KR101338658B1 - Antenna connection device - Google Patents

Abstract

Antenna connection device according to the embodiment includes a substrate; A conductive pad formed on an inner layer of the substrate and forming a plate; And a feeding pad in contact with a surface of the substrate perpendicular to the conductive pad and forming a plate shape, wherein the conductive pad and the feeding pad are operated as a capacitor with the substrate interposed therebetween.

According to the embodiment, there is an effect that can prevent the physical loss between the pads, deterioration of the electrical characteristics by the contactless antenna structure. In addition, it is possible to easily design the antenna characteristics according to the multiple frequency band, there is an effect that can maintain the transmission and reception function stably. In addition, it is possible to implement a low-loss energy transfer structure by removing the direct conduction structure, and there is an effect that can improve the antenna radiation characteristics.

Description

Antenna connection device

1 is a side sectional view showing the form of an antenna connecting apparatus according to a first embodiment;

Fig. 2 is a side sectional view showing the form of the antenna connection device according to the second embodiment.

3 is a diagram schematically illustrating a conductive pad, a substrate, and a feeding pad in order to explain the operation of the antenna connection device according to the embodiment.

4 shows an equivalent circuit of the antenna connection device according to the third embodiment.

5 is a graph showing a frequency band characteristic curve of the antenna connection device according to the embodiment;

Description of the Related Art

110, 130: antenna 111, 131: conductor

112, 132: housing 113, 133: feeding pad

120, 140: substrate 121, 141: first layer

122, 142: second layer 123, 143: conductive pad

150: matching circuit

An embodiment discloses an antenna connecting apparatus.

With the development of wireless telecommunication technology, many products using cell phones, handsets, wireless PDAs and WLANs are emerging, and antennas are the main communication components that determine the performance of these wireless communication products.

Antennas applied to mobile communication terminals mainly use external dipoles and helical antennas, but if the external antennas are not fixed, their characteristics can be modified by users, and they are constrained by various designs of wireless communication terminals, and they also look good. There are various disadvantages.

In order to make up for the shortcomings of such an external antenna, the selection of an internal antenna is essential.

The built-in antenna is used in various forms because the ground interference of the adjacent antenna and the case is small due to the small interference constraints in space. Cell phones, handsets, and wireless PDAs have severe space constraints, so it is difficult to apply the built-in antenna.

The antenna for the mobile communication terminal is mainly used a Planar Invered F-Antenna (PIFA) antenna, the contact method consists of a structure that forms a contact point of the antenna through a separate structure such as a finger strip.

The mobile phone according to the related art includes an antenna coupled to the upper housing and a main substrate coupled to the lower housing.

The antenna has a radiation pattern and a feeding pad implemented by particle plating or deposition in an antenna housing made of plastic.

A conductive pad connected to the RF circuit is formed on the surface of the main substrate, and the conductive pad has an elastic body for contacting the feeding pad when the upper / lower housing of the cellular phone is coupled.

However, such a direct contact structure has a structural weakness that may cause a decrease in radio performance when the elastic force of the elastic body is lowered or the contact resistance is uneven.

In particular, the antenna of the radiation pattern structure, which is widely used, the wear phenomenon of the feeding pad is prominent as the elastic body and the feeding pad is in contact for a long time, the problem of deterioration of radio characteristics due to the bending error between the pads, the increase in contact resistance There is this.

The embodiment provides an antenna connection device capable of preventing a phenomenon in which reliability of contact resistance is degraded due to physical contact and a phenomenon in which wireless characteristics are deteriorated.

Antenna connection device according to the embodiment includes a substrate; A conductive pad formed on an inner layer of the substrate and forming a plate; And a feeding pad in contact with a surface of the substrate perpendicular to the conductive pad and forming a plate shape, wherein the conductive pad and the feeding pad are operated as a capacitor with the substrate interposed therebetween.

Hereinafter, an antenna connection apparatus according to an exemplary embodiment will be described in detail with reference to the accompanying drawings.

Fig. 1 is a side sectional view showing the form of an antenna connecting apparatus according to the first embodiment.

Referring to FIG. 1, the antenna connecting apparatus according to the first embodiment is a device for connecting the antenna 110 and the substrate 120. The feeding pad 113 and the substrate 120 connected to the antenna 110 are provided. ) And a conductive pad 123 formed therein.

The antenna 110, the substrate 120, the conductive pad 123, and the feeding pad 113 are formed inside the mobile communication terminal, and the operation of the antenna connection device related thereto will be described in detail later.

The antenna 110 includes a housing 112 and a conductor 111.

The housing 112 is formed of an insulating material such as a synthetic resin, and has a structure coupled to an upper portion of a mobile communication terminal housing (not shown).

The conductor 111 is a portion that radiates or enters an RF signal and is mechanically coupled to the housing 112 and connected to a feeding pad 113.

The conductor 111 may be manufactured in the form of a copper foil, and may have various antenna shapes such as aberration bent strip line type, slot type, and patch type.

The conductor 111 forms an antenna structure on an upper surface of the housing 112, and a part of the conductor 111 extends to have an elastic force at a bottom surface side thereof and is connected to the feeding pad 113.

The conductor 111 and the feeding pad 113 may be integrally formed.

In an embodiment, the antenna 110 having the above configuration is provided as a Planar Inverted-F Antenna (PIFA) antenna, and the PIFA antenna has an advantage of easy deformation of the conductor 111 to process a multiband signal. have.

The performance of the PIFA antenna is determined by factors such as bandwidth, return loss at resonance frequency, impedance matching efficiency, and the like. Is designed to satisfy.

On the other hand, the substrate 120 is a substrate on which a plurality of circuits (not shown) including an RF circuit is mounted, and in this embodiment, a multilayer printed circuit board (PCB) substrate including a FR4 dielectric layer is used.

The substrate 120 may be a main substrate of a mobile communication terminal, and a conductive pad 123 is mounted on an inner layer thereof.

The housing of the mobile communication terminal is configured to be separated into an upper housing and a lower housing for assembly of the internal components, and the housing 112 of the antenna 110 is coupled to the upper housing of the mobile communication terminal.

In addition, the substrate 120 is coupled to the lower housing of the mobile communication terminal.

Therefore, when the upper housing and the lower housing of the mobile communication terminal are assembled, the antenna 110 and the substrate 120 have a structure in which the natural contact with each other, wherein the feeding pad 113 is perpendicular to the conductive pad 123 It contacts the surface of the board | substrate 120 of the position to become.

The antenna connection device according to the embodiment has a structure in which the feeding pad 113 and the conductive pad 123 are directly contacted and energized, but connected in a contactless manner.

That is, the conductive pad 123 and the feeding pad 113 are contacted with a part of the substrate 120 (see FIG. 3, which is the first layer 121 of the substrate 120) interposed therebetween. The RF signal may be transmitted by coupling an RF signal to an electromagnetic signal.

Therefore, the feeding pad 113 should be positioned so as to correspond exactly to the substrate area when the conductive pad 123 is projected upward, and the entire surface should be evenly contacted with the substrate 120.

The feeding pad 113 and the conductor 111 should be coupled in consideration of such a contact relationship. For example, the feeding pad 113 may be in parallel with the surface of the substrate 120. Combined with

The conductive pad 123 is formed on the inner layer of the substrate 120 and is connected to the RF circuit.

In an embodiment, the conductive pad 123 is formed between the first layer 121, that is, the top layer and the second layer 122 of the substrate 120, and may be connected to the RF circuit through a printed circuit, via hole, or the like. .

In addition, the feeding pad 113 is in contact with the upper surface of the first layer 121 on the conductive pad 123 when the upper housing and the lower housing of the mobile communication terminal are coupled as described above.

In an embodiment, the conductive pad 123 and the feeding pad 113 are made of a metal material in the form of a plate, and preferably have the same or similar area.

When the conductive pad 123 and the feeding pad 113 have different areas, the capacitor capacity is affected by the area, so that one pad meets the area according to the capacitor capacity and the other pad should be formed larger than this. do.

In order to accurately calculate the area, the conductive pad 123 and the feeding pad 113 according to the embodiment are manufactured in a rectangular shape.

Fig. 2 is a side sectional view showing the form of the antenna connection device according to the second embodiment.

2, the antenna connection apparatus according to the second embodiment is different from the first embodiment in that the configuration of the antenna 130 and the structure of the feeding pad are different.

The antenna 130 according to the second embodiment includes a housing 132 and a conductor 131.

The housing 132 is formed of an insulating material and is coupled to the upper housing of the mobile communication terminal. The conductor 131 may be formed by sputtering, particle plating, or deposition, and is coated on the surface of the housing 132 in the form of a metal film.

As described above, the conductor 131 is different from the first embodiment in that the conductor 131 is coated on the antenna housing 132 in the forming process and in the form of a metal film. The point that can be formed in the form of an antenna is the same.

The feeding pad 133 may be formed in the form of a metal film using the same process as the conductor 131, and may be integrally formed with the conductor 131.

In the second embodiment, the feeding pad 133 is formed to be coated on a portion of the bottom surface of the housing 132, and when the antenna 130 and the substrate 140 are coupled to each other, the feeding pad 133 is positioned at the same position as the conductive pad 143. It is preferable to form the same or similar area.

When the conductive pad 143 and the feeding pad 133 have different areas, the capacitor capacity is affected by the area, so that one pad meets the area according to the capacitor capacity and the other pad should be formed larger than this. do.

In addition, first, the structure of the substrate 140, second, the conductive pad 143 is formed between the first layer 141 and the second layer 142 of the substrate 140, third, the antenna 130 and the substrate ( Fourth, the position, shape, coupling relationship of the feeding pad 133 and the conductive pad 143, fifth, the coupling operation by the contactless method, etc. are described in the first embodiment. Since it is similar to the example, repeated description will be omitted.

Hereinafter, a signal coupling operation of the antenna connection apparatus according to the first and second embodiments described above will be described with reference to FIG. 3.

3 is a diagram schematically illustrating conductive pads 123 and 143, substrates 121, 122, 141 and 142, and feeding pads 113 and 133 in order to explain the operation of the antenna connection apparatus according to the embodiment.

Referring to FIG. 3, conductive pads 123 and 143 are formed between the first layers 121 and 141 and the second layers 122 and 142 of the substrate, and the substrates are fed to the first layers 121 and 141. The pads 113 and 133 are in contact.

As described above, as the upper housing and the lower housing of the mobile communication terminal are coupled and the antennas 110 and 130 of the upper housing and the substrates 120 and 140 of the lower housing come into contact with each other, the feeding pads 113 and 133 are shown in FIG. As shown in FIG. 5, the substrate 1 is in contact with the substrate first layers 121 and 141.

In addition, the feeding pads 113 and 133 contact the regions of the substrate first layers 121 and 141 when the conductive pads 123 and 143 are vertically projected, and have the same or similar shape and area as described above. Contact.

Accordingly, the conductive pads 123 and 143 and the feeding pads 113 and 133 may form a capacitor structure with the substrate first layers 121 and 141 interposed therebetween.

In this case, the capacitance of the capacitor is, first, the area of the conductive pads 123 and 143 and the feeding pads 113 and 133, and second, the substrate 1 between the conductive pads 123 and 143 and the feeding pads 113 and 133. Third, the thickness of the layers 121 and 141 is determined according to the combination of the dielectric constants of the first and second substrates 121 and 141.

Here, "C" is the capacitance of the capacitor, "d" is the thickness of the first layers 121 and 141, "A" is the area of the conductive pads 123 and 143 and the feeding pads 113 and 133, "ε" Is the permittivity of the first layers 121 and 141.

As described above, the conductive pads 123 and 143 and the feeding pads 113 and 133 form a capacitor structure to couple the RF signal to an electromagnetic signal, and transmit the RF signal to both sides of the antenna 110 and the substrate 120.

The antenna connection device according to the embodiment is used for a mobile communication terminal, the signal of about 800 MHz to 2 GHz band, that is, the GSM signal of the 824 ~ 894 MHz band, the GPS signal of the 1575.42 MHz band, the PCS signal of the 1.8 ~ 2.0 GHz band And the like.

In order to couple all of the signal bands, the capacitance of the capacitor may satisfy a value between about 5 pF and 6 pF.

The capacity of the capacitor is taken into consideration of factors such as the area of the pads 113, 133, 123, 143, the thickness and type of the first substrate layer 121, 141, and the size of the mobile communication terminal products, which are becoming smaller, are also considered. will be.

In consideration of the above factors, the numerical values calculated by Equation 1 are as follows.

First, the area A of the conductive pads 123 and 143 and the feeding pads 113 and 133 is "3mm x 4mm, that is, 12mm ² ", and the thickness d of the substrate first layers 121 and 141 is If the dielectric constant? Of the substrate first layers 121 and 141 is " 8,854 × 10 ^-12 × 3.36 ", the capacitor capacity is calculated to be about 5.5 pF.

In the case of implementing the antenna access device according to the embodiment with the above numerical value, the aforementioned multiband signals may be satisfied and processed.

Hereinafter, the antenna connection device according to the third embodiment will be described.

4 is a diagram showing an equivalent circuit of the antenna connection device according to the third embodiment.

The antenna connection device according to the third embodiment has a configuration similar to that of the first and second embodiments.

That is, the configurations and operations of the substrates 120 and 140, the antennas 110 and 130, the feeding pads 113 and 133, and the conductive pads 123 and 143 are the same, but the matching circuit unit (the inside of the substrates 120 and 140) 150 is formed is different.

The matching circuit unit 150 is connected between the conductive pads 123 and 143 and the RF circuit to match impedance, and also capacitors of the conductive pads 123 and 143 and the feeding pads 113 and 133. It is linked with the operation.

Therefore, the detailed description of the structure of the antenna connection apparatus according to the third embodiment will be omitted in the circuit aspect.

Referring to FIG. 4, the matching circuit unit 150 includes a first capacitor 154, an inductor 152, and a second capacitor 156, and the second capacitor 156 may include conductive pads 123 and 143. Connected.

Of course, the matching circuit unit 150 may form various circuit forms.

The conductive pads 123 and 143 and the feeding pads 113 and 133 are illustrated as capacitors connected to the antennas 110 and 130.

In this case, the capacitor capacitance by the conductive pads 123 and 143 and the feeding pads 113 and 133 is also affected by the impedance value of the matching circuit unit 150 in addition to the aforementioned factors, and thus, the conductive pads 123 and 143. When the size of the feeding pads 113 and 133 is further reduced or the types of the substrates 120 and 140 need to be replaced, the matching circuit unit 150 is used to maintain the signal transmission function of the antenna connection device according to the embodiment. Can be.

For example, in order to process a multi-band signal, the capacitor capacity of the antenna connection device according to the embodiment should be maintained at about 5 pF to 6 pF, but the sizes of the conductive pads 123 and 143 and the feeding pads 113 and 133 are If the change occurs, it becomes difficult to maintain the capacitor capacity.

In this case, by changing the inductance or capacitance capacity of the matching circuit unit 150 or by changing the device design, it is possible to adjust the capacitor capacity of the antenna connection apparatus according to the embodiment.

The embodiment described above has been described with reference to the internal antenna, but the present invention is not limited thereto and may be equally applied to a connection device of the external antenna.

For example, in the case of an external antenna, a connection structure may be fastened to a cell phone housing in a screw manner, and a connection structure for energizing the antenna and the main board is formed. An antenna connection device according to an embodiment to form a contactless contact between the connection structure and the main board. Can be applied.

5 is a graph showing a frequency band characteristic curve of the antenna connection apparatus according to the embodiment.

The Y axis of the graph means VSWR (Voltage Standing Wave Ratio) for the input / output port, and the X axis means frequency band (GHz).

The S parameter of the VSWR denotes a transfer ratio of an output port to an input port, and the VSWR of FIG. 5 calculates a single input / output signal ratio in the case of S (1,1), that is, the antennas 110 and 130.

The display points m5 and m10 mean measurement points according to the embodiment and reference points according to the signal processing standard in the about 824 MHz band, respectively. According to the graph, the VSWR of m5 is 3.630 and the VSWR of m10 is 4.126.

The display points m6 and m11 mean measurement points according to the embodiment in the about 894 MHz band and reference points according to the signal processing standard, respectively. According to the graph, it can be seen that the VSWR of m6 is 2.235 and the VSWR of m11 is 1.393. According to the antenna connection device according to the embodiment, the GSM signal standard is satisfied.

In addition, the display points m7 and m12 mean a measuring point according to the embodiment and a reference point according to the signal processing standard in the about 1575.42 MHz band, respectively. According to the graph, it can be seen that the VSWR of m7 is 4.937 and the VSWR of m12 is 4.72. According to the antenna access device according to the embodiment, the GPS signal standard is satisfied.

The display points m8 and m13 mean measurement points according to the embodiment in the about 1850 MHz band and reference points according to the signal processing standard, respectively. According to the graph, the VSWR of m8 is 2.813 and the VSWR of m13 is 3.222.

In addition, the display points m9 and m14 mean a measuring point according to an embodiment in the about 1990 MHz band and a reference point according to a signal processing standard, respectively. According to the graph, it can be seen that VSWR of m9 is 2.859 and VSWR of m14 is 2.510. According to the antenna connection device according to the embodiment, the PCS signal standard is satisfied.

As can be seen from the measurement graph, the antenna access device according to the embodiment can confirm that the transmission characteristics of the input and output signals to the antenna port satisfies or improves the multi-band signal specification.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications not illustrated in the drawings are possible. For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

According to the antenna connection device according to the embodiment has the following effects.

First, there is an effect that can prevent the physical loss between the pads, deterioration of electrical characteristics by the contactless antenna structure.

Second, antenna characteristics can be easily designed according to multiple frequency bands, and the transmission and reception function can be stably maintained.

Third, it is possible to implement a low loss energy transfer structure by avoiding the direct conduction structure and to improve antenna radiation characteristics.

Claims (10)

Board; A conductive pad formed on an inner layer of the substrate and forming a plate; And A feeding pad in contact with the surface of the substrate perpendicular to the conductive pad and forming a plate shape, The conductive pad and the feeding pad are operated as a capacitor with the substrate interposed therebetween, The feeding pad is connected to the antenna, The antenna is housing; And And a conductor formed in the housing and connected to the feeding pad. The method of claim 1, By combining the area of the conductive pad and the feeding pad, the substrate thickness between the conductive pad and the feeding pad, and the dielectric constant of the substrate, And a capacitor capacity determined by the conductive pad and the feeding pad. The method of claim 2, wherein the capacitor capacity is Antenna connection device between 5pF and 6pF. delete The method of claim 1, wherein the conductor An antenna connection device having an elastic force and extended to connect with the feeding pad. The antenna of claim 1, wherein the antenna is connected to the substrate, the conductive pad, the feeding pad, and the feeding pad. Antenna connection device formed in the mobile communication terminal. The method of claim 1, And a matching circuit unit formed on the substrate and connected to the conductive pad. The method of claim 7, wherein By combining the area of the conductive pad and the feeding pad, the substrate thickness between the conductive pad and the feeding pad, the dielectric constant of the substrate, and the impedance value of the matching circuit part, And a capacitor capacity determined by the conductive pad and the feeding pad. The method of claim 7, wherein the matching circuit unit An antenna interface comprising at least one element of a capacitor, an inductor and a resistor. The method of claim 1, The conductive pad is formed between the first layer and the second layer of the substrate, And the feeding pad is in contact with the surface of the first layer.

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