KR101337780B1 - Chip inlaid flooring material using polylactic acid resin - Google Patents

Abstract

Chip inlay de flooring using a PLA resin according to an embodiment of the present invention includes a chip inlaid (Chip Inlaid) layer, an intermediate layer and a base layer from above, at least one of the chip inlay deucheung layer, the intermediate layer and the base layer is a binder It includes PLA (Polylactic acid) resin.

Description

Chip inlaid flooring using PLA resin {CHIP INLAID FLOORING MATERIAL USING POLYLACTIC ACID RESIN}

The present invention relates to a chip inlay de flooring using PLA resin.

Floor materials used in buildings such as houses, mansions, apartments, offices or shops are mainly based on petroleum resin such as polyvinyl chloride (PVC).

The flooring material using said polyvinyl chloride etc. is manufactured by extrusion or a calendering method etc. using resin, such as polyvinyl chloride (PVC). However, since the raw material of the polyvinyl chloride resin is based on petroleum resources, there may be a big problem in the supply and demand of raw materials in the future due to exhaustion of petroleum resources.

In addition, polyvinyl chloride (PVC) flooring is required to be used in terms of environmental friendliness due to the generation of many harmful substances at the time of use or disposal.

Recently, instead of polyvinyl chloride-based flooring, there is a growing interest in green flooring based on environmentally friendly resins.

However, in the case of a general green floor material has its own strength and a lot of problems in forming or processing, there is also a problem such as gaps due to heating when used.

The present invention provides an environmentally friendly flooring material by forming a chip inlaying layer using PLA resin in configuring the chip inlaying flooring to solve the above problems.

Chip inlay de flooring material using a PLA resin according to an embodiment of the present invention includes a chip inlaid (Chip Inlaid) layer, an intermediate layer and a base layer from above, at least one of the chip inlaid layer, the intermediate layer and the base layer is a binder It includes PLA (Polylactic acid) resin.

Chip inlay de flooring material using a PLA resin according to another embodiment of the present invention includes a chip inlay deucheung layer, the adhesive layer and the base layer from above, at least one of the chip inlaid layer, the adhesive layer and the base layer comprises a PLA resin as a binder do.

According to one embodiment of the invention, in configuring the chip inlay de flooring, it is possible to provide an environmentally friendly flooring by forming a chip inlay deucheung using PLA resin.

1 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
Figure 2 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
Figure 3 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.
Figure 4 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The PLA (polylactic acid) resin is a lactide or a thermoplastic polyester of lactic acid, and can be produced by polymerizing lactic acid produced by fermenting starch extracted from renewable plant resources such as corn, potatoes and the like. These PLA resins are environmentally friendly substances that can reduce the emission of environmentally harmful substances such as CO ₂ as compared with petroleum-based materials such as polyvinyl chloride (PVC) during use or disposal, .

The PLA resin may be classified into D-PLA, L-PLA, D, L-PLA or meso-PLA. However, in the PLA resin of the present invention, , And various PLA resins can be produced singly or in combination of two or more kinds.

On the other hand, as described above, the PLA resin can be prepared by polymerizing lactic acid or lactide, and if necessary, a glycol compound such as ethylene glycol or propylene glycol, a dicarboxylic acid such as ethanedioic acid or terephthalic acid , Hydroxycarboxylic acids such as glycolic acid or 2-hydroxybenzoic acid; Or lactones such as caprolactone or propiolactone may be further copolymerized.

The PLA resin can be divided into a crystalline PLA (c-PLA) resin and an amorphous PLA (a-PLA) resin. At this time, in the case of the crystalline PLA resin, it is preferable to use an amorphous PLA resin because a bleeding phenomenon in which the plasticizer flows out to the sheet surface may occur. When an amorphous PLA resin is used, there is an advantage that a compatibilizer which is essentially added to prevent bleeding phenomenon is not added. When an amorphous PLA resin is used, it is most preferable to use a 100% amorphous PLA resin as the PLA resin, and a PLA resin in which crystalline and amorphous coexist can be used, if necessary.

The nonphthalate plasticizer softens the PLA resin to increase the thermoplasticity, thereby facilitating the molding at high temperatures and the like, and can be ATBC (Acetyl tributyl citrate) and the like.

When the nonphthalate plasticizer is added to the PLA resin at a level lower than the reference value, the hardness of the PLA resin is increased and the processability may be deteriorated. If the addition amount of the nonphthalate plasticizer exceeds the range defined in each layer, The physical properties such as workability may be deteriorated due to the lowered compatibility with the other components forming each layer.

The acrylic copolymer used as a processing aid serves to reinforce the strength of the PLA resin, which is poor in melt strength or heat resistance in itself during melt extrusion, thereby securing processability. Also, the acrylic copolymer could be applied to the car-rendering and pressing of PLA resin.

When the content of the acrylic copolymer is less than the standard value of 100 parts by weight of the PLA resin, the improvement of the melting efficiency and the melt strength of the PLA resin is insufficient, and when the content of the acrylic copolymer exceeds the reference value, The cost is increased and the overall physical properties of each layer may be lowered due to compatibility problems with other materials constituting each layer.

The weight average molecular weight (Mw) of the acrylic copolymer is not particularly limited, but from the viewpoint of improvement in melt strength during processing and compatibility with other materials, it is preferable to use one having a weight average molecular weight of 800,000 to 6,000,000.

The PLA resin may further include a lubricant in order to prevent accumulation of deposits or crosslinked products in melt extrusion or the like.

Although there are various types of such lubricants, in the embodiments of the present invention, higher fatty acids corresponding to environmentally friendly lubricants are used. Specifically, stearic acid or higher fatty acids, which are saturated higher fatty acids having 18 carbon atoms, are used alone or in combination thereof. It can mix and use species or more.

If the amount of the lubricant used in the PLA resin is less than the reference value of 100 parts by weight of the PLA resin, the effect of using the lubricant can not be obtained. If the amount of the lubricant used exceeds 100 parts by weight of the PLA resin, the impact resistance, heat resistance, There is a problem that it can deteriorate.

In addition, an anti-hydrolysis agent may be added to the PLA resin in order to prevent degradation of mechanical properties such as impact resistance through hydrolysis of the PLA resin. The moisture release can be used without restriction as long as it is usually used as a moisture release agent such as carbodiimide, oxazoline, and the like.

Such moisture release may exceed the standard value with respect to 100 parts by weight of the PLA resin, and the molding processability may be lowered.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the chip inlay de flooring using PLA resin according to the embodiments of the present invention.

Prior to describing the embodiments of the present invention, a printed layer may be added on top of the chip inlaid layer of the present invention, and the base layer and the chip inlaid layer may be composed of two or more layers, respectively. Can be inserted. In addition, although not shown in the drawings, the surface treatment layer may be basically formed on the uppermost portion.

1 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.

1, the chip inlaid flooring material 100 using the PLA resin according to an embodiment of the present invention is a chip inlaid (Chip Inlaid) layer 110, the intermediate layer 120 and the base layer 130 from above It includes.

In the flooring material 100 of the present invention, the chip inlay deucheung 110 has the form of a chip having a natural marble appearance. The chip inlaid layer 110 may be formed in various forms. First, the chip inlaid layer 110 may be formed of a PLA resin layer including separate chips such as chips or fragrance chips made of PLA resin. In addition, the chip inlay deucheung layer 110 is not formed of a separate chip, but formed of a PLA resin layer, assuming that the wood powder and the like chip, when viewed from the surface of the flooring may be a form that looks like a chip embedded. In addition, the chip inlay deucheung 110 may be a form that is arranged on a separate PLA resin layer by pulverizing after producing a sheet from the PLA resin.

Herein, the chip refers to a product obtained by blending a pigment and the like with PLA, and then crushing the rolled sheet to about 0.5 to 20 mm using a grinder.

The chip inlaid layer 110 includes a polylactic acid (PLA) resin as a binder. The chip inlay deucheung layer 110 may further include at least one of an acetyl tributyl citrate (ATBC) as a non-phthalate plasticizer, an acrylic copolymer and an anti-hydrolysis agent as a processing aid in the PLA resin. .

The chip inlay deucheung layer 110 is based on 100 parts by weight of the PLA resin, 5 to 100 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, at least one of stearic acid and higher fatty acids as a lubricant 0.01 ~ 10 parts by weight, acrylic resin 0.01 ~ 10 parts by weight, 10 parts by weight or less of the hydrolysis agent, at least 200 parts by weight of wood flour and chaff, 500 parts by weight or less of calcium carbonate (CaCO ₃ ), titanium dioxide (TiO ₂ ) And at least 50 parts by weight and at most 20 parts by weight of rosin.

Here, the acrylic copolymer may be used in the chip inlay deucheung 110 in a ratio of 0.1 to 20 parts by weight based on 100 parts by weight of the PLA resin.

The acrylic resin may be added to the chip inlaid layer 110 in a ratio of 0.01 to 10 parts by weight based on 100 parts by weight of the PLA resin.

The lubricant may be used in the chip inlay deucheung 110, 0.01 to 10 parts by weight based on 100 parts by weight of the PLA resin.

The hydrolysis agent may be added to the chip inlay deucheung 110, within a range of 10 parts by weight or less based on 100 parts by weight of the PLA resin.

The chip inlay deucheung 110 may be added to the titanium pigment (TiO ₂ ) as a white pigment for the purpose of reinforcing inorganic filler calcium carbonate (CaCO ₃ ) or aesthetics, etc., the texture of the natural wood and the unique wood At least one of wood flour, rice husk, and rosin may be added to impart aroma.

In the case of calcium carbonate, the chip inlaid layer 110 is preferably used in an amount of 500 parts by weight or less relative to 100 parts by weight of the PLA resin. In addition, in the case of titanium dioxide, the chip inlay deucheung 110 is preferably used in 50 parts by weight or less relative to 100 parts by weight of PLA resin.

In the case of wood flour or chaff is preferably added to the chip inlay deucheung 110, 200 parts by weight or less relative to 100 parts by weight of PLA resin, and in the case of rosin is preferably added to 20 parts by weight or less relative to 100 parts by weight of PLA resin. Do.

In the case of wood flour, rice husk, and rosin, the more it is included in the chip inlay deucheung 110, the visual recognition effect, the texture of natural wood, the scent effect can be given more, but when added beyond the above range, Deterioration may result in deterioration of the overall workability of the PLA resin.

The chip inlay deucheung 110 preferably has a thickness of 0.3 ~ 3.0 mm.

In the flooring material 100 of the present invention, the intermediate layer 120 serves to improve the interlayer adhesion.

The intermediate layer 120 may have the same composition and thickness as the base layer 130 to be described below.

In the flooring material 100 of the present invention, the base layer 130 is the most basic layer of the flooring material to support the upper intermediate layer 120, the chip inlay deucheung 110, and absorbs the impact of the upper or lower Play a role.

The base layer 130 may include PLA resin as a binder, ATBC as a nonphthalate plasticizer, and an acrylic copolymer as a melt strength enhancer.

The base layer 130 may include 5 to 100 parts by weight of the non-phthalate plasticizer and 0.1 to 20 parts by weight of the melt strength reinforcing agent based on 100 parts by weight of the PLA resin.

In addition, the base layer 130 is 0.01 to 10 parts by weight of a higher fatty acid, 0.01 to 10 parts by weight of a chain extender, 10 parts by weight or less of a hydrolysis agent, and calcium carbonate (CaCO ₃ ) with respect to 100 parts by weight of the PLA resin as a lubricant. ) 1,000 parts by weight or less, wood powder 200 parts by weight or less, titanium dioxide (TiO ₂ ) 50 parts by weight or less, and may further include one or more of 20 parts by weight or less.

The base layer 130 preferably has a thickness of 1.00 ~ 5.0 mm. If the thickness of the base layer 130 is 1.0 mm or less, the functions cannot be properly performed, and if the thickness of the base layer 130 exceeds 5.0 mm, the use of many PLA resins may cause the flooring manufacturing cost to increase. Becomes

Figure 2 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.

Referring to FIG. 2, the chip inlaid flooring material 200 using the PLA resin according to another embodiment of the present invention is a transparent layer 210, a chip inlaid layer 220, an intermediate layer 230, and a base layer 240 from above. It includes.

The chip inlaid flooring material 200 of the present invention has the same components except for the chip inlaid flooring material 100 and the transparent layer 210 of FIG. 1. Therefore, the description of the chip inlaid layer 220, the intermediate layer 230, and the base layer 240 will be omitted, and only the transparent layer 210 will be described.

In the flooring material 200 of the present invention, the transparent layer 210 is formed on the chip inlay deucheung 220 to give a three-dimensional impression, and serves to protect the pattern formed on the chip inlay deucheung 220.

The transparent layer 210 may include an acrylic resin, PLA resin, or the like as a binder. That is, the transparent layer 210 may include at least one of an acrylic resin and a PLA resin, and a non-phthalate as a first plasticizer, and at least one of an acrylic copolymer and a hydrolysis agent as a processing aid.

The transparent layer 210 is based on 100 parts by weight of the acrylic resin, 5 to 50 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, at least one of stearic acid and higher fatty acids as a lubricant 0.01 to 10 It can include up to 10 parts by weight, and the hydrolysis agent.

The transparent layer 210 preferably has a thickness of 0.1 ~ 1.0 mm. When the thickness of the transparent layer 210 is less than 0.1 mm, the print pattern protection effect directly below the transparent layer 210 is insufficient, and if the thickness of the transparent layer 210 exceeds 1.0 mm, the overall flooring cost may increase. have.

Figure 3 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.

Referring to FIG. 3, the chip inlaid flooring material 300 using the PLA resin according to another embodiment of the present invention includes a chip inlaid layer 310, an adhesive layer 320, and a base layer 330 from above.

In the flooring material 300 of the present invention, the chip inlay deucheung 310 has the form of a chip having a natural marble appearance, it may be composed of two or more layers as necessary.

The chip inlay deucheung 310 may include at least one of PLA resin, non-phthalate non-phthalate plasticizer, acrylic copolymer and anti-hydrolysis agent as a processing aid (binder).

The chip inlay deucheung 310 is based on 100 parts by weight of the PLA resin, 5 to 100 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, 10 parts by weight or less of the hydrolysis agent, wood flour and chaff It may include one or more of 200 parts by weight or less, 500 parts by weight or less of calcium carbonate (CaCO ₃ ), 50 parts by weight or less of titanium dioxide (TiO ₂ ), and 20 parts by weight or less of rosin.

The chip inlay deucheung 310 preferably has a thickness of 0.3 ~ 3.0 mm. If the thickness of the chip inlaid layer 310 is less than 0.3 mm, the functions cannot be properly performed. If the thickness of the chip inlaid layer 310 exceeds 3.0 mm, the flooring manufacturing cost increases due to the use of many PLA resins. Cause.

In the flooring material 300 of the present invention, the adhesive layer 320 is for improving the interlayer adhesion between the chip inlaid layer 310 and the base layer 330, PLA resin, vinyl acetate-based adhesive resin, ethylene vinyl acetate It may be formed of one or more selected from (EVA) adhesive resin, urethane adhesive resin, a mixture of urethane adhesive resin and isocyanate curing agent, acrylic adhesive resin, and a mixture of acrylic adhesive resin and epoxy curing agent.

The adhesive layer 320 preferably has a thickness of 0.05 ~ 0.5mm. If the thickness of the adhesive layer 320 is less than 0.05mm can not perform the function, if it exceeds 0.5mm it takes a long time to cure the adhesive may cause a problem that the productivity is lowered.

In the flooring material 300 of the present invention, the base layer 330 serves as the most basic layer of the flooring material to support the upper chip inlay deucheung 310, and to absorb the impact of the upper or lower.

The substrate layer 330 may include a PLA resin, a nonphthalate plasticizer, and an acrylic copolymer as a melt strength enhancer as a binder.

The base layer 330 may include 5 to 100 parts by weight of the non-phthalate plasticizer and 0.1 to 20 parts by weight of the melt strength reinforcing agent based on 100 parts by weight of the PLA resin.

In addition, the base layer 330 is 0.01 to 10 parts by weight of a higher fatty acid, 0.01 to 10 parts by weight of a chain extender, 10 parts by weight or less of a hydrolysis agent, and calcium carbonate (CaCO ₃ ) with respect to 100 parts by weight of the PLA resin. ) 1,000 parts by weight or less, wood powder 200 parts by weight or less, titanium dioxide (TiO ₂ ) 50 parts by weight or less, and may further include one or more of 20 parts by weight or less.

The base layer 330 preferably has a thickness of 1.00 ~ 5.0 mm. If the thickness of the base layer 330 is 1.0 mm or less, the functions cannot be properly performed. If the thickness of the base layer 330 exceeds 5.0 mm, the use of many PLA resins may cause the flooring manufacturing cost to increase. Becomes

Figure 4 is a cross-sectional view of the chip inlay de flooring using PLA resin according to an embodiment of the present invention.

4, the chip inlay de flooring material 400 using the PLA resin according to another embodiment of the present invention is a transparent layer 410, the chip inlay deucheung layer 420, the adhesive layer 430 and the base layer 440 from above ).

The chip inlaid flooring 400 has the same components except for the chip inlaid flooring 300 and the transparent layer 410 of FIG. 3. Therefore, the description of the chip inlaid layer 420, the adhesive layer 430, and the base layer 440 will be omitted, and only the transparent layer 410 will be described.

The transparent layer 410 is formed on the chip inlay deucheung layer 420 to impart a three-dimensional feeling, and serves to protect the pattern formed on the chip inlay deucheung 420.

The transparent layer 410 may include at least one of PLA resin as a binder, ATBC as a nonphthalate plasticizer, an acrylic copolymer as a processing aid, and a hydrolysis agent.

The transparent layer 410 is based on 100 parts by weight of the PLA resin, 5 to 50 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, at least one of stearic acid and higher fatty acids as a lubricant 0.01 to 10 It may include up to 10 parts by weight of the acrylic resin, 0.01 to 10 parts by weight and hydrolysis agent.

The transparent layer 410 preferably has a thickness of 0.1 ~ 1.0 mm. When the thickness of the transparent layer 410 is less than 0.1 mm, the effect of protecting the printed pattern directly below the transparent layer 410 is insufficient, and if the thickness of the transparent layer 410 exceeds 1.0 mm, the overall flooring cost may increase. have.

The transparent layer 410 is the same in detail with the transparent layer 210 of FIG.

Manufacturing example

Hereinafter, an example of manufacturing a chip inlaid flooring material using a PLA resin according to embodiments of the present invention will be described. However, such a production example is shown as an embodiment of the present invention, and can not be construed as limiting the present invention in any way.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Transparent layer  Produce

100 parts by weight of 2002D (made by Nature Works, melt index: less than 3) as PLA resin, 20 parts by weight of ATBC, 10 parts by weight of ESO, 10 parts by weight of PA828 (manufactured by LG Chemical), an acrylic copolymer, 5 parts by weight of stearic acid, and acrylic resin 5 parts by weight and 5 parts by weight of carbodiimide were first kneaded using an extruder, kneaded at 160 ° by a half-barrier mixer, and then mixed by primary and secondary using a 160-degree double roll. Thereafter, the produced raw material was subjected to car rendering processing at a temperature of 130 DEG C to produce a sheet having a thickness of about 0.6 mm.

chip Inlaid layer  Produce

100 parts by weight of 2002D (Nature Works, melt index: less than 3) as PLA resin, 40 parts by weight of ATBC, 10 parts by weight of ESO, 10 parts by weight of PA828 (manufactured by LG Chemical), an acrylic copolymer, 5 parts by weight of stearic acid, carbodi A sheet having a thickness of about 1 mm consisting of 5 parts by weight of mead, 100 parts by weight of wood powder, 280 parts by weight of calcium carbonate, 20 parts by weight of titanium dioxide, and 10 parts by weight of rosin was prepared and pulverized, and then rolled at a temperature of 150 degrees to obtain a thickness of about 1.5 mm. Phosphorus sheet was prepared.

Mezzanine and Substrate layer  Produce

2002 D 100 parts by weight, ATBC 30 parts by weight, ESO 15 parts by weight, acrylic copolymer 10 parts by weight, stearic acid 5 parts by weight, diisocyanate 5 parts by weight and carbodiimide 5 parts by weight, calcium carbonate 300 parts by weight, wood powder 100 parts by weight Part, 20 parts by weight of titanium dioxide and 10 parts by weight of rosin were processed in the same process as in the above-mentioned transparent layer manufacturing process to prepare a sheet having a thickness of 2 mm.

Adhesive layer manufacturing

An adhesive layer having a thickness of 0.2 mm was prepared by mixing 100 parts by weight of an acrylic emulsion having a resin content of 50 parts by weight, 1 part by weight of fatty acid-modified polyethylene, and 50 parts by weight of calcium carbonate by applying a roll coating method on the base layer.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. . Accordingly, the true scope of the present invention should be determined by the following claims.

110, 220, 310, 320: chip inlaid layer
120, 230: middle layer
210, 410: transparent layer
320, 430: adhesive layer
130, 240, 330, 440: substrate layer

Claims (31)

Including a chip inlaid layer, an intermediate layer, and a base layer from above,
The chip inlaid layer, the intermediate layer and the substrate layer includes a resin or a-PLA resin blended a-PLA and c-PLA as a binder,
The chip inlaid layer is 5 to 100 parts by weight of a non-phthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer, stearic acid as a lubricant based on 100 parts by weight of a-PLA and c-PLA blended resin or a-PLA resin. And 0.01-10 parts by weight of higher fatty acids, 0.01-10 parts by weight of acrylic resin, 5-10 parts by weight of carbodiimide or oxazoline as a hydrolysis agent, and 100-200 Part by weight, 280 to 500 parts by weight of calcium carbonate (CaCO ₃ ), 20 to 50 parts by weight of titanium dioxide (TiO ₂ ) and 10 to 20 parts by weight of rosin chip inlay de flooring using PLA resin.
delete The method of claim 1,
The acrylic copolymer has a weight average molecular weight (Mw) of chip inlay de flooring using PLA resin, characterized in that 80 to 600 million.
delete delete The method of claim 1,
The chip inlay de flooring chip inlay de flooring using a PLA resin, characterized in that having a thickness of 0.3 ~ 3.0 mm.
The method of claim 1,
The intermediate layer or the base layer is a non-phthalate plasticizer, chip inlay de flooring using PLA resin further comprises an acrylic copolymer as a melt strength enhancer (melt strength enhancer).
The method of claim 7, wherein
The intermediate layer or the base layer includes 5 to 100 parts by weight of the non-phthalate plasticizer and 0.1 to 20 parts by weight of the melt strength reinforcing agent based on 100 parts by weight of the a-PLA and c-PLA blended resin or a-PLA resin. Chip inlay de flooring using PLA resin.
9. The method of claim 8,
The intermediate layer or the base layer is 0.01 to 10 parts by weight of a higher fatty acid, 0.01 to 10 parts by weight of a chain extender, and internal moisture as lubricants based on 100 parts by weight of the a-PLA and c-PLA blended resin or a-PLA resin. 10 parts by weight or less of release, calcium carbonate (CaCO ₃ ) 1,000 parts by weight or less, wood powder 200 parts by weight or less, titanium dioxide (TiO ₂ ) 50 parts by weight or less, characterized in that it further comprises at least one of 20 parts by weight or less Chip inlaid flooring using PLA resin.
The method of claim 1,
Chip intermediate inlay flooring using a PLA resin, characterized in that the intermediate layer or the base layer has a thickness of 1.00 ~ 5.0 mm.
The method of claim 1,
Chip inlay de flooring using a PLA resin, characterized in that it further comprises a transparent layer formed on top of the chip inlaid layer.
12. The method of claim 11,
The transparent layer is a chip inlaid flooring using PLA resin, characterized in that it comprises a PLA resin or an acrylic resin as a binder.
The method of claim 12,
The transparent layer is a chip inlaid flooring using PLA resin, characterized in that the PLA resin or acrylic resin further comprises at least one of an ATBC as a non-phthalate plasticizer, an acrylic copolymer and a hydrolysis agent as a processing aid.
The method of claim 13,
The transparent layer is 5 to 50 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, 0.01 to 10 parts by weight of stearic acid and higher fatty acids as lubricants, Chip inlay de flooring using PLA resin, characterized in that it comprises 0.01 to 10 parts by weight of acrylic resin and 10 parts by weight or less of the hydrolysis agent.
12. The method of claim 11,
The transparent layer is a chip inlaid flooring using PLA resin, characterized in that having a thickness of 0.1 ~ 1.0 mm.
From the top including a chip inlaid (Chip Inlaid) layer, an adhesive layer and a base layer,
The chip inlaid layer is 5 to 100 parts by weight of a non-phthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer, stearic acid as a lubricant based on 100 parts by weight of a-PLA and c-PLA blended resin or a-PLA resin. And 0.01-10 parts by weight of higher fatty acids, 0.01-10 parts by weight of acrylic resin, 5-10 parts by weight of carbodiimide or oxazoline as a hydrolysis agent, and 100-200 Part by weight, 280 to 500 parts by weight of calcium carbonate (CaCO ₃ ), 20 to 50 parts by weight of titanium dioxide (TiO ₂ ) and 10 to 20 parts by weight of rosin chip inlay de flooring using PLA resin.
delete 17. The method of claim 16,
The acrylic copolymer has a weight average molecular weight (Mw) of chip inlay de flooring using PLA resin, characterized in that 80 to 600 million.
delete delete 17. The method of claim 16,
The chip inlay de flooring chip inlay de flooring using a PLA resin, characterized in that having a thickness of 0.3 ~ 3.0 mm.
17. The method of claim 16,
The adhesive layer is a chip inlay de flooring using PLA resin, characterized in that it comprises at least one of PLA resin, acrylic resin, urethane resin, vinyl acetate resin.
17. The method of claim 16,
The base layer is a non-phthalate plasticizer, chip inlay de flooring using PLA resin further comprises an acrylic copolymer as a melt strength enhancer (melt strength enhancer).
24. The method of claim 23,
The base layer may include 5 to 100 parts by weight of the non-phthalate plasticizer and 0.1 to 20 parts by weight of the melt strength reinforcing agent based on 100 parts by weight of the a-PLA and c-PLA blended resin or a-PLA resin. Chip inlaid flooring using PLA resin.
25. The method of claim 24,
The base layer is 0.01 to 10 parts by weight of a higher fatty acid as a lubricant, 0.01 to 10 parts by weight of a chain extender, and a hydrolysis agent based on 100 parts by weight of the a-PLA and c-PLA blended resin or a-PLA resin. PLA resin further comprises at least one of by weight, calcium carbonate (CaCO ₃ ) 1,000 parts by weight or less, wood powder 200 parts by weight or less, titanium dioxide (TiO ₂ ) 50 parts by weight or less, and 20 parts by weight or less of rosin. Chip inlaid flooring.
17. The method of claim 16,
The base layer is chip inlay de flooring using PLA resin, characterized in that having a thickness of 1.00 ~ 5.0 mm.
17. The method of claim 16,
Chip inlay de flooring using a PLA resin, characterized in that it further comprises a transparent layer formed on top of the chip inlaid layer.
28. The method of claim 27,
The transparent layer is a chip inlaid flooring using PLA resin, characterized in that it comprises a PLA resin or an acrylic resin as a binder.
28. The method of claim 27,
The transparent layer is a chip inlaid flooring using PLA resin, characterized in that the PLA resin or acrylic resin further comprises at least one of an ATBC as a non-phthalate plasticizer, an acrylic copolymer and a hydrolysis agent as a processing aid.
30. The method of claim 29,
The transparent layer is 5 to 50 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, 0.01 to 10 parts by weight of stearic acid and higher fatty acids as lubricants, Chip inlay de flooring using PLA resin, characterized in that it comprises 0.01 to 10 parts by weight of acrylic resin and 10 parts by weight or less of the hydrolysis agent.
28. The method of claim 27,
The transparent layer is a chip inlaid flooring using PLA resin, characterized in that having a thickness of 0.1 ~ 1.0 mm.

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