amount, making a large area field emission electron beam emitter, making a large number of independent island type field emission electron beam emitters on a large area substrate, making a film type field emission electron beam emitter It is possible to easily manufacture various types of field emission electron beam emitters, such as fabrication of small area emitters at local or local area.

In the present invention, specifically, 2 μl of carbon nanotube paste was coated in a 0.8 mm diameter of tungsten wire rounded in a circular cross section using a conical plastic paste support substrate, and the viscosity of the carbon nanotube paste in the present invention is strong. After coating on the negative substrate through the support substrate, the paste support substrate was removed.

The sixth step S160 may be a step of drying and hot sintering the negative electrode substrate coated with the carbon nanotube paste 2 in the fifth step S150.

When drying in the sixth step (S160) using a highly volatile solvent to finish drying for 1 to 30 minutes at atmospheric pressure, by inducing high volatility to a low atmospheric pressure using a pump to dry quickly or acute drying by heating It is possible to achieve a more uniform coating of carbon nanotube paste using.

The high temperature vacuum sintering of the fifth step (S150) may be different depending on the metal binder used, but by inducing diffusion of the metal binders into the negative electrode substrate using a high temperature of 900 ~ 1500 ℃ can induce a stronger bond. In addition, the strong bonding between the carbon nanotubes and the cathode substrate shows excellent stability against discharges that occur frequently in high-voltage experiments that have not been solved worldwide, as well as field emission-type electron beam emitters having long lifetimes in field emission experiments.

In the present invention, the sample shown in FIG. 4 may be manufactured by high temperature vacuum sintering at a vacuum of 10 ⁻⁴ torr for 40 minutes at 1000 ° C.

3 is an exemplary view showing a field experiment of the field emission through the field emission electron beam emitter made in the present invention.

Referring to FIG. 3, although a negative potential is applied to the anode substrate, a positive potential may be applied to the anode side. In the experiment, the distance (d) between the cathode substrate and the anode has a great influence on the field emission characteristics and the discharge. As the distance d is reduced, the threshold voltage is lowered, and the amount of gas present between the distances is reduced, thereby reducing the amount or force of discharge.

4 is a scanning electron micrograph of the carbon nanotube field emission source according to the present invention, Figure 5 is a graph of the field emission characteristics analysis for the discharge of the carbon nanotube field emission source according to the present invention.

As shown in FIG. 5, the field emission characteristics of the discharge of the carbon nanotube field emission-type electron beam emitter completed in the present invention were deliberately changed while inducing a large number of discharges by rapidly changing the applied field. .

However, despite the impact of strong discharge, it shows very uniform field emission characteristics.

Figure 6 is a carbon nanotube field emission electron beam emitter made of silver commonly used as a metal binder in order to compare the field emission characteristics of the discharge of the carbon nanotube field emission electron beam emitter completed in the present invention A graph showing the field emission characteristics for the discharge of.

As shown in FIG. 6, general field emission emitters have a high threshold voltage due to a strong discharge, and field emission becomes unstable. In addition, when a metal binder is not used or the bonding with the negative electrode substrate is weak, it can be confirmed that a large number of phenomena in which no current comes out due to the blow due to the discharge are observed.

7 is a graph illustrating an electron beam extraction characteristic for measuring stability against discharge of a carbon nanotube field emission source and a comparative example (sample in FIG. 6) according to the present invention.

As shown in FIG. 7, this experiment also drastically raised the current to 480 μA (invention) and 450 μA (comparative sample), resulting in an average of 15 ± 3 discharges per minute during the initial 20 minutes. It can be seen that the nanotube field emission electron beam emitter shows only ± 3-4% emission current change over 80 minutes.

8 is a scanning electron micrograph after the field emission and stability test for the discharge of the carbon nanotube field emission source according to the present invention.

As shown in FIG. 8, it can be seen that only 7 to 8% of carbon nanotube paste coating loss is shown despite being discharged 500 times or more during all experiments.

Figure 9 is a scanning electron micrograph after the field emission and stability test for the discharge of the carbon nanotube field emission source using only a single metal binder for comparison with the carbon nanotube field emission source according to the present invention.

As shown in FIG. 9, more than 65% of the carbon nanotube paste originally coated was lost due to the weak bonding and strong discharge between the carbon nanotubes and the negative electrode substrate after all the experiments.

Therefore, by using a method of manufacturing a high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder and a carbon nanotube field emission electron beam emitter using the same, it is possible to form a network structure of carbon nanotubes on a cathode substrate. Due to the increase of the contact surface with the substrate and the control of the mixing ratio of the metal binder to improve the wettability with the substrate and the strong bonding between the carbon nanotubes and the substrate due to the diffusion to the substrate can be achieved.

In addition, the high temperature vacuum sintering process may help the strong bonding between the carbon nanotube paste and the substrate, and impurities on the carbon nanotube may be removed at a high temperature, thereby improving the amount of electric field emission current even when the same potential is applied.

These factors can cause a strong bond between the substrate and the carbon nanotubes to significantly reduce the resistance between the negative electrode substrate and the carbon nanotubes and dissimilar materials, in particular, it can show high safety against high voltage devices and discharges that occur frequently during experiments.

This is stronger than thermal breakdown that can occur during high temperature brazing compared to the field emission source manufactured at low temperature, and can accelerate the realization of high voltage devices such as high power electron guns.

It can also be applied to the radiographic, medical, nano and entanglement machine industries, such as high-brightness X-ray tubes, implantable non-destructive X-ray tubes, space probe X-ray tubes, ultra-small X-ray tubes for the treatment of proximity cancer, and field emission displays (FED).

As described above with reference to the drawings illustrating a method of manufacturing a high stability carbon nanotube field emission electron beam emitter resistant to discharge using the metal binder according to the present invention and a carbon nanotube field emission electron beam emitter using the same. The present invention is not limited to the embodiments and drawings disclosed herein, and various modifications may be made by those skilled in the art within the technical scope of the present invention.

11: Paste Support Substrate 2: Carbon Nanotube Paste
21: carbon nanotube 22: metal binder
23: volatile solvent 31: negative electrode substrate

Claims (16)

A first step of purifying carbon nanotubes;
Dissolving the purified carbon nanotubes in a volatile solvent;
A third step of preparing a carbon nanotube paste by mixing the carbon nanotube solution and the metal binder;
Polishing the cathode substrate through a mechanical or chemical process;
A fifth step of suspending the carbon nanotube paste on a polished anode substrate by hanging a liquid droplet on a paste support substrate; And
And a sixth step of drying and hot sintering the negative electrode substrate coated with the carbon nanotube paste.
The high temperature sintering of the sixth step,
Method for producing a high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder, characterized in that performed for 20 to 80 minutes at a high temperature of 600 ~ 1500 ℃ in a vacuum of 10 ^-1 ~ 10 ^-7 torr .
The method of claim 1,
The carbon nanotubes of the first step,
A high stability carbon nanotube field emission type electron beam emitter resistant to discharge using a metal binder, which is subjected to an acid treatment for 0.5 to 24 hours by a purification solution composed of sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide, or a mixture thereof. Manufacturing method.
The method of claim 1,
The volatile solvent of the second step,
A method for producing a high stability carbon nanotube field emission type electron beam emitter resistant to discharge using a metal binder, characterized by using isopropyl alcohol, dichloromethane, dichloroethane, or dichlorobenzene.
The method of claim 1,
Carbon nanotubes of the second step,
High stability to discharge using metal binders, which is separated from carbon nanotubes for 0.5 to 5 hours by mixing with volatile solvent at a ratio of 0.1 to 5% by weight with a power consumption of 50 to 300W. Method for producing a carbon nanotube field emission electron beam emitter.
The method of claim 1,
The metal binder of the third step,
A method for producing a high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder comprising silver, a mixed metal binder of copper and indium.
The method of claim 1,
The carbon nanotube and the mixed metal binder of the third step
A method for producing a high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder, characterized in that it is mixed at a weight ratio of 1: 8 to 1:15.
The method of claim 1,
The cathode substrate of the fourth step is a plate, wire or rod (cathode) cathode substrate characterized in that the high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder Manufacturing method.
The method of claim 1,
The material of the negative electrode substrate of the fourth step,
Metals characterized in that they are tungsten (W), iron (Fe), nickel (Ni) titanium (Ti), silver (Ag), copper (Cu), Kovar, stainless (Sus), or palladium (Pd) A method for producing a high stability carbon nanotube field emission electron beam emitter resistant to discharge using a binder.
The method of claim 1,
The negative electrode substrate of the fourth step,
High stability carbon nano nanoparticles resistant to discharge using metal binders characterized by polishing, grinding, buffing, anodizing, or oxidizing the polishing of one or all sections Method for producing a tube field emission electron beam emitter.
The method of claim 1,
The method comprises:
According to the fifth step of the carbon nanotube paste coating method, a large area field emission electron beam emitter is fabricated, an island type field emission electron beam emitter is independent of a large area substrate, a film type field emission electron beam emitter is fabricated, or A method for producing a high stability carbon nanotube field emission type electron beam emitter, which is resistant to discharge using a metal binder, wherein a small area emitter can be manufactured in a local area.
6. The method of claim 5,
The mixed metal binder is 65 wt% silver, 22 wt% copper, and 13 wt% indium, characterized in that the high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder.
The method of claim 1,
Drying of the sixth step,
In the case of the volatile solvent, a method of producing a high stability carbon nanotube field emission type electron beam emitter resistant to discharge using a metal binder, characterized in that a uniform coating is achieved through natural drying for 1 to 30 minutes at atmospheric pressure.
delete 10. The method of claim 9,
Roughness of the negative electrode substrate of the fourth step,
A method of manufacturing a high stability carbon nanotube field emission electron beam emitter resistant to discharge using a metal binder, characterized in that the height and width have a 0.01 to 2mm.
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